7517 Group REJ03B0087-0101Z Rev.1.01 Aug 02, 2004 SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER DESCRIPTION ● Current integrator ......................................................... 1 channel ● Over current detector ................................................... 1 channel ● Watchdog timer ............................................................ 16-bit ✕ 1 ● Clock generating circuit ..................................... Built-in 4 circuits (built-in 4MHz on-chip oscillator and 32kHz RC oscillator, or connect to external ceramic resonator or quartz-crystal oscillator) ● Power source voltage In high-speed mode .................................................. 3.0 to 3.6 V (at 4 MHz oscillation frequency) In middle-speed mode ............................................... 3.0 to 3.6 V (at 8 MHz oscillation frequency) In low-speed mode .................................................... 3.0 to 3.6 V (at 32 kHz oscillation frequency) ● Power dissipation In high-speed mode ...................................................... 8.25 mW (at 4 MHz oscillation frequency, at 3.3 V power source voltage) In low-speed mode ........................................................... 660µW (at 32 kHz oscillation frequency, at 3.3 V power source voltage) ● Operating temperature range .................................... –20 to 85°C The 7517 group is the 8-bit microcomputer based on the 740 family core technology. The 7517 group is designed for battery-pack and includes serial interface functions, 8-bit timer, A/D converter, current integrator and I2C-BUS interface. FEATURES ●Basic machine-language instructions ...................................... 71 ●Minimum instruction execution time .................................. 1.0 µs (at 4 MHz oscillation frequency) ●Memory size Flash memory ............................................................... 32 kbytes RAM ................................................................................ 1 kbytes ●Programmable input/output ports ............................................ 36 ●Interrupts ................................................. 19 sources, 16 vectors ●Timers ............................................................................. 8-bit ✕ 4 ●Serial I/O1 ................... 8-bit ✕ 1 (UART or Clock-synchronized) ●Serial I/O2 ................................... 8-bit ✕ 1(Clock-synchronized) ●Multi-master I2C-BUS interface (option) ...................... 1 channel ●PWM ............................................................................... 8-bit ✕ 1 ●A/D converter ............................................. 10-bit ✕ 10 channels APPLICATION Battery-Pack, etc. P07/AN9 P10/(LED0) P11/(LED1) 27 26 25 P05/AN7 P06/AN8 30 28 P04/AN6 31 29 P02/SCLK2 P03/SRDY2 32 P00/SIN2 P01/SOUT2 34 33 P34/AN4 P35/AN5 36 35 PIN CONFIGURATION (TOP VIEW) P33/AN3 37 24 P32/AN2 38 23 P13/(LED3) P31/AN1 39 22 P14/(LED4) P30/AN0 40 21 P15/(LED5) ADVSS 41 20 P16/(LED6) ADVREF 42 19 P17/(LED7) VCC 43 18 VSS AVCC 44 17 XOUT AVSS 45 16 XIN ISENS0 46 15 RESET ISENS1 47 14 P20/XCOUT DFETCNT/P45 48 13 P21/XCIN 10 11 12 P23/SCL1 CNVSS 9 P24/SDA2/RXD P22/SDA1 7 8 P26/SCLK 6 P25/SCL2/TXD 5 P40/CNTR1 3 4 P42/INT1 P41/INT0 P27/CNTR0/SRDY1 1 2 P44/INT3/PWM P43/INT2/SCMP2 M37517F8HP Package type : 48P6Q-A Fig. 1 M37517F8HP pin configuration Rev.1.01 P12/(LED2) Aug 02, 2004 page 1 of 96 Rev.1.01 Aug 02, 2004 Fig. 2 Functional block diagram page 2 of 96 Current integrator AVcc ISENS0 AVss PWM (8) Reset XCOUT sub-clock output ADVSS ADVREF 41 42 10-bit A/D converter Watchdog timer XCIN sub-clock input 47 46 45 44 ISENS1 Over current detector 17 Main-clock output X OUT Clock generating circuit 16 Main-clock input X IN I/O port P 4 48 1 2 3 4 5 P4(6) INT0 - INT3 RAM FUNCTIONAL BLOCK DIAGRAM ROM PC H I/O port P 3 35 36 37 38 39 40 P3(6) 0 43 18 PS PC L S Y X A SI/O1(8) C P U VCC VSS I2 C (8) XCIN XCOUT CNTR1 I/O port P 2 P1(8) I/O port P 1 P0(8) I/O port P 0 27 28 29 30 31 32 33 34 Timer Y (8) Timer X (8) Timer 2 (8) Timer 1 (8) 19 20 21 22 23 24 25 26 Prescaler Y (8) Prescaler X (8) Prescaler 12 (8) 12 CNVSS 6 7 8 9 10 11 13 14 P2(8) CNTR0 15 Reset input RESET SI/O2(8) 7517 Group FUNCTIONAL BLOCK 7517 Group PIN DESCRIPTION Table 1 Pin description Pin Functions Name Function except a port function VCC, VSS Power source •Apply voltage of 3.3V to Vcc, and 0 V to Vss. AVCC AVSS ADVSS Analog power source •Apply voltage of 3.3V to AVcc, and 0 V to AVss and ADVss. ADVREF Analog reference voltage •Reference voltage input pin for A/D converter. CNVSS CNVSS input •This pin controls the operation mode of the chip. RESET XIN Reset input •Reset input pin for active “L”. Clock input •Input and output pins for the clock generating circuit. XOUT Clock output •Normally connected to VSS. I/O port P0 P00/SIN2 P01/SOUT2 P02/SCLK2 P03/SRDY2 •Connect a ceramic resonator or quartz-crystal oscillator between the XIN and XOUT pins to set the oscillation frequency. •When an on-chip oscillator is used, leave the XIN pin and XOUT pin open. •When an external clock is used, connect the clock source to the XIN pin and leave the XOUT pin open. • Serial I/O2 function pin •8-bit CMOS I/O port. •I/O direction register allows each pin to be individually programmed as either input or output. •CMOS compatible input level. P04/AN8–P07/AN11 P10–P17 I/O port P1 P20/XCOUT P21/XCIN I/O port P2 •CMOS 3-state output structure. •P10 to P17 (8 bits) are enabled to output large current for LED drive. •8-bit CMOS I/O port. •I/O direction register allows each pin to be individually programmed as either input or output. P22/SDA1 P23/SCL1 • A/D converter input pin • Sub-clock generating circuit I/O pins (connect a resonator) • I2C-BUS interface function pin •CMOS compatible input level. P24/SDA2/RxD P25/SCL2/TxD •P22 to P25 can be switched between CMOS compatible input level or SMBUS input level in the I2C-BUS interface function. P26/SCLK P27/CNTR0/ SRDY1 •P20, P21, P24 to P27: CMOS3-state output structure. •P24, P25: N-channel open-drain structure in the I2CBUS interface function. • I2C-BUS interface function pin/ Serial I/O1 function pin • Serial I/O1 function pin • Serial I/O1 function pin/ Timer X function pin •P22, P23: N-channel open-drain structure. P30/AN0– P35/AN5 I/O port P3 •8-bit CMOS I/O port with the same function as port P0. • A/D converter input pin •CMOS compatible input level. •CMOS 3-state output structure. P40/CNTR1 I/O port P4 P41/INT0 P42/INT1 •6-bit CMOS I/O port with the same function as port P0. • Timer Y function pin •CMOS compatible input level. • Interrupt input pin •CMOS 3-state output structure. P43/INT2/SCMP2 • Interrupt input pin/SCMP2 output pin P44/INT3/PWM • Interrupt input pin/PWM output pin P45/DFETCNT • Over current detector function pin ISENS0 Analog input ISENS1 Rev.1.01 Aug 02, 2004 •Input pins for the current integrator and the over current detector. Connect these pins at both ends of a detection resistor, and connect ISENS0 to GND. page 3 of 96 7517 Group FUNCTIONAL DESCRIPTION CENTRAL PROCESSING UNIT (CPU) [CPU Mode Register (CPUM)] 003B16 The 7517 group uses the standard 740 Family instruction set. Refer to the table of 740 Family addressing modes and machine instructions or the 740 Family Software Manual for details on the instruction set. Machine-resident 740 Family instructions are as follows: The FST and SLW instructions cannot be used. The STP, WIT, MUL, and DIV instructions can be used. b7 The CPU mode register contains the stack page selection bit, etc. The CPU mode register is allocated at address 003B16. b0 CPU mode register (CPUM : address 003B16) Processor mode bits b1 b0 0 0 : Single-chip mode 0 1: 1 0: Not available 1 1: Stack page selection bit 0 : 0 page 1 : 1 page Clock source switch bit 0 : On-chip oscillation function 1 : XCIN–XCOUT oscillation function Port XC switch bit 0 : I/O port function (stop oscillating) 1 : XCIN–XCOUT oscillation function Main clock (XIN–XOUT) stop bit 0 : Oscillating 1 : Stopped Main clock division ratio selection bits b7 b6 0 0 : φ = f(XIN)/2 (high-speed mode) 0 1 : φ = f(XIN)/8 (middle-speed mode) 1 0 : φ = f(XCIN)/2 (low-speed mode) 1 1 : Not available Note : All bits in this register are protected by protect mode. Fig. 3 Structure of CPU mode register Rev.1.01 Aug 02, 2004 page 4 of 96 7517 Group MEMORY Special Function Register (SFR) Area Interrupt Vector Area The interrupt vector area contains reset and interrupt vectors. The Special Function Register area in the zero page contains control registers such as I/O ports and timers. Zero Page RAM Access to this area with only 2 bytes is possible in the zero page addressing mode. RAM is used for data storage and for stack area of subroutine calls and interrupts. Special Page Flash Memory Access to this area with only 2 bytes is possible in the special page addressing mode. The first 128 bytes and the last 2 bytes of flash memory are reserved for device testing and the rest is user area for storing programs. 000016 SFR area Zero page 004016 RAM 1024 bytes 010016 044016 0FFD16 0FFF16 Flash memory 32 kbytes Not used SFR area Not used 800016 Reserved memory area (128 bytes) 808016 FF0016 FFD416 Flash memory ID code Special page FFDC16 Interrupt vector area FFFE16 FFFF16 Fig. 4 Memory map diagram Rev.1.01 Aug 02, 2004 page 5 of 96 Reserved memory area 7517 Group 000016 Port P0 (P0) 002016 Prescaler 12 (PRE12) 000116 Port P0 direction register (P0D) 002116 Timer 1 (T1) 000216 Port P1 (P1) 002216 Timer 2 (T2) 000316 Port P1 direction register (P1D) 002316 Timer XY mode register (TM) 000416 Port P2 (P2) 002416 Prescaler X (PREX) 000516 Port P2 direction register (P2D) 002516 Timer X (TX) 000616 Port P3 (P3) 002616 Prescaler Y (PREY) 000716 Port P3 direction register (P3D) 002716 Timer Y (TY) 000816 Port P4 (P4) 002816 Timer count source selection register (TCSS) 000916 Port P4 direction register (P4D) 002916 SFR protect control register (PRREG) 000A16 Discharge counter latch low-order register (DCHARGEL) 002A16 Reserved ✽ 000B16 Discharge counter latch high-order register (DCHARGEH) 002B16 I2C data shift register (S0) 000C16 Charge counter latch low-order register (CHARGEL) 002C16 I2C address register (S0D) 000D16 Charge counter latch high-order register (CHARGEH) 002D16 I2C status register (S1) 000E16 Current integrator control register (CINFCON) 002E16 I2C control register (S1D) 000F16 Short current detector control register (SCDCON) 002F16 I2C clock control register (S2) 001016 Over current detector control register (OCDCON) 003016 I2C start/stop condition control register (S2D) 001116 Current detect time set up register (OCDTIME) 003116 I2C additional function register (S3) 001216 Wake up current detector control register1 (WUDCON1) 003216 32kHz oscillation control register 0 (32KOSCC0) 001316 Current detect status register (OCDSTS) 003316 32kHz oscillation control register 1 (32KOSCC1) 001416 Wake up current detector control register2 (WUDCON2) 003416 A/D control register (ADCON) 001516 Serial I/O2 control register 1 (SIO2CON1) 003516 A/D conversion low-order register (ADL) 001616 Serial I/O2 control register 2 (SIO2CON2) 003616 A/D conversion high-order register (ADH) 001716 Serial I/O2 register (SIO2) 003716 MISRG2 001816 Transmit/Receive buffer register (TB/RB) 003816 MISRG 001916 Serial I/O1 status register (SIOSTS) 003916 Watchdog timer control register (WDTCON) 001A16 Serial I/O1 control register (SIOCON) 003A16 Interrupt edge selection register (INTEDGE) 001B16 UART control register (UARTCON) 003B16 CPU mode register (CPUM) 001C16 Baud rate generator (BRG) 003C16 Interrupt request register 1 (IREQ1) 001D16 PWM control register (PWMCON) 003D16 Interrupt request register 2 (IREQ2) 001E16 PWM prescaler (PREPWM) 003E16 Interrupt control register 1 (ICON1) 001F16 PWM register (PWM) 003F16 Interrupt control register 2 (ICON2) 0FFD16 Reserved ✽ ✽ Reserved : Do not write any data to the reserved area. Fig. 5 Memory map of special function register (SFR) Rev.1.01 Aug 02, 2004 page 6 of 96 0FFE16 Flash memory control register (FCON) 0FFF16 Reserved ✽ 7517 Group I/O PORTS The I/O ports have direction registers which determine the input/ output direction of each individual pin. Each bit in a direction register corresponds to one pin, and each pin can be set to be input port or output port. When “0” is written to the bit corresponding to a pin, that pin becomes an input pin. When “1” is written to that bit, that pin becomes an output pin. If data is read from a pin which is set to output, the value of the port output latch is read, not the value of the pin itself. Pins set to input are floating. If a pin set to input is written to, only the port output latch is written to and the pin remains floating. Table 2 I/O port function Pin P00/SIN2 P01/SOUT2 P02/SCLK2 P03/SRDY2 Name Input/Output Port P0 Input/output, individual bits I/O Structure CMOS compatible input level CMOS 3-state output P04/AN8–P07/AN11 P10–P17 Port P1 P20/XCOUT P21/XCIN Port P2 Non-Port Function Related SFRs Ref.No. Serial I/O2 function I/O Serial I/O2 control register (1) (2) (3) (4) A/D conversion input A/D control register, MISRG2 (5) Sub-clock generating circuit CPU mode register MISRG2 (6) (7) P22/SDA1 P23/SCL1 CMOS compatible input level CMOS/SMBUS input level (when selecting I2C-BUS interface function) N-channel open-drain output I2C-BUS interface function I/O I2C control register (8) (9) (10) P24/SDA2/RxD P25/SCL2/TxD CMOS compatible input level CMOS/SMBUS input level (when selecting I2C-BUS interface function) CMOS 3-state output N-channel open-drain output (when selecting I2C-BUS interface function) I2C-BUS interface function I/O I2C control register Serial I/O1 control register (12) P26/SCLK CMOS compatible input level Serial I/O1 function I/O Serial I/O1 control register (13) P27/CNTR0/ SRDY1 CMOS 3-state output Serial I/O1 function I/O Serial I/O1 control register (14) Serial I/O1 function I/O Timer X function I/O (11) Timer XY mode register P30/AN0– P35/AN5 Port P3 A/D conversion input A/D control register MISRG2 (5) P40/CNTR1 Port P4 Timer Y function I/O Timer XY mode register (15) P41/INT0 P42/INT1 External interrupt input Interrupt edge selection register (16) P43/INT2/SCMP2 External interrupt input Interrupt edge selection register (17) SCMP2 output Serial I/O2 control register External interrupt input P44/INT3/PWM PWM output Interrupt edge selection register (18) PWM control register P45/DFETCNT Rev.1.01 Aug 02, 2004 Over current detector output page 7 of 96 Short current detect control register Over current detect control register Wake up current detect control register (19) 7517 Group (1) Port P00 (2) Port P01 P01/SOUT2 P-channel output disable bit Direction register Serial I/O2 transmit completion signal Serial I/O2 port selection bit Data bus Direction register Port latch Data bus Port latch Serial I/O2 input Serial I/O2 output (3) Port P02 (4) Port P03 P02/SCLK2 P-channel output disable bit Serial I/O2 synchronous clock selection bit Serial I/O2 port selection bit SRDY2 output enable bit Direction register Direction register Data bus Data bus Port latch Port latch Serial I/O2 ready output Serial I/O2 clock output Serial I/O2 external clock input (6) Port P1 (5) Ports P04–P07, P30–P35 Direction register Data bus Direction register Data bus Port latch Port latch A/D converter input Analog input pin selection bit (7) Port P20 (8) Port P21 Port XC switch bit Port XC switch bit Direction register Direction register Data bus Data bus Port latch Port latch Port P21 32kHz RC oscillation enable bit Port Xc switch bit 32kHz RC oscillation enable bit Sub-clock generating circuit input Reference voltage Fig. 6 Port block diagram (1) Rev.1.01 Aug 02, 2004 page 8 of 96 + 7517 Group (9) Port P22 (10) Port P23 I2C-BUS interface enable bit SDA/SCL pin selection bit I2C-BUS interface enable bit SDA/SCL pin selection bit Direction register Direction register Data bus Data bus Port latch Port latch SDA output SCL output SCL input SDA input (11) Port P24 (12) Port P25 I2C-BUS interface enable bit SDA/SCL pin selection bit Serial I/O1 enable bit Receive enable bit P-channel output disable bit Serial I/O1 enable bit Transmit enable bit I2C-BUS interface enable bit SDA/SCL pin selection bit Direction register Direction register Data bus Port latch Data bus Port latch SDA input SDA output Serial I/O1 input SCL input Serial I/O1 output SCL output (14) Port P27 (13) Port P26 Pulse output mode Serial I/O1 synchronous clock selection bit Serial I/O1 enable bit Serial I/O1 mode selection bit Serial I/O1 enable bit SRDY1 output enable bit Serial I/O1 mode selection bit Serial I/O1 enable bit Direction register Direction register Data bus Data bus Port latch Port latch Pulse output mode Serial I/O1 ready output Timer output Serial I/O1 clock output Serial I/O1 external clock input CNTR0 interrupt input (16) Ports P41, P42 (15) Port P40 Direction register Data bus Direction register Data bus Port latch Pulse output mode Timer output Interrupt input CNTR1 interrupt input Fig. 7 Port block diagram (2) Rev.1.01 Aug 02, 2004 Port latch page 9 of 96 7517 Group (18) Port P44 (17) Port P43 PWM output enable bit Serial I/O2 input/output comparison signal control bit Direction register Direction register Data bus Data bus Port latch Port latch PWM output Serial I/O2 input/output comparison signal output Interrupt input Interrupt input (19) Port P45 Short current detect enable bit Over current detect enable bit Wake up current detect enable bit Direction register Port latch Data bus DFETCNT output Fig. 8 Port block diagram (3) Rev.1.01 Aug 02, 2004 page 10 of 96 7517 Group INTERRUPTS ■Notes Interrupts occur by 16 sources among 19 sources: seven external, eleven internal, and one software. When the active edge of an external interrupt (INT0–INT3 , SCL/ SDA, CNTR0, CNTR1) is set, the corresponding interrupt request bit may also be set. Therefore, take the following sequence: Interrupt Control Each interrupt is controlled by an interrupt request bit, an interrupt enable bit, and the interrupt disable flag except for the software interrupt set by the BRK instruction. An interrupt occurs if the corresponding interrupt request and enable bits are “1” and the interrupt disable flag is “0”. Interrupt enable bits can be set or cleared by software. Interrupt request bits can be cleared by software, but cannot be set by software. The BRK instruction cannot be disabled with any flag or bit. The I (interrupt disable) flag disables all interrupts except the BRK instruction interrupt. When several interrupts occur at the same time, the interrupts are received according to priority. Interrupt Operation By acceptance of an interrupt, the following operations are automatically performed: 1. The contents of the program counter and the processor status register are automatically pushed onto the stack. 2. The interrupt disable flag is set and the corresponding interrupt request bit is cleared. 3. The interrupt jump destination address is read from the vector table into the program counter. Rev.1.01 Aug 02, 2004 page 11 of 96 1. Disable the interrupt. 2. Set the interrupt edge selection register (SCL/SDA interrupt pin polarity selection bit for SCL/SDA; the timer XY mode register for CNTR0 and CNTR1). 3. Set the interrupt request bit to “0”. 4. Accept the interrupt. 7517 Group Table 3 Interrupt vector addresses and priority Interrupt Source Reset (Note 2) Priority 1 Vector Addresses (Note 1) Low High FFFC16 FFFD16 Interrupt Request Generating Conditions Remarks At reset Non-maskable External interrupt (active edge selectable) INT0 2 FFFB16 FFFA16 At detection of either rising or falling edge of INT0 input SCL, SDA 3 FFF916 FFF816 At detection of either rising or falling edge of SCL or SDA input External interrupt (active edge selectable) INT1 4 FFF716 FFF616 At detection of either rising or falling edge of INT1 input External interrupt (active edge selectable) INT2 5 FFF516 FFF416 At detection of either rising or falling edge of INT2 input External interrupt (active edge selectable) At detection of either rising or falling edge of INT3 input External interrupt (active edge selectable) At completion of serial I/O2 data reception Valid when serial I/O2 is selected INT3 6 FFF316 FFF216 Serial I/O2 I2C Timer X Timer Y 7 FFF116 FFF016 At completion of data transfer 8 FFEF16 At timer X underflow 9 FFED16 Timer 1 10 FFEB16 FFEE16 FFEC16 FFEA16 Timer 2 11 FFE916 FFE816 At timer 2 underflow Serial I/O1 reception 12 FFE716 FFE616 At completion of serial I/O1 data reception Valid when serial I/O1 is selected At completion of serial I/O1 transfer shift or when transmission buffer is empty Valid when serial I/O1 is selected At short current is detected, at over current is detected, or at wake up current is detected. Valid when short current detector or over current detector, or wake up current detector is selected. Serial I/O1 transmission At timer Y underflow At timer 1 underflow STP release timer underflow 13 FFE516 FFE416 CNTR0 14 FFE316 FFE216 At detection of either rising or falling edge of CNTR0 input External interrupt (active edge selectable) CNTR1 15 FFE116 FFE016 At detection of either rising or falling edge of CNTR1 input External interrupt (active edge selectable) 16 FFDF16 FFDE16 At end of current integration period, or at end of calibration Valid when current integrator is selected 17 FFDD16 FFDC16 At BRK instruction execution Non-maskable software interrupt Over current detection At completion of A/D conversion A/D converter Current integration BRK instruction Notes 1: Vector addresses contain interrupt jump destination addresses. 