Si 8 2 6 x - EVB S i826 X LED E MULATOR I NPUT I SODRIVER E VALUATION B OA RD U SER ’ S G UIDE 1. Introduction The Si826x evaluation board allows designers to evaluate Silicon Lab's Si826x family of CMOS based LED Emulator Input ISOdrivers. The Si826x ISOdrivers are pin-compatible, drop-in upgrades for popular opto-coupled gate drivers, such as 0.6 A ACPL-0302/3020, 2.5 A HCPL-3120/ACPL-3130, HCNW3120/3130, and similar optodrivers. The devices are ideal for driving power MOSFETs and IGBTs used in a wide variety of inverter and motor control applications. The Si826x isolated gate drivers utilize Silicon Laboratories' proprietary silicon isolation technology, supporting up to 5.0 kVRMS withstand voltage per UL1577. This technology enables higher-performance, reduced variation with temperature and age, tighter part-to-part matching, and superior common-mode rejection compared to opto-coupled gate drivers. While the input circuit mimics the characteristics of an LED, less drive current is required, resulting in higher efficiency. Propagation delay time is independent of input drive current, resulting in consistently short propagation times, tighter unit-to-unit variation, and greater input circuit design flexibility. As a result, the Si826x series offers longer service life and dramatically higher reliability compared to opto-coupled gate drivers. The evaluation kit consists of four separately orderable boards with each board featuring either the DIP8, SOIC8, SDIP6, or LGA8 package. For more information on configuring the ISOdriver itself, see the Si826x product data sheet and application note “AN677: Using the Si826x Family of Isolated Gate Drivers”. 1.1. Kit Contents Each Si826x Evaluation Kit contains the following items: Si826x Si826x Si8261 based evaluation board as shown in Figures 1 through 4. LED Emulator Input ISOdriver (installed on the evaluation board) (DIP8, SOIC8, SDIP6, LGA8) Figure 1. Si826x DIP8 Evaluation Board Overview Figure 2. Si826x SOIC8 Evaluation Board Overview Rev. 0.1 2/13 Copyright © 2013 by Silicon Laboratories Si826x-EVB Si826x-EVB Figure 3. Si826x SDIP6 Evaluation Board Overview Figure 4. Si826x LGA8 Evaluation Board Overview 2 Rev. 0.1 Si826x-EVB 2. Required Equipment The following equipment is required to demonstrate the evaluation board: 1 digital multimeter multimeter test leads (red and black) 1 oscilloscope (Tektronix TDS 2024B or equivalent) 1 function generator (Agilent 33220A, 20 MHz or equivalent) 1 dc power supply (HP6024A, 30 V dc, 0–100 mA or equivalent) 1 BNC splitter 3 coaxial cables 2 BNC to clip converters (red and black) 2 Banana to clip wires (red and black) Si826x Evaluation Board (board under test) Si826x LED Emulator Input Evaluation Board User's Guide (this document) 2 Rev. 0.1 3 Si826x-EVB 3. Hardware Overview and Demo Figure 5 illustrates the connection diagram to demonstrate the Si826x-DIP8 EVB. The other footprint boards demonstrate in a similar fashion. This demo transmits a 500 kHz (5 V peak, 50 percent duty cycle) square wave through the ISOdriver to its output (Vo). In this example, VDD is powered by a 15 V supply. Figure 6 shows a scope shot of CH1 (input) and CH2 (output). Note that if a user wants to evaluate an LED Emulator Input ISOdriver other than the ones