LITTELFUSE SMF8.5A

Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
SMF Series
Description
The SMF series is designed specifically to protect sensitive
electronic equipment from voltage transients induced by
lightning and other transient voltage events.
SMF package is 50% smaller in footprint when compare
to SMA package and delivering one of the lowest height
profiles (1.1mm) in the industry.
Features
Maximum Ratings and Thermal Characteristics
(TA=25OC unless otherwise noted)
Parameter
Symbol
Value
Unit
Peak Pulse Power Dissipation at
TA=25ºC by 10x1000µs (Note 1)
PPPM
200
W
Thermal Resistance Junction- toAmbient
RTHJ-A
220
°C/W
Thermal Resistance Junction- toLead
RTHJ-L
100
°C/W
Operating and Storage Temperature
Range
TJ,TSTG
-55 to 150
°C
Notes:
1. Non-repetitive current pulse, per Fig. 3 and derated above TA=25ºC per Fig. 2.
2.Non-repetitive current pulse per Fig. 4 and derated above TA=25ºC per Fig 2.
•Compatible with
industrial standard
package SOD-123
• For surface mounted
applications to optimize
board space
• Low profile: maximum
height of 1.1mm.
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c.
• IEC-61000-4-2 ESD
15kV(Air), 8kV (Contact).
• ESD protection of data
lines in accordance with
IEC 61000-4-2 (IEC801-2).
• EFT protection of data
lines in accordance with
IEC 61000-4-4 (IEC801-4).
• Low inductance, excellent
clamping capability
• 200W peak pulse power
capability at 10 x 1000µs
waveform, repetition rate
(duty cycle): 0.01%
• Fast response time:
typically less than 1.0ns
from 0 Volts to VBR min
• High temperature
soldering: 260°C/40
seconds at terminals
• Glass passivated junction
• Built-in strain relief
• Matte tin lead–free plated
• Halogen-free and RoHS
compliant
Applications
SMF devices are ideal for the protection of I/O interfaces,
VCC bus and other vulnerable circuit used in cellular phones,
portable devices, business machines, power supplies and
other consumer applications.
SMF Series
1
7
Revision: February 29, 2012, 15:16
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
HF RoHS SMF Series
RoHS
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
Electrical Characteristics (T =25°C unless otherwise noted)
A
Part
Number
SMF5.0A
SMF6.0A
SMF6.5A
SMF7.0A
SMF7.5A
SMF8.0A
SMF8.5A
SMF9.0A
SMF10A
SMF11A
SMF12A
SMF13A*
SMF14A*
SMF15A*
SMF16A*
SMF17A*
SMF18A*
SMF20A*
SMF22A*
SMF24A*
SMF26A*
SMF28A*
SMF30A*
SMF33A*
SMF36A*
SMF40A*
SMF43A*
SMF45A*
SMF48A*
SMF51A*
SMF54A*
Breakdown
Voltage VBR
(Volts) @ IT
Code
MIN
MAX
Test
Current
IT
(mA)
AE
AG
AK
AM
AP
AR
AT
AV
AX
AZ
BE
BG
BK
BM
BP
BR
BT
BV
BX
BZ
CE
CG
CK
CM
CP
CR
CT
CV
CX
CZ
DE
6.4
6.67
7.22
7.78
8.33
8.89
9.44
10.0
11.1
12.2
13.3
14.4
15.6
16.7
17.8
18.9
20.0
22.2
24.4
26.7
28.9
31.1
33.3
36.7
40.0
44.4
47.8
50.0
53.3
56.7
60.0
7
7.37
7.98
8.6
9.21
9.83
10.4
11.1
12.3
13.5
14.7
15.9
17.2
18.5
19.7
20.9
22.1
24.5
26.9
29.5
31.9
34.4
36.8
40.6
44.2
49.1
52.8
55.3
58.9
62.7
66.3
10
10
10
10
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Marking
Maximum
Reverse
Reverse
Stand off
Leakage @ VR
Voltage VR (V)
IR (µA)
5.0
6.0
6.5
7.0
7.5
8.0
8.5
9.0
10
11
12
13
14
15
16
17
18
20
22
24
26
28
30
33
36
40
43
45
48
51
54
400
400
250
100
50
25
10
5
2.5
2.5
2.5
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Maximum
Peak Pulse
Current Ipp
(A)
21.7
19.4
17.9
16.7
15.5
14.7
13.9
13
11.8
11
10.1
9.3
8.6
8.2
7.7
7.2
6.8
6.2
5.6
5.1
4.8
4.4
4.1
3.8
3.4
3.1
2.9
2.8
2.6
2.4
2.3
Maximum
Clamping
Voltage @Ipp
VC (V)
9.2
10.3
11.2
12
12.9
13.6
14.4
15.4
17
18.2
19.9
21.5
23.2
24.4
26
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
58.1
64.5
69.4
72.7
77.4
82.4
87.1
Notes:
