Si886xxISO-EVB User's Guide

S i886xxIS O-E V B
S i886 X X I S O - E V B U S E R ’ S G U I D E
Description
This document describes
Si886xxISO-EVB.
Si886xxISO-EVB Overview
the
operation
of
the
Kit Contents
The Si886xxISO Evaluation Kit contains the following
items:


Si886xxISO-EVB
Si88621ED-IS installed on the evaluation board.
Rev. 0.1
Copyright © 2015 by Silicon Laboratories
Si886xxISO-EVB
Si8 86xxI S O - E V B
1. Hardware Overview and Setup
The default configuration of the Si886xxISO-EVB demonstrates the digital isolation capabilities of the installed
Si88621ED-IS as well as its dc-dc converter performance. In this configuration, the dc-dc converter is enabled, the
primary side digital supply is sourced by an external regulator circuit, and the secondary side digital supply is
sourced by the output of the converter. This EVB configuration has a jumper installed at JP9 in the ON position,
JP13 has a jumper installed, and the remaining jumpers not populated.
Note: Do not place jumpers across JP10 or JP11. These are additional test points for VDDA, GNDA and GNDB, and VOUT
respectively.
1.1. DC-DC Converter Input and Output
Supply power to the EVB by applying 24 Vdc to VIN at terminal block J1. LED D21 above terminal block J1
illuminates to show power applied to primary side of the converter.
The isolated dc-dc output, VOUT, is available at terminal block J2. The populated values for R5 and R6 produce a
5 V output at VOUT capable of sourcing up to 5 W to an external load connected to terminal block J2. LED D22
above the terminal block J2 illuminates when the dc-dc converter is operating.
VIN and VOUT test points are available along the upper edge of the EVB.
1.2. Digital Isolator Supplies
The A-side power is provided by a regulator circuit referenced to VREGA pin of the Si888621ED-IS. VIN is stepped
down from 24 V to approximately 4.3 V and applied to VDDA pin.
The B-side power is supplied by the output of the dc-dc converter through JP13.
1.3. Digital Signals
The EVB has a series of header pins for connecting to each digital channel. The inside conductor of each 2x1
header is connected to the device pin and the outer conductor is tied to ground through a resistor of 499 .
Connect digital signals to each side of the Si886xxISO-EVB through a two-row ribbon cable with one row
grounded.
Channel
1 transmits from A1 (JP1 pin 2) to B1 (JP4 pin 1).
Channel 2 transmits from B2 (JP5 pin 1) to A2 (JP2 pin 2).
Note: The digital input signal should not exceed the power supply of the respective side.
1.4. Transformer Current Sensing
Primary side magnetizing current across the sense resistor R12, can be observed by probing TP20, RSNS with
reference to TP33, GNDP.
2
Rev. 0.1
S i8 8 6 x x ISO-E V B
2. Alternative Configurations
2.1. Disabling the DC-DC Converter
The SH_FC input (U1 pin 7) disables the dc-dc converter. JP9 controls the SH_FC input, enabling the converter
when pulled low, ON, and disabling the converter when pulled high, OFF. To disable the dc-dc converter, place the
jumper in the OFF position on JP9.
If interfacing to an external controller through the JP9 header, the controller must drive SH low for normal operation
and high to disable the dc-dc.
Note: When the dc-dc converter is disabled, the B-side can be powered by an active high digital input on the B-side. Ensure B2
input is tri-state or driven low when VDDB is left floating or grounded.
2.2. 3.3 V DC-DC Converter Output
To change VOUT to 3.3 V, change R5 to 43.2 k and R6 to 20.0 k.
2.3. Alternate Supply for VDDA
To bypass the regulator circuit and supply VDDA from a separate supply, remove Q2 and connect positive power
supply through JP9 pin 3 and connect the supply return to J1 pin 2.
2.4. Alternate Supply for VDDB
To supply VDDB from a separate supply, remove the jumper on JP13 and supply desired power through JP13 pin 2
and connect the supply return to J2 pin 1.