pre-populated, this can be accomplished by removing the installed device and replacing it with the desired footprint-compatible ISOdriver device. Input to Scope CH1 Signal Input (500 kHz, 5 Vpk) Square Wave Output to Scope CH2 + + - - Figure 5. Summary Diagram and Test Setup Figure 6. Oscilloscope Display of Input and Output 4 + Rev. 0.1 Power Supply (15 V, 100 mA) Si826x-EVB 3.1. Board Jumper Settings To run the demo, follow the instructions below. Review Figure 5 and Figures 11 through 14 if necessary. 1. Ensure that JP1 and JP6 are installed as shown in Figure 1, 2, 3, or 4. 3.2. DC Supply Configuration 1. Turn OFF the dc power supply and ensure that the output voltage is set to its lowest output voltage. 2. Connect the banana ends of the black and red banana to clip terminated wires to the outputs of the dc supply. 3. Then, connect the clip end of the red and black banana to clip wires to P2. The red wire goes to Pin1. The black wire goes to Pin3. 4. Turn ON the dc power supply. 5. Adjust the dc power supply to provide 15 V on its output. 6. Ensure that the current draw is less than 25 mA. If it is larger, this indicates that either the board or Si826x has been damaged or the supply is connected backwards. 3.3. Wave Form Generator 1. Turn ON the arbitrary waveform generator with the output disengaged. 2. Adjust its output to provide a 500 kHz, 0 to 5 V peak square wave (50 percent duty cycle) to its output. 3. Split the output of the generator with a BNC splitter. 4. From the BNC splitter, connect a coaxial cable to CH1 of the scope. This will be the input. 5. Connect a second coaxial cable to the BNC splitter, and connect a BNC-to-clip converter to the end of the coaxial cable. 6. From here, connect the clip ends of the BNC-to-clip converter to P1, Pin1 (red wire here) and Pin3 (black wire here). The positive terminal is Pin1 on P1. 7. Connect one end of a third coaxial cable to a BNC-to-clip converter (note that a scope probe can be used here instead). 8. From here, connect the clip end of the BNC-to-clip converter to P2, Pin2 (red wire here) and Pin3 (black wire here). Vo is on P2 Pin2. 9. Connect the other end of the coaxial cable to CH2 of the oscilloscope. This will be the output. 10. Engage the output of the waveform generator. 3.4. Oscilloscope Setup 1. Turn ON the oscilloscope. 2. Set the scope to Trigger on CH1 and adjust the trigger level to 1 V minimum. 3. Set CH1 to 2 V per division. Set CH2 to 5 V per division. 4. Adjust the seconds/division setting to 250 ns/division. 5. Adjust the level indicator for all channels to properly view each channel as shown in Figure 6. A 500 kHz square wave should display on Channel 1 of the scope for the input and a slightly delayed 5 V version of this square wave should display the output on Channel 2, as shown in Figure 6. This concludes the basic demo. For more advanced demos, see the following section. Rev. 0.1 5 Si826x-EVB 3.5. Adjusting Input Signal Frequency and VDD Now is a good time to explore some additional functionality of the board. From here the user can do the following: 1. Slowly adjust VDD down to 13 V and up to 30 V. Then, take the VDD voltage below 12 V. Once below 12 V, it can be seen that the Si826x’s UVLO turns on. In this condition, the output should turn off in which case the square wave disappears. 