E2E0018-27-Y4 ¡ Semiconductor MSM6502B/6512 ¡ Semiconductor This version: Jan. 1998 MSM6502B/6512 Previous version: Mar. 1996 Low-power and Built-in LCD Driver 4-Bit Microcontroller GENERAL DESCRIPTION The MSM6502B/6512 is a low-power, 4-bit microcontroller implemented in complementary metal-oxide semiconductor technology. The device is ideally suited to battery-powered systems such as watches and game machines because it can directly drive LCDs with up to 108 picture elements. FEATURES • ROM • RAM • Number of instructions • Clock oscillation • Cycle time • Timer interrupt • I/O port Input-output port Input port • LCD drive • Buzzer • Interrupt • Stack : : : : : : 2000 words ¥ 8 bits 128 words ¥ 4 bits 68 Crystal 32.768 kHz 91.5 ms Dual (16,128 Hz) 2 ports ¥ 4 bits 1 port ¥ 4 bits 108 (4 ¥ 27) picture elements 2000/1000/512 Hz/Soft Three sources (external; two timer sources) Nesting RAM Stack pointer = 7 bits • Power down : Halt mode available • Operating power supply voltage : 2.4 V to 3.6 V • Package options: 56-pin plastic QFP (QFP56-P-910-0.65-K) : (Product name : MSM6502B-¥¥¥GS-K, MSM6512-¥¥¥GS-K) 56-pin plastic QFP (QFP56-P-910-0.65-2K) : (Product name : MSM6502B-¥¥¥GS-2K, MSM6512-¥¥¥GS-2K) ¥¥¥ indicates the code number. : : : : : : 1/12 L PROGRAM MEMORY ROM 2000 ¥ 8bits 8bits ACC 4bits ALU H H L ¡ Semiconductor R BLOCK DIAGRAM INSTRUC– TION DECODER C R O M D A T A IH PCR M L 11bits 11bits H 4bits BUS L 4bits 4bits P0 4bits OSC Timing Generator 4bits H 7bits L H PC M 8bits H P0.0 to P0.3 BZ/BZ OSC1 4 3 2 1 TEST OSC0 RESET L DATA MEMORY TBC 12bits RAM 128 ¥ 4bits LCD Driver INT COM1 - 4 SEG0 - 26 VDD GND 2/12 MSM6502B/6512 P1.0 to P1.3 DP R/W 2 P2.0 to P2.3 L 8bits 8bits f P1 L IDR I INT. TBF V A CONTROL BZ CONT P2 H SP ¡ Semiconductor MSM6502B/6512 56 55 54 53 52 51 50 49 48 47 46 45 44 43 SEG26 SEG25 SEG24 SEG23 SEG22 SEG21 SEG20 VDD SEG19 SEG18 SEG17 SEG16 SEG15 SEG14 PIN CONFIGURATION (TOP VIEW) 42 41 40 39 38 37 36 35 34 33 32 31 30 29 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1 SEG0 15 16 17 18 19 20 21 22 23 24 25 26 27 28 1 2 3 4 5 6 7 8 9 10 11 12 13 14 RESET INT TEST1 TEST2 TEST3 TEST4 VDD OSC0 OSC1 GND COM1 COM2 COM3 COM4 P0.0 P0.1 P0.2 P0.3 P1.0 P1.1 P1.2 P1.3 P2.0 P2.1 P2.2 P2.3 BZ BZ 56-Pin Plastic QFP 3/12 ¡ Semiconductor MSM6502B/6512 PIN DESCRIPTIONS Pin Symbol Description 24 GND Ground pin 21, 49 VDD Power supply pins 22 OSC0 Crystal OSC input, internal clock input 23 OSC1 Crystal OSC input, internal clock output 1 to 4 P0.0 to P0.3 Pseudo-bidirectional ports for 4-bit parallel I/O. To input data from these ports, 5 to 8 P1.0 to P1.3 it is necessary to write "1" beforehand. The port to be selected is specified by the L register. The register contents and the corresponding specified ports are listed below. Content of L Register Port Specified 0, 8 P0 1, 9 P1 2, 0AH P2 3, 0BH P3 4, 0CH P4 5, 0DH P5 6, 7, OEH, OFH No designation Note: P3, P4, and P5 are internal ports. 9 to 12 16 P2.0 to P2.3 Input port for 4-bit parallel input with no latching function. INT Input pin to request an interrupt from the external circuit. The input flag is set at the falling edge of the input signal. 