SL23EP09

SL23EP09
Low Jitter and Skew 10 to 220 MHz Zero Delay Buffer (ZDB)
Key Features

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Description
10 to 220 MHz operating frequency range
Low output clock skew: 45ps-typ
Low output clock jitter:
 50 ps-typ cycle-to-cycle jitter
 20 ps-typ period jitter
Low part-to-part output skew: 90 ps-typ
Wide 2.5 V to 3.3 V power supply range
Low power dissipation:
 26 mA-max at 66 MHz and VDD=3.3 V
 24 mA-max at 66 MHz and VDD=2.5V
One input drives 9 outputs organized as 4+4+1
Select mode to bypass PLL or tri-state outputs
SpreadThru™ PLL that allows use of SSCG
Standard and High-Drive options
Available in 16-pin SOIC and TSSOP packages
Available in Commercial and Industrial grades
Applications


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The SL23EP09 is a low skew, low jitter and low power Zero
Delay Buffer (ZDB) designed to produce up to nine (9) clock
outputs from one (1) reference input clock, for high speed
clock distribution applications.
The product has an on-chip PLL which locks to the input
clock at CLKIN and receives its feedback internally from the
CLKOUT pin.
The SL23EP09 has two (2) clock driver banks each with four
(4) clock outputs. These outputs are controlled by two (2)
select input pins S1 and S2. When only four (4) outputs are
needed, four (4) bank-B output clock buffers can be tri-stated
to reduce power dissipation and jitter. The select inputs can
also be used to tri-state both banks A and B or drive them
directly from the input bypassing the PLL and making the
product behave like a Non-Zero Delay Buffer (NZDB).
The high-drive version operates up to 220MHz and 200MHz
at 3.3V and 2.5V power supplies respectively.
Benefits


Printers, MFPs and Digital Copiers
PCs and Work Stations
Routers, Switchers and Servers
Digital Embeded Systems


Up to nine (9) distribution of input clock
Standard and High-Dirive levels to control impedance
level, frequency range and EMI
Low power dissipation, jitter and skew
Low cost
Block Diagram
Low Power and
Low Jitter
PLL
MUX
CLKOUT
CLKIN
CLKA1
CLKA2
CLKA3
CLKA4
S2
Input Selection
Decoding Logic
S1
CLKB1
CLKB2
CLKB3
2
2
CLKB4
VDD
GND
Rev 2.0, May 12, 2008
2400 West Cesar Chavez, Austin, TX 78701
Page 1 of 14
1+(512) 416-8500
1+(512) 416-9669
www.silabs.com
SL23EP09
Pin Configuration
CLKIN
1
16
CLKOUT
CLKA1
2
15
CLKA2
3
14
CLKA4
CLKA3
VDD
4
13
VDD
GND
5
12
GND
CLKB1
6
11
CLKB2
7
10
CLKB4
CLKB3
S2
8
9
S1
16-Pin SOIC and TSSOP
Pin Description
Pin
Number
Pin Name
Pin Type
Pin Description
1
CLKIN
Input
2
CLKA1
Output
Buffered Clock Output, Bank A. Weak pull-down (250kΩ).
3
CLKA2
Output
Buffered Clock Output, Bank A. Weak pull-down (250kΩ).
4
VDD
Power
3.3V or 2.5V Power Supply.
5
GND
Power
Power Ground.
6
CLKB1
Output
Buffered Clock Output, Bank B. Weak pull-down (250kΩ).
7
CLKB2
Output
Buffered Clock Output, Bank B. Weak pull-down (250kΩ).
8
S2
Input
Select Input, select pin S2. Weak pull-up (250kΩ).
9
S1
Input
Select Input, select pin S1. Weak pull-up (250kΩ).
10
CLKB3
Output
Buffered Clock Output, Bank B. Weak pull-down (250kΩ).
11
CLKB4
Output
Buffered Clock Output, Bank B. Weak pull-down (250kΩ).
12
GND
Power
Power Ground.
13
VDD
Power
3.3V or 2.5V Power Supply.
14
CLKA3
Output
Buffered Clock Output, Bank A. Weak pull-down (250kΩ).
15
CLKA4
Output
Buffered Clock Output, Bank A. Weak pull-down (250kΩ).
