Si595

Si 5 95
REVISION D
VO L TAG E - C ONTR OLLED C RYSTAL O S C I L L A T O R (VCXO)
10 TO 810 MH Z
Features


Available with any-rate output
frequencies from 10 to 810 MHz
 3rd generation DSPLL® with
superior jitter performance
 Internal fixed fundamental mode
crystal frequency ensures high
reliability and low aging




Available CMOS, LVPECL,
LVDS, and CML outputs
3.3, 2.5, and 1.8 V supply options
Industry-standard 5 x 7 mm
package and pinout
Pb-free/RoHS-compliant
–40 to +85 ºC operating range
Applications



Si5602
Ordering Information:
SONET/SDH (OC-3/12/48)
Networking
SD/HD SDI/3G SDI video



See page 7.
FTTx
Clock recovery and jitter cleanup PLLs
FPGA/ASIC clock generation
Pin Assignments:
See page 6.
Description
The Si595 VCXO utilizes Silicon Laboratories’ advanced DSPLL® circuitry to
provide a low-jitter clock at high frequencies. The Si595 is available with
any-rate output frequency from 10 to 810 MHz. Unlike traditional VCXOs,
where a different crystal is required for each output frequency, the Si595
uses one fixed crystal to provide a wide range of output frequencies. This ICbased approach allows the crystal resonator to provide exceptional
frequency stability and reliability. In addition, DSPLL clock synthesis
provides supply noise rejection, simplifying the task of generating low-jitter
clocks in noisy environments. The Si595 IC-based VCXO is factoryconfigurable for a wide variety of user specifications including frequency,
supply voltage, output format, tuning slope, and absolute pull range (APR).
Specific configurations are factory programmed at time of shipment, thereby
eliminating the long lead times associated with custom oscillators.
(Top View)
VC
1
6
VDD
OE
2
5
CLK–
GND
3
4
CLK+
Functional Block Diagram
CLK–
V DD
CLK+
Any-rate
10–810 MHz
DSPLL ®
Clock Synthesis
Fixed
Frequency
XO
ADC
Vc
Rev. 1.2 4/13
OE
GND
Copyright © 2013 by Silicon Laboratories
Si595
Si5 95
1. Electrical Specifications
Table 1. Recommended Operating Conditions
Parameter
Supply Voltage1
Symbol
Test Condition
Min
Typ
Max
VDD
3.3 V option
2.97
3.3
3.63
2.5 V option
2.25
2.5
2.75
1.8 V option
1.71
1.8
1.89
Output enabled
LVPECL
CML
LVDS
CMOS
—
—
—
—
120
110
100
90
135
120
110
100
Tristate mode
—
60
75
VIH
0.75 x VDD
—
—
VIL
—
—
0.5
–40
—
85
Supply Current
IDD
Output Enable (OE)2
Operating Temperature Range
TA
Units
V
mA
V
°C
Notes:
1. Selectable parameter specified by part number. See 3. "Ordering Information" on page 7 for further details.
2. OE pin includes an internal 17 k pullup resistor to VDD for output enable active high or a 17 k pull-down resistor to
GND for output enable active low. See 3. "Ordering Information" on page 7.
Table 2. VC Control Voltage Input
Parameter
Control Voltage Tuning Slope
1,2,3
Control Voltage Linearity4
Symbol
Test Condition
Min
Typ
Max
Units
KV
10 to 90% of VDD
—
45
95
125
185
380
—
ppm/V
LVC
BSL
–5
±1
+5
Incremental
–10
±5
+10
%
Modulation Bandwidth
BW
9.3
10.0
10.7
kHz
VC Input Impedance
ZVC
500
—
—
k
VC Input Capacitance
CVC
—
50
—
pF
—
VDD/2
—
V
VDD
V
Nominal Control Voltage
Control Voltage Tuning Range
VCNOM
@ fO
VC
0
Notes:
1. Positive slope; selectable option by part number. See 3. "Ordering Information" on page 7.
2. For best jitter and phase noise performance, always choose the smallest KV that meets the application’s minimum APR
requirements. See “AN266: VCXO Tuning Slope (KV), Stability, and Absolute Pull Range (APR)” for more information.
3. KV variation is ±10% of typical values.
