S L23E P0 5 LOW JITTER AND SKEW 10 TO 220 MHZ ZERO DELAY B U F F E R ( Z DB) Features 10 to 220 MHz operating frequency range Low output clock jitter: 50 20 Low power dissipation: 16 mA-max at 66 MHz and VDD = 3.3 V 14 mA-max at 66 MHz and VDD = 2.5 V ps-typ cycle-to-cycle jitter ps-typ period jitter Low output-to-output skew: 30 ps-typ Low product-to-product skew: 60 ps-typ Wide 2.5 V to 3.3 V power supply range One input drives five outputs organized as 4+1 SpreadThru™ PLL that allows use of SSCG Standard and High-Drive options Available in 8 pin SOIC and TSSOP packages Available in Commercial and Industrial grades Applications Printers and MFPs Digital Copiers PCs and Work Stations Ordering Information: See page 14. Pin Assignments Routers, Switchers and Servers Digital Embedded Systems SL23EP05 Benefits Up to five distribution of input clock Standard and High-Drive levels to control impedance level, frequency range and EMI Low power dissipation, jitter and skew Low cost Description Patents pending The SL23EP05 is a low skew, low jitter, and low power Zero Delay Buffer (ZDB) designed to produce up to five clock outputs from one reference input clock for high speed clock distribution applications. The product has an onchip PLL which locks to the input clock at CLKIN and receives its feedback internally from the CLKOUT pin. The SL23EP05 is available with two drive strength versions called –1 and –1H. The –1 is the standard-drive version and –1H is the high-drive version. The SL23EP05 high-drive version operates up to 220 MHz and 180 MHz at 3.3 V and 2.5 V power supplies, respectively. The standard drive version –1 operates up to 200 MHz and 167 MHz at 3.3 V and 2.5 V, respectively. The SL23EP05 enter into Power Down (PD) mode if the input at CLKIN is less then 2.0 MHz or there is no rising edge. In this state all five outputs are tri-stated and the PLL is turned off leading to less than 10 μA of power supply current draw. Rev. 2.2 5/15 Copyright © 2015 by Silicon Laboratories SL23EP05 SL2 3EP 05 Functional Block Diagram 2 Rev. 2.2 SL 2 3 E P 05 TA B L E O F C O N T E N T S Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 2. General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3. Input and Output Frequency Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 4. SpreadThru™ Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 5. High and Low-Drive Product Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 6. Skew and Zero Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 7. Power Supply Range (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 8. External Components and Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 8.1. Comments and Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 8.2. Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 9. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 10. Package Outline and Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 10.1. 8-Lead SOIC (150 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 11. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Rev. 2.2 3 SL2 3EP 05 1. Electrical Specifications Table 1. DC Electrical Specifications (VDD = 3.3 V) Unless otherwise stated for both C and I Grades. Parameter Min Max Unit VDD 3.0 3.6 V Input LOW Voltage VIL — 0.8 V Input HIGH Voltage VIH 2.0 VDD+0.3 V Input Leakage Current IIL 0 < VIN < 0.8 V — ±10 μA Input HIGH Current IIH VIN = VDD — 100 μA Output LOW Voltage VOL IOL = 8 mA (Standard Drive) — 0.4 V IOL = 12 mA (High Drive) — 0.4 V IOH = –8 mA (Standard Drive) 2.4 — V IOH = –12 mA (High Drive) 2.4 — V CLKIN = 0 MHz (Commercial) — 10 μA CLKIN = 0 MHz (Industrial) — 25 μA All Outputs CL = 0, 66-MHz CLKIN — 16 mA Min Max Unit VDD 2.3 2.7 V Input