OKI MSM6512

E2E0018-27-Y4
¡ Semiconductor
MSM6502B/6512
¡ Semiconductor
This version:
Jan. 1998
MSM6502B/6512
Previous version: Mar. 1996
Low-power and Built-in LCD Driver 4-Bit Microcontroller
GENERAL DESCRIPTION
The MSM6502B/6512 is a low-power, 4-bit microcontroller implemented in complementary
metal-oxide semiconductor technology.
The device is ideally suited to battery-powered systems such as watches and game machines
because it can directly drive LCDs with up to 108 picture elements.
FEATURES
• ROM
• RAM
• Number of instructions
• Clock oscillation
• Cycle time
• Timer interrupt
• I/O port
Input-output port
Input port
• LCD drive
• Buzzer
• Interrupt
• Stack
:
:
:
:
:
:
2000 words ¥ 8 bits
128 words ¥ 4 bits
68
Crystal 32.768 kHz
91.5 ms
Dual (16,128 Hz)
2 ports ¥ 4 bits
1 port ¥ 4 bits
108 (4 ¥ 27) picture elements
2000/1000/512 Hz/Soft
Three sources (external; two timer sources)
Nesting RAM
Stack pointer = 7 bits
• Power down
: Halt mode available
• Operating power supply voltage : 2.4 V to 3.6 V
• Package options:
56-pin plastic QFP (QFP56-P-910-0.65-K)
: (Product name : MSM6502B-¥¥¥GS-K,
MSM6512-¥¥¥GS-K)
56-pin plastic QFP (QFP56-P-910-0.65-2K) : (Product name : MSM6502B-¥¥¥GS-2K,
MSM6512-¥¥¥GS-2K)
¥¥¥ indicates the code number.
:
:
:
:
:
:
1/12
L
PROGRAM
MEMORY
ROM
2000 ¥ 8bits
8bits
ACC
4bits
ALU
H
H
L
¡ Semiconductor
R
BLOCK DIAGRAM
INSTRUC–
TION
DECODER
C
R
O
M
D
A
T
A
IH
PCR
M L
11bits
11bits
H
4bits
BUS
L
4bits
4bits
P0
4bits
OSC
Timing
Generator
4bits
H
7bits
L
H
PC
M
8bits
H
P0.0
to
P0.3
BZ/BZ OSC1 4 3 2 1
TEST
OSC0 RESET
L
DATA MEMORY
TBC
12bits
RAM 128 ¥ 4bits
LCD Driver
INT
COM1 - 4
SEG0 - 26
VDD
GND
2/12
MSM6502B/6512
P1.0
to
P1.3
DP
R/W
2
P2.0
to
P2.3
L
8bits
8bits
f
P1
L
IDR
I INT. TBF
V
A CONTROL
BZ
CONT
P2
H
SP
¡ Semiconductor
MSM6502B/6512
56
55
54
53
52
51
50
49
48
47
46
45
44
43
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
VDD
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
PIN CONFIGURATION (TOP VIEW)
42
41
40
39
38
37
36
35
34
33
32
31
30
29
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
SEG0
15
16
17
18
19
20
21
22
23
24
25
26
27
28
1
2
3
4
5
6
7
8
9
10
11
12
13
14
RESET
INT
TEST1
TEST2
TEST3
TEST4
VDD
OSC0
OSC1
GND
COM1
COM2
COM3
COM4
P0.0
P0.1
P0.2
P0.3
P1.0
P1.1
P1.2
P1.3
P2.0
P2.1
P2.2
P2.3
BZ
BZ
56-Pin Plastic QFP
3/12
¡ Semiconductor
MSM6502B/6512
PIN DESCRIPTIONS
Pin
Symbol
Description
24
GND
Ground pin
21, 49
VDD
Power supply pins
22
OSC0
Crystal OSC input, internal clock input
23
OSC1
Crystal OSC input, internal clock output
1 to 4
P0.0 to P0.3
Pseudo-bidirectional ports for 4-bit parallel I/O. To input data from these ports,
5 to 8
P1.0 to P1.3
it is necessary to write "1" beforehand.
The port to be selected is specified by the L register. The register contents and
the corresponding specified ports are listed below.
Content of L Register
Port Specified
0, 8
P0
1, 9
P1
2, 0AH
P2
3, 0BH
P3
4, 0CH
P4
5, 0DH
P5
6, 7, OEH, OFH
No designation
Note: P3, P4, and P5 are internal ports.
9 to 12
16
P2.0 to P2.3
Input port for 4-bit parallel input with no latching function.
INT
Input pin to request an interrupt from the external circuit. The input flag is set at
the falling edge of the input signal.
