E2E0015-38-93
¡ Semiconductor
MSM6411A
¡ Semiconductor
This version: MSM6411A
Sep. 1998
Previous version: Mar. 1996
High speed and Simple 4-Bit Microcontroller
GENERAL DESCRIPTION
The MSM6411A, implemented in complementary metal-oxide semiconductor technology, is a
low-power CMOS 4-bit microcontroller developed for smaller-scale control systems.
FEATURES
• ROM
: 1024 words ¥ 8 bits
• RAM
: 32 words ¥ 4 bits
• I/O port
Input-output port
: 2 ports ¥ 4 bits
Input port
: 1 port ¥ 3 bits
• 8-bit serial shift register
• 2 interrupt sources (1 external, 1 internal)
• 63 instructions
• Power-down features
• Minimum instruction execution time : 952 ns @ 4.2 MHz clock
• Single 5 V power supply
• Package:
16-pin plastic DIP (DIP16-P-300-2.54) : (Product name : MSM6411A-¥¥RS)
¥¥ indicates a code number.
1/11
¡ Semiconductor
MSM6411A
BLOCK DIAGRAM
RAM
32 ¥ 4 bits
3
ACC
0
INST.
DEC.
ROM
1024 ¥ 8 bits
DEC
2
SP
P2
2 1 0
INT
0
3
L
DEC
0
P1
3210
ALU
C
H
9
P0
3210
SISO
SCK
I
7
SR
f
O
0
PC
0
INT.C
T.G
RESET OSC0 OSC1
VDD GND
2/11
¡ Semiconductor
MSM6411A
PIN CONFIGURATION (TOP VIEW)
P1.2
1
16 VDD
P1.3
2
15 P1.1
P2.0/INT
3
14 P1.0
P2.1
4
13 P0.3/SI
P2.2
5
12 P0.2/SO
OSC1
6
11 P0.1/SCK
OSC0
7
10 P0.0
GND
8
9 RESET
16-Pin Plastic DIP
PIN DESCRIPTIONS
Pin
Symbol
10
P0.0
11
P0.1/SCK
12
P0.2/SO
13
P0.3/SI
14
P1.0
15
P1.1
1
P1.2
Type
I/O
I/O
2
P1.3
3
P2.0/INT
4
P2.1
5
P2.2
7
OSC0
I
6
OSC1
O
I
Description
4-bit input-output port. P0.1 to P0.3 are used as both
input-output ports and shift register pins.
4-bit input-output port.
3-bit input port with latch. P2.0 is used as both input port
and INT input pin (falling edge trigger input).
System clock input pin.
System clock output pin. This pin and OSC0 pin make up
the oscillator circuit.
During reset
"1"
"1"
Latch is reset.
("0")
Clocked in
—
9
RESET
I
Input pin for system reset.
—
16
VDD
I
Power supply voltage pin.
—
8
GND
I
Ground pin.
—
3/11
¡ Semiconductor
MSM6411A
INSTRUCTION LIST
Arithmetic
Increment and Decrement
Load, Push, Pop, Exchange
Mnemonic
Code
Byte
Cycle
Description
LAI n
90-9F
1
1
A¨n
LLI n
80-8F
1
1
L¨n
LHLI nn
15nn
2
2
HL¨nn
LAL
21
1
1
A¨L
LLA
2D
1
1
L¨A
LAM
38
1
1
A¨M
LMA
2F
1
1
M¨A
LAMD mm
10mm
2
2
A¨Md
LMAD mm
11mm
2
2
Md¨A
LMSR
3E5A
2
2
M(w)¨SR
LSRM
3E52
2
2
SR¨M(w)
PUSH
1C
1
3
ST¨C, A, H, L, SP¨SP – 1
POP
1D
1
3
C, A, H, L¨ST, SP¨SP + 1
X
28
1
1
A¨M
INL
31
1
1
L¨L + 1, SKIP IF L = "0"
INH
32
1
1
H¨H + 1, SKIP IF H = "0"
INM
33
1
1
M¨M + 1, SKIP IF M = "0"
INMD mm
12mm
2
2
Md¨Md – 1, SKIP IF Md = "0"
DCL
35
1
1
L¨L – 1, SKIP IF L = "F"
DCH
36
1
1
H¨H – 1
DCM
37
1
1
M¨M – 1, SKIP IF M = "F"
ADS
02
1
1
A¨A + M, SKIP IF Cy = "1"
ADC
03
1
1
C, A¨C + A + M
AIS n
3E4n
2
2
A¨A + n, SKIP IF Cy = "1"
DAS
0A
1
1
A¨A + 10
AND
0D
1
1
A¨A M
EOR
04
1
1
A¨A M
CMA
0B
1
1
A¨A
CAM
16
1
1
SKIP IF A = M
SC
07
1
1
C¨"1"
RC
08
1
1
C¨"0"
TC
09
1
1