2. Next, adjust the supply back to 15 V. 3. Another dial the user can adjust is the frequency dial on the square wave generator. Turn this dial from tens of Hz up to several MHz and observe the scope output. 6 Rev. 0.1 Si826x-EVB 4. Open Loop POL Evaluation Board The power and jumper connections descriptions are summarized here: P1 P2 JP1 JP2 JP3 JP4 JP5 JP6 External input signal connections to drive the LED Emulator. External output signal and VDD connections. Jumper when installed bypasses the external bootstrap circuitry. Jumper when installed used to accommodate common-anode drive. Jumper when installed can be used to enable the fast reverse recovery diode. Jumper when installed can be used to add additional load to output. Jumper when installed can be used to bypass the output gate resistor. Jumper when installed used to accommodate common-cathode drive. 4.1. Voltage and Current Sense Test Points The Si826x evaluation board has several test points. These test points correspond to the respective pins on the Si826x integrated circuits as well as other useful inspection points. See Figures 7 through 10 for a silkscreen overview. See schematics in Figures 11 through 14 for more details as well. Figure 7. Si826x DIP8 Evaluation Board Silkscreen Figure 8. Si826x SOIC8 Evaluation Board Silkscreen Rev. 0.1 7 Si826x-EVB Figure 9. Si826x SDIP6 Evaluation Board Silkscreen Figure 10. Si826x LGA8 Evaluation Board Silkscreen 8 Rev. 0.1 TP8 ANODE_EXT CATHODE_EXT GND_EXT P1 NI C6 200pF TP6 TP7 R4 R1 4 2 4 3 2 1 JP6 JP2 3 1 Rev. 0.1 NI NI R2 0 SF1 BUMPER TP4 TP2 SF2 BUMPER 4 3 2 1 GND VO VO VDD SF3 BUMPER SI826X PDIP8 NC CATHODE ANODE NC 5 6 7 8 GND2 C1 10uF JP1 SF4 BUMPER TP5 TP3 TP1 Figure 11. Si826x DIP8 Evaluation Board Schematic 267 267 U1 NI D1 US1K JP5 R3 4.7 JP3 C2 1uF BAS16X CR1 GND2 C3 0.1uF GND2 NI NI JS2 Jumper Shunt JS1 Jumper Shunt C5 200pF GND2 C4 200pF JP4 VDD VO GND2 P2 Si826x-EVB 5. Si826x Evaluation Board Schematics 9 10 TP8 ANODE_EXT CATHODE_EXT GND_EXT P1 NI C6 200pF TP6 TP7 R4 R1 4 2 4 3 2 1 JP6 3 1 JP2 Rev. 0.1 NI NI R2 0 SF1 BUMPER TP4 TP2 NC CATHODE ANODE NC GND VO VO VDD SF3 BUMPER SI826X SOIC8 SF2 BUMPER 4 3 2 1 5 6 7 8 GND2 C1 10uF JP1 SF4 BUMPER TP5 TP3 TP1 Figure 12. Si826x SOIC8 Evaluation Board Schematic 267 267 U1 NI D1 US1K JP5 R3 4.7 JP3 C2 1uF BAS16X CR1 GND2 C3 0.1uF GND2 NI NI JS2 Jumper Shunt JS1 Jumper Shunt C5 200pF GND2 C4 200pF JP4 VDD VO GND2 P2 Si826x-EVB P1 TP8 ANODE_EXT CATHODE_EXT GND_EXT TP7 NI C6 200pF TP6 R4 R1 4 2 4 3 2 1 JP6 JP2 3 1 Rev. 0.1 NI NI R2 0 SF1 BUMPER TP4 TP2 GND VO VDD SF3 BUMPER SI826X SDIP6 CATHODE NC ANODE SF2 BUMPER 3 2 1 4 5 6 GND2 C1 10uF JP1 SF4 BUMPER TP5 TP3 TP1 Figure 13. Si826x SDIP6 Evaluation Board Schematic 267 267 U1 NI D1 US1K JP5 R3 4.7 JP3 C2 1uF BAS16X CR1 GND2 C3 0.1uF GND2 NI NI JS2 Jumper Shunt JS1 Jumper Shunt C5 200pF GND2 C4 200pF JP4 VDD VO GND2 P2 Si826x-EVB 11 12 TP8 ANODE_EXT CATHODE_EXT GND_EXT P1 TP7 NI C6 200pF TP6 R4 R1 4 2 4 3 2 1 JP6 JP2 3 1 Rev. 0.1 NI NI R2 0 SF1 BUMPER TP4 TP2 SI826X LGA8 NC CATHODE ANODE NC SF2 BUMPER 4 3 2 1 5 6 7 8 SF3 BUMPER GND VO VO VDD GND2 C1 10uF JP1 TP1 SF4 BUMPER TP5 TP3 Figure 14. Si826x LGA8 Evaluation Board Schematic 267 267 U1 NI D1 US1K JP5 R3 4.7 JP3 C2 