16
CLKOUT
Output
Buffered Clock Output, PLL Internal Feedback Output. Weak pull-down (250kΩ).
Rev 2.0, May 12, 2008
Reference Frequency Clock Input. Weak pull-down (250kΩ).
Page 2 of 14
SL23EP09
General Description
Select Input Control
The SL23EP09 is a low skew, low jitter Zero Delay Buffer
with very low operating current.
The SL23EP09 provides two (2) input select control pins
called S1 and S2. This feature enables users to selects
various states of output clock banks-A and bank-B, output
source and PLL shutdown features as shown in the Table 2.
The product includes an on-chip high performance PLL that
locks into the input reference clock and produces nine (9)
output clock drivers tracking the input reference clock for
systems requiring clock distribution.
in addition to CLKOUT that is used for internal PLL
feedback, there are two (2) banks with four (4) outputs in
each bank, bringing the number of total available output
clocks to nine (9).
Input and output Frequency Range
The input and output frequency range is the same. But, it
depends on VDD and drive levels as given in the below
Table 1.
VDD(V)
Drive
Min(MHz)
Max(MHz)
3.3
HIGH
10
220
3.3
STD
10
200
2.5
HIGH
10
180
2.5
STD
10
167
Table 1. Input/Output Frequency Range
The S1 (Pin-9) and S2 (Pin-8) inputs include 250 kΩ weak
pull-up resistors to VDD.
PLL Bypass Mode
If the S2 and S1 pins are logic High(1) and Low(0)
respectively, the on-chip PLL is shutdown and bypassed,
and all the nine output clocks bank A, bank B and CLKOUT
clocks are driven directly from the reference input clock. In
this operation mode SL23EP09 works like a non-ZDB fanout
buffer.
High and Low-Drive Product Options
The SL23EP09 is offered with High-Drive “-1H” and
Standard-Drive “-1” options. These drive options enable the
users to control load levels, frequency range and EMI
control. Refer to the AC electrical tables for the details.
Skew and Zero Delay
If the input clock frequency is DC (GND to VDD), this is
detected by an input frequency detection circuitry and all
nine (9) clock outputs are forced to Hi-Z. The PLL is
shutdown to save power. In this shutdown state, the product
draws less than 12 μA supply current.
All outputs should drive the similar load to achieve output-tooutput skew and input-to-output specifications given in the
AC electrical tables. However, Zero delay between input
and outputs can be adjusted by changing the loading of
CLKOUT relative to the banks A and B clocks since
CLKOUT is the feedback to the PLL.
SpreadThru™ Feature
Power Supply Range (VDD)
If a Spread Spectrum Clock (SSC) were to be used as an
input clock, the SL23EP09 is designed to pass the
modulated Spread Spectrum Clock (SSC) signal from its
reference input to the output clocks. The same spread
characteristics at the input are passed through the PLL and
drivers without any degradation in spread percent (%),
spread profile and modulation frequency
The SL23EP09 is designed to operate in a wide power
supply range from 2.3V (Min) to 3.6V (Max). An internal onchip voltage regulator is used to supply PLL constant power
supply of 1.8V, leading to a consistent and stable PLL
electrical performance in terms of skew, jitter and power
dissipation. Contact SLI for 1.8V power supply version ZDB
called SL23EPL09.
Rev 2.0, May 12, 2008
Page 3 of 14
SL23EP09
S2
S1
Clock A1-A4
Clock B1-4
CLKOUT
Output Source
PLL Status
0
0
Tri-state
Tri-state
Driven
PLL
On
0
1
Driven
Tri-state
Driven
PLL
On
1
0
Driven
Driven
Driven
Reference
Off
1
1
Driven
Driven
Driven
PLL
On
Table 2. Select Input Decoding
CLKIN Input to CLKA or CLKB Delay (ps)
1500
1000
500
0
-30
-25
-20
-15
-10
-5
0
5
10
15
20
25
30
-500
-1000
-1500
Output Load Difference: FBK Load – CLKA or CLKB Load (pF)
Figure 1. CLKIN Input to CLK A and B Delay
(In terms of load difference between CLKOUT and CLK A and B)
Rev 2.0, May 12, 2008
Page 4 of 14
SL23EP09
Absolute Maximum Ratings
Description
Condition
Min.
Max.