SKIP IF C = "1"
RAL
0E
1
1
A
C¨3¨2¨1¨0¨
4/11
¡ Semiconductor
MSM6411A
INSTRUCTION LIST (continued)
Bit manipulation
Mnemonic
Code
Byte
Cycle
TAB n2
54-57
1
1
SKIP IF [A bit n2] = "1"
TMB n2
58-5B
1
1
SKIP IF [M bit n2] = "1"
RMB n2
68-6B
1
1
[M bit n2]¨"0"
SMB n2
78-7B
1
1
[M bit n2]¨"1"
TPBD p•n2
3D p0 to 3
2
2
SKIP IF [Pp bit n2] = "1"
RPBD p•n2
3D p4 to 7
2
2
[Pp bit n2]¨"0"
SPBD p•n2
3D p8 to B
2
2
[Pp bit n2]¨"1"
3E60
2
2
MEIF¨"1"
MDI
3E61
2
2
MEIF¨"0"
EICT
3DCB
2
2
EICTF¨"1"
EIEX
3DC8
2
2
EIEXF¨"1"
DICT
3DC7
2
2
EICTF¨"0"
DIEX
3DC4
2
2
EIEXF¨"0"
TICT
3DC3
2
2
SKIP IF EICTF = "1"
TIEX
3DC0
2
2
SKIP IF EIEXF = "1"
TQEX
3D20
2
2
SKIP IF IRQEX = "1"
TQSR
3DD3
2
2
SKIP IF IRQSR = "1"
Shift
register
Interrupt
MEI
RQEX
3D24
2
2
IRQEX¨"0"
RQSR
3DD7
2
2
IRQSR¨"0"
ESR
3DBA
2
2
SRF¨"1"
DSR
3DB6
2
2
SRF¨"0"
TSR
Branch
JCP a6
JP a10
Input/
output
CPU
CAL a10
control
Description
RT
3DB2
2
2
SKIP IF SRF = "1"
C0 to FF
1
1
PC¨a6
2
2
PC¨a10
2
4
ST¨PC + 2, PC¨a10, SP¨SP - 1
1
4
PC¨ST, SP¨SP + 1
40 to 43
00 to FF
A0 to A3
00 to FF
IE
IPD p
3DpD
2
2
A¨Pp
OPD p
3DpC
2
2
Pp¨A
STOP
3DB9
2
2
STOP CLOCK
NOP
00
1
1
NO OPERATION
5/11
¡ Semiconductor
MSM6411A
ABSOLUTE MAXIMUM RATINGS
Parameter
Power Supply Voltage
Symbol
Input Voltage
VI
Output Voltage
VO
Power Dissipation
PD
Storage Temperature
Condition
Rating
Unit
–0.3 to +7
V
–0.3 to VDD
V
–0.3 to VDD
V
200 max.
mW
Ta = 25°C per output
50 max.
mW
—
–55 to +150
°C
VDD
TSTG
Ta = 25°C
Ta = 25°C per package
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Power Supply Voltage
VDD
Data-Hold Voltage
VDDH
Operating Temperature
Fan Out
Top
N
Condition
Range
Unit
fOSC £ 1 MHz
3 to 6
V
fOSC £ 4.2 MHz
4.5 to 5.5
V
fOSC £ 0 Hz
2 to 6
V
°C
—
–40 to +85
MOS load
15
TTL load
1
—
6/11
¡ Semiconductor
MSM6411A
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD = 5 V ±10%, Ta = –40 to +85°C)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
"H" Input Voltage
*1,*2
VIH
—
2.4
—
VDD
V
"H" Input Voltage
*3,*4
VIH
—
3.6
—
VDD
V
VIL
—
–0.3
—
+0.8
V
"H" Output Voltage
*1,*5
VOH
IO = –15 mA
4.2
—
—
V
"L" Output Voltage
*1
VOL
IO = 1.6 mA
—
—
0.4
V
"L" Output Voltage
*5
VOL
IO = 15 mA
—
—
0.4
V
Input Current
*3
IIH/IIL
VI = VDD/0 V
—
—
15/–15
mA
Input Current
*2,*4
IIH/IIL
VI = VDD/0 V
—
—
1/–30
mA
"L" Input Voltage
"H" Output Current
*1
IOH
VO = 2.4 V
–0.1
—
—
mA
"H" Output Current
*1
IOH
VO = 0.4 V
—
—
–1.2
mA
—
5
—
—
7
—
VDD = 2 V, no load, Ta = 25°C
—
0.2
5
mA
No load
—
1
100
mA
—
6
12
mA
Input Capacitance
CI
Output Capacitance
CO
Power Supply Current
(In Stop Mode)
Power Supply Current
*1
*2
*3
*4
*5
IDDS
IDD
f = 1 MHz, Ta = 25°C
Crystal oscillation,
no load, 4.2 MHz
pF
Applied to P0 and P1
Applied to P2
Applied to OSC0
Applied to RESET
Applied to OSC1
7/11
¡ Semiconductor
MSM6411A
AC Characteristics
(VDD = 5 V ±10%, Ta = –40 to +85°C)
Symbol
Condition
Min.
