ESDAXLC6-1BU2 Single-line bidirectional ESD protection for high speed interface Datasheet - production data Features • Bidirectional device • Extra low diode capacitance: 0.4 pF • Low leakage current • 0201 SMD package size compatible • Ultra small PCB area: 0.18 mm2 • ECOPACK®2 and RoHS compliant component Complies with the following standards: 0201 package Pin 1 available in different forms Figure 1. Functional diagram (top view) Pin1 • IEC 61000-4-2 level 4 – ±15 kV (air discharge) – ±8 kV (contact discharge) Applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: • Smartphones, mobile phone and accessories • Tablet PCs, netbooks and notebooks • Portable multimedia devices and accessories • Digital cameras and camcorders • Communication and highly integrated systems Description The ESDAXLC6-1BU2 is a bidirectional single line TVS diode designed to protect the data lines or other I/O ports against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. March 2014 This is information on a product in full production. DocID023702 Rev 2 1/9 www.st.com Characteristics ESDAXLC6-1BU2 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit ± 16 ± 25 kV VPP Peak pulse voltage: IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge PPP Peak pulse power (8/20 µs) 40 W IPP Peak pulse current (8/20 µs) 1.3 A Tj Operating junction temperature range - 40 to +150 °C Tstg Storage temperature range - 65 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C Note: For a surge greater than the maximum values, the diode will fail in short-circuit Figure 2. Electrical characteristics (definitions) Symbol VBR VRM IRM IPP = = = = Parameter Breakdown voltage Stand-off voltage Leakage current @ VRM Peak pulse current Rd αT C = = = Dynamic impedance Voltage temperature coefficient Parasite capacitance Table 2. Electrical characteristics (values, Tamb = 25 °C) Symbol Test Condition Min. Typ. Max. VBR IR = 1 mA IRM VRM = 3 V 70 nA VCL IPP = 1 A, 8/20 µA 17 V Cline F = (200 MHz- 3000 MHz), VR = 0 V 0.5 pF 2/9 6 Unit V 0.4 DocID023702 Rev 2 ESDAXLC6-1BU2 Characteristics Figure 3. Leakage current versus junction temperature (typical values) Figure 4. Junction capacitance versus applied voltage (typical values) IR(nA) 10.00 C (pF) 1.0 VR = 3 V Direct/Reverse Vosc = 30 mVRMS Tj = 25°C direct / reverse 0.8 1.00 0.6 0.4 0.10 0.2 VR(V) Tj(°C) 0.0 0.01 25 35 45 55 65 75 85 95 0 105 115 125 135 145 Figure 5. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 50 V/div 1 2 4 5 Figure 6. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 50 V/div 1 2 3 4 VCL: Peak clamping voltage VCL :clamping voltage at 30 ns VCL :clamping voltage at 60 ns VCL :clamping voltage at 100 ns 4 3 2 1 3 -31 V -14 V -41 V 158 V 1 22 42 V 3 29 V 4 1 2 -163 V 3 4 15 V VCL: Peak clamping voltage VCL :clamping voltage at 30 ns VCL :clamping voltage at 60 ns VCL :clamping voltage at 100 ns 20 ns/div 20 ns/div Figure 7. Attenuation measurement results 0.00 S21(dB) -1.00 -2.00 -3.00 -4.00 -5.00 F(Hz) -6.00 10.0M 100.0M 1.0G 10.0G 100.0G ESDAXLC6-1BU2 DocID023702 Rev 2 3/9 9 Package information 2 ESDAXLC6-1BU2 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 8. 0201 dimension definitions E D Top A L1 Side L2 b1 b2 Bottom Pin 1 L1 e L2 b1 b2 Bottom e Pin 1 available in different forms Table 3. 0201 package dimension values Dimensions Ref. Millimeters Min. Typ. Max. Min. Typ. Max. A 0.23 0.28 0.33 0.0091 0.0110 0.0130 b1 0.20 0.25 0.30 0.0079 0.0098 0.0118 b2 0.20 0.25 0.30 0.0079 0.0098 0.0118 D 0.25 0.30 0.35 0.0099 0.0118 0.0138 E 0.55 0.60 0.65 0.0217 0.0236 0.0256 e 4/9 Inches 0.35 0.0138 L1 0.13 0.18 0.23 0.0052 0.0071 0.0091 L2 0.14 0.19 0.24 0.0055 0.0075 0.0095 DocID023702 Rev 2 ESDAXLC6-1BU2 Package information Figure 9. Footprint dimensions in mm (inches) 0.243 (0.0096) 0.656 (0.0258) Figure 10. Marking 0.243 (0.0096) Z2 Pin2 0.300 (0.0118) Pin 1 0.170 (0.0067) Product marking may be rotated by 180° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 11. Tape and reel specifications Bar indicates Pin 1 Ø 1.55 4.0 2.0 3.5 0.67 1.75 0.22 8.0 Note: Z2 Z2 Z2 0.38 Z2 Z2 All dimensions in mm Z2 Z2 0.34 2.0 User direction of unreeling DocID023702 Rev 2 5/9 9 Recommendation on PCB assembly ESDAXLC6-1BU2 3 Recommendation on PCB assembly 3.1 Stencil opening design Figure 12. Recommended stencil windows position 0.230 (0.0091) 0.643 (0.0253) 0.183 (0.0072) 0.285 (0.0112) 0.008 (0.0003) 0.300 (0.0118) 0.008 (0.0003) 0.656 (0.0258) 0.007 0.007 (0.00027) (0.00027) 0.170 (0.0067) 0.243 (0.0096) mm (inches) Footprint 3.2 6/9 Stencil window Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed 4. Solder paste with fine particles: powder particle size is 20-45 µm. DocID023702 Rev 2 ESDAXLC6-1BU2 3.3 3.4 3.5 Recommendation on PCB assembly Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Reflow profile Figure 13. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2 °C/s 2 - 3 °C/s 60 sec (90 max) 200 -3 °C/s 150 -6 °C/s 100 0.9 °C/s 50 Time (s) 0 Note: 30 60 90 120 150 180 210 240 270 300 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. DocID023702 Rev 2 7/9 9 Ordering information 4 ESDAXLC6-1BU2 Ordering information Figure 14. Ordering information scheme ESDA XLC 6 - 1B U2 ESDA array Extra low capacitance Breakdown voltage 6 = 6 V min Direction B = Bidirectional Package U2 = ST0201 Table 4. Ordering information Order code Marking (1) ESDAXLC6-1BU2 Z2 Weight Base qty Delivery mode 0.124 mg 15000 Tape and reel 1. The marking can be rotated by 180° to differentiate assembly location 5 Revision history Table 5. Document revision history 8/9 Date Revision Changes 21-Sep-2012 1 Initial release. 27-Mar-2014 2 Updated Figure 5, Figure 6, Figure 7, Figure 9 and Figure 13. Updated package graphics. DocID023702 Rev 2 ESDAXLC6-1BU2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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