2: Reset function in the same way as an interrupt with the highest priority. Rev.1.01 Aug 02, 2004 page 12 of 96 7517 Group Interrupt request bit Interrupt enable bit Interrupt disable flag (I) BRK instruction Reset Interrupt request Fig. 9 Interrupt control b7 b0 Interrupt edge selection register (INTEDGE : address 003A16) INT0 active edge selection bit INT1 active edge selection bit INT2 active edge selection bit INT3 active edge selection bit Serial I/O2 / INT3 interrupt source bit 0 : Falling edge active 1 : Rising edge active 0 : INT3 interrupt selected 1 : Serial I/O2 interrupt selected Current integrate/A/D converter interrupt source bit 0 : AD converter interrupt selected 1 : Current integrate interrupt selected Over current detect / Serial I/O1 transmit interrupt source bit 0 : Serial I/O1 transmit interrupt selected 1 : Over current detect interrupt selected Not used (returns “0” when read) b7 b7 b0 Interrupt request register 1 (IREQ1 : address 003C16) b0 b0 Interrupt request register 2 (IREQ2 : address 003D16) INT0 interrupt request bit SCL/SDA interrupt request bit INT1 interrupt request bit INT2 interrupt request bit INT3 / Serial I/O2 interrupt request bit I2C interrupt request bit Timer X interrupt request bit Timer Y interrupt request bit Timer 1 interrupt request bit Timer 2 interrupt request bit Serial I/O1 reception interrupt request bit Serial I/O1 transmit / Over current detect interrupt request bit CNTR0 interrupt request bit CNTR1 interrupt request bit AD converter /current integrate interrupt request bit Not used (returns “0” when read) 0 : No interrupt request issued 1 : Interrupt request issued 0 : No interrupt request issued 1 : Interrupt request issued Interrupt control register 1 (ICON1 : address 003E16) INT0 interrupt enable bit SCL/SDA interrupt enable bit INT1 interrupt enable bit INT2 interrupt enable bit INT3 / Serial I/O2 interrupt enable bit I2C interrupt enable bit Timer X interrupt enable bit Timer Y interrupt enable bit 0 : Interrupts disabled 1 : Interrupts enabled Fig. 10 Structure of interrupt-related registers (1) Rev.1.01 b7 Aug 02, 2004 page 13 of 96 b7 b0 Interrupt control register 2 (ICON2 : address 003F16) Timer 1 interrupt enable bit Timer 2 interrupt enable bit Serial I/O1 reception interrupt enable bit Serial I/O1 transmit / Over current detect interrupt enable bit CNTR0 interrupt enable bit CNTR1 interrupt enable bit AD converter / current integrate interrupt enable bit Not used (returns “0” when read) (Do not write “1” to this bit) 0 : Interrupts disabled 1 : Interrupts enabled 7517 Group TIMERS Timer 1 and Timer 2 The 7517 group has four timers: timer X, timer Y, timer 1, and timer 2. The division ratio of each timer or prescaler is given by 1/(n + 1), where n is the value in the corresponding timer or prescaler latch. All timers are count down. When the timer reaches “0016”, an underflow occurs at the next count pulse and the corresponding timer latch is reloaded into the timer and the count is continued. When a timer underflows, the interrupt request bit corresponding to that timer is set to “1”. The count source of prescaler 12 is the oscillation frequency which is selected by timer 12 count source selection bit. The output of prescaler 12 is counted by timer 1 and timer 2, and a timer underflow sets the interrupt request bit. Timer X and Timer Y Timer X and Timer Y can each select in one of four operating modes by setting the timer XY mode register. (1) Timer Mode The timer counts the count source selected by Timer count source selection bit. (2) Pulse Output Mode b0 b7 Timer XY mode register (TM : address 002316) Timer X operating mode bits b1b0 0 0: Timer mode 0 1: Pulse output mode 1 0: Event counter mode 1 1: Pulse width measurement mode CNTR0 active edge selection bit 0: Interrupt at falling edge Count at rising edge in event counter mode 1: Interrupt at rising edge Count at falling edge in event counter mode Timer X count stop bit 0: Count start 1: Count stop Timer Y operating mode bits b5b4 0 0: Timer mode 0 1: Pulse output mode 1 0: Event counter mode 1 1: Pulse width measurement mode CNTR1 active edge selection bit 0: Interrupt at falling edge Count at rising edge in event counter mode 1: Interrupt at rising edge Count at falling edge in event counter mode Timer Y count stop bit 0: Count start 1: Count stop Fig. 11 Structure of timer XY mode register b0 b7 Timer count source selection register (TCSS : address 002816) Timer X count source selection bit 0 : f(XIN)/16 (f(XCIN)/16 at low-speed mode) 1 : f(XIN)/2 (f(XCIN)/2 at low-speed mode) Timer Y count source selection bit 0 : f(XIN)/16 (f(XCIN)/16 at low-speed mode) 1 : f(XIN)/2 (f(XCIN)/2 at low-speed mode) Timer 12 count source selection bit 0 : f(XIN)/16 (f(XCIN)/16 at low-speed mode) 1 : f(XCIN) Not used (returns “0” when read) Fig. 12 Structure of timer count source selection register Rev.1.01 Aug 02, 2004 page 14 of 96 The timer counts the count source selected by Timer count source selection bit. Whenever the contents of the timer reach “0016”, the signal output from the CNTR 0 (or CNTR1) pin is inverted. If the CNTR0 (or CNTR1) active edge selection bit is “0”, output begins at “ H”. If it is “1”, output starts at “L”. When using a timer in this mode, set the corresponding port P27 ( or port P40) direction register to output mode. (3) Event Counter Mode Operation in event counter mode is the same as in timer mode, except that the timer counts signals input through the CNTR0 or CNTR1 pin. When the CNTR0 (or CNTR1) active edge selection bit is “0”, the rising edge of the CNTR0 (or CNTR1) pin is counted. When the CNTR0 (or CNTR1) active edge selection bit is “1”, the falling edge of the CNTR0 (or CNTR1) pin is counted. (4) Pulse Width Measurement Mode If the CNTR0 (or CNTR1) active edge selection bit is “0”, the timer counts the selected signals by the count source selection bit while the CNTR0 (or CNTR1) pin is at “H”. If the CNTR0 (or CNTR1) active edge selection bit is “1”, the timer counts it while the CNTR0 (or CNTR1) pin is at “L”. The count can be stopped by setting “1” to the timer X (or timer Y) count stop bit in any mode. The corresponding interrupt request bit is set each time a timer underflows. ■Note When switching the count source by the timer 12, X or Y count source bit, the value of timer count is altered in inconsiderable amount owing to generating of a thin pulses in the count input signals. Therefore, select the timer count source before set the value to the prescaler and the timer. 7517 Group Data bus f(XIN)/16 f(XIN)/2 Prescaler X latch (8) Pulse width Timer X count source selection bit measurement Timer mode Pulse output mode mode Prescaler X (8) CNTR0 active edge selection “0” bit P27/CNTR0 Event counter mode “1” Timer X (8) To timer X interrupt request bit Timer X count stop bit To CNTR0 interrupt request bit CNTR0 active edge selection “1” bit “0” Q Toggle flip-flop T Q R Timer X latch write pulse Pulse output mode Port P27 latch Port P27 direction register Timer X latch (8) Pulse output mode Data bus Prescaler Y latch (8) f(XIN)/16 f(XIN)/2 Timer Y count source selection bit Pulse width measurement mode Timer mode Pulse output mode Prescaler Y (8) CNTR1 active edge selection “0” bit P40/CNTR1 Event counter mode “1” Timer Y latch (8) Timer Y (8) To timer Y interrupt request bit Timer Y count stop bit To CNTR1 interrupt request bit CNTR1 active edge selection “1” bit Q Toggle flip-flop T Q “0” R Port P40 latch Timer Y latch write pulse Pulse output mode Port P40 direction register Pulse output mode Data bus Prescaler 12 latch (8) f(XIN)/16 f(XCIN) Prescaler 12 (8) Timer 1 latch (8) Timer 2 latch (8) Timer 1 (8) Timer 2 (8) To timer 2 interrupt request bit Timer 12 count source selection bit To timer 1 interrupt request bit Fig. 13 Block diagram of timer X, timer Y, timer 1, and timer 2 Rev.1.01 Aug 02, 2004 page 15 of 96 7517 Group SERIAL I/O1 (1) Clock Synchronous Serial I/O Mode Serial I/O1 can be used as either clock synchronous or asynchronous (UART) serial I/O. A dedicated timer is also provided for baud rate generation. Clock synchronous serial I/O mode can be selected by setting the serial I/O1 mode selection bit of the serial I/O1 control register (bit 6 of address 001A16) to “1”. For clock synchronous serial I/O, the transmitter and the receiver must use the same clock. If an internal clock is used, transfer is started by a write signal to the TB/RB. Data bus Serial I/O1 control register Address 001816 Receive buffer register Receive interrupt request (RI) Receive shift register P24/RXD Address 001A16 Receive buffer full flag (RBF) Shift clock Clock control circuit P26/SCLK XIN Serial I/O1 synchronous clock selection bit Frequency division ratio 1/(n+1) Baud rate generator 1/4 Address 001C16 BRG count source selection bit 1/4 P27/SRDY1 F/F Clock control circuit Falling-edge detector Shift clock P25/TXD Transmit shift completion flag (TSC) Transmit interrupt source selection bit Transmit interrupt request (TI) Transmit shift register Transmit buffer register Address 001816 Transmit buffer empty flag (TBE) Serial I/O1 status register Address 001916 Data bus Fig. 14 Block diagram of clock synchronous serial I/O1 Transfer shift clock (1/2 to 1/2048 of the internal clock, or an external clock) Serial output TxD D0 D1 D2 D3 D4 D5 D6 D7 Serial input RxD D0 D1 D2 D3 D4 D5 D6 D7 Receive enable signal SRDY1 Write pulse to receive/transmit buffer register (address 001816) TBE = 0 TBE = 1 TSC = 0 RBF = 1 TSC = 1 Overrun error (OE) detection Notes 1: As the transmit interrupt (TI), either when the transmit buffer has emptied (TBE=1) or after the transmit shift operation has ended (TSC=1), by setting the transmit interrupt source selection bit (TIC) of the serial I/O1 control register. 2: If data is written to the transmit buffer register when TSC=0, the transmit clock is generated continuously and serial data is output continuously from the TxD pin. 3: The receive interrupt (RI) is set when the receive buffer full flag (RBF) becomes “1” . Fig. 15 Operation of clock synchronous serial I/O1 function Rev.1.01 Aug 02, 2004 page 16 of 96 7517 Group (2) Asynchronous Serial I/O(UART) Mode two buffers have the same address in memory. Since the shift register cannot be written to or read from directly, transmit data is written to the transmit buffer register, and receive data is read from the receive buffer register. The transmit buffer register can also hold the next data to be transmitted, and the receive buffer register can hold a character while the next character is being received. Clock asynchronous serial I/O mode (UART) can be selected by clearing the serial I/O1 mode selection bit (b6) of the serial I/O1 control register to “0”. Eight serial data transfer formats can be selected, and the transfer formats used by a transmitter and receiver must be identical. The transmit and receive shift registers each have a buffer, but the Data bus Address 001816 OE P24/RXD Serial I/O1 control register Address 001A16 Receive buffer full flag (RBF) Receive interrupt request (RI) Receive buffer register Character length selection bit ST detector 7 bits Receive shift register 1/16 8 bits PE FE SP detector Clock control circuit UART control register Address 001B16 Serial I/O1 synchronous clock selection bit P26/SCLK1 XIN BRG count source selection bit Frequency division ratio 1/(n+1) Baud rate generator Address 001C16 1/4 ST/SP/PA generator 1/16 P25/TXD Transmit shift register Transmit interrupt source selection bit Transmit interrupt request (TI) Transmit buffer register Transmit buffer empty flag (TBE) Serial I/O1 status register Address 001916 Character length selection bit Address 001816 Data bus Fig. 16 Block diagram of UART serial I/O1 Rev.1.01 Aug 02, 2004 page 17 of 96 Transmit shift completion flag (TSC) 7517 Group Transmit or receive clock Transmit buffer write signal TBE=0 TSC=0 TBE=1 Serial output TXD TBE=0 TBE=1 ST D0 D1 SP TSC=1 ST D0 Receive buffer read signal SP D1 1 start bit 7 or 8 data bit 1 or 0 parity bit 1 or 2 stop bit (s) Generated at 2nd bit in 2-stop-bit mode RBF=0 RBF=1 Serial input RXD ST D0 D1 SP RBF=1 ST D0 D1 SP Notes 1: Error flag detection occurs at the same time that the RBF flag becomes “1” (at 1st stop bit, during reception). 2: As the transmit interrupt (TI), when either the TBE or TSC flag becomes “1”, can be selected to occur depending on the setting of the transmit interrupt source selection bit (TIC) of the serial I/O1 control register. 3: The receive interrupt (RI) is set when the RBF flag becomes “1”. 4: After data is written to the transmit buffer when TSC=1, 0.5 to 1.5 cycles of the data shift cycle is necessary until changing to TSC=0. Fig. 17 Operation of UART serial I/O1 function [Transmit Buffer Register/Receive Buffer Register (TB/RB)] 001816 The transmit buffer register and the receive buffer register are located at the same address. The transmit buffer is write-only and the receive buffer is read-only. If a character bit length is 7 bits, the MSB of data stored in the receive buffer is “0”. [Serial I/O1 Status Register (SIOSTS)] 001916 The read-only serial I/O1 status register consists of seven flags (bits 0 to 6) which indicate the operating status of the serial I/O1 function and various errors. Three of the flags (bits 4 to 6) are valid only in UART mode. The receive buffer full flag (bit 1) is cleared to “0” when the receive buffer register is read. If there is an error, it is detected at the same time that data is transferred from the receive shift register to the receive buffer register, and the receive buffer full flag is set. A write to the serial I/O1 status register clears all the error flags OE, PE, FE, and SE (bit 3 to bit 6, respectively). Writing “0” to the serial I/O1 enable bit SIOE (bit 7 of the serial I/O1 control register) also clears all the status flags, including the error flags. Bits 0 to 6 of the serial I/O1 status register are initialized to “0” at reset, but if the transmit enable bit (bit 4) of the serial I/O1 control register has been set to “1”, the transmit shift completion flag (bit 2) and the transmit buffer empty flag (bit 0) become “1”. Rev.1.01 Aug 02, 2004 page 18 of 96 [Serial I/O1 Control Register (SIOCON)] 001A16 The serial I/O1 control register consists of eight control bits for the serial I/O1 function. [UART Control Register (UARTCON)] 001B16 The UART control register consists of four control bits (bits 0 to 3) which are valid when asynchronous serial interface is selected and set the data format of an data transfer and one bit (bit 4) which is always valid and sets the output structure of the P25/TXD pin. [Baud Rate Generator (BRG)] 001C16 The baud rate generator determines the baud rate for serial transfer. The baud rate generator divides the frequency of the count source by 1/(n + 1), where n is the value written to the baud rate generator. ■Note When using the serial I/O1, clear the I2C-BUS interface enable bit to “0” or the SCL/SDA pin selection bit to “0”. 7517 Group b7 b0 Serial I/O1 status register (SIOSTS : address 001916) Transmit buffer empty flag (TBE) 0: Buffer full 1: Buffer empty Receive buffer full flag (RBF) 0: Buffer empty 1: Buffer full Transmit shift completion flag (TSC) 0: Transmit shift in progress 1: Transmit shift completed Overrun error flag (OE) 0: No error 1: Overrun error Parity error flag (PE) 0: No error 1: Parity error Framing error flag (FE) 0: No error 1: Framing error Summing error flag (SE) 0: (OE) U (PE) U (FE)=0 1: (OE) U (PE) U (FE)=1 Not used (returns “1” when read) b7 b0 UART control register (UARTCON : address 001B16) Character length selection bit (CHAS) 0: 8 bits 1: 7 bits Parity enable bit (PARE) 0: Parity checking disabled 1: Parity checking enabled Parity selection bit (PARS) 0: Even parity 1: Odd parity Stop bit length selection bit (STPS) 0: 1 stop bit 1: 2 stop bits P25/TXD P-channel output disable bit (POFF) 0: CMOS output (in output mode) 1: N-channel open drain output (in output mode) Not used (return “1” when read) Fig. 18 Structure of serial I/O1 control registers Rev.1.01 Aug 02, 2004 page 19 of 96 b7 b0 Serial I/O1 control register (SIOCON : address 001A16) BRG count source selection bit (CSS) 0: f(XIN) 1: f(XIN)/4 Serial I/O1 synchronous clock selection bit (SCS) 0: BRG output divided by 4 when clock synchronous serial I/O1 is selected, BRG output divided by 16 when UART is selected. 1: External clock input when clock synchronous serial I/O1 is selected, external clock input divided by 16 when UART is selected. SRDY1 output enable bit (SRDY) 0: P27 pin operates as ordinary I/O pin 1: P27 pin operates as SRDY1 output pin Transmit interrupt source selection bit (TIC) 0: Interrupt when transmit buffer has emptied 1: Interrupt when transmit shift operation is completed Transmit enable bit (TE) 0: Transmit disabled 1: Transmit enabled Receive enable bit (RE) 0: Receive disabled 1: Receive enabled Serial I/O1 mode selection bit (SIOM) 0: Clock asynchronous (UART) serial I/O 1: Clock synchronous serial I/O Serial I/O1 enable bit (SIOE) 0: Serial I/O1 disabled (pins P24 to P27 operate as ordinary I/O pins) 1: Serial I/O1 enabled (pins P24 to P27 operate as serial I/O1 pins) 7517 Group ●Serial I/O2 The serial I/O2 can be operated only as the clock synchronous type. As a synchronous clock for serial transfer, either internal clock or external clock can be selected by the serial I/O2 synchronous clock selection bit (b6) of serial I/O2 control register 1. The internal clock incorporates a dedicated divider and permits selecting 6 types of clock by the internal synchronous clock selection bit (b2, b1, b0) of serial I/O2 control register 1. Regarding SOUT2 and SCLK2 being output pins, either CMOS output format or N-channel open-drain output format can be selected by the P01/S OUT2, P02/S CLK2 P-channel output disable bit (b7) of serial I/O2 control register 1. When the internal clock has been selected, a transfer starts by a write signal to the serial I/O2 register (address 001716). After completion of data transfer, the level of the SOUT2 pin goes to high impedance automatically but bit 7 of the serial I/O2 control register 2 is not set to "1" automatically. When the external clock has been selected, the contents of the serial I/O2 register is continuously sifted while transfer clocks are input. Accordingly, control the clock externally. Note that the SOUT2 pin does not go to high impedance after completion of data transfer. To cause the SOUT2 pin to go to high impedance in the case where the external clock is selected, set bit 7 of the serial I/O2 control register 2 to "1" when SCLK2 is "H" after completion of data transfer. After the next data transfer is started (the transfer clock falls), bit 7 of the serial I/O2 control register 2 is set to "0" and the SOUT2 pin is put into the active state. Regardless of the internal clock to external clock, the interrupt request bit is set after the number of bits (1 to 8 bits) selected by the optional transfer bit is transferred. In case of a fractional number of bits less than 8 bits as the last data, the received data to be stored in the serial I/O2 register becomes a fractional number of bits close to MSB if the transfer direction selection bit of serial I/O2 control register 1 is LSB first, or a fractional number of bits close to LSB if the said bit is MSB first. For the remaining bits, the previously received data is shifted. At transmit operation using the clock synchronous serial I/O, the SCMP2 signal can be output by comparing the state of the transmit pin SOUT2 with the state of the receive pin SIN2 in synchronization with a rise of the transfer clock. If the output level of the SOUT2 pin is equal to the input level to the SIN2 pin, "L" is output from the SCMP2 pin. If not, "H" is output. At this time, an INT2 interrupt request can also be generated. Select a valid edge by bit 2 of the interrupt edge selection register (address 003A16). [Serial I/O2 Control Registers 1, 2] SIO2CON1 / SIO2CON2 The serial I/O2 control registers 1 and 2 are containing various selection bits for serial I/O2 control as shown in Figure 19. Rev.1.01 Aug 02, 2004 page 20 of 96 b7 b0 Serial I/O2 control register 1 (SIO2CON1 : address 001516) Internal synchronous clock selection bit b2 b1 b0 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0: f(XIN)/8 (f(XCIN)/8 in low-speed mode) 1: f(XIN)/16 (f(XCIN)/16 in low-speed mode) 0: f(XIN)/32 (f(XCIN)/32 in low-speed mode) 1: f(XIN)/64 (f(XCIN)/64 in low-speed mode) 0: Not available 1: Not available 0: f(XIN)/128 f(XCIN)/128 in low-speed mode) 1: f(XIN)/256 (f(XCIN)/256 in low-speed mode) Serial I/O2 port selection bit 0: I/O port 1: SOUT2,SCLK2 output pin SRDY2 output enable bit 0: P03 pin is normal I/O pin 1: P03 pin is SRDY2 output pin Transfer direction selection bit 0: LSB first 1: MSB first Serial I/O2 synchronous clock selection bit 0: External clock 1: Internal clock P01/SOUT2 ,P02/SCLK2 P-channel output disable bit 0: CMOS output (in output mode) 1: N-channel open-drain output (in output mode ) b7 b0 Serial I/O2 control register 2 (SIO2CON2 : address 001616) Optional transfer bits b2 b1 b0 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0: 1 bit 1: 2 bit 0: 3 bit 1: 4 bit 0: 5 bit 1: 6 bit 0: 7 bit 1: 8 bit Not used ( returns "0" when read) Serial I/O2 I/O comparison signal control bit 0: P43 I/O 1: SCMP2 output SOUT2 pin control bit (P01) 0: Output active 1: Output high-impedance Fig. 19 Structure of Serial I/O2 control registers 1, 2 7517 Group Internal synchronous clock selection bit 1/8 XCIN 1/16 "10" Divider Main clock division ratio selection bits (Note) "00" "01" XIN Data bus 1/32 1/64 1/128 1/256 P03 latch Serial I/O2 synchronous clock selection bit "0" SRDY2 "1" SRDY2 output enable bit "1" Synchronous circuit SCLK2 P03/SRDY2 "0" External clock P02 latch Optional transfer bits (3) "0" P02/SCLK2 Serial I/O2 interrupt request Serial I/O counter 2 (3) "1" Serial I/O2 port selection bit P01 latch "0" P01/SOUT2 "1" Serial I/O2 port selection bit Serial I/O2 register (8) P00/SIN2 P43 latch "0" D P43/SCMP2/INT2 Q "1" Serial I/O2 I/O comparison signal control bit Note: Either high-speed, middle-speed or low-speed mode is selected by bits 6 and 7 of CPU mode register. Fig. 20 Block diagram of Serial I/O2 Transfer clock (Note 1) Write-in signal to serial I/O2 register (Note 2) Serial I/O2 output SOUT2 D0 D1 . D2 D3 D4 D5 D6 D7 Serial I/O2 input SIN2 Receive enable signal SRDY2 Serial I/O2 interrupt request bit set Notes 1: When the internal clock is selected as a transfer clock, the f(XIN) clock division (f(XCIN) in low-speed mode) can be selected by setting bits 0 to 2 of serial I/O2 control register 1. 