Typ.
Max.
Unit
Clock (OSC0) Pulse Width
Parameter
tfW
—
119
—
—
ns
Cycle Time
tCY
—
952
—
—
ns
Input Data Setup Time
tDS
—
120
—
—
ns
Input Data Hold Time
tDH
—
120
—
—
ns
tDW
—
120
—
—
ns
SR Clock Pulse Width
tSW
—
tfW
—
—
ns
SR Data Setup Time
tSS
—
120
—
—
ns
Input Data/Input Clock
Pulse Width
SR Data Hold Time
tSH
—
120
—
—
ns
Data Delay Time
tDR
CL = 15 pF
—
—
tCY + 300
ns
PORT Clock SR Data Delay Time
tSR
CL = 15 pF
—
—
tCY + 480
ns
tSP
CL = 15 pF
—
—
360
ns
tSINH
—
2/8 tCY
—
—
ns
External Clock SR Data Delay
Time
SR Clock Invalid Time
8/11
¡ Semiconductor
MSM6411A
Timing Diagrams
1MC
tCY
OSC0
tfW
P0, P1, P2
tfW
INPUT
DATA
tDS tDH
P0, P1
tDR
P0.2/SO
tSR
P0.1/SCK
tSW
tSW
INPUT
DATA
P0.3/SI
tSS tSH
P0.2/SO
tSP
P2.0/INT
tDW
1MC
OSC0
P0.1/SCK inhibit period
during LMSR INST
tSINH
9/11
¡ Semiconductor
MSM6411A
Operating Characteristics
Current (IOH) vs. Voltage (VOH) for
High State Output
Current (IOL) vs. Voltage (VOL) for
Low State Output
0
(Ta = 25°C)
VDD = 6 V
IOL (mA)
IOH (mA)
(Ta = 25°C)
–1.0
–0.9
–0.8
–0.7
–0.6
–0.5
–0.4
–0.3
–0.2
–0.1
5V
4V
3V
1 2 3 4 5 6 7 8 9 10
VOH (V)
Maximum Clock Frequency (fOSC) vs.
Supply Voltage (VDD)
0
1m
500 m
1 2 3 4 5 6 7 8 9 10
VDD (V)
(CL = 15 pF)
fOSC (MHz)
VDD = 5 V
4V
3V
1 2 3 4 5 6 7 8 9 10
VOL (V)
(Ta = 25°C, no load)
fOSC = 4 MHz
2 MHz
1 MHz
500 kHz
100 kHz
Maximum Clock Frequency (fOSC) vs.
Temperature (Ta)
10
9
8
7
6
5
4
3
2
1
10 m
5m
IDD (A)
fOSC (MHz)
0
6V
Supply Current (IDD) vs. Supply
Voltage (VDD)
(Ta = 25°C, CL = 15 pF)
10
9
8
7
6
5
4
3
2
1
20
18
16
14
12
10
8
6
4
2
100 m
50 m
10 m
5m
0 Hz
1m
500 n
100 n
0 1 2 3 4 5 6 7 8 9 10
VDD (V)
VDD = 5 V
0 –40 –20 0 20 40 60 80 100 120
Ta (°C)
10/11
¡ Semiconductor
MSM6411A
PACKAGE DIMENSIONS
(Unit : mm)
DIP16-P-300-2.54
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.99 TYP.
11/11