RCN Datasheet

RCN
www.vishay.com
Vishay Electro-Films
Wire Bondable Thin Film Filter Resistor Networks
FEATURES
• Wire bondable
• Standard resistance range: 25  and 50 
• Standard capacitance range: 50 pF, 100 pF, 200
pF, 400 pF
• Resistance tolerance to 1 %, capacitance
tolerance to 5 %
Product may not be to scale
The RCN series combines resistor and capacitor technology
on a single chip to provide filtering capability together with
excellent stability. Specifications below are standard but
may be changed and customized for the application and are
available in widebody SOIC or DIP packages.
These chips are manufactured using Vishay (EFI)
sophisticated thin film equipment and manufacturing
technology. The RCNs are 100 % electrically tested and
visually inspected to MIL-STD-883.
• Capacitor MOS/MNOS
• Chip size: 0.135" x 0.125"
• Case: 1210
• Resistor material: Tantalum nitride, self-passivating
• Oxidized silicon substrate
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• The RCN filter chips are used for low pass filters, RFI and
EMI, CMOS digital filters, ECL terminators and power
supply filters.
• Contact our Sales Department for any
configurations or requirements that are needed.
special
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES
PARAMETER
VALUE
Total Resistance Range
25, 50

Standard Capacitace Range
50, 100, 200, 400
pF
Standard Tolerances
± 0.01, ± 0.1, ± 1
%
TCR
UNIT
± 100
ppm/°C
+ 45 ± 75
ppm/°C
PARAMETER
VALUE
UNIT
Noise, MIL-STD-202, Method 308
100  to 250 k
< 100  or > 251 k
- 35 typ.
- 20 typ.
dB
Moisture Resistance, MIL-STD-202, Method 106
± 0.5 max. R/R
%
Stability, 100 h, + 125 °C, 50 mW/Res, at WVDC
± 0.5 max. R/R
± 2.0 max. R/R
%
Absolute TCC
STANDARD ELECTRICAL SPECIFICATIONS
Operating Temperature Range
- 55 to + 125
°C
Thermal Shock, MIL-STD-202, Method 107,
Test Condition F
± 0.1 max. R/R
%
High Temperature Exposure, + 150 °C, 1000 h
± 0.2 max. R/R
%
Insulation Resistance
109 min.
Operating Voltage
25 max.
V
0.05
W
± 0.5 max. R/R
%
DC Power Rating at - 55 °C to + 125 °C (100 V max.)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
(100 V max.)
Revision: 02-May-13
Document Number: 61013
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
RCN
www.vishay.com
Vishay Electro-Films
DIMENSIONS in inches
0.135
0.125
SCHEMATIC
Chip back plane
MECHANICAL SPECIFICATIONS
PARAMETER
VALUE
Chip Size
0.135" x 0.125" ± 0.005" (3.429 mm x 3.175 mm ± 0.127 mm)
Chip Thickness
0.010" ± 0.002" (0.254 mm ± 0.05 mm)
Chip Substrate Mmaterial
Oxidized silicon, 10 kÅ minimum SiO2
Resistor Material
Tantalum nitride, self-passivating
Bonding Pad Size
0.005" x 0.007" (0.127 mm x 0.178 mm)
Number of Pads
16 (8 x RC)
Pad Material
10 kÅ minimum aluminum
Backing
3 kÅ minimum gold
Options: Gold bonding pads 15 kÅ minimum thickness. Consult Applications Engineer
ORDERING INFORMATION
Example: 100 % visualled, 25 , ± 20 %, 200 pF ± 20 %, ± 100 ppm/°C, aluminum pads, class H visual inspection
P/N:
W
RCN
200
250
A
201
M
INSPECTION/PACKAGING
PRODUCT
FAMILY
SERIES
RESISTANCE
VALUE
RESISTOR
TOLERANCE
CAPACITOR
VALUE
CAPACITANCE
TOLERANCE
Use the first 3
significant digits of
the resistance
and multiplier
B = 0.01
A = 0.1
0=1
1 = 10
2 = 100
Use the first 3
significant digits
of the
capacitance and
multiplier
J = 5.0 %
K = 10 %
M = 20 %
N = 25 %
W = 100 % visually inspected
parts in matrix trays per
MIL-STD-883
X = Sample, commercial
visually inspected parts loaded in 
matrix trays (4 % AQL)
Revision: 02-May-13
Document Number: 61013
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000