2: When the internal clock is selected as a transfer clock, the SCOUT2 pin has high impedance after transfer completion. Fig. 21 Timing chart of Serial I/O2 Rev.1.01 Aug 02, 2004 page 21 of 96 7517 Group SCMP2 SCLK2 SOUT2 SIN2 Judgement of I/O data comparison Fig. 22 SCMP2 output operation Rev.1.01 Aug 02, 2004 page 22 of 96 7517 Group MULTI-MASTER I2C-BUS INTERFACE Table 4 Multi-master I2C-BUS interface functions I2C-BUS The multi-master interface is a serial communications circuit, conforming to the Philips I2C-BUS data transfer format. This interface, offering both arbitration lost detection and a synchronous functions, is useful for the multi-master serial communications. Figure 23 shows a block diagram of the multi-master I2C-BUS interface and Table 4 lists the multi-master I 2 C-BUS interface functions. This multi-master I 2C-BUS interface consists of the I2C address register, the I2C data shift register, the I2C clock control register, the I2C control register, the I 2C status register, the I2C start/stop condition control register and other control circuits. When using the multi-master I 2 C-BUS interface, set 1 MHz or more to φ . Note: Renesas Technology Corporation assumes no responsibility for infringement of any third-party’s rights or originating in the use of the connection control function between the I2C-BUS interface and the ports SCL1, SCL2, SDA1 and SDA2 with the bit 6 of I2C control register (002E16). Item Format Communication mode SCL clock frequency In conformity with Philips I2C-BUS standard: Master transmission Master reception Slave transmission Slave reception 16.1 kHz to 400 kHz (at φ = 4 MHz) System clock φ = f(XIN)/2 (high-speed mode) φ = f(XIN)/8 (middle-speed mode) I2C address register b7 Function In conformity with Philips I2C-BUS standard: 10-bit addressing format 7-bit addressing format High-speed clock mode Standard clock mode b0 Interrupt generating circuit SAD6 SAD5 SAD4 SAD3 SAD2 SAD1 SAD0 RWB S0D Interrupt request signal (IICIRQ) Address comparator Serial data (SDA) Noise elimination circuit Data control circuit b0 b7 I2C data shift register b7 b0 S0 AL AAS AD0 LRB MST TRX BB PIN SIS SIP SSC4 SSC3 SSC2 SSC1 SSC0 S2D AL circuit I2C status register S1 I2C start/stop condition control register Internal data bus BB circuit Serial clock (SCL) Noise elimination circuit Clock control circuit b7 ACK b0 ACK FAST CCR4 CCR3 CCR2 CCR1 CCR0 BIT MODE S2 I2C clock control register Clock division b7 TISS TSEL 10BIT SAD b0 ALS ES0 BC2 BC1 BC0 S1D I 2 C control register System clock (φ) Bit counter Fig. 23 Block diagram of multi-master I2C-BUS interface ✽ : Purchase of Renesas Technology Corporation‘s I2C components conveys a license under the Philips I2C Patent Rights to use these components an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. Rev.1.01 Aug 02, 2004 page 23 of 96 7517 Group [I2C Data Shift Register (S0)] 002B16 The I2C data shift register (S0 : address 002B16) is an 8-bit shift register to store receive data and write transmit data. When transmit data is written into this register, it is transferred to the outside from bit 7 in synchronization with the SCL clock, and each time one-bit data is output, the data of this register are shifted by one bit to the left. When data is received, it is input to this register from bit 0 in synchronization with the SCL clock, and each time one-bit data is input, the data of this register are shifted by one bit to the left. The minimum 2 machine cycles are required from the rising of the SCL clock until input to this register. The I2C data shift register is in a write enable status only when the I2C-BUS interface enable bit (ES0 bit : bit 3 of address 002E16) of the I2C control register is “1”. The bit counter is reset by a write instruction to the I2C data shift register. When both the ES0 bit and the MST bit of the I2C status register (address 002D16) are “1”, the SCL is output by a write instruction to the I2C data shift register. Reading data from the I2C data shift register is always enabled regardless of the ES0 bit value. [I2C Address Register (S0D)] 002C16 The I 2 C address register (address 002C 16) consists of a 7-bit slave address and a read/write bit. In the addressing mode, the slave address written in this register is compared with the address data to be received immediately after the START condition is detected. •Bit 0: Read/write bit (RWB) This is not used in the 7-bit addressing mode. In the 10-bit addressing mode, the first address data to be received is compared with the contents (SAD6 to SAD0 + RWB) of the I2C address register. The RWB bit is cleared to “0” automatically when the stop condition is detected. •Bits 1 to 7: Slave address (SAD0–SAD6) These bits store slave addresses. Regardless of the 7-bit addressing mode or the 10-bit addressing mode, the address data transmitted from the master is compared with these bit's contents. Rev.1.01 Aug 02, 2004 page 24 of 96 b7 b0 SAD6 SAD5 SAD4 SAD3 SAD2 SAD1 SAD0 RWB I2C address register (S0D: address 002C 16) Read/write bit Slave address Fig. 24 Structure of I2C address register 7517 Group Note: Do not write data into the I2C clock control register during transfer. If data is written during transfer, the I 2C clock generator is reset, so that data cannot be transferred normally. Rev.1.01 Aug 02, 2004 page 25 of 96 I2C clock control register (S2 : address 002F16) SCL frequency control bits Refer to Table 5. SCL mode specification bit 0 : Standard clock mode 1 : High-speed clock mode ACK bit 0 : ACK is returned. 1 : ACK is not returned. ACK clock bit 0 : No ACK clock 1 : ACK clock Fig. 25 Structure of I2C clock control register Table 5 Set values of I 2 C clock control register and SCL frequency Setting value of CCR4–CCR0 CCR4 CCR3 CCR2 CCR1 CCR0 SCL frequency (Note 1) (at φ = 4 MHz, unit : kHz) Standard clock High-speed clock mode mode 0 0 0 0 0 Setting disabled Setting disabled 0 0 0 0 1 Setting disabled Setting disabled Setting disabled 333 0 0 1 0 0 0 0 1 1 – (Note 2) 0 0 1 0 0 – (Note 2) 250 0 0 1 0 1 100 400 (Note 3) 0 0 1 1 0 83.3 166 … 0 Setting disabled … •Bit 7: ACK clock bit (ACK) This bit specifies the mode of acknowledgment which is an acknowledgment response of data transfer. When this bit is set to “0”, the no ACK clock mode is selected. In this case, no ACK clock occurs after data transmission. When the bit is set to “1”, the ACK clock mode is selected and the master generates an ACK clock each completion of each 1-byte data transfer. The device for transmitting address data and control data releases the SDA at the occurrence of an ACK clock (makes SDA “H”) and receives the ACK bit generated by the data receiving device. b0 ACK FAST CCR4 CCR3 CCR2 CCR1 CCR0 BIT MODE … ✽ACK clock: Clock for acknowledgment b7 ACK … The I2C clock control register (address 002F16) is used to set ACK control, SCL mode and SCL frequency. •Bits 0 to 4: SCL frequency control bits (CCR0–CCR4) These bits control the SCL frequency. Refer to Table 5. •Bit 5: SCL mode specification bit (FAST MODE) This bit specifies the SCL mode. When this bit is set to “0”, the standard clock mode is selected. When the bit is set to “1”, the high-speed clock mode is selected. When connecting the bus of the high-speed mode I2C bus standard (maximum 400 kbits/s), use 8 MHz or more oscillation frequency f(XIN) and 2 division clock. •Bit 6: ACK bit (ACK BIT) This bit sets the SDA status when an ACK clock ✽ is generated. When this bit is set to “0”, the ACK return mode is selected and SDA goes to “L” at the occurrence of an ACK clock. When the bit is set to “1”, the ACK non-return mode is selected. The SDA is held in the “H” status at the occurrence of an ACK clock. However, when the slave address agree with the address data in the reception of address data at ACK BIT = “0”, the SDA is automatically made “L” (ACK is returned). If there is a disagreement between the slave address and the address data, the SDA is automatically made “H” (ACK is not returned). … [I2C Clock Control Register (S2)] 002F16 500/CCR value (Note 3) 1 1 1 0 1 17.2 1000/CCR value (Note 3) 34.5 1 1 1 1 0 16.6 33.3 1 1 1 1 1 16.1 32.3 Notes 1: Duty of SCL clock output is 50 %. The duty becomes 35 to 45 % only when the high-speed clock mode is selected and CCR value = 5 (400 kHz, at φ = 4 MHz). “H” duration of the clock fluctuates from –4 to +2 machine cycles in the standard clock mode, and fluctuates from –2 to +2 machine cycles in the high-speed clock mode. In the case of negative fluctuation, the frequency does not increase because “L” duration is extended instead of “H” duration reduction. These are value when SCL clock synchronization by the synchronous function is not performed. CCR value is the decimal notation value of the SCL frequency control bits CCR4 to CCR0. 2: Each value of SCL frequency exceeds the limit at φ = 4 MHz or more. When using these setting value, use φ of 4 MHz or less. 3: The data formula of SCL frequency is described below: φ/(8 ✕ CCR value) Standard clock mode φ/(4 ✕ CCR value) High-speed clock mode (CCR value ≠ 5) φ/(2 ✕ CCR value) High-speed clock mode (CCR value = 5) Do not set 0 to 2 as CCR value regardless of φ frequency. Set 100 kHz (max.) in the standard clock mode and 400 kHz (max.) in the high-speed clock mode to the SCL frequency by setting the SCL frequency control bits CCR4 to CCR0. 7517 Group [I2C Control Register (S1D)] 002E16 The I2C control register (address 002E16) controls data communication format. •Bits 0 to 2: Bit counter (BC0–BC2) These bits decide the number of bits for the next 1-byte data to be transmitted. The I2C interrupt request signal occurs immediately after the number of count specified with these bits (ACK clock is added to the number of count when ACK clock is selected by ACK clock bit (bit 7 of address 002F16 )) have been transferred, and BC0 to BC2 are returned to “0002”. Also when a START condition is received, these bits become “0002” and the address data is always transmitted and received in 8 bits. •Bit 3: I2C interface enable bit (ES0) This bit enables to use the multi-master I2C-BUS interface. When this bit is set to “0”, the use disable status is provided, so that the SDA and the SCL become high-impedance. When the bit is set to “1”, use of the interface is enabled. When ES0 = “0”, the following is performed. • PIN = “1”, BB = “0” and AL = “0” are set (which are bits of the I2C status register at address 002D16 ). • Writing data to the I2C data shift register (address 002B16) is disabled. •Bit 4: Data format selection bit (ALS) This bit decides whether or not to recognize slave addresses. When this bit is set to “0”, the addressing format is selected, so that address data is recognized. When a match is found between a slave address and address data as a result of comparison or when a general call (refer to “I 2C Status Register”, bit 1) is received, transfer processing can be performed. When this bit is set to “1”, the free data format is selected, so that slave addresses are not recognized. •Bit 5: Addressing format selection bit (10BIT SAD) This bit selects a slave address specification format. When this bit is set to “0”, the 7-bit addressing format is selected. In this case, only the high-order 7 bits (slave address) of the I2C address register (address 002C16) are compared with address data. When this bit is set to “1”, the 10-bit addressing format is selected, and all the bits of the I 2C address register are compared with address data. •Bit 6: SDA/SCL pin selection bit This bit selects the input/output pins of SCL and SDA of the multimaster I2C-BUS interface. •Bit 7: I2C-BUS interface pin input level selection bit This bit selects the input level of the SCL and SDA pins of the multi-master I2C-BUS interface. TSEL SCL1/P23 SCL SCL2/TxD/P25 Multi-master I2C-BUS interface TSEL TSEL SDA1/P22 SDA SDA2/RxD/P24 TSEL Fig. 26 SDA/SCL pin selection bit b7 TISS TSEL b0 10 BIT SAD ALS ES0 BC2 BC1 BC0 I2C control register (S1D : address 002E16) Bit counter (Number of transmit/receive bits) b2 b1 b0 0 0 0 : 8 0 0 1 : 7 0 1 0 : 6 0 1 1 : 5 1 0 0 : 4 1 0 1 : 3 1 1 0 : 2 1 1 1 : 1 I2C-BUS interface enable bit 0 : Disabled 1 : Enabled Data format selection bit 0 : Addressing format 1 : Free data format Addressing format selection bit 0 : 7-bit addressing format 1 : 10-bit addressing format SDA/SCL pin selection bit 0 : Connect to ports P22, P23 1 : Connect to ports P24, P25 I2C-BUS interface pin input level selection bit 0 : CMOS input 1 : SMBUS input Fig. 27 Structure of I2C control register Rev.1.01 Aug 02, 2004 page 26 of 96 7517 Group [I2C Status Register (S1)] 002D16 The I2C status register (address 002D16) controls the I2C-BUS interface status. The low-order 4 bits are read-only bits and the high-order 4 bits can be read out and written to. Set “00002” to the low-order 4 bits, because these bits become the reserved bits at writing. •Bit 0: Last receive bit (LRB) This bit stores the last bit value of received data and can also be used for ACK receive confirmation. If ACK is returned when an ACK clock occurs, the LRB bit is set to “0”. If ACK is not returned, this bit is set to “1”. Except in the ACK mode, the last bit value of received data is input. The state of this bit is changed from “1” to “0” by executing a write instruction to the I 2C data shift register (address 002B16). •Bit 1: General call detecting flag (AD0) When the ALS bit is “0”, this bit is set to “1” when a general call✽ whose address data is all “0” is received in the slave mode. By a general call of the master device, every slave device receives control data after the general call. The AD0 bit is set to “0” by detecting the STOP condition or START condition, or reset. ✽General call: The master transmits the general call address “0016” to all slaves. •Bit 2: Slave address comparison flag (AAS) This flag indicates a comparison result of address data when the ALS bit is “0”. (1)In the slave receive mode, when the 7-bit addressing format is selected, this bit is set to “1” in one of the following conditions: • The address data immediately after occurrence of a START condition agrees with the slave address stored in the high-order 7 bits of the I2C address register (address 002C16). • A general call is received. (2)In the slave receive mode, when the 10-bit addressing format is selected, this bit is set to “1” with the following condition: • When the address data is compared with the I2C address register (8 bits consisting of slave address and RWB bit), the first bytes agree. (3)This bit is set to “0” by executing a write instruction to the I2C data shift register (address 002B16) when ES0 is set to “1” or reset. •Bit 3: Arbitration lost✽ detecting flag (AL) In the master transmission mode, when the SDA is made “L” by any other device, arbitration is judged to have been lost, so that this bit is set to “1”. At the same time, the TRX bit is set to “0”, so that immediately after transmission of the byte whose arbitration was lost is completed, the MST bit is set to “0”. The arbitration lost can be detected only in the master transmission mode. When arbitration is lost during slave address transmission, the TRX bit is set to “0” and the reception mode is set. Consequently, it becomes possible to detect the agreement of its own slave address and address data transmitted by another master device. ✽Arbitration lost :The status in which communication as a master is disabled. Rev.1.01 Aug 02, 2004 page 27 of 96 •Bit 4: SCL pin low hold bit (PIN) This bit generates an interrupt request signal. Each time 1-byte data is transmitted, the PIN bit changes from “1” to “0”. At the same time, an interrupt request signal occurs to the CPU. The PIN bit is set to “0” in synchronization with a falling of the last clock (including the ACK clock) of an internal clock and an interrupt request signal occurs in synchronization with a falling of the PIN bit. When the PIN bit is “0”, the SCL is kept in the “0” state and clock generation is disabled. Figure 29 shows an interrupt request signal generating timing chart. The PIN bit is set to “1” in one of the following conditions: • Executing a write instruction to the I2C data shift register (address 002B16). (This is the only condition which the prohibition of the internal clock is released and data can be communicated except for the start condition detection.) • When the ES0 bit is “0” • At reset • When writing “1” to the PIN bit by software The conditions in which the PIN bit is set to “0” are shown below: • Immediately after completion of 1-byte data transmission (including when arbitration lost is detected) • Immediately after completion of 1-byte data reception • In the slave reception mode, with ALS = “0” and immediately after completion of slave address agreement or general call address reception • In the slave reception mode, with ALS = “1” and immediately after completion of address data reception •Bit 5: Bus busy flag (BB) This bit indicates the status of use of the bus system. When this bit is set to “0”, this bus system is not busy and a START condition can be generated. The BB flag is set/reset by the SCL, SDA pins input signal regardless of master/slave. This flag is set to “1” by detecting the start condition, and is set to “0” by detecting the stop condition. The condition of these detecting is set by the start/stop condition setting bits (SSC4–SSC0) of the I2C start/stop condition control register (address 0030 16). When the ES0 bit of the I 2C control register (address 002E16) is “0” or reset, the BB flag is set to “0”. For the writing function to the BB flag, refer to the sections “START Condition Generating Method” and “STOP Condition Generating Method” described later. 7517 Group •Bit 6: Communication mode specification bit (transfer direction specification bit: TRX) This bit decides a direction of transfer for data communication. When this bit is “0”, the reception mode is selected and the data of a transmitting device is received. When the bit is “1”, the transmission mode is selected and address data and control data are output onto the SDA in synchronization with the clock generated on the SCL. This bit is set/reset by software and hardware. About set/reset by hardware is described below. This bit is set to “1” by hardware when all the following conditions are satisfied: • When ALS is “0” • In the slave reception mode or the slave transmission mode • When the R/W bit reception is “1” This bit is set to “0” in one of the following conditions: • When arbitration lost is detected. • When a STOP condition is detected. • When writing “1” to this bit by software is invalid by the START condition duplication preventing function (Note). • With MST = “0” and when a START condition is detected. • With MST = “0” and when ACK non-return is detected. • At reset •Bit 7: Communication mode specification bit (master/slave specification bit: MST) This bit is used for master/slave specification for data communication. When this bit is “0”, the slave is specified, so that a START condition and a STOP condition generated by the master are received, and data communication is performed in synchronization with the clock generated by the master. When this bit is “1”, the master is specified and a START condition and a STOP condition are generated. Additionally, the clocks required for data communication are generated on the SCL. This bit is set to “0” in one of the following conditions. • Immediately after completion of 1-byte data transfer when arbitration lost is detected • When a STOP condition is detected. • Writing “1” to this bit by software is invalid by the START condition duplication preventing function (Note). • At reset Note: START condition duplication preventing function The MST, TRX, and BB bits is set to “1” at the same time after confirming that the BB flag is “0” in the procedure of a START condition occurrence. However, when a START condition by another master device occurs and the BB flag is set to “1” immediately after the contents of the BB flag is confirmed, the START condition duplication preventing function makes the writing to the MST and TRX bits invalid. The duplication preventing function becomes valid from the rising of the BB flag to reception completion of slave address. b7 b0 MST TRX BB PIN AL AAS AD0 LRB I2C status register (S1 : address 002D 16) Last receive bit (Note) 0 : Last bit = “0” 1 : Last bit = “1” General call detecting flag (Note) 0 : No general call detected 1 : General call detected Slave address comparison flag (Note) 0 : Address disagreement 1 : Address agreement Arbitration lost detecting flag (Note) 0 : Not detected 1 : Detected SCL pin low hold bit 0 : SCL pin low hold 1 : SCL pin low release Bus busy flag 0 : Bus free 1 : Bus busy Communication mode specification bits 00 : Slave receive mode 01 : Slave transmit mode 10 : Master receive mode 11 : Master transmit mode Note: These bits and flags can be read out, but cannot be written. Write “0” to these bits at writing. Fig. 28 Structure of I2C status register SCL PIN IICIRQ Fig. 29 Interrupt request signal generating timing Rev.1.01 Aug 02, 2004 page 28 of 96 7517 Group START Condition Generating Method START/STOP Condition Detecting Operation When writing “1” to the MST, TRX, and BB bits of the I2C status register (address 002D16) at the same time after writing the slave address to the I2C data shift register (address 002B 16) with the condition in which the ES0 bit of the I2C control register (address 002E 16) is “1” and the BB flag is “0”, a START condition occurs. After that, the bit counter becomes “0002” and an SCL for 1 byte is output. The START condition generating timing is different in the standard clock mode and the high-speed clock mode. Refer to Figure 30, the START condition generating timing diagram, and Table 6, the START condition generating timing table. The START/STOP condition detection operations are shown in Figures 32, 33, and Table 8. The START/STOP condition is set by the START/STOP condition set bit. The START/STOP condition can be detected only when the input signal of the SCL and SDA pins satisfy three conditions: SCL release time, setup time, and hold time (see Table 8). The BB flag is set to “1” by detecting the START condition and is reset to “0” by detecting the STOP condition. The BB flag set/reset timing is different in the standard clock mode and the high-speed clock mode. Refer to Table 8, the BB flag set/ reset time. Note: When a STOP condition is detected in the slave mode (MST = 