4. BSL determined from deviation from best straight line fit with VC ranging from 10 to 90% of VDD. Incremental slope
determined with VC ranging from 10 to 90% of VDD.
2
Rev. 1.2
Si595
Table 3. CLK± Output Frequency Characteristics
Parameter
Nominal Frequency1,2,3
Symbol
Test Condition
Min
Typ
Max
fO
LVDS/CML/LVPECL
10
—
810
CMOS
10
—
160
TA = –40 to +85 ºC
–20
–50
—
—
+20
+50
ppm
Temperature Stability1,4
Units
MHz
Absolute Pull Range1,4
APR
±10
—
±370
ppm
Power up Time5
tOSC
—
—
10
ms
Notes:
1. See Section 3. "Ordering Information" on page 7 for further details.
2. Specified at time of order by part number.
3. Nominal output frequency set by VCNOM = VDD/2.
4. Selectable parameter specified by part number.
5. Time from power up or tristate mode to fO.
Table 4. CLK± Output Levels and Symmetry
Parameter
LVPECL Output Option
1
LVDS Output Option2
Symbol
Test Condition
Min
Typ
Max
Units
VO
mid-level
VDD – 1.42
—
VDD – 1.25
V
VOD
swing (diff)
1.1
—
1.9
VPP
VSE
swing (single-ended)
0.55
—
0.95
VPP
VO
mid-level
1.125
1.20
1.275
V
VOD
swing (diff)
0.5
0.7
0.9
VPP
2.5/3.3 V option mid-level
—
VDD – 1.30
—
1.8 V option mid-level
—
VDD – 0.36
—
2.5/3.3 V option swing (diff)
1.10
1.50
1.90
1.8 V option swing (diff)
0.35
0.425
0.50
VOH
0.8 x VDD
—
VDD
VOL
—
—
0.4
LVPECL/LVDS/CML
—
—
350
ps
CMOS with CL = 15 pF
—
2
—
ns
45
—
55
%
VO
CML Output Option
2
VOD
CMOS Output Option3
Rise/Fall time (20/80%)
Symmetry (duty cycle)
tR, tF
SYM
LVPECL:
LVDS:
CMOS:
VDD – 1.3 V (diff)
1.25 V (diff)
VDD/2
V
VPP
V
Notes:
1. 50  to VDD – 2.0 V.
2. Rterm = 100  (differential).
3. CL = 15 pF. Sinking or sourcing 12 mA for VDD = 3.3 V, 6 mA for VDD = 2.5 V, 3 mA for VDD = 1.8 V.
Rev. 1.2
3
Si5 95
Table 5. CLK± Output Phase Jitter
Parameter
Phase Jitter (RMS)1,2
for FOUT of 50 MHz < FOUT
810 MHz
Symbol
J
Test Condition
Min
Typ
Max
Kv = 45 ppm/V
12 kHz to 20 MHz
—
0.5
—
Kv = 95 ppm/V
12 kHz to 20 MHz
—
0.5
—
Kv = 125 ppm/V
12 kHz to 20 MHz
—
0.5
—
Kv = 185 ppm/V
12 kHz to 20 MHz
—
0.5
—
Kv = 380 ppm/V
12 kHz to 20 MHz
—
0.7
—
Units
ps
Notes:
1. Refer to AN256 for further information.
2. For best jitter and phase noise performance, always choose the smallest KV that meets the application’s minimum APR
requirements. See “AN266: VCXO Tuning Slope (KV), Stability, and Absolute Pull Range (APR)” for more information.
Table 6. CLK± Output Period Jitter
Parameter
Period Jitter*
Symbol
Test Condition
Min
Typ
Max
Units
JPER
RMS
—
3
—
ps
Peak-to-Peak
—
35
—
*Note: Any output mode, including CMOS, LVPECL, LVDS, CML. N = 1000 cycles. Refer to AN279 for further information.
Table 7. CLK± Output Phase Noise (Typical)
Offset Frequency
100 Hz
1 kHz
10 kHz
100 kHz
1 MHz
10 MHz
20 MHz
4
74.25 MHz
148.5 MHz
155.52 MHz
185 ppm/V
185 ppm/V
95 ppm/V
LVPECL
LVPECL
LVPECL
–77
–101
–121
–134
–149
–151
–150
–68
–95
–116
–128
–144
–147
–148
–77
–101
–119
–127
–144
–147
–148
Rev. 1.2
Units
dBc/Hz
Si595
Table 8. Environmental Compliance and Package Information
Parameter
Conditions/Test Method
Mechanical Shock
MIL-STD-883, Method 2002
Mechanical Vibration
MIL-STD-883, Method 2007
Solderability
MIL-STD-883, Method 2003
Gross and Fine Leak
MIL-STD-883, Method 1014
Resistance to Solder Heat
MIL-STD-883, Method 2036
Moisture Sensitivity Level
J-STD-020, MSL1
Contact Pads
Gold over Nickel
Table 9. Thermal Characteristics
(Typical values TA = 25 ºC, VDD = 3.3 V)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Thermal Resistance Junction to Ambient
JA
Still Air
—
84.6
—
°C/W
Thermal Resistance Junction to Case
JC
Still Air
—
38.8
—
°C/W
Ambient Temperature
TA
–40
—
85
°C