Rev. 0.1
3
Si8 86xxI S O - E V B
3. Quick Reference Tables
Table 1. Test Point Descriptions
Test Point
Description
Referenced to
TP1
VIN
GNDA/GNDP
TP2
GNDA/GNDP
N/A
TP3
VOUT
GNDB
TP4
GNDB
N/A
TP5
SHDN
GNDA/GNDP
TP19
COMP
GNDB
TP20
RSNS
GNDA/GNDP
TP33
GNDP
N/A
Table 2. Jumper Descriptions
Jumper
PIN 1*
PIN 2*
PIN 3*
Default Position
Description
JP1
GNDA
(through 499 )
A1
—
Not Installed
Digital Isolator Connector
JP2
GNDA
(through 499 )
A2
—
Not Installed
Digital Isolator Connector
JP5
B1
GNDB
(through 499 )
—
Not Installed
Digital Isolator Connector
JP6
B2
GNDB
(through 499 )
—
Not Installed
Digital Isolator Connector
JP9
GNDA
SHDN
VDDA
Installed
(SHDN - GNDA)
DC-DC Converter Enabled
JP10
VIN
GNDA
—
Not Installed
DO NOT SHORT –
test points only
JP11
GNDB
VOUT
—
Not Installed
DO NOT SHORT –
test points only
JP13
VDDB
VOUT
—
Installed
Connects VDDB to VOUT
*Note: Pin numbering is from left to right.
4
Rev. 0.1
J1
D20
28V
Valid range: 24V +/- 10%
Input Power Supply
1
2
*1
D21
RED
R21
69.8K
Rev. 0.1
1
2
3
SH
JP6
R28
HEADER 1x3
TP5
Si88621
SHDN
VDDA
499
Figure 1. Si886xxISO-EVB Schematic (1 of 2)
JS9
JP9
B2
JP5
JP11
TP4
GNDB
R29
499
A2
B1
TP3
VOUT
499
JP2
A1
U1
VOUT
VIN
R25
JP1
TP1
VIN
499
R24
JP10
TP2
GNDA
VIN
GNDA
VOUT
GNDB
VIN
D22
RED
*2
2
1
J2
DO NOT connect an external power supply to J2
This is an OUTPUT
R22
10K
VOUT
S i8 8 6 x x ISO-E V B
4. Si886xxISO-EVB Schematics
5
Rev. 0.1
A2
A1
SHDN
VDDA
GNDA
VIN
10uF
C2
0.1uF
C14
R14
19.6K
D7
0
10uF
0.47uF
0.1uF
C5
R13
TP20
RSNS
TP33
GNDP
R12
0.1
10
9
8
7
6
5
4
3
2
1
Q1
FDT3612
D6
NI
R15
NI
A2
A1
SS
SH_FC
VREGA
GNDA
VDDA
ESW
RSNS
GNDP
U1
R16
82.0
C19
68pF
1
T1
4 25uH
5
8
Si88621
B2
B1
NC
NC
COMP
VSNS
NC
VREGB
VDDB
GNDB
R8
27.4
11
12
13
14
15
16
17
18
19
20
C8
100pF
COMP
TP19
SBRT5A50SA
D1
Figure 2. Si886xxISO-EVB Schematic (2 of 2)
4.32K
C4
C6
Q2
MMBT2222LT1
NI
C18
ISOLATION
6
For VOUT of 3.3V, change R5 to 43.2k and R6 to 20.0k
Default EVB Converter Configuration:
VIN = 24V +/- 10%
VOUT = 5V
R7
100K
0.1uF
C12
22uF
0.1uF
1.5nF
C11
C10
C9
R6
13.3K
R5
49.9K
JP13
JS13
B2
B1
GNDB
VOUT
Si8 86xxI S O - E V B
S i8 8 6 x x ISO-E V B
5. Si886xxISO-EVB Layout
Top
Bottom
Figure 3. Si886xxISO-EVB Layout
Rev. 0.1
7
Si8 86xxI S O - E V B
6. Bill of Materials
Table 3. Si886xxISO-EVB Bill of Materials
Part Reference
Description
Manufacturer
Manufacturer Part Number
C2
CAP, 10 μF, 50 V, ±20%, X7R, 1210
Venkel
C1210X7R500-106M
C4
CAP, 10 μF, 10 V, ±20%, X7R, 1206
Venkel
C1206X7R100-106M
C5 C9 C12 C14
CAP, 0.1 μF, 10 V, ±10%, X7R, 0603
Venkel
C0603X7R100-104K
C6
CAP, 0.47 μF, 16 V, ±10%, X7R, 0805
Venkel
C0805X7R160-474K
C8
CAP, 100 pF, 50 V, ±10%, X7R, 0603
Venkel
C0603X7R500-101K
C10
CAP, 22 μF, 25 V, ±10%, X7R, 1210
Venkel
C1210X7R250-226M
C11
CAP, 1.5 nF, 25 V, ±10%, X5R, 0603
Venkel
C0603X5R250-152K
C18
CAP, 0.047 μF, 100 V, ±10%, X7R, 0805
Venkel
C0805X7R101-473K
C19
CAP, 68 pF, 100 V, ±10%, C0G, 0603
Venkel
C0603C0G101-680K
D1
DIO, SUPER BARRIER, 50 V, 5.0A, SMA
Diodes Inc.