0), an interrupt request signal “IICIRQ” occurs to the CPU. 2 I C status register write signal SCL AAA Setup time SDA Fig. 30 START condition generating timing diagram Table 6 START condition generating timing table Standard clock mode High-speed clock mode Item Setup time 5.0 µs (20 cycles) 2.5 µs (10 cycles) Hold time 5.0 µs (20 cycles) 2.5 µs (10 cycles) Note: Absolute time at φ = 4 MHz. The value in parentheses denotes the number of φ cycles. STOP Condition Generating Method When the ES0 bit of the I2C control register (address 002E 16) is “1”, write “1” to the MST and TRX bits, and write “0” to the BB bit of the I2C status register (address 002D16) simultaneously. Then a STOP condition occurs. The STOP condition generating timing is different in the standard clock mode and the high-speed clock mode. Refer to Figure 31, the STOP condition generating timing diagram, and Table 7, the STOP condition generating timing table. I2C status register write signal SCL SDA Setup time AAA AAA Hold time Fig. 31 STOP condition generating timing diagram Table 7 STOP condition generating timing table Standard clock mode High-speed clock mode Item 5.0 µs (20 cycles) 3.0 µs (12 cycles) Setup time 4.5 µs (18 cycles) 2.5 µs (10 cycles) Hold time Note: Absolute time at φ = 4 MHz. The value in parentheses denotes the number of φ cycles. Rev.1.01 Aug 02, 2004 page 29 of 96 AAAA AAAA AAA AAA SCL release time Hold time SCL SDA BB flag Setup time Hold time BB flag set time Fig. 32 START condition detecting timing diagram AAA AAA SCL release time SCL SDA BB flag Setup time Hold time BB flag reset time Fig. 33 STOP condition detecting timing diagram Table 8 START condition/STOP condition detecting conditions Standard clock mode High-speed clock mode SCL release time Setup time Hold time BB flag set/ reset time SSC value + 1 cycle (6.25 µs) 4 cycles (1.0 µs) SSC value + 1 cycle < 4.0 µs (3.125 µs) 2 cycles (1.0 µs) 2 SSC value + 1 cycle < 4.0 µs (3.125 µs) 2 cycles (0.5 µs) 2 SSC value –1 + 2 cycles (3.375 µs) 3.5 cycles (0.875 µs) 2 Note: Unit : Cycle number of system clock φ SSC value is the decimal notation value of the START/STOP condition set bits SSC4 to SSC0. Do not set “0” or an odd number to SSC value. The value in parentheses is an example when the I2C START/ STOP condition control register is set to “1816” at φ = 4 MHz. 7517 Group [I2C START/STOP Condition Control Register (S2D)] 003016 The I2C START/STOP condition control register (address 003016) controls START/STOP condition detection. •Bits 0 to 4: START/STOP condition set bits (SSC4–SSC0) SCL release time, setup time, and hold time change the detection condition by value of the main clock divide ratio selection bit and the oscillation frequency f(XIN) because these time are measured by the internal system clock. Accordingly, set the proper value to the START/STOP condition set bits (SSC4 to SSC0) in considered of the system clock frequency. Refer to Table 9. Do not set “000002” or an odd number to the START/STOP condition set bit (SSC4 to SSC0). Refer to Table 9, the recommended set value to START/STOP condition set bits (SSC4–SSC0) for each oscillation frequency. b7 b0 SIS SIP SSC4 SSC3 SSC2 SSC1 SSC0 I2C START/STOP condition control register (S2D : address 003016) START/STOP condition set bit •Bit 5: SCL/SDA interrupt pin polarity selection bit (SIP) An interrupt can occur when detecting the falling or rising edge of the SCL or SDA pin. This bit selects the polarity of the SCL or SDA pin interrupt pin. •Bit 6: SCL/SDA interrupt pin selection bit (SIS) This bit selects the pin of which interrupt becomes valid between the SCL pin and the SDA pin. •Bit 7: STP/Low speed mode data receive enable bit Selecting this bit “1” enables I2C to receive the start condition address data even if the CPU is stopping or running at the low speed mode. The detecting the falling edge of the SDA pin, RC on-chip oscillator begins oscillation, and receive the start condition address data. After receiving the last bit of address data ( in case of ACK clock bit =“1”, after receiving ACK bit), SCL/SDA interrupt and I2C interrupt are requested at the same time. And then SCL pin becomes low hold state as a result of becoming SCL pin low hold bit “0”. During this state, it is possible to start the Xin oscillation. And after oscillation becomes stable, normal I2C operation begins. If the start condition which is not satisfied the hold time of start condition is input, SCL/SDA interrupt is requested. Note: When changing the setting of the SCL/SDA interrupt pin polarity selection bit, the SCL/SDA interrupt pin selection bit, or the I2C-BUS interface enable bit ES0, the SCL/SDA interrupt request bit may be set. When selecting the SCL/SDA interrupt source, disable the interrupt before the SCL/SDA interrupt pin polarity selection bit, the SCL/ SDA interrupt pin selection bit, or the I2C-BUS interface enable bit ES0 is set. Reset the request bit to “0” after setting these bits, and enable the interrupt. SCL/SDA interrupt pin polarity selection bit 0 : Falling edge active 1 : Rising edge active SCL/SDA interrupt pin selection bit 0 : SDA valid 1 : SCL valid STP/Low speed mode data receive enable bit 0 : disable 1 : enable Fig. 34 Structure of I2C START/STOP condition control register Table 9 Recommended set value to START/STOP condition set bits (SSC4–SSC0) for each oscillation frequency Oscillation START/STOP Main clock System SCL release time Setup time frequency condition divide ratio clock φ (µs) (µs) f(XIN) (MHz) control register (MHz) XXX11010 6.75 µs (27 cycles) 3.375 µs (13.5 cycles) 3.375 µs (13.5 cycles) XXX11000 6.25 µs (25 cycles) 3.125 µs (12.5 cycles) 3.125 µs (12.5 cycles) 1 XXX00100 5.0 µs (5 cycles) 2.5 µs (2.5 cycles) 2.5 µs (2.5 cycles) 6.5 µs (13 cycles) 5.5 µs (11 cycles) 3.25 µs (6.5 cycles) 2.75 µs (5.5 cycles) 3.25 µs (6.5 cycles) 5.0 µs (5 cycles) 2.5 µs (2.5 cycles) 2.5 µs (2.5 cycles) 8 2 4 8 8 4 2 2 XXX01100 XXX01010 2 2 1 XXX00100 Note: Do not set “000002” or an odd number to the START/STOP condition set bit (SSC4 to SSC0). Rev.1.01 Aug 02, 2004 Hold time (µs) page 30 of 96 2.75 µs (5.5 cycles) 7517 Group I2C additional function register (1) bit 0: Time-out mode bit (TOM) Setting the time-out mode bit “1” , continuity of I2C-Bus busy state for about 125 ms (XIN = 8 MHz) makes time-out flag “1” and time-out interrupt. Restart condition resets the time-out timer. (2) bit 1: Time-out flag (TOF) Time-out flag becomes “1” when the time-out state occurs. Writing “1” to this bit, time-out timer is reset, and this bit is cleared “0” also. (3) bit 2: SM-Bus interface pin input threshold select bit (TIS2) The SM-Bus interface pin input threshold is selected by this bit. Setting this bit “0”, the SM-Bus interface pin input threshold is for SM-Bus Ver1.0 specification, and setting this bit “1”, it is for SM-Bus Ver1.1 specification. (4) Stop condition flag (SCF) This flag turns to “1”, when the stop condition is generated or detected. This bit is cleared “0” at reset, or when I2C-Bus interface enable bit is “0” or writing this bit “1”. This bit is available when I2C-Bus interface enable bit is “1”. b7 b0 I2C additional function register (S3 : address 003116) Time-out mode bit (TOM) 0 : disable 1 : enable Time-out flag (TOF) 0 : Not generated 1 : Generated *Writing this bit “1”, this flag is cleared to “0”. SM-Bus interface pin input threshold select bit (TIS2) 0 : Ver1.0 (VIL=0.6V,VIH=1.4V) 1 : Ver1.1 (VIL=0.8V,VIH=2.1V) Stop condition flag (SCF) 0 : Not detect stop condition 1 : Detect stop condition *Writing this bit “1”, this flag is cleared to “0”. Not used (returns “0” when read) Fig. 35 I2C additional function register Rev.1.01 Aug 02, 2004 page 31 of 96 7517 Group Address Data Communication comparison, an address comparison between the RWB bit of the I2 C address register (address 002C 16) and the R/W bit which is the last bit of the address data transmitted from the master is made. In the 10-bit addressing mode, the RWB bit which is the last bit of the address data not only specifies the direction of communication for control data, but also is processed as an address data bit. When the first-byte address data agree with the slave address, the AAS bit of the I2C status register (address 002D16) is set to “1”. After the second-byte address data is stored into the I2C data shift register (address 002B16), perform an address comparison between the second-byte data and the slave address by software. When the address data of the 2 bytes agree with the slave address, set the RWB bit of the I2C address register (address 002C16) to “1” by software. This processing can make the 7-bit slave address and R/W data agree, which are received after a RESTART condition is detected, with the value of the I2C address register (address 002C16). For the data transmission format when the 10-bit addressing format is selected, refer to Figure 36, (3) and (4). There are two address data communication formats, namely, 7-bit addressing format and 10-bit addressing format. The respective address communication formats are described below. (1)7-bit addressing format To adapt the 7-bit addressing format, set the 10BIT SAD bit of the I2C control register (address 002E16) to “0”. The first 7-bit address data transmitted from the master is compared with the high-order 7-bit slave address stored in the I2C address register (address 002C16). At the time of this comparison, address comparison of the RWB bit of the I 2C address register (address 002C 16) is not performed. For the data transmission format when the 7-bit addressing format is selected, refer to Figure 36, (1) and (2). (2)10-bit addressing format To adapt the 10-bit addressing format, set the 10BIT SAD bit of the I 2C control register (address 002E 16) to “1”. An address comparison is performed between the first-byte address data transmitted from the master and the 8-bit slave address stored in the I2C address register (address 002C16). At the time of this S Slave address R/W 7 bits A “0” Data A 1 to 8 bits Data A/A P A P 1 to 8 bits (1) A master-transmitter transnmits data to a slave-receiver S Slave address R/W 7 bits A “1” Data A 1 to 8 bits Data 1 to 8 bits (2) A master-receiver receives data from a slave-transmitter S Slave address R/W 1st 7 bits 7 bits A “0” Slave address 2nd bytes A Data 1 to 8 bits 8 bits A Slave address R/W 1st 7 bits A Slave address 2nd bytes A AA AA Slave address R/W 1st 7 bits Sr “1” 7 bits “0” 8 bits 7 bits (4) A master-receiver receives data from a slave-transmitter with a 10-bit address S : START condition A : ACK bit Sr : Restart condition P : STOP condition R/W : Read/Write bit Aug 02, 2004 : Master to slave : Slave to master Fig. 36 Address data communication format Rev.1.01 AA page 32 of 96 P 1 to 8 bits (3) A master-transmitter transmits data to a slave-receiver with a 10-bit address S A/A Data A Data 1 to 8 bits A Data 1 to 8 bits A P 7517 Group Example of Master Transmission Example of Slave Reception An example of master transmission in the standard clock mode, at the SCL frequency of 100 kHz and in the ACK return mode is shown below. (1) Set a slave address in the high-order 7 bits of the I2C address register (address 002C16) and “0” into the RWB bit. (2) Set the ACK return mode and SCL = 100 kHz by setting “8516” in the I2C clock control register (address 002F16). (3) Set “0016” in the I2C status register (address 002D 16) so that transmission/reception mode can become initializing condition. (4) Set a communication enable status by setting “0816” in the I2C control register (address 002E16). (5) Confirm the bus free condition by the BB flag of the I2C status register (address 002D16). (6) Set the address data of the destination of transmission in the high-order 7 bits of the I2C data shift register (address 002B16) and set “0” in the least significant bit. (7) Set “F016” in the I2C status register (address 002D16) to generate a START condition. At this time, a SCL for 1 byte and an ACK clock automatically occur. (8) Set transmit data in the I 2 C data shift register (address 002B16). At this time, a SCL and an ACK clock automatically occur. (9) When transmitting control data of more than 1 byte, repeat step (8). (10) Set “D016” in the I2C status register (address 002D16) to generate a STOP condition if ACK is not returned from slave reception side or transmission ends. An example of slave reception in the high-speed clock mode, at the SCL frequency of 400 kHz, in the ACK non-return mode and using the addressing format is shown below. (1) Set a slave address in the high-order 7 bits of the I2C address register (address 002C16) and “0” in the RWB bit. (2) Set the no ACK clock mode and SCL = 400 kHz by setting “2516” in the I2C clock control register (address 002F16). (3) Set “0016” in the I2C status register (address 002D16) so that transmission/reception mode can become initializing condition. (4) Set a communication enable status by setting “0816” in the I2C control register (address 002E16). (5) When a START condition is received, an address comparison is performed. (6) •When all transmitted addresses are “0” (general call): AD0 of the I2C status register (address 002D16) is set to “1” and an interrupt request signal occurs. •When the transmitted addresses agree with the address set in (1): ASS of the I2C status register (address 002D16) is set to “1” and an interrupt request signal occurs. • In the cases other than the above AD0 and AAS of the I2C status register (address 002D16) are set to “0” and no inter rupt request signal occurs. (7) Set dummy data in the I2C data shift register (address 002B16). (8) When receiving control data of more than 1 byte, repeat step (7). (9) When a STOP condition is detected, the communication ends. Rev.1.01 Aug 02, 2004 page 33 of 96 7517 Group ■Precautions when using multi-master I2C-BUS interface (1) Read-modify-write instruction The precautions when the read-modify-write instruction such as SEB, CLB etc. is executed for each register of the multi-master I2C-BUS interface are described below. • I2C data shift register (S0: address 002B16) When executing the read-modify-write instruction for this register during transfer, data may become a value not intended. • I2C address register (S0D: address 002C16) When the read-modify-write instruction is executed for this register at detecting the STOP condition, data may become a value not intended. It is because H/W changes the read/write bit (RWB) at the above timing. • I2C status register (S1: address 002D16) Do not execute the read-modify-write instruction for this register because all bits of this register are changed by H/W. • I2C control register (S1D: address 002E16) When the read-modify-write instruction is executed for this register at detecting the START condition or at completing the byte transfer, data may become a value not intended. Because H/W changes the bit counter (BC0-BC2) at the above timing. • I2C clock control register (S2: address 002F16) The read-modify-write instruction can be executed for this register. • I 2 C START/STOP condition control register (S2D: address 003016) The read-modify-write instruction can be executed for this register. (2) START condition generating procedure using multi-master 1. Procedure example (The necessary conditions of the generating procedure are described as the following 2 to 5. :: LDA — (Taking out of slave address value) SEI (Interrupt disabled) BBS 5, S1, BUSBUSY (BB flag confirming and branch process) BUSFREE: STA S0 (Writing of slave address value) LDM #$F0, S1 (Trigger of START condition generating) CLI (Interrupt enabled) :: BUSBUSY: CLI (Interrupt enabled) :: 2. Use “Branch on Bit Set” of “BBS 5, $002D, –” for the BB flag confirming and branch process. 3. Use “STA $2B, STX $2B” or “STY $2B” of the zero page addressing instruction for writing the slave address value to the I2C data shift register. 4. Execute the branch instruction of above 2 and the store instruction of above 3 continuously shown the above procedure example. 5. Disable interrupts during the following three process steps: Rev.1.01 Aug 02, 2004 page 34 of 96 • BB flag confirming • Writing of slave address value • Trigger of START condition generating When the condition of the BB flag is bus busy, enable interrupts immediately. (3) RESTART condition generating procedure 1. Procedure example (The necessary conditions of the generating procedure are described as the following 2 to 4.) Execute the following procedure when the PIN bit is “0”. :: LDM #$00, S1 (Select slave receive mode) LDA — (Taking out of slave address value) SEI (Interrupt disabled) STA S0 (Writing of slave address value) LDM #$F0, S1 (Trigger of RESTART condition generating) CLI (Interrupt enabled) :: 2. Select the slave receive mode when the PIN bit is “0”. Do not write “1” to the PIN bit. Neither “0” nor “1” is specified for the writing to the BB bit. The TRX bit becomes “0” and the SDA pin is released. 3. The SCL pin is released by writing the slave address value to the I2C data shift register. 4. Disable interrupts during the following two process steps: • Writing of slave address value • Trigger of RESTART condition generating (4) Writing to I2C status register Do not execute an instruction to set the PIN bit to “1” from “0” and an instruction to set the MST and TRX bits to “0” from “1” simultaneously. It is because it may enter the state that the SCL pin is released and the SDA pin is released after about one machine cycle. Do not execute an instruction to set the MST and TRX bits to “0” from “1” simultaneously when the PIN bit is “1”. It is because it may become the same as above. (5) Process of after STOP condition generating Do not write data in the I2C data shift register S0 and the I2C status register S1 until the bus busy flag BB becomes “0” after generating the STOP condition in the master mode. It is because the STOP condition waveform might not be normally generated. Reading to the above registers do not have the problem. 7517 Group PULSE WIDTH MODULATION (PWM) PWM Operation The 7517 group has a PWM function with an 8-bit resolution, based on a signal that is the clock input XIN or that clock input divided by 2. When bit 0 (PWM enable bit) of the PWM control register is set to “1”, operation starts by initializing the PWM output circuit, and pulses are output starting at an “H”. If the PWM register or PWM prescaler is updated during PWM output, the pulses will change in the cycle after the one in which the change was made. Data Setting The PWM output pin also functions as port P44. Set the PWM period by the PWM prescaler, and set the “H” term of output pulse by the PWM register. If the value in the PWM prescaler is n and the value in the PWM register is m (where n = 0 to 255 and m = 0 to 255) : PWM period = 255 ✕ (n+1) / f(XIN) = 31.875 ✕ (n+1) µs (when f(XIN) = 8 MHz, count source is f(XIN) ) Output pulse “H” term = PWM period ✕ m / 255 = 0.125 ✕ (n+1) ✕ m µs (when f(XIN) = 8 MHz, count source is f(XIN)) 31.875 ✕ m ✕ (n+1) 255 µs PWM output T = [31.875 ✕ (n+1)] µs m: Contents of PWM register n : Contents of PWM prescaler T : PWM period (when f(XIN) = 8 MHz, count source is f(XIN)) Fig. 37 Timing of PWM period Data bus PWM prescaler pre-latch PWM register pre-latch Transfer control circuit PWM prescaler latch PWM register latch PWM prescaler PWM register Count source selection bit “0” XIN 1/2 Port P44 “1” Port P44 latch PWM enable bit Fig. 38 Block diagram of PWM function Rev.1.01 Aug 02, 2004 page 35 of 96 7517 Group b7 b0 PWM control register (PWMCON : address 001D 16) PWM function enable bit 0: PWM disabled 1: PWM enabled Count source selection bit 0: f(XIN) 1: f(XIN)/2 Not used (return “0” when read) Fig. 39 Structure of PWM control register A B B = C T2 T C PWM output T PWM register write signal T T2 (Changes “H” term from “A” to “B”.) PWM prescaler write signal (Changes PWM period from “T” to “T2”.) When the contents of the PWM register or PWM prescaler have changed, the PWM output will change from the next period after the change. Fig. 40 PWM output timing when PWM register or PWM prescaler is changed ■Note The PWM starts after the PWM enable bit is set to enable and "L" level is output from the PWM pin. The length of this "L" level output is as follows: Rev.1.01 n+1 2 • f(XIN) sec (Count source selection bit = 0, where n is the value set in the prescaler) n+1 f(XIN) sec (Count source selection bit = 1, where n is the value set in the prescaler) Aug 02, 2004 page 36 of 96 7517 Group A/D CONVERTER [A/D Conversion Registers (ADL, ADH)] 003516, 003616 b0 b7 AD control register (ADCON : address 003416) The A/D conversion registers are read-only registers that store the result of an A/D conversion. Do not read these registers during an A/D conversion Analog in additional bit* Analog input pin selection bits 0 0 0: P30/AN0 0 0 1: P31/AN1 0 1 0: P32/AN2 0 1 1: P33/AN3 1 0 0: P34/AN4 1 0 1: P35/AN5 0 0 0: P04/AN8 0 0 1: P05/AN9 0 1 0: P06/AN10 0 1 1: P07/AN11 0 0 0 0 0 0 1 1 1 1 [AD Control Register (ADCON)] 003416 The AD control register controls the A/D conversion process. Bits 0 to 2 select a specific analog input pin. Bit 4 indicates the completion of an A/D conversion. The value of this bit remains at “0” during an A/D conversion and changes to “1” when an A/D conversion ends. Writing “0” to this bit starts the A/D conversion. Not used (returns “0” when read) A/D conversion completion bit 0: Conversion in progress 1: Conversion completed Comparison Voltage Generator The comparison voltage generator divides the voltage between AVSS and VREF into 1024 and outputs the divided voltages. Not used (returns “0” when read) *Bit 0 of MISRG2 (003716) Channel Selector The channel selector selects one of ports P04/AN 8 to P07/AN11 and ports P30/AN0 to P35/AN5 and inputs the voltage to the comparator. Fig. 41 Structure of AD control register 10-bit reading (Read address 003616 before 003516) Comparator and Control Circuit The comparator and control circuit compare an analog input voltage with the comparison voltage, and the result is stored in the A/ D conversion registers. When an A/D conversion is completed, the control circuit sets the A/D conversion completion bit and the A/D interrupt request bit to “1”. Note that because the comparator consists of a capacitor coupling, set f(XIN) to 500 kHz or more during an A/D conversion. When the A/D converter is operated at low-speed mode, f(X IN) and f(X CIN) do not have the lower limit of frequency, because of the A/D converter has a built-in self-oscillation circuit. b7 b0 b9 b8 b7 b0 (Address 003616) (Address 003516) b7 b6 b5 b4 b3 b2 b1 b0 Note : The high-order 6 bits of address 003616 become “0” at reading. 