Junction Temperature
TJ
—
—
125
°C
Table 10. Absolute Maximum Ratings1
Parameter
Symbol
Rating
Units
TAMAX
85
ºC
VDD
–0.5 to +3.8
V
Input Voltage
VI
–0.5 to VDD + 0.3
Storage Temperature
TS
–55 to +125
ºC
ESD
2500
V
TPEAK
260
ºC
tP
20–40
seconds
Maximum Operating Temperature
Supply Voltage
ESD Sensitivity (HBM, per JESD22-A114)
Soldering Temperature (Pb-free profile)2
Soldering Temperature Time @ TPEAK (Pb-free
profile)2
Notes:
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional
operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for
extended periods may affect device reliability.
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download from
www.silabs.com/VCXO for further information, including soldering profiles.
Rev. 1.2
5
Si5 95
2. Pin Descriptions
(Top View)
VC
1
6
VDD
OE
2
5
CLK–
GND
3
4
CLK+
Table 11. Si595 Pin Descriptions
Pin
Name
Type
Function
1
VC
Analog Input
Control Voltage
2
OE*
Input
Output Enable
3
GND
Ground
Electrical and Case Ground
4
CLK+
Output
Oscillator Output
5
CLK–
(N/C for CMOS)
Output
Complementary Output
(N/C for CMOS, do not make external connection)
6
VDD
Power
Power Supply Voltage
*Note: OE pin includes a 17 k resistor to VDD for OE active high option or 17 k to GND for OE active low option.
See 3. "Ordering Information" on page 7.
6
Rev. 1.2
Si595
3. Ordering Information
The Si595 supports a variety of options including frequency, temperature stability, tuning slope, output format, and
VDD. Specific device configurations are programmed into the Si595 at time of shipment. Configurations are
specified using the Part Number Configuration chart shown below. Silicon Labs provides a web browser-based part
number configuration utility to simplify this process. Refer to www.silabs.com/VCXOPartNumber to access this tool
and for further ordering instructions. The Si595 VCXO series is supplied in an industry-standard, RoHS compliant,
lead-free, 6-pad, 5 x 7 mm package. Tape and reel packaging is an ordering option.
595
X
X
XXXMXXX
D
G
R
R = Tape & Reel
Blank = Trays
595 VCXO
Product Family
Operating Temp Range (°C)
G
–40 to +85 °C
Device Revision Letter
Frequency (e.g., 148M500 is 148.5 MHz)
Available frequency range is 10 to 810 MHz. The position of “M” shifts
to denote higher or lower frequencies. If the frequency of interest
requires greater than 6 digit resolution, a six digit code will be
assigned for the specific frequency.
1st Option Code
A
B
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
T
U
V
W
VDD
3.3
3.3
3.3
3.3
2.5
2.5
2.5
2.5
1.8
1.8
3.3
3.3
3.3
3.3
2.5
2.5
2.5
2.5
1.8
1.8
2nd Option Code
Output Format Output Enable Polarity
LVPECL
High
LVDS
High
CMOS
High
CML
High
LVPECL
High
LVDS
High
CMOS
High
CML
High
CMOS
High
CML
High
LVPECL
Low
LVDS
Low
CMOS
Low
CML
Low
LVPECL
Low
LVDS
Low
CMOS
Low
CML
Low
CMOS
Low
CML
Low
Code
A
B
C
D
E
F
G
H
Temperature
Stability
± ppm (max)
20
20
50
20
20
50
50
20
Tuning Slope
Kv
ppm/V (typ)
380
185
185
125
95
125
95
45
3.3 V
370
160
130
100
65
70
35
15
Minimum APR
(±ppm) for VDD @
2.5 V
1.8 V
275
200
110
80
80
50
75
40
50
25
45
10
20
N/A
N/A
N/A
Notes:
1. For best jitter and phase noise performance, always choose the smallest Kv that meets
the application’s minimum APR requirements. Lower Kv options minimize noise
coupling and jitter in real-world PLL designs. See AN266 for more information.
2. APR is the ability of a VCXO to track a signal over the product lifetime. A VCXO with an
APR of ±100 ppm is able to lock to a clock with a ±100 ppm stability over 15 years over
all operating conditions.