Unit
Supply voltage, VDD
– 0.5
4.6
V
All Inputs and Outputs
– 0.5
VDD+0.5
V
Ambient Operating Temperature
In operation, C-Grade
0
70
°C
Ambient Operating Temperature
In operation, I-Grade
– 40
85
°C
Storage Temperature
No power is applied
– 65
150
°C
Junction Temperature
In operation, power is applied
–
125
°C
–
260
°C
Soldering Temperature
ESD Rating (Human Body Model)
JEDECCC22-A114D
-4000
4000
V
ESD Rating (Change Device Model)
JEDECCC22-C101C
-1500
1500
V
ESD Rating (Machine Model)
JEDECCC22-A115D
-200
200
V
Rev 2.0, May 12, 2008
Page 5 of 14
SL23EP09
Operating Conditions: Unless Otherwise Stated VDD=2.3V to 3.6V and for Both C and I Grades
Symbol
Description
Condition
Min.
Max.
Unit
VDD3.3
3.3V Supply Voltage
3.3V+/-10%
3.0
3.6
V
VDD2.5
2.5V Supply Voltage
2.5V+/-10%
2.3
2.7
V
TA
Operating Temperature(Ambient)
Commercial
0
70
°C
–40
85
°C
<220 MHz, 3.3V with High Drive
–
15
pF
<200 MHz, 3.3V with Standard drive
–
15
pF
<180 MHz, 2.5V with High Drive
–
15
pF
<167 MHz, 2.5V with Standard drive
–
15
pF
<200 MHz, 3.3V with High Drive
–
22
pF
<180 MHz, 3.3V with Standard drive
–
22
pF
<167 MHz, 2.5V with High Drive
–
22
pF
<134 MHz, 2.5V with Standard drive
–
22
pF
<133 MHz, 3.3V with High Drive
–
30
pF
<100 MHz, 3.3V with Standard drive
–
30
pF
<80 MHz, 2.5V with High Drive
–
30
pF
<67 MHz, 2.5V with Standard drive
–
30
pF
Input Capacitance
S1, S2 and CLKIN pins
–
5
pF
Pull-up and Pull-down Resistors
Pins-12/3/6/7/8/9/10/11/14/15/16
250kΩ-typ
175
325
kΩ
Closed-loop bandwidth
3.3V, (typical)
1.2
MHz
2.5V, (typical)
0.8
MHz
3.3V, (typical), High drive
29
Ω
3.3V, (typical), Standard drive
41
Ω
2.5V, (typical), High drive
37
Ω
2.5V, (typical), Standard drive
41
Ω
Industrial
CLOAD
CIN
RPU/D
CLBW
ZOUT
Load Capacitance
Output Impedance
Rev 2.0, May 12, 2008
Page 6 of 14
SL23EP09
DC Electrical Specifications (VDD=3.3V): Unless Otherwise Stated for Both C and I Grades
Symbol
Description
Condition
Min
Max
Unit
3.0
3.6
V
VDD
Supply Voltage
VIL
Input LOW Voltage
–
0.8
V
VIH
Input HIGH Voltage
2.0
VDD+0.3
V
IIL
Input Leakage Current
0 < VIN < 0.8V
–
±10
µA
IIH
Input HIGH Current
VIN = VDD
–
100
µA
VOL
Output LOW Voltage
IOL = 8 mA (standard drive)
–
0.4
V
IOL = 12 mA (high drive)
–
0.4
V
IOH = –8 mA (standard drive)
2.4
–
V
IOH = –12 mA (high drive)
2.4
–
V
VOH
Output HIGH Voltage
Power Down Supply Current
CLKIN<2.0MHz
Measured at CLKIN = 0 MHz (C-Grade)
–
12
µA
Measured at CLKIN = 0 MHz (I-Grade)
–
25
µA
IDD1
Power Supply Current
All Outputs CL=0, 66 MHz CLKIN
–
26
mA
IDD2
Power Supply Current
All Outputs CL=0, 133 MHz CLKIN
–
42
mA
IDDPD