LOW Voltage VIL — 0.7 V Input HIGH Voltage VIH 1.7 VDD+ 0.3 V Input Leakage Current IIL 0<VIN < 0.8 V — +/-10 μA Input HIGH Current IIH VIN = VDD — 100 μA Output LOW Voltage VOL IOL = 8 mA (Standard drive) — 0.5 V IOL = 12 mA (High drive) — 0.5 V IOH = –8 mA (Standard drive) VDD – 0.6 — V IOH = –12 mA (High drive) VDD – 0.6 — V CLKIN = 0 MHz (Commercial) — 10 μA CLKIN = 0 MHz (Industrial) — 25 μA All Outputs CL = 0, 66 MHz CLKIN — 14 mA Supply Voltage Output HIGH Voltage Power Down Supply Current Power Supply Current Symbol Test Condition VOH IDDPD IDD Table 2. DC Electrical Specifications (VDD = 2.5 V) Unless otherwise stated for both C and I Grades. Parameter Supply Voltage Output HIGH Voltage Power Down Supply Current Power Supply Current 4 Symbol VOH IDDPD IDD Test Condition Rev. 2.2 SL 2 3 E P 05 Table 3. AC Electrical Specifications (VDD = 3.3 V and 2.5 V) Parameter Maximum Frequency (Input=Output) 1 Input Duty Cycle Output Duty Cycle Symbol Test Condition Min Typ Max Unit FMAX 3.3 V High Drive 10 — 220 MHz 3.3 V Standard Drive 10 — 200 MHz 2.5 V High Drive 10 — 180 MHz 2.5 V Standard Drive 10 — 167 MHz <135 MHz, VDD = 3.3 V 25 — 75 % <135 MHz, VDD = 2.5 V 40 — 60 % <135 MHz, VDD = 3.3 V 45 — 55 % <135 MHz, VDD = 2.5 V 40 — 60 % High drive, CL = 15 pF, >135 MHz — — 0.5 ns Std drive, CL = 15 pF, <170 MHz — — 1.5 ns High drive, CL = 30 pF, <100 MHz — — 1.5 ns Std drive, CL = 30 pF, <100 MHz — — 2.5 ns High drive, CL = 15 pF, >135 MHz — — 1.5 ns Std drive, CL = 15 pF, <135 MHz — — 2.5 ns High drive, CL = 30 pF, <100 MHz — — 2.5 ns All outputs CL = 0, 3.3 V supply, 2.5 V power supply, standard drive — 30 90 ps All outputs CL = 0, 2.5 V power supply, high drive — 40 100 ps PLL enabled @ 3.3 V –100 — 100 ps PLL enabled @2.5 V –200 — 200 ps Measured at VDD/2. Any output to any output, 3.3 V supply –150 — 150 ps Measured at VDD/2. Any output to any output, 2.5 V supply –300 — 300 ps INDC 2 Rise, Fall Time (3.3V) Measured at: 0.8 to 2.0 V 2 Rise, Fall Time (2.5) 2 Measured at: 0.6 to 1.8 V Output-to-Output Skew 2 OUTDC tr/f3.3 tr/f2.5 t1 Delay Time, CLKIN Rising Edge to CLKOUT Rising Edge 2 t2 Part-to-Part Skew 2 t3 Notes: 1. For the given maximum loading conditions. See CL in Operating Conditions Table. 2. Parameter is guaranteed by design and characterization. Not 100% tested in production. Rev. 2.2 5 SL2 3EP 05 Table 4. AC Electrical Specifications (VDD = 3.3 V and 2.5 V) Parameter PLL Lock Time[9] Cycle-to-cycle Jitter Peak Period Jitter Symbol Test Condition Min Typ Max Unit — — 1.0 ms 3.3 V supply, >66 MHz, <15 pF, Standard Drive — 50 125 ps 3.3 V supply, >66 MHz, <30 pF, High Drive — 70 140 ps 3.3 V supply, >66 MHz, <30 pF, Standard Drive — 80 170 ps 2.5 V supply, >66 MHz, <15 pF, High Drive — 50 80 ps 2.5 V supply, >66 MHz, <15 pF, Standard Drive — 90 200 ps 2.5 V supply, >66 MHz, <30 pF, High Drive — 100 250 ps 3.3 V supply, >100 MHz, <15 pF, Standard Drive — 30 65 ps 3.3 V supply, 66–100 MHz, <15 pF, Standard Drive — 40 75 ps 3.3 V supply, >66 MHz, <30 pF, High Drive — 60 120 ps 3.3 V supply, >66 MHz, <30 pF, Standard Drive — 70 150 ps 2.5 V supply, > 100 MHz, <15 pF, High Drive — 20 45 ps 2.5 V supply, 66–100 MHz, <15 pF, High Drive — 20 60 ps 2.5 V supply, >66 MHz, <15 pF, Standard Drive — 60 120 ps tPLLOCK From 90% of VDD to valid clocks presented on all output clock pins CCJ * PPJ * *Note: Typical jitter is measured at 3.3 V or 2.5 V, 30ºC with all outputs driven into the maximum specified load. 6 Rev. 2.2 SL 2 3 E P 05 Table 5. Operating Conditions Unless otherwise stated VDD = 2.5 V to 3.3 V and for both C and I Grades. Parameter Symbol 3.3 V Supply Voltage 2.5 V Supply Voltage Operating Temperature (Ambient) Load Capacitance Input Capacitance Closed-loop