3. Nominal Pull range (±) = 0.5 x VDD x tuning slope.
4. Minimum APR values noted above include worst case values for all parameters.
Note:
CMOS available to 160 MHz.
Example Part Number: 595AE148M500DGR is a 5 x 7 mm VCXO in a 6 pad package. The nominal frequency is 148.5 MHz, with a 3.3 V supply,
LVPECL output, and Output Enable active high polarity. Temperature stability is specified as ±20 ppm and the tuning slope is 95 ppm/V. The part is
specified for a –40 to +85 C° ambient temperature range operation and is shipped in tape and reel format.
Figure 1. Part Number Convention
Rev. 1.2
7
Si5 95
4. Outline Diagram and Suggested Pad Layout
Figure 2 illustrates the package details for the Si595. Table 12 lists the values for the dimensions shown in the
illustration.
Figure 2. Si595 Outline Diagram
Table 12. Package Diagram Dimensions (mm)
Dimension
A
b
c
D
D1
e
E
E1
H
L
p
R
aaa
bbb
ccc
ddd
eee
8
Min
1.50
1.30
0.50
4.30
6.10
0.55
1.17
1.80
Nom
1.65
1.40
0.60
5.00 BSC
4.40
2.54 BSC.
7.00 BSC.
6.20
0.65
1.27
—
0.70 REF
0.15
0.15
0.10
0.10
0.50
Rev. 1.2
Max
1.80
1.50
0.70
4.50
6.30
0.75
1.37
2.60
Si595
5. Si5xx Mark Specification
Figure 3 illustrates the mark specification for the Si595. Table 13 lists the line information.
Figure 3. Mark Specification
Table 13. Si595 Top Mark Description
Line
Position
1
1–10
“SiLabs”+ Part Family Number, 595 (First 3 characters in part number)
2
1–10
Si595: Option1+Option2+Freq(7)+Temp
Si595 w/ 8-digit resolution: Option1+Option2+ConfigNum(6)+Temp
3
Description
Trace Code
Position 1
Pin 1 orientation mark (dot)
Position 2
Product Revision (D)
Position 3–6
Tiny Trace Code (4 alphanumeric characters per assembly release instructions)
Position 7
Year (least significant year digit), to be assigned by assembly site (ex: 2009 = 9)
Position 8–9
Calendar Work Week number (1–53), to be assigned by assembly site
Position 10
“+” to indicate Pb-Free and RoHS-compliant
Rev. 1.2
9
Si5 95
6. 6-Pin PCB Land Pattern
Figure 4 illustrates the 6-pin PCB land pattern for the Si595. Table 14 lists the values for the dimensions shown in
the illustration.
Figure 4. Si595 PCB Land Pattern
Table 14. PCB Land Pattern Dimensions (mm)
Dimension
Min
Max
D2
5.08 REF
e
2.54 BSC
E2
4.15 REF
GD
0.84
—
GE
2.00
—
VD
8.20 REF
VE
7.30 REF
X
1.70 TYP
Y
2.15 REF
ZD
—
6.78
ZE
—
6.30
Notes:
1. Dimensioning and tolerancing per the ANSI Y14.5M-1994 specification.
2. Land pattern design based on IPC-7351 guidelines.
3. All dimensions shown are at maximum material condition (MMC).
4. Controlling dimension is in millimeters (mm).
10
Rev. 1.2
Si595
DOCUMENT CHANGE LIST:
Revision 0.1 to Revision 0.2

Updated Table 5, “CLK± Output Phase Jitter,” on
page 4.
Updated
typical phase jitter from 0.6 to 0.7 ps for
kV = 380 ppm/V.
Revision 0.2 to Revision 1.0






Updated 2.5 V/3.3 V and 1.8 V CML output level
specifications in Table 4 on page 3.
Updated Si595 device to support frequencies up to
810 MHz for LVPECL, LVDS, and CML outputs.
Separated 1.8 V, 2.5 V/3.3 V supply voltage.
specifications for CML output in Table 3 on page 5.
Updated Note 1 of Table 5 on page 4 to refer to
AN256.
Updated Table 8 on page 5 to include the "Moisture
Sensitivity Level" and "Contact Pads" rows.
Updated Figure 3 and Table 13 on page 9 to reflect
specific marking information.
Revision 1.0 to Revision 1.1

Swapped D and E values in Table 12 on page 8.
Revision 1.1 to Revision 1.2

Added Table 9, “Thermal Characteristics,” on
page 5.
Rev. 1.2
11
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