15
RESET
The reset mode starts after "0" is input to the RESET pin for more than 2
machine cycles.
The reset signal has priority over all of other signals and performs the following
operations automatically:
(1) Resets all bits of the PC (program counter) to"0".
(2) Sets all bits of the parallel I/O ports (P0.0 to P1.3) to "1"
(3) Resets the internal register (H, L, ACC, C, P3, P4, P5).
(4) Resets the skip flag.
(5) Resets all bits of the time base counter (TBC).
(6) Resets the interrupt request flag (IRQF).
(7) Resets the interrupt enable flag (EIF).
(8) Resets the master interrupt enable flag (MEIF).
(9) Sets all bits of the stack pointer (SP) to "1" .
(10) Initializes the segment and common outputs.
(11) Sets all bits of the index register (IDR) to "1".
Since the RESET pin is pulled up to VDD by an internal resistor (800 kW), it is
possible to achieve power ON reset by connecting it with an external capacitor.
4/12
¡ Semiconductor
MSM6502B/6512
PIN DESCRIPTIONS (Continued)
Pin
29 to 48
Symbol
LCD Drive Pins
A special AC waveform designed to comply with liquid-crystal properties is
SEG 0 to 26
required for liquid-crystal-drive purposes. The MSM6502B/6512 is equipped with
a 1/4 duty, 1/3 bias liquid-crystal-drive circuit with four common output ports and
50 to 56
25 to 28
Description
COM 1 to 4
27 segments, to enable displays of up to 108 picture elements. On/off selection of
picture elements involves writing "0" or "1" to the corresponding bits in
the RAM 00H to 1AH display area, and subsequent automatic hardware
controlled display. The frame frequency is 64 Hz.
13,14
BZ/BZ
BZ and BZ are used in the generation of alarms and other sounds. The selectable
frequencies include three hardware frequencies (TBC output) of 512, 1024, and
2048 Hz, and a software type based on P5.0 data. These frequencies are selected
at P3. When one of the hardware frequencies is selected by P3, output of that
frequency is continuous. But selection of the software type results in output of the
P5.0 contents to generate a melody by program.
5/12
¡ Semiconductor
MSM6502B/6512
ABSOLUTE MAXIMUM RATINGS
Parameter
Power Supply Voltage
Symbol
Condition
Rating
–0.3 to +7
V
Ta=25°C
–0.3 to VDD
V
–0.3 to VDD
V
VDD
Unit
Input Voltage
VI
Output Voltage
VO
Power Dissipation
PD
Ta=25°C per package
200
mW
TSTG
—
–55 to +150
°C
Range
Unit
Storage Temperature
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Condition
Power Supply Voltage
VDD
fOSC£32.768 kHz
2.4 to 3.6
V
Operating Temperature
Top
—
–20 to +70
°C
6/12
¡ Semiconductor
MSM6502B/6512
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD=3 V, Ta=–20 to +70°C)
Parameter
Symbol
Condition
Min.
"H" Input Voltage
VIH
—
2.6
—
—
V
"L" Input Voltage
VIL
—
—
—
0.4
V
"H" Output Voltage (*1)
VOH
IO=–1.0 mA
2.0
—
—
V
"L" Output Voltage (*2)
VOL
IO=1.0 mA
—
—
1.0
V
2.8
—
3.0
V
1.8
—
2.2
V
0.8
—
1.2
V
0.0
—
0.2
V
2/–2
mA
V3
V2
LCD Drive
Output Voltage (*3)
V1
V0
MSM6502B
IO=–5 mA
MSM6512
IO=–2 mA
MSM6502B
IO=±2 mA
MSM6512
IO=±0.5 mA
MSM6502B
IO=±2 mA
MSM6512
IO=±0.5 mA
MSM6502B
IO=5 mA
MSM6512
IO=2 mA
Typ.
OSC0 Input Current
IIH/IIL
VI=VDD/VI=0 V
—
—
Max.
Unit
Input Current (*4)
IIH/IIL
VI=VDD/VI=0 V
—
—
1/–10
mA
Input Current (*5)
IIH/IIL
VI=VDD/VI=0 V
—
—
1000/–1
mA
Input Current (*6)
IIH/IIL
VI=VDD/VI=0 V
—
—
1/–10
mA
IOH
VO=0 V
—
—
–50
mA
MSM6502B fOSC=32.768
—
45
70
MSM6512 kHz at no load
—
30
55
—
30
40
—
12
25
—
15
25
—
5
15
—
—
10
P0, P1 "H" Output Current
IDD
Current Consumption
IDDHLT
IDDS
Oscillation Start Time
MSM6502B fOSC=32.768
kHz at HLT
MSM6512
execution
MSM6502B
Static
MSM6512
TOSC
—
mA
mA
mA
sec
*1 Applied to BZ, BZ
*2 Applied to BZ, BZ, P0, P1
*3 Applied to COM1-4, SEG0-26
V3
V2
V1
V0
*4 Applied to RESET, INT
*5 Applied to P2 (When input is disabled)
*6 Applied to P2 (When input is enabled)
7/12
¡ Semiconductor
MSM6502B/6512
Switching Characteristics
(VDD=3 V, Ta=–20 to +70°C)
Symbol
Condition
Min.