DC Electrical Specifications (VDD=2.5V): Unless Otherwise Stated for Both C and I Grades
Symbol
Description
Condition
Min
Max
Unit
2.3
2.7
V
VDD
Supply Voltage
VIL
Input LOW Voltage
–
0.7
V
VIH
Input HIGH Voltage
1.7
VDD+ 0.3
V
IIL
Input Leakage Current
0<VIN < 0.8V
–
10
µA
IIH
Input HIGH Current
VIN = VDD
–
100
µA
VOL
Output LOW Voltage
IOL = 8 mA (standard drive)
–
0.5
V
IOL = 12 mA (high drive)
–
0.5
V
IOH = –8 mA (standard drive)
VDD – 0.6
–
V
IOH = –12 mA (high drive)
VDD – 0.6
–
V
VOH
Output HIGH Voltage
Power Down Supply Current
CLKIN<2MHz
Measured at CLKIN = 0 MHz (C-Grade)
–
12
µA
Measured at CLKIN = 0 MHz (I-Grade)
–
25
µA
IDD1
Power Supply Current
All Outputs CL=0, 66 MHz CLKIN
–
24
mA
IDD2
Power Supply Current
All Outputs CL=0, 133 MHz CLKIN
–
40
mA
IDDPD
Rev 2.0, May 12, 2008
Page 7 of 14
SL23EP09
AC Electrical Specifications (VDD=3.3V and 2.5V)
Symbol
FMAX
INDC
OUTDC
tr/f3.3
tr/f2.5
t1
Description
Maximum Frequency
(Input=Output )
Condition
[1]
Input Duty Cycle
Output Duty
Cycle[2]
(3.3V) [2]
Rise, Fall Time
(Measured at: 0.8 to 2.0V)
Rise, Fall Time (2.5) [2]
(Measured at: 0.6 to 1.8V)
Output-to-Output Skew [9]
(Measured at VDD/2)
t2
t3
Min
Typ
Max
Unit
3.3V High Drive
10
–
220
MHz
3.3V Standard Drive
10
–
200
MHz
2.5V High Drive
10
–
180
MHz
2.5V Standard Drive
10
–
167
MHz
<135 MHz, VDD=3.3V
25
–
75
%
<135 MHz, VDD=2.5V
40
–
60
%
<135 MHz, VDD=3.3V
45
–
55
%
<135 MHz, VDD=2.5V
40
60
%
High drive, CL = 15 pF, <135 MHz
–
–
0.75
ns
Std drive, CL = 15 pF, <170 MHz
–
–
1.5
ns
High drive, CL = 22 pF, <135 MHz
–
–
1.2
ns
Std drive, CL = 22 pF, <135 MHz
–
–
1.6
ns
High drive, CL = 30 pF, <100 MHz
–
–
1.5
ns
Std drive, CL = 30 pF, >100 MHz
–
–
2.5
ns
High drive, CL = 15 pF, <135 MHz
–
–
1.5
ns
Std drive, CL = 15 pF, <135 MHz
–
–
2.5
ns
High drive, CL = 22 pF, <135 MHz
–
–
1.3
ns
High drive, CL = 30 pF, >100 MHz
–
–
2.5
ns
All outputs CL=0, 3.3V supply, 2.5 power
supply, standard drive
–
45
100
ps
All outputs CL=0, 2.5V power supply, high
drive
–
–
110
ps
1.5
–
4.4
ns
PLL enabled @ 3.3V
–100
–
100
ps
PLL enabled @2.5V
–200
–
200
ps
Delay Time, CLKIN Rising
Edge to CLKOUT Rising
Edge[2]
(Measured at VDD/2)
PLL Bypass mode
Part-to-Part Skew[2]
(Measured at VDD/2)
Measured at VDD/2. Any output to any
output, 3.3V supply
–
–
±150
ps
Measured at VDD/2. Any output to any
output, 2.5V supply
–
–
±300
ps
Notes:
1. For the given maximum loading conditions. See CL in Operating Conditions Table.
2. Parameter is guaranteed by design and characterization. Not 100% tested in production.
Rev 2.0, May 12, 2008
Page 8 of 14
SL23EP09
AC Electrical Specifications (VDD=3.3V and 2.5V) (cont.)
