RClamp5011ZA

RClamp5011ZA
Ultra Small RClamp®
1-Line, 5V ESD Protection
PROTECTION PRODUCTS - RailClamp®
Description
Features
RClamp® TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. They
are designed to replace 0201 size multilayer varistors
(MLVs) in portable applications such as cell phones,
notebook computers, and other portable electronics.
This device offers desirable characteristics for board
level protection including fast response time, low operating and clamping voltage, and no device degradation.
‹‹ High ESD withstand Voltage: +/-15kV (Contact) and
+/- 18kV (Air) per IEC 61000-4-2
‹‹ Ultra-small package
‹‹ Protects one data line
‹‹ Low ESD clamping voltage
‹‹ Working voltage: 5V
‹‹ Low capacitance: 0.45pF maximum
‹‹ Low leakage current
‹‹ Extremely low dynamic resistance: 0.25 Ohms (Typ)
‹‹ Solid-state silicon-avalanche technology
RClamp®5011ZA features extremely good ESD protection characteristics highlighted by low typical dynamic resistance of 0.25 Ohms, low peak ESD clamping voltage,
and high ESD withstand voltage (+/-15kV contact per
IEC 61000-4-2). Low maximum capacitance (0.45pF at
VR=0V) minimizes loading on sensitive cirucuits. Each
device will protect one high-speed data line operating at
5 Volts.
Mechanical Characteristics
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RClamp5011ZA is in a 2-pin SLP0603P2X3F package
measuring 0.6 x 0.3 mm with a nominal height of only
0.25mm. Leads are finished with NiAu. The small package gives the designer the flexibility to protect single
lines in applications where arrays are not practical. The
combination of small size and high ESD surge capability
makes them ideal for use in portable applications such
as cellular phones, digital cameras, and tablet PC’s.
Applications
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Package Dimensions
HDMI
USB 3.0
MiPi / MDDI
MHL
FM Antenna
Schematic & Pin Configuration
0.600
0.220
SLP0603P2X3F package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking: Marking code
Packaging: Tape and Reel
1
0.300
0.160
0.355 BSC
2
0.250
Nominal Dimensions in mm
12/11/2014
SLP0603P2X3F (Bottom View)
1
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RClamp5011ZA
PROTECTION PRODUCTS
Absolute Maximum Ratings
Rating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20µs)
PPK
50
W
Peak Pulse Current (tp = 8/20µs)
IPP
4
A
VESD
±18
±15
kV
TJ
-40 to +85
O
TSTG
-55 to +150
O
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)(1)
(1)
Operating Temperature
Storage Temperature
C
C
Electrical Characteristics (T=25OC unless otherwise specified)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
T = -40 to +85OC
Punch-Through Voltage
VBR
IPT = 1mA
Reverse Leakage Current
IR
VRWM = 5V
Clamping Voltage
VC
Min.
Max.
Units
5
V
7.5
10
V
<5
50
nA
IPP = 2A, tP = 8/20µs
11.5
V
IPP = 4A, tP = 8/20µs
12.5
V
6.5
Typ.
ESD Clamping Voltage2
VC
IPP = 4A
tp = 0.2/100ns
8.5
V
ESD Clamping Voltage2
VC
IPP = 16A
tp = 0.2/100ns
11.5
V
Dynamic Resistance2, 3
RDYN
tp = 0.2/100ns
0.25
Ohms
Junction Capacitance
CJ
VR = 0V; f = 1MHz
0.40
0.45
pF
Notes
1)Measured with a 40dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
 2014 Semtech Corporation.
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RClamp5011ZA
PROTECTION PRODUCTS
Typical Characteristics
ESD Clamping (8kV Contact per IEC 61000-4-2)
120
20
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 40dB attenuator. ESD gun
return path connected to ESD ground plane.
0
Clamping Voltage - VC (V)
100
Clamping Voltage - VC (V)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
80
60
40
20
-40
-60
-80
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 40dB attenuator. ESD gun
return path connected to ESD ground plane.
-100
0
-20
-20
-10
0
10
20
30
40
50
60
70
-120
80
-10
0
10
Time (ns)
TLP Characteristic
25
Peak Clamping Voltage - VC (V)
TLP Current (A)
60
70
80
11
10
5
0
0
50
12
15
-5
30
40
Time (ns)
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
Transmission Line Pulse Test
(TLP) Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
20
20
5
10
15
10
20
9
8
7
6
Clamping Voltage (V)
TA = 25OC
Waveform: tp= 8x20us
0
1
Capacitance vs. Reverse Voltage
2
3
Peak Pulse Current - IPP (A)
4
5
Insertion Loss - S21 (dB)
1.6
0
1.4
-2
Insertion Loss (dB)
Junction Capacitance - CJ (pF)
1.2
1
0.8
0.6
0.4
-6
-8
0.2
0
-4
f = 1MHz
Any I/O to GND
0
1
2
3
4
-10
5
0
5
10
15
Frequency (GHz)
20
25
Voltage (V)
 2014 Semtech Corporation.
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RClamp5011ZA
PROTECTION PRODUCTS
Typical Characteristics
USB 3.0 Eye Pattern Without RClamp5011ZA
USB 3.0 Eye Pattern with RClamp5011ZA
HDMI 1.4 Eye Pattern Without RClamp5011ZA
HDMI 1.4 Eye Pattern With RClamp5011ZA
 2014 Semtech Corporation.
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RClamp5011ZA
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The small size of this device means that some care must
be taken during the mounting process to insure reliable
solder joint. The table below provides Semtech’s recommended assembly guidelines for mounting this device.
The figure at the right details Semtech’s recommended
aperture based on the below recommendations. Note
that these are only recommendations and should serve
only as a starting point for design since there are many
factors that affect the assembly process. The exact
manufacturing parameters will require some experimentation to get the desired solder application.
Assembly Parameter
Laser cut, Electro-polished
Aperture shape
Rectangular with rounded
corners
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
 2014 Semtech Corporation.
0.175
0.272
Recommendation
Solder Stencil Design
Solder Stencil Thickness
Stencil Aperture
Mounting Pad
Package
0.250
0.298
0.270
Recommended Mounting Pattern
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
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RClamp5011ZA
PROTECTION PRODUCTS
Outline Drawing - SLP0603P2X3F
A
B
D
DIM
A
A1
b
D
E
e
L
N
aaa
bbb
E
TOP VIEW
A
0.235 0.250 0.265
0.000 0.010 0.050
0.200 0.220 0.240
0.580 0.600 0.620
0.280 0.300 0.320
0.355 BSC
0.140 0.160 0.180
2
0.08
0.10
SEATING
PLANE
aaa C
C
A1
bbb
DIMENSIONS
MILLIMETERS
MIN NOM MAX
e/2
R0.025
TYP
bxN
C A B
2X L
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3F
DIMENSIONS
DIM
G
X
Y
Z
Z
G
MILLIMETERS
0.177
0.272
0.247
0.671
Y
X
NOTES:
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
 2014 Semtech Corporation.
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