8-bit reading (Read only address 003516) b7 (Address 003516) b0 b9 b8 b7 b6 b5 b4 b3 b2 Fig. 42 Structure of A/D conversion registers Data bus AD control register (Address 003416) b7 b0 Analog input pin selection additional bit 4 A/D interrupt request Channel selector A/D control circuit P30/AN0 P31/AN1 P32/AN2 P33/AN3 P34/AN4 P35/AN5 P04/AN8 P05/AN9 P06/AN10 P07/AN11 Comparator A/D conversion high-order register (Address 003616) A/D conversion low-order register (Address 003516) 10 Resistor ladder VREF AVSS Fig. 43 Block diagram of A/D converter Rev.1.01 Aug 02, 2004 page 37 of 96 7517 Group Current Integrator Current integrator integrates the current which flows through sense resistor (10 mΩ) connected between ISENS0 pin and ISENS1 pin. The current between sense resistor makes electrical potential difference between ISENS0 pin and ISENS1 pin, and it is integrated by the built-in integrator. The output of integrator is connected to comparator, and the integrator and comparator measures about 1 mA current. Setting the current integrate enable bit “1”, the current integrator starts the operation. Current integrate mode Setting the current integrate mode bit “0”, input of the level shift circuit is connected to the ISENS1 pin and ISENS0 pin, and the current integrator measures the electrical potential difference between ISENS1 pin and ISENS0 pin. Each electrical potential of the ISENS1 pin and ISENS0 pin is added AVCC/2 by level shift circuit, and then output of the level shift circuit is input to integrator. This makes enable to minus level input to ISENS1 pin, and the current integrator can measure both polarity current. The output of the integrator is connected to the comparator. The integrator integrates input voltage between ISENS1 pin and ISENS0 pin. And when output of the integrator amounts to compared voltage, output of the comparator rises “H”, and charge (discharge) counter is increased 1 count. And at the same time, electric charge of the integrator’s capacitor is discharged, then the integrator starts next integration. Charge (Discharge) counter is counting the number of the times “H” output of the comparator during integration period (125 ms), and at the end of the period, charge (discharge) counter is latched onto charge (discharge) counter latch. Then charge (discharge) counter is cleared “0”, and starts new count. At the end of the period, current integrate interrupt occurs also. The current integrator has 2 set of comparator and counter for discharge and charge, and only discharge counter counts up in discharge state, and only charge counter counts up in charge state. The integrator and comparator are designed to sense approximate 1 mA current, then 1 count of counter means approximate 1 mA Therefore reading the value of counter latch means measuring the total current which flows the sense resistor during integrate period (125 ms). The calibration integrates the current of the period selected by the calibration period selection bits, after discharging the electric charge accumulated in the capacitor of the integrator. AD conversion complete signal Edge detect Calibration control circuit Calibration control signal Calibration control signal ISENS0 XX0 001 10mΩ ISENS1 011 Level shift circuit 101 Charge counter XX0 001 011 101 Charge counter latch Current integrate control register b2 b1 b0 XX0 : Current integrate mode 001 : Zero calibration 011 : Full calibration for discharge 101 : Full calibration for charge Discharge counter Calibration control signal Discharge counter latch 0.1V 10bit AD AD conversion complete signal ANi Data Bus Fig. 44 Block diagram of Current integrator Rev.1.01 Aug 02, 2004 page 38 of 96 Current integrate interrupt 125 ms Timer 125 ms over flow XCIN 7517 Group Integrate period Integrate period 125 ms 125 ms ISENS1 input 1.65V Level shift circuit output 0V 2.45V Integrator output 1.65V 0.85V Discharge comparator Charge comparator n-6 Discharge counter n-5 n-4 n-2 n-3 n n-1 Count value of last integrate period Discharge counter latch Charge counter m Charge counter latch 0 n 1 0 Count value of last integrate period m ISENS1 input Level shift circuit output 2.45V Integrator output 1.65V 0.8V Discharge comparator Discharge signal for integrator Discharge counter n-3 Fig. 45 Current integrator timing diagram Rev.1.01 Aug 02, 2004 page 39 of 96 3 2 1 n-2 n-1 2 3 7517 Group Calibration mode Setting the current integrate mode bit “1”, the input of level shift circuit is connected to internal AVSS or 0.1V for reference voltage. When the calibration selection bit is “00”, both of plus and GND input of level shift circuit are connected to internal AVSS, and zero calibration is operated. When the calibration selection bit is “01”, plus input of level shift circuit is connected to internal 0.1V reference voltage, and GND input of level shift circuit is connected to Integrate period 125 ms internal AVSS, and then full calibration for discharge state is operated. When the calibration selection bit is “10”, plus input of level shift circuit is connected to internal AVSS, and GND input of level shift circuit is connected to 0.1V reference voltage, and the full calibration for charge state is operated. The calibration period can be selected by calibration period selection bit among 15.625 ms, 31.25 ms, 62.5 ms, 125.0 ms. The calibration starts at beginning of next integrate period, after setting the current integrate mode bit “1”. Integrate period 125 ms Integrate period 125 ms Current integrate mode Calibration 15.625 ms -125 ms VINF input Set calibration complete flag to “1”. Current integrate mode bit Counter latch content flag Level shift circuit out put Integrator output Discharge comparator Discharge counter 0 1 2 3 Count value of last integrate period Discharge counter latch 3 (Calibration result) Count value of last integrate period * * Except calibration period Integrate period 125ms Integrate period 125ms Calibration 15.625 ms -125 ms Integrator output AD conversion mode bit Discharge comparator Discharge signal for integrator AD conversion completion bit Fig. 46 Calibration timing Rev.1.01 Aug 02, 2004 page 40 of 96 AD conversion execute 7517 Group The calibration starts current integration for period selected calibration period selection bit, after discharging electric charge which remain in integrator's capacitor. After finished calibration period, value of the discharge (charge) counter is latched to discharge (charge) counter latch, then current integrate mode bit is cleared “0”, and current integrate mode is switched to current integrate mode from calibration mode automatically. At this time the current integrate interrupt occurs. Which interrupt has occurred current integrate interrupt for current integrate mode or for calibration mode can be judged by reading the counter latch content flag. The counter latch content flag shows the contents of counter latch, value for current integrate mode or value for calibration mode. Note that the contents of the counter latch is updated automatically at the end of next current integration or calibration. ■Notes on calibration mode •After enabling the current integrator, a first-time integrate period cannot be operated in the calibration mode. •Do not change the value of the calibration selection bit and the calibration period selection bits during operation in the calibration mode. •When calibration time is set as 125 ms, next current period which the calibration is completed cannot be operated in the calibration b7 b7 b6 b5 b4 b3 b2 b7 b7 b6 b5 b4 b3 b2 b7 Setting the AD conversion connection bit to “1”, AD converter comes to convert the electric charge remained in the integrator capacitor at the end of current integrate or calibration period. This makes a fraction of a count possible to measure. When AD conversion connection bit is “1”, input of AD converter is connected automatically to the output of the integrator just after the end of the current integrate or calibration period, and AD conversion starts. The current integrate interrupt occurs at the end of the AD conversion. Then remained electric charge in the integrator capacitor is discharged, and new current integration starts. After AD conversion completes, the input of the AD conversion is automatically returned previous state. Discharge counter latch low-order register (000A16) b0 Discharge counter latch high-order register (000B16) b0 b1 b0 Charge counter latch low-order register (000C16) b0 b15 b14 b13 b12 b11 b10 b9 b8 b7 AD conversion connection mode b0 b1 b0 b15 b14 b13 b12 b11 b10 b9 b8 b7 mode. •After the current integrator is set to the calibration mode, do not disable the current integrator until the current period in the calibration mode is completed. When current integration is disabled before the current period completion in the calibration mode after setting “1” to the current integrate mode bit, the current period of the first time which re-permitted current integration may operate in the calibration mode regardless of the setting of the current integrate mode bit. Charge counter latch high-order register (000D16) b0 Current integrate control register (000E16) Current integrate mode bit 0 : Current integrate mode 1 : Calibration mode Calibration selection bits 00 : Zero calibration 01 : Full calibration for discharge 10 : Full calibration for charge 11 : Not used AD conversion connection bit 0 : Not connect 1 : Connect Calibration period selection bits 00 : 15.625ms 01 : 31.25ms 10 : 62.5ms 11 : 125ms Counter latch contents flag 0 : Current integrate data 1 : Calibration data Current integrate enable bit 0 : Disable 1 : Enable Fig. 47 Current integrator registers Rev.1.01 Aug 02, 2004 page 41 of 96 7517 Group Notes on current integrator When changing current integration into prohibition from permission, incorrect interrupt may occur. Perform any one of the following by software as the measure. (1) How to control timing which disable current integrator •When changing current integration to prohibition in the current integrate mode, change the setting during “H” of the clock signal which operates in a cycle of 125 ms. •When changing current integration to prohibition in the calibration mode, change the setting during “H” of the clock signal operated by cycle which is set by the calibration period selection bits. Table 10 shows the how to distinguish “H” period of each clock signal. (2) How to invalidate interrupt after prohibition setup of current integrator After changing current integration to prohibition, wait for about 61.0 ms, and then set the request flag to “0”. (3) How to check truth of interrupt request •Check the current integrate enable bit during the current integrator interrupt routine. When disabling the current integrator, skip the interrupt processing. Notes on AD conversion connection mode •When the AD conversion of the current integrator is performed, do not execute other AD conversion. •When using the AD conversion connection mode at the time of calibration completion, do not set the AD conversion connection bit to “1” before calibration starts. •The count value immediately after AD conversion completion of the current integrator may be incorrect. Only when the count value immediately after the AD conversion completion, such as initial proofreading etc, is unnecessary, use the AD conversion connection mode. •The current integrator starts current integration in the low-speed clock 1-2 cycles, after setting the current integrate enable bit to “1”. After setting the current integrate enable bit to “0”, initialization of 1-2 cycle period of a low-speed clock and an internal circuit is performed. Do not enable the current integrator again in this period. •After the current integrate enable bit is set to “1”, current integration starts with a delay of 1 to 2 cycles of a low-speed clock. As for the period for 1 to 2 cycle of the low-speed clock immediately after setting the current integrate enable bit to “0”, the internal circuit is initialized. Do not enable the current integrator again in this period. Table 10 Mode switch timing Current integrate mode Calibration mode Rev.1.01 12.5 ms setting Mode switch timing Period for about 62.5 ms after interrupt occurrence of last integrate period 15.26 ms setting Period for about 31.25 ms after interrupt occurrence of last integrate period 31.25 ms setting 62.5 ms setting Period for about 15.625 ms after interrupt occurrence of last integrate period Aug 02, 2004 page 42 of 96 Period for about 7.8127 ms after interrupt occurrence of last integrate period 7517 Group Over current detector Over current detector detects the over current which flows through the sense resistor connected between ISENS1 pin and ISENS0 pin, and turn off the discharge control FET to stop battery from discharging. In the low power state, and when current integrator disables, wake up current detector which detects approximate 1 mA current and generates the interrupt is also built-in. Enabling interrupt for over current detect is determined by over current interrupt enable bit. And in case of the FET control enable bit is “1”, the FET control signal is generated from DFETCNT pin with over current interrupt. Setting the over current detect restart bit (bit 5 of 0013 16) “1” makes the over current detect state clear. Wake up current detector Short current detector Short current detector detects the short current (10A-47.5A) with 10 mΩ sense resistor. Setting short current detect enable bit of the short current detect control register (000F16) “1”, short current detector starts the operation. The compare voltage is determined by setting the short current detect voltage select bit of the short current detect control register, and the detect time is determined by setting the short current detect time set up bit of the current detect time set up register (001116). The potential difference between sense resistor exceeds the compare voltage and continue more than detect time, then short current detect flag (bit 2 of 001316) becomes “1”, and short current detect interrupt occurs. Enabling interrupt for short current detect is determined by short current interrupt enable bit. And in case of the FET control enable bit is “1”, The FET control signal is generated from DFETCNT pin with short current interrupt. The polarity of the FET control signal is determined by setting the FET control polarity switch bit (bit 5 of 000F16). Setting the short current detect restart bit(bit 6 of 0013 16) “1” makes the short current detect state clear. Wake up current detector detects approximate 1A current with 10mW sense resistor. Setting wake up current detect enable bit of the wake up current detect control register 1(001216) “1”, wake up current detector starts the operation. The sensing voltage is 10 times amplified and compared by the comparator. The comparator is comparing every 3.9 msec, and more than 1A current is keeping for about 62 msec, wake up current detect flag (bit 0 of 0013 16) becomes “1”, and the wake up current detect interrupt occurs. The enabling interrupt for wake up current detect is determined by wake up current detect interrupt enable bit(bit6 of 001216). Setting the wake up current detect restart bit “1” makes the wake up current detect state clear. The ofset calibration of the amplifier and comparator is able to be adjusted by setting the wake up current compare voltage select bit. Setting the wake up current detect calibration enable bit (bit 5 of 001416) “1”, calibration mode starts. In the calibration mode, input of level shift circuit is connected to internal GND, and it is possible to measure the comparator threshold voltage at 0 V input state, with setting wake up current detect compare voltage select bit. Then set the wake up current detect compare voltage select bit the value which is added comparator threshold voltage at 0 V state and 0.1V (1A worth voltage). Over current detector Over current detector detects the over current (5A-20.5A) with 10 mΩ sense resistor. Setting over current detect enable bit of the over current detect control register (001016) “1”, over current detector starts the operation. The compare voltage is determined by setting the over current detect voltage select bit of the over current detect control register (001016), and the detect time is determined by setting the over current detect time set up bit of the current detect time set up register (001016) The potential difference between sense resistor exceeds the compare voltage and continue more than detect time, then over current detect flag (bit 1 of 001316) becomes “1”, and over current detect interrupt occurs. Rev.1.01 Aug 02, 2004 page 43 of 96 SFR protect control register SFR protect control register (002916) protects SFR from changing the contents easily cause of like microcomputer runs away. When the bit of SFR protect control register is “0”, corresponded bit register is protected. In case of writing to the protected register, write “1” to the corresponded bit of protect register, then write the protected register in succession. If other register is written, the contents of SFR protect register is cleared “00”. 7517 Group Short current detect voltage select bit Over current detect voltage select bit AVCC Wake up current detect voltage select bit Over current detect status register Current detect time set up resister FET control enable bit (when short current detect enable) ISENS1 Level shift circuit Short current detect time counter S R Over current detect time counter S FET control enable bit (when over current detect enable) Q R X10 XCIN/128 Wake up calibration enable bit Wake up current detect time counter 0 Level shift circuit S Q R 1 Over current detect interrupt Fig. 48 Block diagram of Over current detector Rev.1.01 Aug 02, 2004 page 44 of 96 FET Q FET control polarity switch bit 7517 Group b7 b0 b7 b0 Short current detect control register protect bit (000F16) SFR protect control register (002916) PRCR Short current detect voltage select bits 0000 : 0.100V 1000 : 0.300V 0001 : 0.125V 1001 : 0.325V 0010 : 0.150V 1010 : 0.350V 0011 : 0.175V 1011 : 0.375V 0100 : 0.200V 1100 : 0.400V 0101 : 0.225V 1101 : 0.425V 0110 : 0.250V 1110 : 0.450V 0111 : 0.275V 1111 : 0.475V Short current detect control register protect bit (000F16) 0 : Write disable 1 : Write enable Over current detect control register protect bit (001016) 0 : Write disable 1 : Write enable Current detect time set up register protect bit (001116) 0 : Write disable 1 : Write enable Short current detect interrupt enable bit 0 : Disable 1 : Enable Wake up current detect control register 1 protect bit (001216) 0 : Write disable 1 : Write enable FETcontrol polarity switch bit 0 : active "L" output 1 : active "H" output Over current detect status register protect bit (001316) 0 : Write disable 1 : Write enable FETcontrol enable bit (When short current detect enable) 0 : FET control disable 1 : FET control enable Wake up current detect control register 2 protect bit (001416) 0 : Write disable 1 : Write enable Short current detect enable bit 0 : Disable 1 : Enable MISRG2 protect bit (0037) 0 : Write disable 1 : Write enable CPU mode register protect bit (003B) 0 : Write disable 1 : Write enable Note : All bits are protected. b7 b0 Over current detect control register (001016) Note : Same bits in this register are not protected. Short current detect voltage select bits 00000 : 0.050V 10000 : 0.130V 00001 : 0.055V 10001 : 0.135V 00010 : 0.060V 10010 : 0.140V 00011 : 0.065V 10011 : 0.145V 00100 : 0.070V 10100 : 0.150V 00101 : 0.075V 10101 : 0.155V 00110 : 0.080V 10110 : 0.160V 00111 : 0.085V 10111 : 0.165V 01000 : 0.090V 11000 : 0.170V 01001 : 0.095V 11001 : 0.175V 01010 : 0.100V 11010 : 0.180V 01011 : 0.105V 11011 : 0.185V 01100 : 0.110V 11100 : 0.190V 01101 : 0.115V 11101 : 0.195V 01110 : 0.120V 11110 : 0.200V 01111 : 0.125V 11111 : 0.205V Over current detect interrupt enable bit 0 : Disable 1 : Enable FETcontrol enable bit (When over current detect enable) 0 : FET control disable 1 : FET control enable Over current detect enable bit 0 : Disable 1 : Enable Note : All bits are protected. Fig. 49 Over current detector registers (1) Rev.1.01 Aug 02, 2004 page 45 of 96 7517 Group b7 b7 b0 Wake up current detect control register 1 (001216) Short current detect time set up bits 0000 : 0µs 1000 : 488µs 0001 : 61µs 1001 : 549µs 0010 : 122µs 1010 : 610µs 0011 : 183µs 1011 : 671µs 0100 : 244µs 1100 : 732µs 0101 : 305µs 1101 : 793µs 0110 : 366µs 1110 : 854µs 0111 : 427µs 1111 : 915µs Wake up current detect compare voltage select bits Wake up current detect compare voltage select bits n Over current detect time set up bits 0000 : 1.0ms 1000 : 17.0ms 0001 : 3.0ms 1001 : 19.0ms 0010 : 5.0ms 1010 : 21.0ms 0011 : 7.0ms 1011 : 23.0ms 0100 : 9.0ms 1100 : 25.0ms 0101 : 11.0ms 1101 : 27.0ms 0110 : 13.0ms 1110 : 29.0ms 0111 : 15.0ms 1111 : 31.0ms compare voltage (V) b5 b4 b3 b2 b1 b0 0 0 0 0 0 0 1 1 1 1 X 0 0 0 0 X 0 0 0 0 X 0 0 1 1 X 0 1 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 1 1 0 1 0 1 Setting disabled 1.44 1.45 1.46 1.47 0.01n+1.28 Note : All bits are protected. b7 b0 Current detect time set up register (001116) 1.87 1.89 1.90 1.91 Wake up current detect interrupt enable bit 0 : Disable 1 : Enable b0 Over current detect status register(001316) Wake up current detect enable bit 0 : Disable 1 : Enable Wake up current detect flag 0 : Not detected 1 : Detected Note : All bits are protected. Over current detect flag 0 : Not detected 1 : Detected Over current detect flag 0 : Not detected 1 : Detected Not used (returns "0" when read) Wake up current detect restart bit 0 : Invalid 1 : Restart Over current detect restart bit 0 : Invalid 1 : Restart Short current detect restart bit 0 : Invalid 1 : Restart Not used (returns "0" when read) Note : All bits are protected. Fig. 50 Over current detector registers (2) Rev.1.01 Aug 02, 2004 page 46 of 96 b7 b0 Wake up current detect control register 2 (001416) Reserved (Do not write "1"to this bit) Wake up calibration enable bit 0 : Disable 1 : Enable Not used (returns "0" when read) Note : All bits are protected. 