1. VBR measured after IT applied for 300µs, IT = sequare wave pulse or equivalent.
2. Surge current waveform per 10 x 1000µs exponential wave and derated per Fig.2.
3. All terms and symbols are consistent with ANSI/IEEE C62.35.
4. Parts with “*” are still under development, and will be available in Q3,2012.
SMF Series
2
8
Revision: February 29, 2012, 15:16
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
I-V Curve Characteristics
Unidirectional
Bidirectional
Ipp
Vc VBR VR
V
IR VF
IT
Vc VBR VR
Ipp
IT
IR
IR
IT
VR VBR Vc
V
Ipp
•Peak Pulse Power Dissipation- PPPM
-- Max power dissipation
•Stand-off Voltage - VR
-- Maximum voltage that can be applied to the TVS without
operation
•Breakdown Voltage - VBR
-- Maximum current that flows though the TVS at a specified test
current (IT)
•Clamping Voltage - VC
-- Peak voltage measured across the suppressor at a specified
Ippm (peak impulse current)
•Reverse Leakage Current - IR
-- Current measured at VR
•Forward Voltage Drop for Uni-directional - VF
Ratings and Characteristic Curves (T =25°C unless otherwise noted)
A
Figure 1 - TVS Transients Clamping Waveform
Figure 2 - Peak Pulse Power Rating Curve
Voltage Transients
PPPM-Peak Pulse Power (kW)
10
Voltage or Current
Voltage Cross TVS
Current Cross TVS
1
0.1
0.000001
Time
SMF Series
3
9
Revision: February 29, 2012, 15:16
0.00001
0.0001
0.001
td-Pulse Width (sec.)
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
Ratings and Characteristic Curves (T =25°C unless otherwise noted)
A
Figure 3 - Pulse Derating Curve
Figure 4 - Pulse Waveform - 10x1000µS
150
IPPM- Peak Pulse Current, % IRSM
Peak Pulse Power (PPP) or Current (IPP)
Derating in Percentage %
100
80
60
40
20
0
0
25
50
75
100
125
150
tr=10µsec
Half Value
IPPM IPPM
( )
2
50
TA-Ambient temperature (ºC)
10/1000µsec. Waveform
as defined by R.E.A
td
0
1.0
2.0
3.0
4.0
t-Time (ms)
Figure 5 - Steady State Power Dissipation Derating
Curve
Figure 6 - Forward Voltage
1.2
Vf - Typical forward dropped voltage
1.50
PM(AV), Steady State Power Dissipation (W)
Peak Value
IPPM
100
0
175
TJ=25°C
Pulse Width(td) is defined
as the point where the peak
current decays to 50% of IPPM
1.25
1.00
0.75
0.50
0.25
0
0
25
50
75
100 125
TL - Tab temperature (ºC)
150
175
1
0.8
0.6
0.4
0.2
0
-55
10
75
140
Temperature (ºC)
Figure 7 - Cj Vs Working Peak Reverse Voltage
10000
1000
Cj (pf)
Measured@Vr=0v
100
10
1
Measured@50%Vr
10
100
Vbr - Reverse breakdown voltage
SMF Series
4
10
Revision: February 29, 2012, 15:16
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
Soldering Parameters
Lead–free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Ramp-up
TL
Average ramp up rate (Liquidus Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Time (min to max) (ts)
60 – 150 seconds
Peak Temperature (TP)
260
20 – 40 seconds
Critical Zone
TL to TP
Ts(min)
Ramp-down
ts
Preheat
t 25˚C to Peak
Time (t)
°C
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
Physical Specifications
Environmental Specifications
Case
SOD-123 Plastic over glass passivated
junction
Polarity
Color band denotes cathode except bipolar
Terminal
Matte tin-plated leads, solderable per
JESD22-B102D
SMF Series
tL
Ts(max)
25˚C
Time within 5°C of actual peak
Temperature (tp)
+0/-5
tp
TP
Temperature (T)
Reflow Condition
5
11
Revision: February 29, 2012, 15:16
Temperature Cycle
JESD22-A104
Pressure Cooker
JESD22-A102
High Temp. Storage
JESD22-A103
HTRB
JESD22-A108
Thermal Shock
JESD22-A106
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
Dimensions - SOD-123 Package
E
Dimensions
E
B
A
F
G
H
D
Inches
Min
Max
Min
Max
2.50
2.90
0.0984
0.1142
B
3.40
3.90
0.1339
0.1535
C
0.70
1.20
0.0275
0.0472
D
1.50
2.00
0.0591
0.0787
E
0.35
0.90
0.0138
0.0354
A
C
Millimeters
F
0.05
0.26
0.0020
0.0102
G
0.00
0.10
0.0000
0.0039
H
0.95
1.10
0.0374
0.0433
Mounting Pad Layout
1.6 (0.062)
1.3 (0.051)
1.4 (0.055)
Part Numbering System
Part Marking System
SMF xx A
LF
5% VBR VOLTAGE TOLERANCE
XX
YM
VR VOLTAGE
SERIES
Cathode Band
Marking Code
Trace Code Marking
Y:Year Code
M: Month Code
Packaging
Part number
SMFXXX
Component
Package
SOD-123
Quantity
3000
Packaging
Option
Tape & Reel – 8mm/7” tape
Packaging
Specification
EIA RS-481
Tape and Reel Specification
0.157
(4.0)
Cathode
0.31
(8.0)
0.157
(4.0)
0.059 DIA
(1.5)
Cover tape
7.0 (178)
0.80 (20.2)
Arbor Hole Dia.
0.33
(8.5)
SMF Series
Dimensions are in inches
(and millimeters).
Direction of Feed
6
12
Revision: February 29, 2012, 15:16
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.