1uF BAS16X CR1 GND2 C3 0.1uF GND2 NI NI JS2 Jumper Shunt JS1 Jumper Shunt C5 200pF GND2 C4 200pF JP4 VDD VO GND2 P2 Si826x-EVB Si826x-EVB 6. Bill of Materials Table 1. Si826x DIP8 Evaluation Board Bill of Materials Item Qty Ref Part # Supplier Description Value 1 1 C1 GRM32DF51H106ZA01L Murata Electronics North America CAP, 10 µF, 50 V, –20% to +80%, Y5V, 1210 10 µF 2 1 C2 C1210X7R101-105K Venkel CAP, 1 µF, 100 V, ±10%, X7R, 1210 1 µF 3 1 C3 C0603X7R101-104M Venkel CAP, 0.1 µF, 100 V, ±20%, X7R, 0603 0.1 µF 4 3 C4, C5, C6 C0805C0G500-201K Venkel CAP, 200 pF, 50 V, ±10%, COG, 0805 200 pF 5 1 CR1 BAS16XV2T1G On Semi DIO, SWITCH, 200 mA, 75 V, SOD523 BAS16X 6 1 D1 US1K-13-F Diodes Inc. DIO, SWITCH, ULT FAST 1 A 800 V, SMA US1K 7 5 JP1, JP2, JP3, JP4, JP5 TSW-102-07-T-S Samtec Header, 2x1, 0.1in pitch, Tin Plated Jumper 8 1 JP6 TSW-102-07-T-D Samtec Header, 2x2, 0.1in pitch, Tin Plated Header 2x2 9 2 JS1, JS2 SNT-100-BK-T Samtec Shunt, 1x2, 0.1in pitch, Tin Plated Jumper Shunt 10 2 P1, P2 TSW-103-07-T-S Samtec Header, 3x1, 0.1in pitch, Tin Plated Header 1x3 11 2 R1, R4 CR0805-10W-2670F Venkel Res, 267 , 1/10 W, ±1%, ThickFilm, 0805 267 12 1 R2 CR0805-10W-000 Venkel Res, 0 , 2 A, ThickFilm, 0805 0 13 1 R3 CR0805-10W-4R7J Venkel Res, 4.7 , 1/10W, ±5%, ThickFilm, 0805 4.7 14 4 SF1, SF2, SF3, SF4 SJ61A6 3M HDW, Bumpon Cylindrical .312X.215 BLK Bumper 15 8 TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8 151-201-RC Kobiconn Testpoint, White, PTH White 16 1 U1 Si8261BCC-C-IP Silicon Labs ISOdriver 3.75 kV emulator input, DIP8, RoHS Si826X DIP8 Rev. 0.1 13 Si826x-EVB Table 2. Si826x SOIC8 Evaluation Board Bill of Materials Item Qty Ref Part # Supplier Description Value 1 1 C1 GRM32DF51H106ZA01L Murata Electronics North America CAP, 10 µF, 50 V, –20% to +80%, Y5V, 1210 10 µF 2 1 C2 C1210X7R101-105K Venkel CAP, 1 µF, 100 V, ±10%, X7R, 1210 1 µF 3 1 C3 C0603X7R101-104M Venkel CAP, 0.1 µF, 100 V, ±20%, X7R, 0603 0.1 µF 4 3 C4, C5, C6 C0805C0G500-201K Venkel CAP, 200 pF, 50 V, ±10%, COG, 0805 200 pF 5 1 CR1 BAS16XV2T1G On Semi DIO, SWITCH, 200 mA, 75 V, SOD523 BAS16X 6 1 D1 US1K-13-F Diodes Inc. DIO, SWITCH, ULT FAST 1 A 800 V, SMA US1K 7 5 JP1, JP2, JP3, JP4, JP5 TSW-102-07-T-S Samtec Header, 2x1, 0.1in pitch, Tin Plated Jumper 8 1 JP6 TSW-102-07-T-D Samtec Header, 2x2, 0.1in pitch, Tin Plated Header 2x2 9 2 JS1, JS2 SNT-100-BK-T Samtec Shunt, 1x2, 0.1in pitch, Tin Plated Jumper Shunt 10 2 P1, P2 TSW-103-07-T-S Samtec Header, 3x1, 0.1in pitch, Tin Plated Header 1x3 11 2 R1, R4 CR0805-10W-2670F Venkel Res, 267 , 1/10 W, ±1%, ThickFilm, 0805 267 12 1 R2 CR0805-10W-000 Venkel Res, 0 , 2 A, ThickFilm, 0805 0 13 1 R3 CR0805-10W-4R7J Venkel Res, 4.7 , 1/10W, ±5%, ThickFilm, 0805 4.7 14 4 SF1, SF2, SF3, SF4 SJ61A6 3M HDW, Bumpon Cylindrical .312X.215 BLK Bumper 15 8 TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8 151-201-RC Kobiconn Testpoint, White, PTH White 16 1 U1 Si8261BCC-C-IS Silicon Labs ISOdriver 3.75 kV emulator input, SOIC8, RoHS Si826X SOIC8 14 Rev. 0.1 Si826x-EVB Table 3. Si826x SDIP6 Evaluation Board Bill of Materials Item Qty Ref Part # Supplier Description Value 1 1 C1 GRM32DF51H106ZA01L Murata Electronics North America CAP, 10 µF, 50 V, –20% to +80%, Y5V, 1210 10 µF 2 1 C2 C1210X7R101-105K Venkel CAP, 1 µF, 100 