7517 Group WATCHDOG TIMER The watchdog timer gives a mean of returning to the reset status when a program cannot run on a normal loop (for example, because of a software run-away). The watchdog timer consists of an 8-bit watchdog timer L and an 8-bit watchdog timer H. Standard Operation of Watchdog Timer When any data is not written into the watchdog timer control register (address 003916) after resetting, the watchdog timer is in the stop state. The watchdog timer starts to count down by writing an optional value into the watchdog timer control register (address 003916) and an internal reset occurs at an underflow of the watchdog timer H. Accordingly, programming is usually performed so that writing to the watchdog timer control register (address 0039 16 ) may be started before an underflow. When the watchdog timer control register (address 003916) is read, the values of the high-order 6 bits of the watchdog timer H, STP instruction disable bit, and watchdog timer H count source selection bit are read. ●Watchdog timer H count source selection bit operation Bit 7 of the watchdog timer control register (address 003916) permits selecting a watchdog timer H count source. When this bit is set to “0”, the count source becomes the underflow signal of watchdog timer L. The detection time is set to 131.072 ms at f(XIN) = 8 MHz frequency and 32.768 s at f(XCIN) = 32 kHz frequency. When this bit is set to “1”, the count source becomes the signal divided by 16 for f(XIN) (or f(XCIN)). The detection time in this case is set to 512 µs at f(XIN) = 8 MHz frequency and 128 ms at f(XCIN) = 32 kHz frequency. This bit is cleared to “0” after resetting. ●Operation of STP instruction disable bit Bit 6 of the watchdog timer control register (address 003916) permits disabling the STP instruction when the watchdog timer is in operation. When this bit is “0”, the STP instruction is enabled. When this bit is “1”, the STP instruction is disabled, once the STP instruction is executed, an internal reset occurs. When this bit is set to “1”, it cannot be rewritten to “0” by program. This bit is cleared to “0” after resetting. ●Initial value of watchdog timer At reset or writing to the watchdog timer control register (address 003916), each watchdog timer H and L is set to “FF16”. XCIN “10” Main clock division ratio selection bits (Note) XIN “FF16” is set when watchdog timer control register is written to. Data bus “0” Watchdog timer L (8) 1/16 “1” “00” “01” Watchdog timer H (8) “FF16” is set when watchdog timer control register is written to. Watchdog timer H count source selection bit STP instruction disable bit STP instruction Reset circuit RESET Note: Any one of high-speed, middle-speed or low-speed mode is selected by bits 7 and 6 of the CPU mode register. Fig. 51 Block diagram of Watchdog timer b0 b7 Watchdog timer control register (WDTCON : address 003916) Watchdog timer H (for read-out of high-order 6 bit) STP instruction disable bit 0: STP instruction enabled 1: STP instruction disabled Watchdog timer H count source selection bit 0: Watchdog timer L underflow 1: f(XIN)/16 or f(XCIN)/16 Fig. 52 Structure of Watchdog timer control register Rev.1.01 Aug 02, 2004 page 47 of 96 Internal reset 7517 Group RESET CIRCUIT Poweron To reset the microcomputer, RESET pin must be held at an “L” level for 20 XIN cycles or more. Then the RESET pin is returned to an “H” level (the power source voltage must be between 2.7 V and 3.6 V, and the oscillation must be stable), reset is released. After the reset is completed, the program starts from the address contained in address FFFD16 (high-order byte) and address FFFC16 (low-order byte). Make sure that the reset input voltage is less than 0.54 V for VCC of 2.7 V. RESET Power source voltage 0V VCC Reset input voltage 0V (Note) 0.2VCC Note : Reset release voltage ; Vcc=2.7 V RESET VCC Power source voltage detection circuit Fig. 53 Reset circuit example XIN φ RESET RESETOUT ? ? Address ? ? FFFC FFFD ADH,L Reset address from the vector table. ? Data ? ? ? ADL ADH SYNC XIN: 8 to 13 clock cycles Notes 1: The frequency relation of f(X IN) and f(φ) is f(XIN) = 2 • f(φ). 2: The question marks (?) indicate an undefined state that depends on the previous state. 3: All signals except X IN and RESET are internals. Fig. 54 Reset sequence Rev.1.01 Aug 02, 2004 page 48 of 96 7517 Group Address Register contents Address Register contents (1) Port P0 direction register (P0D) 000116 0016 (27) Prescaler X (PREX) 002416 FF16 (2) Port P1 direction register (P1D) 000316 0016 (28) Timer X (TX) 002516 FF16 (3) Port P2 direction register (P2D) 000516 0016 (29) Prescaler Y (PREY) 002616 FF16 (4) Port P3 direction register (P3D) 000716 0016 (30) Timer Y (TY) 002716 FF16 (5) Port P4 direction register (P4D) 000916 0016 (31) Timer count source select register (TCSS) 002816 0016 (6) Discharge counter latch low-order register (DCHARGEL) 000A16 0016 (32) SFR protect control register (PRREG) 002916 0016 (7) Discharge counter latch high-order register (DCHARGEH) 000B16 0016 (33) I2C address register (S0D) 002C16 0016 (8) Charge counter latch low-order register (CHARGEL) 000C16 0016 (34) I2C status register (S1) 002D16 0 0 0 1 0 0 0 X (9) Charge counter latch high-order register (CHARGEH) 000D16 0016 (35) I2C control register (S1D) 002E16 0016 000E16 0016 (36) I2C clock control register (S2) 002F16 0016 003016 0 0 0 X XXX X (10) Current integrato14r control register (CINFCON) (11) Short current detector control register (SCDCON) 000F16 0016 (37) I2C start/stop condition control register (S2D) (12) Over current detector control register (OCDCON) 001016 0016 (38) I2C additional function register (S3) 003116 0016 (13) Current detect time set up register (OCDTIME) 001116 0016 (39) 32kHz oscillation circuit control register 0 (32KOSCC0) 003216 0016 (14) Wake up current detector control register 1 (WDDCON1) 001216 0016 (40) 32kHz oscillation circuit control register 1 (32KOSCC1) 003316 0016 001316 0016 (41) AD control register (ADCON) 003416 0 0 0 1 0 0 0 0 (16) Wake up current detector cuntrol register 2 (WDDCON2) 001416 0016 (42) MISRG2 003716 0016 (17) Serial I/O2 control register 1 (SI02CON1) 0016 (43) MISRG 003816 0016 (15) Over current detect status register (OCDSTS) 001516 (18) Serial I/O2 control register 2 (SI02CON2) 001616 0 0 0 0 0 1 1 1 (44) Watchdog timer control register (WDTCON) 003916 0 0 1 1 1 1 1 1 (19) Serial I/O1 status register (SIOSTS) 001916 1 0 0 0 0 0 0 0 (45) Interrupt edge selection register (INTEDGE) 003A16 0016 (20) Serial I/O1 control register (SIOCON) 001A16 (46) CPU mode register (CPUM) 003B16 0 1 1 0 0 0 0 0 (21) UART control register (UARTCON) 001B16 1 1 1 0 0 0 0 0 (47) Interrupt request register 1 (IREQ1) 003C16 0016 (22) PWM control register (PWMCON) 001D16 0016 (48) Interrupt request register 2 (IREQ2) 003D16 0016 (23) Prescaler 12 (PRE12) 002016 FF16 (49) Interrupt control register 1 (ICON1) 003E16 0016 (24) Timer 1 (T1) 002116 0116 (50) Interrupt control register 2 (ICON2) 003F16 0016 (PS) (PCH) FFFD16 contents (PCL) FFFC16 contents 0016 (25) Timer 2 (T2) 002216 0016 (51) Processor status register (26) Timer XY mode register (TM) 002316 0016 (52) Program counter Note : X indicates Not fixed . Fig. 55 Internal status at reset Rev.1.01 Aug 02, 2004 page 49 of 96 XX X X X 1 X X 7517 Group CLOCK GENERATING CIRCUIT (4) Low power dissipation mode The 7517 group has four built-in oscillation circuits: high-speed on-chip oscillation circuit, an oscillation circuit can be formed by connecting a resonator between XIN and XOUT, resonator between XCIN and XCOUT, and a 32 kHz RC oscillation circuit can be formed by connecting capacitor and resistor. The oscillation source (highspeed on-chip oscillation or X IN -X OUT oscillation) can be controlled by setting the clock source switch bit (CPU mode register) and high-speed on-chip oscillation stop bit (MISRG2) and XIN switching inhibit bit (MISRG2). Immediately after power on, only the high-speed on-chip oscillation circuit starts oscillation. In case of using X IN-X OUT oscillation circuit, change the clock source switch bit after start the XIN-XOUT oscillation setting the main clock (XIN-XOUT) stop bit (CPU mode register). When not using XIN-XOUT oscillation circuit, XIN pin and XOUT pin must be open. Setting the XIN switching inhibit bit “1” (disable switch to XIN), the clock source switch bit become invalid, and X IN-XOUT oscillation circuit becomes disabled since. When this bit is set to “1”, it cannot be rewritten to “0” by program. Setting the port Xc switch bit (CPU mode register) “1”, 32 kHz RC oscillation circuit or XCIN-XCOUT oscillation circuit starts oscillation. The selection of 32 kHz RC oscillation circuit or XcIN-XCOUT oscillation circuit is selected by 32 kHz RC oscillation enable bit (MISRG2). In case of using external resonator, connect resonator to XIN pin and XOUT pin (XCIN pin and XCOUT pin). Use the circuit constants in accordance with the resonator manufacturer’s recommended values. No external resistor is needed between X IN and X OUT since a feed-back resistor exists on-chip. However, an external feed-back resistor is needed between XCIN and XCOUT. Immediately after power on, XCIN and XCOUT pins function as I/O ports. The low power consumption operation can be realized by stopping the main clock XIN or high-speed on-chip oscillation in low-speed mode. To stop the main clock, set the main clock stop bit (bit 5 of CPU mode register) or the high-speed on-chip oscillation stop bit (bit 2 of MISRG2) to “1”. When the main clock XIN is restarted (by setting the main clock stop bit to “0”), set sufficient time for oscillation to stabilize. The sub-clock XCIN-XCOUT oscillating circuit can not directly input clocks that are generated externally. Accordingly, make sure to cause an external resonator to oscillate. Frequency Control (1) Middle-speed mode The internal clock φ is the frequency of high-speed on-chip oscillation clock or XIN divided by 8. After reset, this mode is selected. (2) High-speed mode The internal clock φ is half the frequency of high-speed on-chip oscillation clock or XIN. (3) Low-speed mode The internal clock φ is half the frequency of XCIN. ■Note If you switch the mode between middle/high-speed and lowspeed, stabilize both XIN and XCIN oscillations. The sufficient time is required for the sub-clock to stabilize, especially immediately after power on and at returning from the stop mode. When switching the mode between middle/high-speed and low-speed, set the frequency on condition that f(XIN) > 3•f(XCIN). Rev.1.01 Aug 02, 2004 page 50 of 96 32kHz RC oscillation circuit Setting the port Xc switch bit “1” after setting the 32 kHz RC oscillation enable bit “1”, the built-in 32 kHz RC oscillation circuit starts oscillation. In case of using 32 kHz RC oscillation circuit, connect 82 kΩ resistor between XCIN-XCOUT, and connect 120 pF capacitor between XCIN and GND. Setting appropriate value to the 32 kHz oscillation circuit control registers 0,1 it is possible to adjust the frequency error cause by evenness of resistor and capacitor value . The resistor ladder divided by 512 adjusts the frequency, and it makes possible about 50 Hz step adjustment. The theoretical frequency is calculated as follow. 1 f32CR= 2CRln(1+2R1/R2) 7517 Group 120 pF 82 kΩ C R XCIN XCOUT comparator 1/2 clock control circuit 32 kHz oscillation circuit control registers 0,1 Vcc 2 (1.65V) 35.84 Ω 71.68 kΩ 70 Ω ✕ 512 resistor ladder R1 Fig. 56 32 kHz RC oscillation circuit block diagram Rev.1.01 Aug 02, 2004 page 51 of 96 R2 7517 Group Oscillation Control (1) Stop mode If the STP instruction is executed, the internal clock φ stops at an “H” level, and high-speed on-chip oscillation clock or XIN and XCIN oscillation stops. When the oscillation stabilizing time set after STP instruction released bit is “0”, the prescaler 12 is set to “FF16” and timer 1 is set to “0116”. When the oscillation stabilizing time set after STP instruction released bit is “1”, set the sufficient time for oscillation of used oscillator to stabilize since nothing is set to the prescaler 12 and timer 1. Either high-speed on-chip oscillation clock, or XIN or XCIN divided by 16 is input to the prescaler 12 as count source. Oscillator restarts when an external interrupt is received, but the internal clock φ is not supplied to the CPU (remains at “H”) until timer 1 underflows. The internal clock φ is supplied for the first time, when timer 1 underflows. This ensures time for the clock oscillation using the ceramic resonators to be stabilized. When the oscillator is ____________ restarted by reset, apply “L” level to the RESET pin until the oscillation is stable since a wait time will not be generated. In case of using high-speed on-chip oscillation clock as main clock, the oscillation stabilizing time does not almost need. (2) Wait mode If the WIT instruction is executed, the internal clock φ stops at an “H” level, but the oscillator does not stop. The internal clock φ restarts at reset or when an interrupt is received. Since the oscillator does not stop, normal operation can be started immediately after the clock is restarted. To ensure that the interrupts will be received to release the STP or WIT state, their interrupt enable bits must be set to “1” before executing of the STP or WIT instruction. When releasing the STP state, the prescaler 12 and timer 1 will start counting the high-speed on-chip oscillation clock or XIN divided by 16. Accordingly, set the timer 1 interrupt enable bit to “0” before executing the STP instruction. XCOUT Rf XIN XOUT Rd CCIN CCOUT CIN COUT Fig. 57 Ceramic resonator circuit XCIN XCOUT Rf CCIN XIN XOUT Open Rd CCOUT External oscillation circuit Vcc Vss Fig. 58 External clock input circuit XCIN XCOUT XIN Open XOUT Open 82kΩ ■Note When using XIN-XOUT oscillation by using an external resonator, in case of using the oscillation stabilizing time set after STP instruction released bit set to “1”, evaluate time to stabilize oscillation of the used oscillator and set the value to the timer 1 and prescaler 12. Rev.1.01 XCIN Aug 02, 2004 page 52 of 96 120pF Fig.59 On-chip oscillation circuit and 32kHz CR oscillation circuit 7517 Group XCIN XCOUT Data bus “1” “0” Port XC switch bit 32kHZ RC oscillation enable bit Port XC switch bit 32kHZ RC oscillation enable bit 32 kHZ oscillation control registers 0, 1 Port XC switch bit 1/2 XOUT XIN Clock source switch bit XIN-XOUT oscillation Main clock division ratio selection bit (Note 1) Low-speed mode 1/2 High-speed on-chip oscillation High-speed on-chip oscillation circuit 1/4 Prescaler 12 Timer 1 High-speed or middle-speed mode Main clock division ratio selection bits (Note 1) Middle-speed mode XIN switching inhibit bit High-speed on-chip oscillation stop bit 1/2 Timing φ (Internal clock) High-speed or low-speed mode Main clock stop bit S Q Q S STP instruction R WIT instruction R Q S R STP instruction Reset Interrupt disable flag l Interrupt request Note: Any one of high-speed mode, middle-speed mode or low-speed mode is selected by bits 7 and 6 of the CPU mode register. When low-speed mode is selected, set port Xc switch bit (b4) to “1”. Fig. 60 System clock generating circuit block diagram (Single-chip mode) Rev.1.01 Aug 02, 2004 page 53 of 96 7517 Group ■Notes on middle-speed mode switch set bit When the middle-speed mode automatic switch set bit is set to “1” during operation in the low-speed mode, XIN oscillation starts automatically by detecting the rising edge or the falling edge of the SCL pin or the SDA pin and the microcomputer switch to the middle-speed mode. Select the timing which switch from the lowspeed mode to the middle-speed mode by the middle-speed mode automatic switch wait time set bit. The timing which changes from the low-speed mode by the middle-speed mode automatic switch wait time set bit. Select according to the oscillation start characteristic of the oscillator of X IN to be used. By writing “1” in the middle-speed mode automatic switch start bit during operation in the low-speed mode, XIN oscillation starts automatically and the microcomputer changes to the middle-speed mode. b7 b7 b0 MISRG(003816) Oscillation stabilizing time set after STP instruction released bit 0: Automatically set “0116” to Timer 1, “FF16” to Prescaler 12 1: Automatically set nothing Middle-speed mode automatic switch set bit 0: Disabled 1: Automatic switch enabled (Notes 1, 2) Middle-speed mode automatic switch wait time set bit 0: 4.5 to 5.5 cycles 1: 6.5 to 7.5 cycles Middle-speed mode automatic switch start bit (depends on software) 0: Invalid 1: Automatic switch start (Note 2) Not used (return “0” when read) Notes 1: The microcomputer can be switched to the middle-speed mode automatically by the SCL/SDA interrupt during operation in the low-speed mode. 2: When switching from the low-speed mode to the middle-speed mode, the value of the CPU mode register also changes. b0 MISRG2(003716) Analog in addtional bit bit0 ADCON bit2 bit1 bit0 (003416) 0 X X X 1 0 0 0 1 0 0 1 1 0 1 0 1 0 1 1 1 1 X X P35/AN5 - P30/AN0 P04/AN8 P05/AN9 P06/AN10 P07/AN11 Not available 32kHz RC oscillation calibration enable bit (Note 4) 0:Disabled 1:Enabled High-speed on-chip oscillation stop bit (Note 4) 0:Oscillating 1:Stopping Xin swith disable bit (Notes 3, 4) 0:Enable swith to XIN 1:Disable swith to XIN 32kHz RC oscillation enable bit (Note 4) 0:XCIN-XCOUT oscillation 1:32kHz RC oscillation Low-speed mode serial I/O2 clock source select bit 0:XCIN 1:Built-in oscillator for SI/O2 Not used (returnn"0" when read) Reserved (do not write "1") Notes 3: When this bit is set to "1", it cannot be rewritten to "0" by program. 4: This bit is protected. Fig.61 Structure of MISRG1, MISRG2 b7 b0 AA AA A AA A AA AA AAAAAA AAA AAA b7 b6 b5 b4 b3 b2 b1 b0 b7 32kHz oscillation control register 0 (003216) b0 b8 32kHz oscillation control register 1 (003316) Fig.62 32kHz oscillation control register Rev.1.01 Aug 02, 2004 page 54 of 96 "0" XIN oscillation high-speed mode(f(φ)=2MHz) CM7=0 CM6=0 CM5=0(4MHz oscillating) CM4=0(32kHz stopped) CM3=1 MISRG2(bit2)=1(High-speed on-chip oscillating stopped) "1 " 6 "0 " CM "0 7 CM " "1 " "0" Low-speed mode(f(φ)=16kHz) CM7=1 CM6=0 CM5=0(4MHz oscillating) CM4=1(32kHz oscillating) CM3=1 MISRG2(bit2)=1(High-speed on-chip oscillating stopped) Low-speed mode(f(φ)=16MHz) CM7=1 CM6=0 CM5=1(4MHz oscillating stopped) CM4=1(32kHz oscillating) CM3=1 MISRG2(bit2)=1(High-speed on-chip oscillating stopped) CM3 "1" CM3 "1" On-chip oscillation CM5 "0" high-speed mode(f(φ)=approximately 2MHz) CM7=0 CM5 CM6=0 "0" CM5=0(4MHz oscillating) "0" CM4=0(32kHz stopped) CM3=0 MISRG2(bit2)=0(High-speed on-chip oscillating) high-speed mode(f(φ)=approximately 2MHz) CM6 CM7=0 CM6=0 "1" CM5=1(4MHz oscillating stopped) CM4=0(32kHz stopped) CM3=0 MISRG2(bit2)=0(High-speed on-chip oscillating) On-chip oscillation "0" "1" "1" CM3 "1" On-chip oscillation middle-speed mode(f(φ)=500kHz) CM7=0 CM6=1 CM5=0(4MHz oscillating) CM4=1(32kHz oscillating) CM3=1 MISRG2(bit2)=0(High-speed on-chip oscillating) XIN oscillation high-speed mode(f(φ)=approximately 2MHz) CM7=0 CM6=0 "0" CM5=0(4MHz oscillating) CM4=1(32kHz oscillating ) CM3=0 MISRG2(bit2)=0(High-speed on-chip oscillating) CM3 "1" "0" "0" Low-speed mode(f(φ)=16kHz) CM7=1 CM6=0 CM5=1(4MHz oscillating stopped) CM4=1(32kHz oscillating) CM3=0 MISRG2(bit2)=0(High-speed on-chip oscillating) Low-speed mode(f(φ)=16kHz) CM7=1 CM6=0 CM5=1(4MHz oscillating stopped) CM4=1(32kHz oscillating) CM3=0 MISRG2(bit2)=1(High-speed on-chip oscillating stopped) " "0 7 CM " " "1 "1 6 CM " "0 b2 High-speed on-chip oscillation stop bit 0 : oscillating 1 : stopped MISRG2 (003716) b7 On-chip oscillating middle-speed mode(f(φ)=approximately 500kHz) CM7=0 CM6=1 CM5=1(4MHz oscillating stopped) CM4=1(32kHz oscillating) CM3=0 MISRG2(bit2)=0(High-speed on-chip oscillating) "1 " C "0 M4 C " " 0 M6 " "1 " CM5 "1" CM5 "1" mode(f(φ)=approximately 2MHz) CM7=0 CM6=0 CM5=1(4MHz oscillating stopped) CM4=1(32kHz oscillating ) CM3=0 MISRG2(bit2)=0(High-speed on-chip oscillating) CM6 "1" "0" mode(f(φ)=approximately 500kHz) CM7=0 CM6=1 CM5=1(4MHz oscillating stopped) CM4=0(32kHz stopped) CM3=0 MISRG2(bit2)=0(High-speed on-chip oscillating) On-chip oscillating middle-speed RESET On-chip oscillation high-speed Switch the mode by the allows shown between the mode blocks. (Do not switch between the modes directly without an allow.) The all modes can be switched to the stop mode or the wait mode and return to the source mode when the stop mode or the wait mode is ended. Timer operates in the wait mode. When the stop mode is ended, a delay of approximately 2 ms occurs by connecting Timer 1 in middle/high-speed mode. When the stop mode is ended, the following is performed. (1) After the clock is restarted, a delay of approximately 16ms occurs in low-speed mode if Timer 12 count source selection bit is "0". (2) After the clock is restarted, a delay of approximately 250ms occurs in low-speed mode if Timer 12 count source selection bit is "1". 