Symbol
Description
Condition
Min
Typ
Max
Unit
tPLLOCK
PLL Lock Time[9]
Time from 90% of VDD to valid clocks on all the
output clocks
–
–
1.0
ms
CCJ [2,3]
Cycle-to-cycle Jitter
3.3V supply, >66 MHz, <15 pF, high drive
–
30
60
ps
3.3V supply, >66 MHz, <15 pF, standard drive
–
50
185
ps
2.5V supply, >66 MHz, <15 pF, high drive
–
70
150
ps
2.5V supply, >66 MHz, <15 pF, standard drive
–
100
250
ps
3.3V supply, >66 MHz, <30 pF, high drive
–
50
350
ps
3.3V supply, >66 MHz, <30 pF, standard drive
–
65
250
ps
2.5V supply, >66 MHz, <30 pF, high drive
–
75
430
ps
S2:S1 = 1:0 mode, 3.3V, <15pF, high drive
–
15
40
ps
S2:S1 = 1:0 mode, 3.3V, <15pF, standard drive
–
15
40
ps
S2:S1 = 1:0 mode, 2.5V, <15pF, high drive
–
20
50
ps
S2:S1 = 1:0 mode, 2.5V, <15pF, standard drive
–
20
50
ps
3.3V supply, >100 MHz, <15 pF, standard drive
–
40
90
ps
3.3V supply, 66-100 MHz, <15 pF, standard
drive
–
50
95
ps
2.5V supply, 66-100 MHz, <15 pF, high drive
–
40
85
ps
2.5V supply, >66 MHz, <15 pF, standard drive
–
75
180
ps
2.5V supply, >100 MHz, <15 pF, high drive
–
15
45
ps
S2:S1 = 1:0 mode, 3.3V, <15pF, standard drive
–
25
60
ps
S2:S1 = 1:0 mode, 3.3V, <15pF, high drive
–
25
60
ps
S2:S1 = 1:0 mode, 2.5V, <15pF, standard drive
–
40
80
ps
S2:S1 = 1:0 mode, 2.5V, <15pF, high drive
–
40
80
ps
PPJ
[2,3]
Peak Period Jitter
Notes:
3. Typical jitter is measured at 3.3V or 2.5V, 30C with all outputs driven into the maximum specified load.
Rev 2.0, May 12, 2008
Page 9 of 14
SL23EP09
External Components & Design Considerations
Typical Application Schematic
1
CLKIN
16
CLKOUT
CL
2
4
VDD
0.1μF
CLKA1
CL
SL23EP09
13
VDD
0.1μF
S1
11
CLKB4
9
CL
VDD
S2
8
5
12
GND
GND
Comments and Recommendations
Decoupling Capacitor: A decoupling capacitor of 0.1μF must be used between VDD and VSS pins. Place the capacitor on
the component side of the PCB as close to the VDD pin as possible. The PCB trace to the VDD pin and to the GND via
should be kept as short as possible. Do not use vias between the decoupling capacitor and the VDD pin.
Series Termination Resistor: A series termination resistor is recommended if the distance between the output clocks and
the load is over 1 ½ inch. The nominal impedance of the clock outputs is given on the page 4. Place the series termination
resistors as close to the clock outputs as possible.
Zero Delay and Skew Control: All outputs and CLKIN pins should be loaded with the same load to achieve “Zero Delay”
between the CLKIN and the outputs. The CLKOUT pin is connected to CLKIN internally on-chip for feedback to PLL, and
sees an additional 2 pF load with respect to Bank A and B clocks. For applications requiring zero input/output delay, the load
at the all output pins including the CLKOUT pin must be the same. If any delay adjustment is required, the capacitance at
the CLKOUT pin could be increased or decreased to increase or decrease the delay between Bank A and B clocks and
CLKIN.
For minimum pin-to-pin skew, the external load at all the Bank A and B clocks must be the same.
Rev 2.0, May 12, 2008
Page 10 of 14
SL23EP09
Switching Waveforms
VDD/2
OUTPUT
VDD/2
OUTPUT
t1
Figure 2. Output to Output Skew
VDD/2
INPUT
VDD/2
CLKOUT
t2
Figure 3. Input to Output Skew
VDD/2
Any Output
Part 1 or 2
VDD/2
Any Output
Part 2 or 1
t3
Figure 4. Part-to-Part Skew
Rev 2.0, May 12, 2008
Page 11 of 14
SL23EP09
Package Drawing and Dimensions
16-Lead TSSOP (4.4mm)
9
16
6.250(0.246)
6.500(0.256)
4.300(0.169)
4.500(0.177)
Dimensions are in milimeters(inches).