Typ.
Max.
Unit
Clock (OSC0) Pulse Width
Parameter
tfW
—
15
—
—
ms
Cycle Time
tCY
—
(*1)
—
—
ms
tDV
—
(*2)
—
—
ms
tDIV
—
—
—
(*3)
ms
tDDS
CL=50 pF
—
—
(*4)
ms
P0
P1 Data Valid Time
P2
P0
P1 Data Invalid Time
P2
P0
P1
*1
*2
*3
*4
Data Delay Time
tCY=3 ¥ 1/fOSC
tDV=1/2 ¥ 1/fOSC
tDIV=1 ¥ 1/fOSC + 10 ms
tDDS=5/2 ¥ 1/fOSC + 15 ms
1MC
tCY
OSC0
tfW
P0
P1 Input mode
P2
P0 Output mode
P1
tfW
INVALID
VALID
tDIV
tDV
INVALID
OLD DATA
NEW DATA
tDDS
8/12
¡ Semiconductor
MSM6502B/6512
Operating Characteristics (MSM6502B)
High-level Output Current (IOH) - Output
Voltage (VOH)
Low-level Output Current (IOL) - Output
Voltage (VOL)
(VDD=3 V, Ta=25°C)
–5
–3
BZ, BZ pins
–2
–1
IOL (mA)
IOH (mA)
–4
(COM, SEG pins)
(P0, P1 pins)
0 1 2 3 4 5 6 7 8 9 10
VOH (V)
I1, I2 (mA)
Middle-level Output Current (I1, I2) - Output
Voltage (V1, V2)
25
20
15
10
2
0
–5
–10
–15
–20
–25
(VDD=3 V, Ta=25°C)
(P0, P1 pins)
(BZ, BZ pins)
COM, SEG pins
0 1 2 3 4 5 6 7 8 9 10
VOL (V)
Current Consumption (IDD) - Power Supply
Voltage (VDD)
(VDD=3 V, Ta=25°C)
10m
5m
(Ta=25°C, no load)
V1 V2
1m
500m
(COM, SEG pins)
100m
50m
0 1 2 3 4 5 6 7 8 9 10
V1, V2 (V)
IDD (A)
0
10
9
8
7
6
5
4
3
2
1
0
fOSC=32.768 kHz
0Hz
10m
5m
1m
500n
100n
0 1 2 3 4 5 6 7 8 9 10
VDD (V)
9/12
¡ Semiconductor
MSM6502B/6512
Operating Characteristics (MSM6512)
High-level Output Current (IOH) - Output
Voltage (VOH)
Low-level Output Current (IOL) - Output
Voltage (VOL)
(VDD=3 V, Ta=25°C)
–5
–3
(BZ, BZ pins)
–2
–1
IOL (mA)
IOH (mA)
–4
(COM, SEG pins)
(P0, P1 pins)
0 1 2 3 4 5 6 7 8 9 10
VOH (V)
I1, I2 (mA)
Middle-level Output Current (I1, I2) - Output
Voltage (V1, V2)
25
20
15
10
2
0
–5
–10
–15
–20
–25
(VDD=3 V, Ta=25°C)
(P0, P1 pins)
(BZ, BZ pins)
(COM, SEG pins)
0 1 2 3 4 5 6 7 8 9 10
VOL (V)
Current Consumption (IDD) - Power Supply
Voltage (VDD)
(VDD=3 V, Ta=25°C)
10m
5m
(Ta=25°C, no load)
V1 V2
1m
500m
(COM, SEG pins)
100m
50m
0 1 2 3 4 5 6 7 8 9 10
V1, V2 (V)
IDD (A)
0
10
9
8
7
6
5
4
3
2
1
0
10m
5m
fOSC=32.768 kHz
0Hz
1m
500n
100n
0 1 2 3 4 5 6 7 8 9 10
VDD (V)
10/12
¡ Semiconductor
MSM6502B/6512
PACKAGE DIMENSIONS
(Unit : mm)
QFP56-P-910-0.65-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.36 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
11/12
¡ Semiconductor
MSM6502B/6512
(Unit : mm)
QFP56-P-910-0.65-2K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.43 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
12/12