bandwidth Output Impedance Min Max Unit VDD3.3 3.0 3.6 V VDD2.5 2.3 2.7 V Commercial 0 70 °C Industrial –40 85 °C <220 MHz, 3.3 V with High Drive — 15 pF <200 MHz, 3.3 V with Standard Drive — 15 pF <180 MHz, 2.5 V with High Drive — 15 pF <167 MHz, 2.5 V with Standard Drive — 15 pF <200 MHz, 3.3 V with High Drive — 22 pF <180 MHz, 3.3 V with Standard Drive — 22 pF <167 MHz, 2.5 V with High Drive — 22 pF <134 MHz, 2.5 V with Standard Drive — 22 pF <133 MHz, 3.3 V with High Drive — 30 pF <100 MHz, 3.3 V with Standard Drive — 30 pF <80 MHz, 2.5 V with High Drive — 30 pF < 67 MHz, 2.5 V with Standard Drive — 30 pF CLKIN pin — 5 pF TA CLOAD CIN CLBW ZOUT Test Condition 3.3 V, (typical) 1-1.5 MHz 2.5 V, (typical) 0.8 MHz 3.3 V, (typical), High Drive 29 Ω 3.3 V, (typical), Standard Drive 41 Ω 2.5 V, (typical), High Drive 37 Ω 2.5 V, (typical), Standard Drive 41 Ω Rev. 2.2 7 SL2 3EP 05 Table 6. Thermal Characteristics Parameter Symbol Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case Test Condition Min Typ Max Unit Still air — 110 — °C/W 1 m/s air flow — 100 — °C/W 3 m/s air flow — 80 — °C/W Independent of air flow — 35 — °C/W Table 7. Absolute Maximum Rating Parameter Test Condition Min Max Unit Supply voltage, VDD –0.5 4.6 V All Inputs and Outputs –0.5 VDD+0.5 V Ambient Operating Temperature In operation, C-Grade 0 70 °C Ambient Operating Temperature In operation, I-Grade –40 85 °C Storage Temperature No power is applied –65 150 °C Junction Temperature In operation, power is applied — 125 °C — 260 °C Soldering Temperature 8 ESD Rating (Human Body Model) JEDECC22-A114D –4000 4000 V ESD Rating (Charge Device Model) JEDECC22-C101C –1500 1500 V ESD Rating (Machine Model) JEDECC22-A115D –200 200 V Rev. 2.2 SL 2 3 E P 05 2. General Description The SL23EP05 is a low skew, low jitter Zero Delay Buffer with very low operating current. The product includes an on-chip high performance PLL that locks into the input reference clock and produces five output clock drivers tracking the input reference clock for systems requiring clock distribution. 3. Input and Output Frequency Range The input and output frequency range is the same. However, it depends on VDD and drive levels as given in the below Table 8. Table 8. Input/Output Frequency Range VDD (V) Drive Min (MHz) Max (MHz) 3.3 HIGH 10 220 3.3 STD 10 200 2.5 HIGH 10 180 2.5 STD 10 167 If the input clock frequency is DC (0 to VDD), this is detected by an input frequency detection circuitry and all five clock outputs are forced to Hi-Z. The PLL is shutdown to save power. In this shutdown state, the product draws less than 10 μA supply current. 4. SpreadThru™ Feature If a Spread Spectrum Clock (SSC) were to be used as an input clock, the SL23EP05 is designed to pass the modulated Spread Spectrum Clock (SSC) signal from its reference input to the output clocks. The same spread characteristics at the input are passed through the PLL and drivers without any degradation in spread percent (%), spread profile and modulation frequency. 5. High and Low-Drive Product Options The SL23EP05 is offered with High-Drive “–1H” and Standard-Drive “–1” options. These drive options enable the users to control load levels, frequency range and EMI control. Refer to the AC electrical tables for the details. 