V, ±10%, X7R, 1210 1 µF 3 1 C3 C0603X7R101-104M Venkel CAP, 0.1 µF, 100 V, ±20%, X7R, 0603 0.1 µF 4 3 C4, C5, C6 C0805C0G500-201K Venkel CAP, 200 pF, 50 V, ±10%, COG, 0805 200 pF 5 1 CR1 BAS16XV2T1G On Semi DIO, SWITCH, 200 mA, 75 V, SOD523 BAS16X 6 1 D1 US1K-13-F Diodes Inc. DIO, SWITCH, ULT FAST 1 A 800 V, SMA US1K 7 5 JP1, JP2, JP3, JP4, JP5 TSW-102-07-T-S Samtec Header, 2x1, 0.1in pitch, Tin Plated Jumper 8 1 JP6 TSW-102-07-T-D Samtec Header, 2x2, 0.1in pitch, Tin Plated Header 2x2 9 2 JS1, JS2 SNT-100-BK-T Samtec Shunt, 1x2, 0.1in pitch, Tin Plated Jumper Shunt 10 2 P1, P2 TSW-103-07-T-S Samtec Header, 3x1, 0.1in pitch, Tin Plated Header 1x3 11 2 R1, R4 CR0805-10W-2670F Venkel Res, 267 , 1/10 W, ±1%, ThickFilm, 0805 267 12 1 R2 CR0805-10W-000 Venkel Res, 0 , 2 A, ThickFilm, 0805 0 13 1 R3 CR0805-10W-4R7J Venkel Res, 4.7 , 1/10W, ±5%, ThickFilm, 0805 4.7 14 4 SF1, SF2, SF3, SF4 SJ61A6 3M HDW, Bumpon Cylindrical .312X.215 BLK Bumper 15 8 TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8 151-201-RC Kobiconn Testpoint, White, PTH White 16 1 U1 Si8261BCD-C-IS Silicon Labs ISOdriver 5 kV emulator input, SDIP6, RoHS Si826X SDIP6 Rev. 0.1 15 Si826x-EVB Table 4. Si826x LGA8 Evaluation Board Bill of Materials Item Qty Ref Part # Supplier Description Value 1 1 C1 GRM32DF51H106ZA01L Murata Electronics North America CAP, 10 µF, 50 V, –20% to +80%, Y5V, 1210 10 µF 2 1 C2 C1210X7R101-105K Venkel CAP, 1 µF, 100 V, ±10%, X7R, 1210 1 µF 3 1 C3 C0603X7R101-104M Venkel CAP, 0.1 µF, 100 V, ±20%, X7R, 0603 0.1 µF 4 3 C4, C5, C6 C0805C0G500-201K Venkel CAP, 200 pF, 50 V, ±10%, COG, 0805 200 pF 5 1 CR1 BAS16XV2T1G On Semi DIO, SWITCH, 200 mA, 75 V, SOD523 BAS16X 6 1 D1 US1K-13-F Diodes Inc. DIO, SWITCH, ULT FAST 1 A 800 V, SMA US1K 7 5 JP1, JP2, JP3, JP4, JP5 TSW-102-07-T-S Samtec Header, 2x1, 0.1in pitch, Tin Plated Jumper 8 1 JP6 TSW-102-07-T-D Samtec Header, 2x2, 0.1in pitch, Tin Plated Header 2x2 9 2 JS1, JS2 SNT-100-BK-T Samtec Shunt, 1x2, 0.1in pitch, Tin Plated Jumper Shunt 10 2 P1, P2 TSW-103-07-T-S Samtec Header, 3x1, 0.1in pitch, Tin Plated Header 1x3 11 2 R1, R4 CR0805-10W-2670F Venkel Res, 267 , 1/10 W, ±1%, ThickFilm, 0805 267 12 1 R2 CR0805-10W-000 Venkel Res, 0 , 2 A, ThickFilm, 0805 0 13 1 R3 CR0805-10W-4R7J Venkel Res, 4.7 , 1/10W, ±5%, ThickFilm, 0805 4.7 14 4 SF1, SF2, SF3, SF4 SJ61A6 3M HDW, Bumpon Cylindrical .312X.215 BLK Bumper 15 8 TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8 151-201-RC Kobiconn Testpoint, White, PTH White 16 1 U1 Si8261BCD-C-IM Silicon Labs ISOdriver 5 kV emulator input, LGA8, RoHS Si826X LGA8 16 Rev. 0.1 Si826x-EVB 7. Ordering Guide Table 5. Si826x Evaluation Board Ordering Guide Ordering Part Number (OPN) Si826xDIP8-KIT Description Si826x ISOdriver Evaluation Board Kit featuring DIP8 Package Si826xSOIC8-KIT Si826x ISOdriver Evaluation Board Kit featuring SOIC8 Package Si826xSDIP6-KIT Si826x ISOdriver Evaluation Board Kit featuring SDIP6 Package Si826xLGA8-KIT Si826x ISOdriver Evaluation Board Kit featuring LGA8 Package Rev. 0.1 17 Smart. Connected. Energy-Friendly Products Quality www.silabs.com/products www.silabs.com/quality Support and Community community.silabs.com Disclaimer Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. 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