Top line: (MIN) and Bottom line: (Max)
Pin-1 ID
1
8
2.900(0.114)
3.100(0.122)
1.100(0.043) MAX
0.650(0.025)
BSC
0.050(0.002)
0.150(0.006)
0.850(0.033)
0.950(0.037)
0.076(0.003)
0.190(0.007)
0.300(0.012)
0.650(0.025)
BSC
0.090(0.003)
0.200(0.008)
Gauge
Plane
Seating Plane
0 to 8°
0.500(0.020)
0.700(0.027)
**Dimensions are in inches (millimeters)
Thermal Characteristics
Parameter
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Rev 2.0, May 12, 2008
Symbol
Condition
Min
Typ
Max
Unit
θ JA
Still air
-
105
-
°C/W
θ JA
1m/s air flow
-
95
-
°C/W
θ JA
3m/s air flow
-
90
-
°C/W
θ JC
Independent of air flow
-
35
-
°C/W
Page 12 of 14
SL23EP09
Package Drawing and Dimensions (Cont.)
16-Lead SOIC (150 Mil)
16
9
Dimensions are in milimeters(inches).
Top line: (MIN) and Bottom line: (Max)
0.150(3.810)
0.157(3.987
Pin-1 ID
0.230(5.842)
0.244(6.197)
1
8
0.189(4.800)
0.196(4.978)
0.010(0.2540)
X 45°
0.016(0.406)
0.0075(0.190)
0.0098(0.249)
0.061(1.549)
0.068(1.727)
0.004(0.102)
0.050(1.270)
BSC
0.004(0.102)
0.0098(0.249)
Seating plane
0.016(0.406)
0.035(0.889)
0° to 8°
0.0138(0.350)
0.0192(0.487)
**Dimensions are in inches (millimeters)
Thermal Characteristics
Parameter
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Rev 2.0, May 12, 2008
Symbol
Condition
Min
Typ
Max
Unit
θ JA
Still air
-
80
-
°C/W
θ JA
1m/s air flow
-
74
-
°C/W
θ JA
3m/s air flow
-
71
-
°C/W
θ JC
Independent of air flow
-
44
-
°C/W
Page 13 of 14
SL23EP09
Ordering Information [4]
Ordering Number
Marking
Shipping Package
Package
Temperature
SL23EP09ZC-1
SL23EP09ZC-1
Tube
16-pin TSSOP
0 to 70°C
SL23EP09ZC-1T
SL23EP09ZC-1
Tape and Reel
16-pin TSSOP
0 to 70°C
SL23EP09ZC-1H
SL23EP09ZC-1H
Tube
16-pin TSSOP
0 to 70°C
SL23EP09ZC-1HT
SL23EP09ZC-1H
Tape and Reel
16-pin TSSOP
0 to 70°C
SL23EP09ZI-1
SL23EP09ZI-1
Tube
16-pin TSSOP
-40 to 85°C
SL23EP09ZI-1T
SL23EP09ZI-1
Tape and Reel
16-pin TSSOP
-40 to 85°C
SL23EP09ZI-1H
SL23EP09ZI-1H
Tube
16-pin TSSOP
-40 to 85°C
SL23EP09ZI-1HT
SL23EP09ZI-1H
Tape and Reel
16-pin TSSOP
-40 to 85°C
SL23EP09SC-1
SL23EP09SC-1
Tube
16-pin SOIC
0 to 70°C
SL23EP09SC-1T
SL23EP09SC-1
Tape and Reel
16-pin SOIC
0 to 70°C
SL23EP09SC-1H
SL23EP09SC-1H
Tube
16-pin SOIC
0 to 70°C
SL23EP09SC-1HT
SL23EP09SC-1H
Tape and Reel
16-pin SOIC
0 to 70°C
SL23EP09SI-1
SL23EP09SI-1
Tube
16-pin SOIC
-40 to 85°C
SL23EP09SI-1T
SL23EP09SI-1
Tape and Reel
16-pin SOIC
-40 to 85°C
SL23EP09SI-1H
SL23EP09SI-1H
Tube
16-pin SOIC
-40 to 85°C
SL23EP09SI-1HT
SL23EP09SI-1H
Tape and Reel
16-pin SOIC
-40 to 85°C
Notes:
4. The SL23EP09 products are RoHS compliant.
Rev 2.0, May 12, 2008
Page 14 of 14
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