6. Skew and Zero Delay All outputs should drive the similar load to achieve output-to-output skew and input-to-output specifications given in the AC electrical tables. However, Zero delay between input and outputs can be adjusted by changing the loading of CLKOUT relative to the banks A and B clocks since CLKOUT is the feedback to the PLL. 7. Power Supply Range (VDD) The SL23EP05 is designed to operate in a wide power supply range from 2.250 V (Min) to 3.360 V (Max). This power supply range complies with 3.3 V+/–10% and 2.5 V+/–10% standard power supply requirements used in most systems. An internal on-chip voltage regulator is used to supply PLL constant power supply of 1.8 V, leading to a consistent and stable PLL electrical performance in terms of skew, and jitter and power dissipation. Rev. 2.2 9 SL2 3EP 05 8. External Components and Design Considerations Figure 1. Typical Application Schematic 8.1. Comments and Recommendations Decoupling Capacitor: A minimum decoupling capacitor of 0.1 μF must be used between VDD and VSS on the pins 6 and 4. Additional capacitors may be necessary depending on the application. Place the capacitor on the component side of the PCB as close to the VDD pin as possible. The PCB trace to the VDD pin and to the GND via should be kept as short as possible. Do not use vias between the decoupling capacitor and the VDD pin. Series Termination Resistor: A series termination resistor is recommended if the distance between the output (SSCLK) and the load is over 1.5 inches. The nominal impedance of the SSCLK output is about 30 Ω. Use 20 Ω resistor in series with the output to terminate 50 Ω trace impedance and place 20 Ω resistor as close to the clock outputs as possible. Zero Delay and Skew Control: All outputs and CLKIN pins should be loaded with the same load to achieve “Zero Delay” between the CLKIN and the outputs. The CLKOUT pin is connected to CLKIN internally on-chip for internal feedback to PLL, and sees an additional 2 pF load with respect to the clock pins. For applications requiring zero input/output delay, the load at the all output pins including the CLKOUT pin must be the same. If any delay adjustment is required, the capacitance at the CLKOUT pin could be increased or decreased to increase or decrease the delay between clocks and CLKIN. For minimum pin-to-pin skew, the external load at the clocks must be the same. 10 Rev. 2.2 SL 2 3 E P 05 8.2. Switching Waveforms Figure 2. Output to Output Skew Figure 3. Input to Output Skew Figure 4. Part-to-Part Skew Rev. 2.2 11 SL2 3EP 05 9. Pin Descriptions Figure 5. 8-Pin SOIC Table 9. Pin Descriptions 12 Pin Number Pin Name Pin Type Pin Description 1 CLKIN Input 2 CLK2 Output Buffered Clock Output Weak pull-down (150 kΩ). 3 CLK1 Output Buffered Clock Output. Weak pull-down (150 kΩ). 4 GND Power Power Ground. 5 CLK3 Output Buffered Clock Output. Weak pull-down (150 kΩ). 6 VDD Power 3.3 V or 2.5 V Power Supply. 7 CLK4 Output Buffered Clock Output. Weak pull-down (150 kΩ). 8 CLKOUT Output Buffered Clock Output. Used for Internal Feedback to PLL Input. Weak pull-down (150 kΩ). Reference Frequency Clock Input. Weak pull-down (150 kΩ). Rev. 2.2 SL 2 3 E P 05 10. Package Outline and Dimensions 10.1. 8-Lead SOIC (150 mm) Figure 6. 8-Lead SOIC (150 mm) Rev. 2.2 13 SL2 3EP 05 11. Ordering Guide Table 10. Ordering Guide Ordering Number Shipping Package Package Temperature SL23EP05SC-1 Tube 8-pin SOIC 0 to 70°C SL23EP05SC-1T Tape and Reel 8-pin SOIC 0 to 70°C SL23EP05SI-1 Tube 8-pin SOIC –40 to 85°C SL23EP05SI-1T Tape & Reel 8-pin SOIC –40 to 85°C SL23EP05SC-1H Tube 8-pin SOIC 0 to 70°C SL23EP05SC-1HT Tape & Reel 8-pin SOIC 0 to 70°C SL23EP05SI-1H Tube 8-pin SOIC –40 to 85°C SL23EP05SI-1HT Tape & Reel 8-pin SOIC –40 to 85°C SL23EP05BSI-1H Tube 8-pin SOIC –40 to 85°C SL23EP05BSI-1HT Tape & Reel 8-pin SOIC –40 to 85°C Notes: 1. The SL23EP05 products are RoHS compliant. 2. Minimum Order Quantity (MOQ) is for production orders. Silicon Labs provides lesser quantities for pre-production samples. 14 Rev. 2.2 ClockBuilder Pro One-click access to Timing tools, documentation, software, source code libraries & more. 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