SBRT5A50SA
D6
DIO, FAST, 200 V, 1.0A, PowerDI-123
Diodes Inc.
DFLU1200-7
D7
RES, 0  1A, ThickFilm, 0603
Venkel
CR0603-16W-000
D20
DIO, ZENER, 28 V, 500 mW, SOD123
On Semi
MMSZ5255BT1G
D21 D22
LED, RED, 631 nM, 20 mA, 2 V, 54mcd, 0603
Lite-On
LTST-C190KRKT
J1 J2
CONN, TERM BLOCK 2POS, 5MM PCB
Phoenix Contact
1729018
JP1 JP2 JP5 JP6
JP10 JP11 JP13
Header, 2x1, 0.1” pitch, Tin Plated
Samtec
TSW-102-07-T-S
JP9
Header, 3x1, 0.1” pitch, Tin Plated
Samtec
TSW-103-07-T-S
JS9 JS13
Shunt, 1x2, 0.1” pitch, Tin plating
Samtec
SNT-100-BK-T
MH1 MH2 MH3
MH4
HDW, Screw, 4-40 x 1/4" Pan Head, Slotted,
Nylon
Richco Plastic Co
NSS-4-4-01
Q1
TRANSISTOR, MOSFET, N-CHNL, 100 V, 3.7A,
3W, Switching, SOT223
Fairchild
FDT3612
Q2
TRANSISTOR, NPN, 30 V, 600 mA, SOT23
On Semi
MMBT2222LT1
R5
RES, 49.9K, 1/16W, ±1%, ThickFilm, 0603
Venkel
CR0603-16W-4992F
R6
RES, 13.3K, 1/16W, ±1%, ThickFilm, 0603
Venkel
CR0603-16W-1332F
R7
RES, 100K, 1/10W, ±1%, ThickFilm, 0603
Venkel
CR0603-10W-1003F
R8
RES, 27.4 ,1/10W, ±1%, ThickFilm, 0603
Venkel
CR0603-10W-27R4F
R12
RES, 0.1 , 1/2W, ±1%, ThickFilm, 1206
Venkel
LCR1206-R100F
R13
RES, 4.32K, 1/10W, ±1%, ThickFilm, 0603
Venkel
CR0603-10W-4321F
R14
RES, 19.6K, 1/16W, ±1%, ThickFilm, 0603
Venkel
CR0603-16W-1962F
8
Rev. 0.1
S i8 8 6 x x ISO-E V B
Table 3. Si886xxISO-EVB Bill of Materials
Part Reference
Description
Manufacturer
Manufacturer Part Number
R15
RES, 10K, 1/10W, ±1%, ThickFilm, 0805
Venkel
CR0805-10W-1002F
R16
RES, 82.0 , 1/10W, ±1%, ThickFilm, 0603
Venkel
CR0603-10W-82R0F
R21
RES, 69.8K, 1/16W, ±1%, ThickFilm, 0603
Venkel
CR0603-16W-6982F
R22
RES, 10K, 1/10W, ±5%, ThickFilm, 0603
Venkel
CR0603-10W-103J
R24 R25 R28 R29
RES, 499 , 1/10W, ±1%, ThickFilm, 0603
Venkel
CR0603-10W-4990F
SO1 SO2 SO3
SO4
HDW, STANDOFF, 1/4" HEX, 4-40x3/4", NYLON
Keystone
1902D
T1
TRANSFORMER, Flyback, 25 μH Primary,
500 nH Leakage, 3:1, SMT
UMEC
UTB02205s
TP1 TP2 TP3 TP4
TP5 TP19 TP20
TP33
TESTPOINT, BLACK, PTH
Kobiconn
151-203-RC
U1
IC, ISOLATOR, DC-DC External Switch, Freq
Control, 2 Digital Ch, SO20 WB
Silicon Labs
Si88621ED-IS
Rev. 0.1
9
Si8 86xxI S O - E V B
7. Si886xxISO-EVB Ordering Guide
Table 4. Si886xxISO-EVB Ordering Guide
10
Ordering Part Number (OPN)
Description
Si886xxISO-KIT
Si886xx dc-dc digital isolator evaluation board kit
Rev. 0.1
S i8 8 6 x x ISO-E V B
CONTACT INFORMATION
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
Tel: 1+(512) 416-8500
Fax: 1+(512) 416-9669
Toll Free: 1+(877) 444-3032
Please visit the Silicon Labs Technical Support web page:
https://www.siliconlabs.com/support/pages/contacttechnicalsupport.aspx
and register to submit a technical support request.
Patent Notice
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Rev. 0.1
11