LITTELFUSE LC03

TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - LC03-3.3 Series
LC03-3.3 Series 3.3V 150A Diode Array
RoHS
Pb GREEN
Description
This LC03-3.3 series provides overvoltage protection for
applications such as 10/100/1000 BaseT Ethernet, and
T3/E3 interfaces. This new protector combines the TVS
diode element with a diode rectifier bridge to provide both
longitudinal and differential protection in one package.
This design results in a capacitive loading characteristic
that is log-linear with respect to the signal voltage across
the device. This reduces intermodulation (IM) distortion
caused by a typical solid-state protection solution. The
application schematic provides the connection information
and the LC03-3.3 is rated for GR-1089, intra-building
transient immunity requirements for telecommunication
installations.
Pinout
Features
1
8
2
7
3
6
4
• SOIC-8 surface mount
package (JEDEC MS-012)
• Lightning Protection,
IEC61000-4-5, 150A
(tp=8/20µs)
• Combined longitudinal
and metallic protection
• EFT, IEC61000-4-4, 40A
(tp=5/50ns)
• Clamping speed of
nanoseconds
• Low insertion loss, loglinear capacitance
5
• UL 94V-0 epoxy molding
• Low clamping voltage
SOIC-8 (Top View)
Functional Block Diagram
• RoHS compliant
Applications
• T1/E1 Line cards
Pin 1 and 8
Line in
• T3/E3 and DS3 Interfaces
Line out
• 10/100/1000 BaseT
Ethernet
• STS-1 Interfaces
Application Example
Pin 2, 3, 6,
and 7
TeleLink (0461 1.25)
Line out
Line in
Pin 4 and 5
LC03-3.3BTG
1
8
2
7
3
6
4
5
to chipset
(Ethernet PHY,
T3/E3 PHY, etc.)
Additional Information
Datasheet
Resources
Samples
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/04/13
This schematic shows a high-speed data interface
protection solution. The LC03-3.3BTG is compatible with
the intra-building surge requirements of Telcordia’s GR1089-CORE, and the Basic Level Recommendations of
ITU K.20 and K.21. The TeleLink fuse provides overcurrent
protection for the long term 50/60 Hz power fault events.
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - LC03-3.3 Series
Thermal Information
Rating
Units
Peak Pulse Current (8/20µs)
Parameter
150
A
SOIC Package
Peak Pulse Power (8/20µs)
3300
W
Operating Temperature Range
IEC 61000-4-2, Direct Discharge, (Level 4)
30
kV
Storage Temperature Range
–55 to 150
°C
IEC 61000-4-2, Air Discharge, (Level 4)
30
kV
Maximum Junction Temperature
150
°C
IEC 61000-4-5 (8/20µs)
150
A
260
°C
Telcordia GR 1089 (Intra-Building) (2/10µs)
100
A
Maximum Lead Temperature (Soldering
20-40s) (SOIC - Lead Tips Only)
ITU K.20 (5/310µs)
40
A
Parameter
Rating
Units
170
°C/W
–40 to 125
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (TOP = 25°C)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
VRWM
IT≤1µA
-
-
3.3
V
Reverse Breakdown Voltage
VBR
IT= 2µA
3.3
-
-
V
Snap Back Voltage
VSB
IT= 50mA
3.3
-
-
V
Reverse Leakage Current
IR
VRWM= 3.3V, T= 25°C
-
-
1
µA
Clamping Voltage, Line-Ground
VC
IPP= 50A, tp=8/20 µs
-
-
13
V
Reverse Stand-Off Voltage
VC
IPP= 100A, tp=8/20 µs
-
-
17
V
RDYN
(VC2-VC1)/(IPP2-IPP1)
-
0.15
-
W
Clamping Voltage, Line-Line
VC
IPP= 50A, tp=8/20 µs
-
-
15
V
Clamping Voltage, Line-Line
VC
IPP= 100A, tp=8/20 µs
-
-
20
V
RDYN
(VC2-VC1)/(IPP2-IPP1)
-
0.25
-
W
Between I/O Pins and Ground
VR=0V, f= 1MHz
-
9
12
pF
Between I/O Pins
VR=0V, f= 1MHz
-
4.5
6
pF
Clamping Voltage, Line-Ground
Dynamic Resistance, Line-Ground
Dynamic Resistance , Line-Line
Junction Capacitance
Cj
Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time
Figure 2: Current Derating Curve
120
Percentage of Rated Current (%IP)
Peak Pulse Current (A)
1000
100
10
1
1
10
100
Pulse decay time (µs)
1000
100
80
60
40
20
0
0
20
40
60
80
100
120
140
160
Ambient Temperature (C)
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/04/13
SP03A-3.3
Absolute Maximum Ratings
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - LC03-3.3 Series
Figure 3: Pulse Waveform
Figure 4: Clamping Voltage vs. Peak Pulse Current
18
100%
16
90%
14
Clamp Voltage-VC(V)
110%
Percent of IPP
80%
70%
60%
50%
40%
Line to Line
12
10
8
Line to Ground
6
4
30%
2
20%
0
10%
0%
0
0.0
5.0
10.0
15.0
20.0
25.0
10
20
30
40
50
60
70
80
90
100
Peak Pulse Current-I PP (A)
30.0
Time (μs)
Figure 5: Capacitance vs. Reverse Voltage
Figure 6: Forward Voltage vs. Forward Current
10
7
Line to Ground
9
6
Forward Voltage (V)
Capacitance (pF)
8
7
6
5
4
Line to Line
3
2
Ground-to-Line
5
4
3
2
1
1
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
10
20
30
Bias Voltage (V)
40
50
60
70
80
90
100
Forward Current (A)
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
260
°C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/04/13
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
Peak Temperature (TP)
+0/-5
tP
TP
Temperature
Reflow Condition
tS
time to peak temperature
Time
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - LC03-3.3 Series
Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline
SOIC-8
Pins
8
JEDEC
MS-012
Millimetres
LF
o
Recommended
Soldering Pad Outline
(Reference Only)
Inches
Min
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
A2
1.25
1.65
0.050
0.065
B
0.31
0.51
0.012
0.020
c
0.17
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
1.27 BSC
e
1.27
0.40
L
0.050 BSC
0.050
0.016
Embossed Carrier Tape & Reel Specification — SOIC Package
Millimetres
E
1.85
0.065
0.073
5.4
5.6
0.213
0.22
2.05
0.077
0.081
D
1.5
1.6
0.059
0.063
1.50 Min
3.9
4.1
40.0 ± 0.20
0.059 Min
0.154
0.161
1.574 ± 0.008
W
11.9
12.1
0.468
0.476
P
7.9
8.1
0.311
0.319
A0
6.3
6.5
0.248
0.256
B0
5.1
5.3
0.2
0.209
K0
2
2.2
0.079
0.087
0.30 ± 0.05
t
T= Tape & Reel
Max
1.65
1.95
P0
G= Green
Min
F
10P0
LC03– 3.3 B T G
Max
P2
D1
Part Numbering System
Inches
Min
0.012 ± 0.002
Package
B = SOIC
Series
Working
Voltage
Product Characteristics
Part Marking System
LF LC03-3.3
XXXXXXXX
First Line: Part number
Second Line: Date code
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
LC03-3.3BTG
SOIC-8
LC03-3.3
2500
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/04/13
SP03A-3.3
Package