15 RESET The reset mode starts after "0" is input to the RESET pin for more than 2 machine cycles. The reset signal has priority over all of other signals and performs the following operations automatically: (1) Resets all bits of the PC (program counter) to"0". (2) Sets all bits of the parallel I/O ports (P0.0 to P1.3) to "1" (3) Resets the internal register (H, L, ACC, C, P3, P4, P5). (4) Resets the skip flag. (5) Resets all bits of the time base counter (TBC). (6) Resets the interrupt request flag (IRQF). (7) Resets the interrupt enable flag (EIF). (8) Resets the master interrupt enable flag (MEIF). (9) Sets all bits of the stack pointer (SP) to "1" . (10) Initializes the segment and common outputs. (11) Sets all bits of the index register (IDR) to "1". Since the RESET pin is pulled up to VDD by an internal resistor (800 kW), it is possible to achieve power ON reset by connecting it with an external capacitor. 4/12 ¡ Semiconductor MSM6502B/6512 PIN DESCRIPTIONS (Continued) Pin 29 to 48 Symbol LCD Drive Pins A special AC waveform designed to comply with liquid-crystal properties is SEG 0 to 26 required for liquid-crystal-drive purposes. The MSM6502B/6512 is equipped with a 1/4 duty, 1/3 bias liquid-crystal-drive circuit with four common output ports and 50 to 56 25 to 28 Description COM 1 to 4 27 segments, to enable displays of up to 108 picture elements. On/off selection of picture elements involves writing "0" or "1" to the corresponding bits in the RAM 00H to 1AH display area, and subsequent automatic hardware controlled display. The frame frequency is 64 Hz. 13,14 BZ/BZ BZ and BZ are used in the generation of alarms and other sounds. The selectable frequencies include three hardware frequencies (TBC output) of 512, 1024, and 2048 Hz, and a software type based on P5.0 data. These frequencies are selected at P3. When one of the hardware frequencies is selected by P3, output of that frequency is continuous. But selection of the software type results in output of the P5.0 contents to generate a melody by program. 5/12 ¡ Semiconductor MSM6502B/6512 ABSOLUTE MAXIMUM RATINGS Parameter Power Supply Voltage Symbol Condition Rating –0.3 to +7 V Ta=25°C –0.3 to VDD V –0.3 to VDD V VDD Unit Input Voltage VI Output Voltage VO Power Dissipation PD Ta=25°C per package 200 mW TSTG — –55 to +150 °C Range Unit Storage Temperature RECOMMENDED OPERATING CONDITIONS Parameter Symbol Condition Power Supply Voltage VDD fOSC£32.768 kHz 2.4 to 3.6 V Operating Temperature Top — –20 to +70 °C 6/12 ¡ Semiconductor MSM6502B/6512 ELECTRICAL CHARACTERISTICS DC Characteristics (VDD=3 V, Ta=–20 to +70°C) Parameter Symbol Condition Min. "H" Input Voltage VIH — 2.6 — — V "L" Input Voltage VIL — — — 0.4 V "H" Output Voltage (*1) VOH IO=–1.0 mA 2.0 — — V "L" Output Voltage (*2) VOL IO=1.0 mA — — 1.0 V 2.8 — 3.0 V 1.8 — 2.2 V 0.8 — 1.2 V 0.0 — 0.2 V 2/–2 mA V3 V2 LCD Drive Output Voltage (*3) V1 V0 MSM6502B IO=–5 mA MSM6512 IO=–2 mA MSM6502B IO=±2 mA MSM6512 IO=±0.5 mA MSM6502B IO=±2 mA MSM6512 IO=±0.5 mA MSM6502B IO=5 mA MSM6512 IO=2 mA Typ. OSC0 Input Current IIH/IIL VI=VDD/VI=0 V — — Max. Unit Input Current (*4) IIH/IIL VI=VDD/VI=0 V — — 1/–10 mA Input Current (*5) IIH/IIL VI=VDD/VI=0 V — — 1000/–1 mA Input Current (*6) IIH/IIL VI=VDD/VI=0 V — — 1/–10 mA IOH VO=0 V — — –50 mA MSM6502B fOSC=32.768 — 45 70 MSM6512 kHz at no load — 30 55 — 30 40 — 12 25 — 15 25 — 5 15 — — 10 P0, P1 "H" Output Current IDD Current Consumption IDDHLT IDDS Oscillation Start Time MSM6502B fOSC=32.768 kHz at HLT MSM6512 execution MSM6502B Static MSM6512 TOSC — mA mA mA sec *1 Applied to BZ, BZ *2 Applied to BZ, BZ, P0, P1 *3 Applied to COM1-4, SEG0-26 V3 V2 V1 V0 *4 Applied to RESET, INT *5 Applied to P2 (When input is disabled) *6 Applied to P2 (When input is enabled) 7/12 ¡ Semiconductor MSM6502B/6512 Switching Characteristics (VDD=3 V, Ta=–20 to +70°C) Symbol Condition Min. Typ. Max. Unit Clock (OSC0) Pulse Width Parameter tfW — 15 — — ms Cycle Time tCY — (*1) — — ms tDV — (*2) — — ms tDIV — — — (*3) ms tDDS CL=50 pF — — (*4) ms P0 P1 Data Valid Time P2 P0 P1 Data Invalid Time P2 P0 P1 *1 *2 *3 *4 Data Delay Time tCY=3 ¥ 1/fOSC tDV=1/2 ¥ 1/fOSC tDIV=1 ¥ 1/fOSC + 10 ms tDDS=5/2 ¥ 1/fOSC + 15 ms 1MC tCY OSC0 tfW P0 P1 Input mode P2 P0 Output mode P1 tfW INVALID VALID tDIV tDV INVALID OLD DATA NEW DATA tDDS 8/12 ¡ Semiconductor MSM6502B/6512 Operating Characteristics (MSM6502B) High-level Output Current (IOH) - Output Voltage (VOH) Low-level Output Current (IOL) - Output Voltage (VOL) (VDD=3 V, Ta=25°C) –5 –3 BZ, BZ pins –2 –1 IOL (mA) IOH (mA) –4 (COM, SEG pins) (P0, P1 pins) 0 1 2 3 4 5 6 7 8 9 10 VOH (V) I1, I2 (mA) Middle-level Output Current (I1, I2) - Output Voltage (V1, V2) 25 20 15 10 2 0 –5 –10 –15 –20 –25 (VDD=3 V, Ta=25°C) (P0, P1 pins) (BZ, BZ pins) COM, SEG pins 0 1 2 3 4 5 6 7 8 9 10 VOL (V) Current Consumption (IDD) - Power Supply Voltage (VDD) (VDD=3 V, Ta=25°C) 10m 5m (Ta=25°C, no load) V1 V2 1m 500m (COM, SEG pins) 100m 50m 0 1 2 3 4 5 6 7 8 9 10 V1, V2 (V) IDD (A) 0 10 9 8 7 6 5 4 3 2 1 0 fOSC=32.768 kHz 0Hz 10m 5m 1m 500n 100n 0 1 2 3 4 5 6 7 8 9 10 VDD (V) 9/12 ¡ Semiconductor MSM6502B/6512 Operating Characteristics (MSM6512) High-level Output Current (IOH) - Output Voltage (VOH) Low-level Output Current (IOL) - Output Voltage (VOL) (VDD=3 V, Ta=25°C) –5 –3 (BZ, BZ pins) –2 –1 IOL (mA) IOH (mA) –4 (COM, SEG pins) (P0, P1 pins) 0 1 2 3 4 5 6 7 8 9 10 VOH (V) I1, I2 (mA) Middle-level Output Current (I1, I2) - Output Voltage (V1, V2) 25 20 15 10 2 0 –5 –10 –15 –20 –25 (VDD=3 V, Ta=25°C) (P0, P1 pins) (BZ, BZ pins) (COM, SEG pins) 0 1 2 3 4 5 6 7 8 9 10 VOL (V) Current Consumption (IDD) - Power Supply Voltage (VDD) (VDD=3 V, Ta=25°C) 10m 5m (Ta=25°C, no load) V1 V2 1m 500m (COM, SEG pins) 100m 50m 0 1 2 3 4 5 6 7 8 9 10 V1, V2 (V) IDD (A) 0 10 9 8 7 6 5 4 3 2 1 0 10m 5m fOSC=32.768 kHz 0Hz 1m 500n 100n 0 1 2 3 4 5 6 7 8 9 10 VDD (V) 10/12 ¡ Semiconductor MSM6502B/6512 PACKAGE DIMENSIONS (Unit : mm) QFP56-P-910-0.65-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.36 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 11/12 ¡ Semiconductor MSM6502B/6512 (Unit : mm) QFP56-P-910-0.65-2K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.43 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 12/12