6 : Wait until oscillation stabilizes after oscillating the main clock XIN before the switching from the low-speed mode to middle/high-speed mode. 7 : The example assumes that 4 MHz is being applied to the XIN pin and 32 kHz to the XCIN pin. φ indicates the internal clock. Notes1 : 2: 3: 4: 5: MISRG2 (bit 2) "1" "0" high-speed mode(f(φ)=2MHz) CM7=0 CM6=0 CM5=0(4MHz oscillating) CM4=1(32kHz oscillating ) CM3=1 MISRG2(bit2)=0(High-speed on-chip oscillating) CM6 "1" XIN oscillation XIN oscillation high-speed mode(f(φ)=2MHz) CM7=0 MISRG2 (bit 2) CM6=0 "1" "0" CM5=0(4MHz oscillating) CM4=1(32kHz oscillating) CM3=1 MISRG2(bit2)=1(High-speed on-chip oscillating stopped) "0" XIN oscillation high-speed mode(f(φ)=2MHz) CM7=0 CM6=0 CM5=0(4MHz oscillating) CM4=0(32kHz stopped) CM3=1 MISRG2(bit2)=0(High-speed on-chip oscillating) XIN oscillation " middle-speed mode(f(φ)=500kHz) CM7=0 CM6=1 CM5=0(4MHz oscillating) CM4=1(32kHz oscillating) CM3=1 MISRG2(bit2)=1(High-speed on-chip oscillatin stopped) "1" MISRG2 (bit 2) XIN oscillation middle-speed mode(f(φ)=500kHz) CM7=0 CM6=1 CM5=0(4MHz oscillating) CM4=0(32kHz stopped) CM3=1 MISRG2(bit2)=0(High-speed on-chip oscillating) "0" CM4 "1" " C " 1 M4 C " " 1 M6 "0 " "0" "0" CM4 "1" CM6 "1" "1" "0" CM4 "1" XIN oscillation " "0 "0" CM4 "1" "0" CM4 "1" "0" page 55 of 96 CM7 "1" Fig. 63 State transitions of system clock "0 "0" " C " 1 M4 C " " 0 M6 "0 " middle-speed mode(f(φ)=500 kHz) CM7=0 CM6=1 CM5=0(4MHz oscillating) CM4=0(32kHz stopped) CM3=1 MISRG2(bit2)=1(High-speed on-chip oscillating stopped) " "0" "1 CM7 "1" 4 MISGR2 (bit2) "1" "0" CM " "0 6 CM " "1 CM5 "1" " "1 "0" CM4 "1" Aug 02, 2004 b3 "0" "0" On-chip oscillating middle-speed mode(f(φ)=approximately 500kHz) CM7=0 CM6=1 CM5=0(4MHz oscillating) CM4=0(32kHz stopped) CM3=0 MISRG2(bit2)=0(High-speed on-chip oscillating) "0" Rev.1.01 CPUM Clock source switch bit 0 : On-chip oscillation function 1 : XIN-XOUT oscillation function CM4 : Port Xc switch bit 0 : I/O port function (stop oscillating) 1 : XCIN-XCOUT oscillating function CM5 : Main clock(XIN- XOUT) stop bit 0 : oscillating 1 : stopped CM7,CM6: Main clock division ratio selection bits b7 b6 0 0 : f= f(XIN)/2 (high-speed mode) 0 1 : f= f(XIN)/8 (middle-speed mode) 1 0 : f= f(XCIN)/2 (low-speed mode) 1 1 : Not available CPU mode register (003B16) mode(f(φ)=approximately 500kHz) CM7=0 CM6=1 CM5=0(4MHz oscillating) CM4=1(32kHz oscillating) CM3=0 MISRG2(bit2)=0(High-speed on-chip oscillating) On-chip oscillating middle-speed CM4 "1" MISRG2 (bit 2) 7517 Group 7517 Group NOTES ON PROGRAMMING Processor Status Register A/D Converter The contents of the processor status register (PS) after a reset are undefined, except for the interrupt disable flag (I) which is “1”. After a reset, initialize flags which affect program execution. In particular, it is essential to initialize the index X mode (T) and the decimal mode (D) flags because of their effect on calculations. The comparator uses capacitive coupling amplifier whose charge will be lost if the clock frequency is too low. Therefore, make sure that f(XIN) is at least on 500 kHz during an A/D conversion. Do not execute the STP or WIT instruction during an A/D conversion. Interrupts Instruction Execution Time The contents of the interrupt request bits do not change immediately after they have been written. After writing to an interrupt request register, execute at least one instruction before performing a BBC or BBS instruction. The instruction execution time is obtained by multiplying the frequency of the internal clock φ by the number of cycles needed to execute an instruction. The number of cycles required to execute an instruction is shown in the list of machine instructions. The frequency of the internal clock φ is half of the XIN frequency in high-speed mode. Decimal Calculations • To calculate in decimal notation, set the decimal mode flag (D) to “1”, then execute an ADC or SBC instruction. After executing an ADC or SBC instruction, execute at least one instruction before executing a SEC, CLC, or CLD instruction. • In decimal mode, the values of the negative (N), overflow (V), and zero (Z) flags are invalid. Timers If a value n (between 0 and 255) is written to a timer latch, the frequency division ratio is 1/(n+1). Multiplication and Division Instructions • The index X mode (T) and the decimal mode (D) flags do not affect the MUL and DIV instruction. • The execution of these instructions does not change the contents of the processor status register. Ports The contents of the port direction registers cannot be read. The following cannot be used: • The data transfer instruction (LDA, etc.) • The operation instruction when the index X mode flag (T) is “1” • The addressing mode which uses the value of a direction register as an index • The bit-test instruction (BBC or BBS, etc.) to a direction register • The read-modify-write instructions (ROR, CLB, or SEB, etc.) to a direction register. Use instructions such as LDM and STA, etc., to set the port direction registers. Serial interface In clock synchronous serial I/O, if the receive side is using an external clock and it is to output the SRDY1 signal, set the transmit enable bit, the receive enable bit, and the SRDY1 output enable bit to “1”. Serial I/O1 continues to output the final bit from the TXD pin after transmission is completed. SOUT2 pin for serial I/O2 goes to high impedance after transmission is completed. When an external clock is used as synchronous clock in serial I/ O1 or serial I/O2, write transmission data to the transmit buffer register or serial I/O2 register while the transfer clock is “H”. Rev.1.01 Aug 02, 2004 page 56 of 96 NOTES ON USAGE Handling of Source Pins In order to avoid a latch-up occurrence, connect a capacitor suitable for high frequencies as bypass capacitor between power source pin (VCC pin) and GND pin (VSS pin) and between power source pin (V CC pin) and analog power source input pin (AV SS pin). Besides, connect the capacitor to as close as possible. For bypass capacitor which should not be located too far from the pins to be connected, a ceramic capacitor of 0.01 µF 0.1µF is recommended. Power Source Voltage When the power source voltage value of a microcomputer is less than the value which is indicated as the recommended operating conditions, the microcomputer does not operate normally and may perform unstable operation. In a system where the power source voltage drops slowly when the power source voltage drops or the power supply is turned off, reset a microcomputer when the power source voltage is less than the recommended operating conditions and design a system not to cause errors to the system by this unstable operation. 7517 Group FLASH MEMORY MODE Summary Table 11 lists the summary of the M37517F8 (flash memory version). Table 11 Summary of M37517F8 (flash memory version) Specifications Item Vcc = 2.7– 5.5 V (Note 1) Power source voltage Vcc = 2.7–3.6 V (Note 2) VPP voltage (For Program/Erase) 4.5–5.5 V, f(XIN) = 8 MHz Flash memory mode User ROM area 3 modes (Parallel I/O mode, Standard serial I/O mode, CPU rewrite mode) 1 block (32 Kbytes) Boot ROM area 1 block (4 Kbytes) (Note 3) Erase block division Program method Byte program Erase method Batch erasing Program/Erase control method Program/Erase control by software command Number of commands Number of program/Erase times 6 commands ROM code protection Available in parallel I/O mode and standard serial I/O mode 100 times Notes 1: The power source voltage must be Vcc = 4.5–5.5 V at program and erase operation. 2: The power source voltage can be Vcc = 3.0–3.6 V also at program and erase operation. 3: The Boot ROM area has had a standard serial I/O mode control program stored in it when shipped from the factory. This Boot ROM area can be rewritten in only parallel I/O mode. Rev.1.01 Aug 02, 2004 page 57 of 96 7517 Group The M37517F8 (flash memory version) has an internal new DINOR (Divided bit line NOR) flash memory that can be rewritten with a single power source when VCC is 5 V, and 2 power sources when VPP is 5 V and VCC is 3.3-5.0 V in the CPU rewrite and standard serial I/O modes. For this flash memory, three flash memory modes are available in which to read, program, and erase: the parallel I/O and standard serial I/O modes in which the flash memory can be manipulated using a programmer and the CPU rewrite mode in which the flash memory can be manipulated by the Central Processing Unit (CPU). The flash memory of the M37517F8 is divided into User ROM area and Boot ROM area as shown in Figure 64. In addition to the ordinary User ROM area to store the MCU operation control program, the flash memory has a Boot ROM area that is used to store a program to control rewriting in CPU rewrite and standard serial I/O modes. This Boot ROM area has had a standard serial I/O mode control program stored in it when shipped from the factory. However, the user can write a rewrite control program in this area that suits the user’s application system. This Boot ROM area can be rewritten in only parallel I/O mode. Parallel I/O mode 800016 Block 1 : 32 kbyte FFFF16 F00016 4 kbyte FFFF16 User ROM area Boot ROM area BSEL = 0 BSEL = 1 CPU rewrite mode, standard serial I/O mode 800016 Block 1 : 32 kbyte Product name Flash memory start address M37517F8 800016 FFFF16 F00016 4 kbyte FFFF16 User ROM area User area / Boot area selection bit = 0 Boot ROM area User area / Boot area selection bit = 1 Notes 1: The Boot ROM area can be rewritten in only parallel input/ output mode. (Access to any other areas is inhibited.) 2: To specify a block, use the maximum address in the block. Fig. 64 Block diagram of built-in flash memory Rev.1.01 Aug 02, 2004 page 58 of 96 7517 Group (1) CPU Rewrite Mode Microcomputer Mode and Boot Mode In CPU rewrite mode, the internal flash memory can be operated on (read, program, or erase) under control of the Central Processing Unit (CPU). In CPU rewrite mode, only the User ROM area shown in Figure 64 can be rewritten; the Boot ROM area cannot be rewritten. Make sure the program and block erase commands are issued for only the User ROM area and each block area. The control program for CPU rewrite mode can be stored in either User ROM or Boot ROM area. In the CPU rewrite mode, because the flash memory cannot be read from the CPU, the rewrite control program must be transferred to internal RAM area to be executed before it can be executed. The control program for CPU rewrite mode must be written into the User ROM or Boot ROM area in parallel I/O mode beforehand. (If the control program is written into the Boot ROM area, the standard serial I/O mode becomes unusable.) See Figure 64 for details about the Boot ROM area. Normal microcomputer mode is entered when the microcomputer is reset with pulling CNVSS pin low. In this case, the CPU starts operating using the control program in the User ROM area. When the microcomputer is reset by pulling the P41/INT0 pin high, the CNVss pin high, the CPU starts operating using the control program in the Boot ROM area (program start address is FFFC16, FFFD16 fixation). This mode is called the “Boot” mode. The User ROM area can be rewritten also by the control program in the Boot ROM area. Block Address Block addresses refer to the maximum address of each block. These addresses are used in the block erase command. In case of the M37517F8, it has only one block. Rev.1.01 Aug 02, 2004 page 59 of 96 7517 Group Outline Performance (CPU Rewrite Mode) CPU rewrite mode is usable in the single-chip or Boot mode. The only User ROM area can be rewritten in CPU rewrite mode. In CPU rewrite mode, the CPU erases, programs and reads the internal flash memory by executing software commands. This rewrite control program must be transferred to the RAM before it can be executed. The MCU enters CPU rewrite mode by applying 5 V ± 0.5 V to the CNVSS pin and setting “1” to the CPU Rewrite Mode Select Bit (bit 1 of address 0FFE16). Software commands are accepted once the mode is entered. Use software commands to control program and erase operations. Whether a program or erase operation has terminated normally or in error can be verified by reading the status register. Figure 65 shows the flash memory control register. Bit 0 is the RY/BY status flag used exclusively to read the operating status of the flash memory. During programming and erase operations, it is “0” (busy). Otherwise, it is “1” (ready). Bit 1 is the CPU Rewrite Mode Select Bit. When this bit is set to “1”, the MCU enters CPU rewrite mode. Software commands are accepted once the mode is entered. In CPU rewrite mode, the CPU becomes unable to access the internal flash memory directly. b7 Therefore, use the control program in the RAM for write to bit 1. To set this bit to “1”, it is necessary to write “0” and then write “1” in succession. The bit can be set to “0” by only writing “0”. Bit 2 is the CPU Rewrite Mode Entry Flag. This flag indicates “1” in CPU rewrite mode, so that reading this flag can check whether CPU rewrite mode has been entered or not. Bit 3 is the flash memory reset bit used to reset the control circuit of internal flash memory. This bit is used when exiting CPU rewrite mode and when flash memory access has failed. When the CPU Rewrite Mode Select Bit is “1”, setting “1” for this bit resets the control circuit. To set this bit to “1”, it is necessary to write “0” and then write “1” in succession. To release the reset, it is necessary to set this bit to “0”. Bit 4 is the User Area/Boot Area Select Bit. When this bit is set to “1”, Boot ROM area is accessed, and CPU rewrite mode in Boot ROM area is available. In Boot mode, this bit is set to “1” automatically. Reprogramming of this bit must be in the RAM. Figure 66 shows a flowchart for setting/releasing CPU rewrite mode. b0 Flash memory control register (address 0FFE16) (Note 1) FMCR RY/BY status flag (FMCR0) 0: Busy (being programmed or erased) 1: Ready CPU rewrite mode select bit (FMCR1) (Note 2) 0: Normal mode (Software commands invalid) 1: CPU rewrite mode (Software commands acceptable) CPU rewrite mode entry flag (FMCR2) 0: Normal mode 1: CPU rewrite mode Flash memory reset bit (FMCR3) (Note 3) 0: Normal operation 1: Reset User ROM area / Boot ROM area select bit (FMCR4) 0: User ROM area accessed 1: Boot ROM area accessed Reserved bits (Indefinite at read/ “0” at write) Notes 1: The contents of flash memory control register are “XXX00001” just after reset release. 2: For this bit to be set to “1”, the user needs to write “0” and then “1” to it in succession. If it is not this procedure, this bit will not be set to “1”. 3: This bit is valid when the CPU rewrite mode select bit is “1”. Set this bit 3 to “0” subsequently after setting bit 3 to “1”. Fig. 65 Structure of flash memory control register Rev.1.01 Aug 02, 2004 page 60 of 96 7517 Group Start Single-chip mode or Boot mode Set CPU mode register (Note 1) Transfer CPU rewrite mode control program to RAM Jump to control program transferred in RAM (Subsequent operations are executed by control program in this RAM) Set CPU rewrite mode select bit to “1” (by writing “0” and then “1” in succession) Using software command execute erase, program, or other operation Execute read array command or reset flash memory by setting flash memory reset bit (by writing “1” and then “0” in succession) (Note 2) Write “0” to CPU rewrite mode select bit End Notes 1: Set bits 6, 7 (main clock division ratio selection bits) of CPU mode register (003B16). 2: Before exiting the CPU rewrite mode after completing erase or program operation, always be sure to execute the read array command or reset the flash memory. Fig. 66 CPU rewrite mode set/release flowchart Rev.1.01 Aug 02, 2004 page 61 of 96 7517 Group Precautions on CPU Rewrite Mode Described below are the precautions to be observed when rewriting the flash memory in CPU rewrite mode. (1) Operation speed During CPU rewrite mode, set the internal clock φ 4.0 MHz or less using the main clock division ratio selection bits (bit 6, 7 at 003B16). (2) Instructions inhibited against use The instructions which refer to the internal data of the flash memory cannot be used during CPU rewrite mode . (3) Interrupts inhibited against use The interrupts cannot be used during CPU rewrite mode because they refer to the internal data of the flash memory. (4) Watchdog timer In case of the watchdog timer has been running already, the internal reset generated by watchdog timer underflow does not happen, because of watchdog timer is always clearing during program or erase operation. (5) Reset Reset is always valid. In case of CNVSS = H when reset is released, boot mode is active. So the program starts from the address contained in address FFFC16 and FFFD16 in boot ROM area. Rev.1.01 Aug 02, 2004 page 62 of 96 7517 Group Software Commands (CPU Rewrite Mode) Table 12 lists the software commands. After setting the CPU Rewrite Mode Select Bit of the flash memory control register to “1”, execute a software command to specify an erase or program operation. Each software command is explained below. ●Read Array Command (FF16) The read array mode is entered by writing the command code “FF16” in the first bus cycle. When an address to be read is input in one of the bus cycles that follow, the contents of the specified address are read out at the data bus (D0 to D7). The read array mode is retained intact until another command is written. register mode is entered automatically and the contents of the status register is read at the data bus (D0 to D7). The status register bit 7 (SR7) is set to “0” at the same time the write operation starts and is returned to “1” upon completion of the write operation. In this case, the read status register mode remains active until the next command is written. ____ The RY/BY Status Flag is “0” (busy) during write operation and “1” (ready) when the write operation is completed as is the status register bit 7. At program end, program results can be checked by reading bit 4 (SR4) of the status register. Start ●Read Status Register Command (7016) The read status register mode is entered by writing the command code “7016” in the first bus cycle. The contents of the status register are read out at the data bus (D0 to D7) by a read in the second bus cycle. The status register is explained in the next section. Write 4016 Write Write address Write data Status register read ●Clear Status Register Command (5016) This command is used to clear the bits SR1, SR4, and SR5 of the status register after they have been set. These bits indicate that operation has ended in an error. To use this command, write the command code “5016” in the first bus cycle. SR7 = 1 ? or RY/BY = 1 ? ●Program Command (4016) Program operation starts when the command code “4016” is written in the first bus cycle. Then, if the address and data to program are written in the 2nd bus cycle, program operation (data programming and verification) will start. Whether the write operation is completed can be confirmed by _____ reading the status register or the RY/BY Status Flag of the flash memory control register. When the program starts, the read status NO YES NO S R4 = 0 ? Program error YES Program completed (Read array command “FF16” write) Fig. 67 Program flowchart Table 12 List of software commands (CPU rewrite mode) Command Cycle number Mode Read array 1 Write Read status register 2 Clear status register First bus cycle Data Address (D0 to D7) X Second bus cycle Data Mode Address (D0 to D7) (Note 4) FF16 Write X 7016 1 Write X 5016 Program 2 Write X 4016 Write WA (Note 2) WD (Note 2) Erase all blocks 2 Write X 2016 Write X 2016 Block erase 2 Write X 2016 Write (Note 3) D016 Notes 1: SRD = Status Register Data 2: WA = Write Address, WD = Write Data 3: BA = Block Address to be erased (Input the maximum address of each block.) 4: X denotes a given address in the User ROM area . Rev.1.01 Aug 02, 2004 page 63 of 96 Read X BA SRD (Note 1) 7517 Group ●Erase All Blocks Command (2016/2016) By writing the command code “2016” in the first bus cycle and the confirmation command code “2016” in the second bus cycle that follows, the operation of erase all blocks (erase and erase verify) starts. Whether the erase all blocks command is terminated can be con____ firmed by reading the status register or the RY/BY Status Flag of flash memory control register. When the erase all blocks operation starts, the read status register mode is entered automatically and the contents of the status register can be read out at the data bus (D0 to D7). The status register bit 7 (SR7) is set to “0” at the same time the erase operation starts and is returned to “1” upon completion of the erase operation. In this case, the read status register mode remains active until another command is written. ____ The RY/BY Status Flag is “0” during erase operation and “1” when the erase operation is completed as is the status register bit 7 (SR7). After the erase all blocks end, erase results can be checked by reading bit 5 (SR5) of the status register. For details, refer to the section where the status register is detailed. Start Write 2016 Write 2016/D016 Block address Status register read SR7 = 1 ? or RY/BY = 1 ? Rev.1.01 Aug 02, 2004 page 64 of 96 NO YES SR5 = 0 ? ●Block Erase Command (2016/D016) By writing the command code “2016” in the first bus cycle and the confirmation command code “D016” and the block address in the second bus cycle that follows, the block erase (erase and erase verify) operation starts for the block address of the flash memory to be specified. Whether the block erase operation is completed can be confirmed ____ by reading the status register or the RY/BY Status Flag of flash memory control register. At the same time the block erase operation starts, the read status register mode is automatically entered, so that the contents of the status register can be read out. The status register bit 7 (SR7) is set to “0” at the same time the block erase operation starts and is returned to “1” upon completion of the block erase operation. In this case, the read status register mode remains active until the read array command (FF16) is written. ____ The RY/BY Status Flag is “0” during block erase operation and “1” when the block erase operation is completed as is the status register bit 7. After the block erase ends, erase results can be checked by reading bit 5 (SRS) of the status register. For details, refer to the section where the status register is detailed. 2016:Erase all blocks command D016:Block erase command YES Erase completed (Read comand “FF16” write) Fig. 68 Erase flowchart NO Erase error 7517 Group Status Register (SRD) The status register shows the operating status of the flash memory and whether erase operations and programs ended successfully or in error. It can be read in the following ways: (1) By reading an arbitrary address from the User ROM area after writing the read status register command (7016) (2) By reading an arbitrary address from the User ROM area in the period from when the program starts or erase operation starts to when the read array command (FF16) is input. Also, the status register can be cleared by writing the clear status register command (5016). After reset, the status register is set to “8016”. Table 13 shows the status register. Each bit in this register is explained below. •Erase status (SR5) The erase status indicates the operating status of erase operation. If an erase error occurs, it is set to “1”. When the erase status is cleared, it is set to “0”. •Program status (SR4) The program status indicates the operating status of write operation. When a write error occurs, it is set to “1”. The program status is set to “0” when it is cleared. If “1” is written for any of the SR5 and SR4 bits, the program, erase all blocks, and block erase commands are not accepted. Before executing these commands, execute the clear status register command (5016) and clear the status register. Also, if any commands are not correct, both SR5 and SR4 are set to “1”. •Sequencer status (SR7) The sequencer status indicates the operating status of the flash memory. This bit is set to “0” (busy) during write or erase operation and is set to “1” when these operations ends. After power-on, the sequencer status is set to “1” (ready). Table 13 Definition of each bit in status register (SRD) Symbol Status name SR7 (bit7) SR6 (bit6) SR5 (bit5) Sequencer status Reserved Erase status SR4 (bit4) SR3 (bit3) Program status Reserved SR2 (bit2) SR1 (bit1) SR0 (bit0) Reserved Reserved Reserved Rev.1.01 Aug 02, 2004 page 65 of 96 Definition “1” “0” Ready - Busy - Terminated in error Terminated in error Terminated normally Terminated normally - - - - 7517 Group Full Status Check By performing full status check, it is possible to know the execution results of erase and program operations. Figure 69 shows a full status check flowchart and the action to be taken when each error occurs. Read status register SR4 = 1 and SR5 = 1 ? YES Command sequence error NO SR5 = 0 ? NO Erase error Execute the clear status register command (5016) to clear the status register. Try performing the operation one more time after confirming that the command is entered correctly. Should an erase error occur, the block in error cannot be used. YES SR4 = 0 ? NO Program error Should a program error occur, the block in error cannot be used. YES End (erase, program) Note: When one of SR5 and SR4 is set to “1”, none of the read array, the program, erase all blocks, and block erase commands is accepted. Execute the clear status register command (5016) before executing these commands. Fig. 69 Full status check flowchart and remedial procedure for errors Rev.1.01 Aug 02, 2004 page 66 of 96 7517 Group Functions To Inhibit Rewriting Flash Memory Version To prevent the contents of internal flash memory from being read out or rewritten easily, this MCU incorporates a ROM code protect function for use in parallel I/O mode and an ID code check function for use in standard serial I/O mode. ●ROM Code Protect Function (in Parallel I/O Mode) The ROM code protect function is the function to inhibit reading out or modifying the contents of internal flash memory by using the ROM code protect control (address FFDB 16) in parallel I/O mode. Figure 70 shows the ROM code protect control (address FFDB16). (This address exists in the User ROM area.) If one or both of the pair of ROM Code Protect Bits is set to “0”, b7 the ROM code protect is turned on, so that the contents of internal flash memory are protected against readout and modification. The ROM code protect is implemented in two levels. If level 2 is selected, the flash memory is protected even against readout by a shipment inspection LSI tester, etc. When an attempt is made to select both level 1 and level 2, level 2 is selected by default. If both of the two ROM Code Protect Reset Bits are set to “00”, the ROM code protect is turned off, so that the contents of internal flash memory can be read out or modified. Once the ROM code protect is turned on, the contents of the ROM Code Protect Reset Bits cannot be modified in parallel I/O mode. Use the serial I/O or CPU rewrite mode to rewrite the contents of the ROM Code Protect Reset Bits. b0 1 1 ROM code protect control register (address FFDB16) ROMCP Reserved bits (“1” at read/write) ROM code protect level 2 set bits (ROMCP2) (Notes 1, 2) b3b2 0 0: Protect enabled 0 1: Protect enabled 1 0: Protect enabled 1 1: Protect disabled ROM code protect reset bits (ROMCR) (Note 3) b5b4 0 0: Protect removed 0 1: Protect set bits effective 1 0: Protect set bits effective 1 1: Protect set bits effective ROM code protect level 1 set bits (ROMCP1) (Note 1) b7b6 0 0: Protect enabled 0 1: Protect enabled 1 0: Protect enabled 1 1: Protect disabled Notes 1: When ROM code protect is turned on, the internal flash memory is protected against readout or modification in parallel I/O mode. 2: When ROM code protect level 2 is turned on, ROM code readout by a shipment inspection LSI tester, etc. also is inhibited. 3: The ROM code protect reset bits can be used to turn off ROM code protect level 1 and ROM code protect level 2. However, since these bits cannot be modified in parallel I/O mode, they need to be rewritten in standard serial I/O mode or CPU rewrite mode. Fig. 70 Structure of ROM code protect control Rev.1.01 Aug 02, 2004 page 67 of 96 7517 Group ID Code Check Function (in Standard serial I/O mode) Use this function in standard serial I/O mode. When the contents of the flash memory are not blank, the ID code sent from the programmer is compared with the ID code written in the flash memory to see if they match. If the ID codes do not match, the commands sent from the programmer are not accepted. The ID code consists of 8-bit data, and its areas are FFD4 16 to FFDA 16. Write a program which has had the ID code preset at these addresses to the flash memory. Address FFD416 ID1 FFD516 ID2 FFD616 ID3 FFD716 ID4 FFD816 ID5 FFD916 ID6 FFDA16 ID7 FFDB16 ROM code protect control Interrupt vector area Fig. 71 ID code store addresses Rev.1.01 Aug 02, 2004 page 68 of 96 7517 Group (2) Parallel I/O Mode Parallel I/O mode is the mode which parallel output and input software command, address, and data required for the operations (read, program, erase, etc.) to a built-in flash memory. Use the exclusive external equipment flash programmer which supports the 7517 Group (flash memory version). Refer to each programmer maker’s handling manual for the details of the usage. User ROM and Boot ROM Areas In parallel I/O mode, the user ROM and boot ROM areas shown in Figure 64 can be rewritten. Both areas of flash memory can be operated on in the same way. Program and block erase operations can be performed in the user ROM area. The user ROM area and its block is shown in Figure 64. The boot ROM area is 4 Kbytes in size. It is located at addresses F00016 through FFFF16. Make sure program and block erase operations are always performed within this address range. (Access to any location outside this address range is prohibited.) In the Boot ROM area, an erase block operation is applied to only one 4 Kbyte block. The boot ROM area has had a standard serial I/O mode control program stored in it when shipped from the Renesas factory. Therefore, using the device in standard serial I/O mode, you do not need to write to the boot ROM area. Rev.1.01 Aug 02, 2004 page 69 of 96 7517 Group (3) Standard serial I/O Mode The standard serial I/O mode inputs and outputs the software commands, addresses and data needed to operate (read, program, erase, etc.) the internal flash memory. This I/O is clock synchronized serial. This mode requires the exclusive external equipment (serial programmer). The standard serial I/O mode is different from the parallel I/O mode in that the CPU controls flash memory rewrite (uses the CPU rewrite mode), rewrite data input and so forth. The standard serial I/O mode is started by connecting “H” to the P26 (SCLK) pin and “H” to the P41 (INT0) pin and “H” to the CNVSS pin (apply 4.5 V to 5.5 V to Vpp from an external source), and releasing the reset operation. (In the ordinary microcomputer mode, set CNVss pin to “L” level.) This control program is written in the Boot ROM area when the product is shipped from Renesas. Accordingly, make note of the fact that the standard serial I/O mode cannot be used if the Boot ROM area is rewritten in parallel I/O mode. Figure T-9 shows the pin connection for the standard serial I/O mode. In standard serial I/O mode, serial data I/O uses the four serial I/O pins S CLK, RxD, TxD and SRDY1 (BUSY). The SCLK1 pin is the transfer clock input pin through which an external transfer clock is input. The TxD pin is for CMOS output. The SRDY1 (BUSY) pin outputs “L” level when ready for reception and “H” level when reception starts. Serial data I/O is transferred serially in 8-bit units. In standard serial I/O mode, only the User ROM area shown in Figure 64 can be rewritten. The Boot ROM area cannot. In standard serial I/O mode, a 7-byte ID code is used. When there is data in the flash memory, commands sent from the peripheral unit (programmer) are not accepted unless the ID code matches. Rev.1.01 Aug 02, 2004 page 70 of 96 Outline Performance (Standard Serial I/O Mode) In standard serial I/O mode, software commands, addresses and data are input and output between the MCU and peripheral units (serial programmer, etc.) using 4-wire clock-synchronized serial I/ O (serial I/O1). In reception, software commands, addresses and program data are synchronized with the rise of the transfer clock that is input to the S CLK pin, and are then input to the MCU via the RxD pin. In transmission, the read data and status are synchronized with the fall of the transfer clock, and output from the TxD pin. The TxD pin is for CMOS output. Transfer is in 8-bit units with LSB first. When busy, such as during transmission, reception, erasing or program execution, the S RDY1 (BUSY) pin is “H” level. Accordingly, always start the next transfer after the SRDY1 (BUSY) pin is “L” level. Also, data and status registers in a memory can be read after inputting software commands. Status, such as the operating state of the flash memory or whether a program or erase operation ended successfully or not, can be checked by reading the status register. Here following explains software commands, status registers, etc. 7517 Group Table 14 Description of pin function (Standard Serial I/O Mode) Pin Name Description I/O VCC, VSS Power input AVCC Analog power supply input I Connect AVCC to VCC . AVSS Analog power supply input I Connect AVSS to VSS . CNVSS CNVSS I Connect to VCC when VCC = 4.5 V to 5.5 V. Connect to Vpp (=4.5 V to 5.5 V) when VCC = 2.7 V to 4.5 V. RESET Reset input I Reset input pin. While reset is “L” level, a 20 cycle or longer clock must be input to XIN pin. XIN Clock input I XOUT Clock output Connect a ceramic resonator or crystal oscillator between XIN and XOUT pins. To input an externally generated clock, input it to XIN pin and open XOUT pin. ADVSS Analog power supply input ADVREF AD reference voltage input I Enter the reference voltage for AD from this pin, or open. P00 to P07 Input port P0 I Input “H” or “L”, or open. P10 to P17 Input port P1 I Input “H” or “L”, or open. P20 to P23 Input port P2 I Input “H” or “L”, or open. P24 RxD input I This pin is for serial data input. P25 TxD output O This pin is for serial data output. P26 SCLK input I This pin is for serial clock input. P27 BUSY output O P30 to P35 Input port P3 I Input “H” or “L”, or open. P40, P42 to P45 Input port P4 I Input “H” or “L”, or open. P41 Input port P4 I Input “H” when RESET is released only. ISENS0 ISENS1 Analog input I Connect the sense register. ISENS0 is connected the GND side. Rev.1.01 Aug 02, 2004 page 71 of 96 Apply program/erase protection voltage to Vcc pin and 0 V to Vss pin. O Connect ADVSS to VSS . This pin is for BUSY signal output. P11/(LED1) P07 P10/(LED0) P05 P06 P04 P02/SCLK2 P03/SRDY2 P00/SIN2 P01/SOUT2 P34/AN4 P35/AN5 7517 Group 25 27 26 28 29 30 31 32 34 33 36 35 VCC VSS P33/AN3 37 24 P12/(LED2) P32/AN2 38 23 P13/(LED3) P31/AN1 39 22 P14/(LED4) P30/AN0 40 21 P15/(LED5) ADVSS 41 20 P16/(LED6) ADVREF 42 19 P17/(LED7) VCC 43 18 VSS AVCC 44 17 XOUT AVSS 45 16 XIN ISENS0 46 15 RESET ISENS1 47 14 P20/XCOUT DFETCNT/P45 48 13 P21/XCIN 10 P23/SCL1 12 9 P25/SCL2/TXD P24/SDA2/RXD TXD RXD CNVSS 7 8 P26/SCLK SCLK 11 6 P22/SDA1 5 P40/CNTR1 P27/CNTR0/SRDY1 BUSY 3 4 P42/INT1 P41/INT0 1 2 P44/INT3/PWM P43/INT2/SCMP2 M37517F8HP ✽1 RESET Value 4.5 to 5.5 V VCC ✽ 3 RESET P26/SCLK VCC VSS VCC ✽ 3 Aug 02, 2004 page 72 of 96 ✽2 Notes 1: Connect oscillator circuit, or open. 2: Connect to Vcc when Vcc = 4.5 V to 5.5 V. Connect to Vpp (=4.5 V to 5.5 V) when Vcc = 2.7 V to 4.5 V. 3: It is necessary to apply Vcc only when reset is released. Fig. 72 Pin connection diagram in standard serial I/O mode Rev.1.01 VPP Signal CNVSS P41 P41 Mode setup method 7517 Group Software Commands (Standard Serial I/O Mode) commands via the RxD pin. Software commands are explained here below. Table 15 lists software commands. In standard serial I/O mode, erase, program and read are controlled by transferring software Table 15 Software commands (Standard serial I/O mode) Control command 1st byte transfer 2nd byte 3rd byte 4th byte Address (middle) Address (high) Data output Address (high) Data Data Data input input input 5th byte 6th byte ..... When ID is not verified Data Data output output Data output to 259th byte Not acceptable Data input to 259th byte Not acceptable 1 Page read FF16 2 Page program 4116 Address (middle) 3 Erase all blocks A716 D016 4 Read status register 7016 SRD output 5 Clear status register 5016 6 ID code check F516 Address (low) Address (middle) Address (high) ID size ID1 7 Download function FA16 Size (low) Size (high) Checksum Data input To required number of times 8 Version data output function FB16 Version data output Version data output Version data output Version data output Version data output Not acceptable SRD1 output Acceptable Not acceptable To ID7 Acceptable Not acceptable Version data output to 9th byte Acceptable Notes1: Shading indicates transfer from the internal flash memory microcomputer to a programmer. All other data is transferred from an external equipment (programmer) to the internal flash memory microcomputer. 2: SRD refers to status register data. SRD1 refers to status register 1 data. 3: All commands can be accepted when the flash memory is totally blank. 4: Address high must be “0016”. Rev.1.01 Aug 02, 2004 page 73 of 96 7517 Group ●Page Read Command This command reads the specified page (256 bytes) in the flash memory sequentially one byte at a time. Execute the page read command as explained here following. (1) Transfer the “FF16” command code with the 1st byte. (2) Transfer addresses A8 to A15 and A16 to A23 (“00 16”) with the 2nd and 3rd bytes respectively. (3) From the 4th byte onward, data (D0 to D7) for the page (256 bytes) specified with addresses A8 to A 23 will be output sequentially from the smallest address first synchronized with the fall of the clock. SCLK FF16 RxD A8 to A15 A16 to A23 data0 TxD data255 SRDY1(BUSY) Fig. 73 Timing for page read ●Read Status Register Command This command reads status information. When the “7016” command code is transferred with the 1st byte, the contents of the status register (SRD) with the 2nd byte and the contents of status register 1 (SRD1) with the 3rd byte are read. SCLK RxD TxD SRDY1(BUSY) Fig. 74 Timing for reading status register Rev.1.01 Aug 02, 2004 page 74 of 96 7016 SRD output SRD1 output 7517 Group ●Clear Status Register Command This command clears the bits (SR4, SR5) which are set when the status register operation ends in error. When the “5016” command code is sent with the 1st byte, the aforementioned bits are cleared. When the clear status register operation ends, the SRDY1 (BUSY) signal changes from “H” to “L” level. SCLK RxD 5016 TxD SRDY1(BUSY) Fig. 75 Timing for clear status register ●Page Program Command This command writes the specified page (256 bytes) in the flash memory sequentially one byte at a time. Execute the page program command as explained here following. (1) Transfer the “4116” command code with the 1st byte. (2) Transfer addresses A8 to A15 and A16 to A23 (“0016”) with the 2nd and 3rd bytes respectively. (3) From the 4th byte onward, as write data (D0 to D7 ) for the page (256 bytes) specified with addresses A8 to A23 is input sequentially from the smallest address first, that page is automatically written. When reception setup for the next 256 bytes ends, the SRDY1 (BUSY) signal changes from “H” to “L” level. The result of the page program can be known by reading the status register. For more information, see the section on the status register. SCLK 4116 RxD TxD SRDY1(BUSY) Fig. 76 Timing for page program Rev.1.01 Aug 02, 2004 page 75 of 96 A8 to A15 A16 to A23 data0 data255 7517 Group ●Erase All Blocks Command This command erases the contents of all blocks. Execute the erase all blocks command as explained here following. (1) Transfer the “A716” command code with the 1st byte. (2) Transfer the verify command code “D0 16” with the 2nd byte. With the verify command code, the erase operation will start and continue for all blocks in the flash memory. When erase all blocks end, the S RDY1 (BUSY) signal changes from “H” to “L” level. The result of the erase operation can be known by reading the status register. SCLK RxD TxD SRDY1(BUSY) Fig. 77 Timing for erase all blocks Rev.1.01 Aug 02, 2004 page 76 of 96 A716 D016 7517 Group ●Download Command This command downloads a program to the RAM for execution. Execute the download command as explained here following. (1) Transfer the “FA16” command code with the 1st byte. (2) Transfer the program size with the 2nd and 3rd bytes. (3) Transfer the check sum with the 4th byte. The check sum is added to all data sent with the 5th byte onward. (4) The program to execute is sent with the 5th byte onward. When all data has been transmitted, if the check sum matches, the downloaded program is executed. The size of the program will vary according to the internal RAM. SCLK RxD FA16 TxD SRDY1(BUSY) Fig. 78 Timing for download Rev.1.01 Aug 02, 2004 page 77 of 96 Data size Data size (low) (high) Check su m Program data Program data 7517 Group ●Version Information Output Command This command outputs the version information of the control program stored in the Boot ROM area. Execute the version information output command as explained here following. (1) Transfer the “FB16” command code with the 1st byte. (2) The version information will be output from the 2nd byte onward. This data is composed of 8 ASCII code characters. SCLK R xD FB16 TxD SRDY1(BUSY) Fig. 79 Timing for version information output Rev.1.01 Aug 02, 2004 page 78 of 96 ‘V’ ‘E’ ‘R’ ‘X’ 7517 Group ●ID Check This command checks the ID code. Execute the boot ID check command as explained here following. (1) Transfer the “F516” command code with the 1st byte. (2) Transfer addresses A0 to A7, A8 to A15 and A16 to A23 (“0016”) of the 1st byte of the ID code with the 2nd, 3rd, and 4th bytes respectively. (3) Transfer the number of data sets of the ID code with the 5th byte. (4) Transfer the ID code with the 6th byte onward, starting with the 1st byte of the code. SCLK R xD F516 D416 FF16 0016 ID size TxD SRDY1(BUSY) Fig. 80 Timing for ID check ●ID Code When the flash memory is not blank, the ID code sent from the serial programmer and the ID code written in the flash memory are compared to see if they match. If the codes do not match, the command sent from the serial programmer is not accepted. An ID code contains 8 bits of data. Area is, from the 1st byte, addresses FFD416 to FFDA16. Write a program into the flash memory, which already has the ID code set for these addresses. Address FFD416 ID1 FFD516 ID2 FFD616 ID3 FFD716 ID4 FFD816 ID5 FFD916 ID6 FFDA16 ID7 FFDB16 ROM code protect control Interrupt vector area Fig. 81 ID code storage addresses Rev.1.01 Aug 02, 2004 page 79 of 96 ID1 ID7 7517 Group ●Status Register (SRD) The status register indicates operating status of the flash memory and status such as whether an erase operation or a program ended successfully or in error. It can be read by writing the read status register command (70 16 ). Also, the status register is cleared by writing the clear status register command (5016). Table 16 lists the definition of each status register bit. After releasing the reset, the status register becomes “8016”. •Sequencer status (SR7) The sequencer status indicates the operating status of the flash memory. After power-on and recover from deep power down mode, the sequencer status is set to “1” (ready). This status bit is set to “0” (busy) during write or erase operation and is set to “1” upon completion of these operations. •Erase status (SR5) The erase status indicates the operating status of erase operation. If an erase error occurs, it is set to “1”. When the erase status is cleared, it is set to “0”. •Program status (SR4) The program status indicates the operating status of write operation. If a program error occurs, it is set to “1”. When the program status is cleared, it is set to “0”. Table 16 Definition of each bit of status register (SRD) Definition SRD0 bits Status name “1” “0” Ready - Busy - Terminated in error Terminated in error Terminated normally Terminated normally Reserved Reserved Reserved - - Reserved - - SR7 (bit7) SR6 (bit6) Sequencer status Reserved SR5 (bit5) SR4 (bit4) Erase status Program status SR3 (bit3) SR2 (bit2) SR1 (bit1) SR0 (bit0) Rev.1.01 Aug 02, 2004 page 80 of 96 7517 Group ●Status Register 1 (SRD1) The status register 1 indicates the status of serial communications, results from ID checks and results from check sum comparisons. It can be read after the status register (SRD) by writing the read status register command (7016). Also, status register 1 is cleared by writing the clear status register command (5016). Table 17 lists the definition of each status register 1 bit. This register becomes “0016” when power is turned on and the flag status is maintained even after the reset. •Boot update completed bit (SR15) This flag indicates whether the control program was downloaded to the RAM or not, using the download function. •Check sum consistency bit (SR12) This flag indicates whether the check sum matches or not when a program, is downloaded for execution using the download function. •ID check completed bits (SR11 and SR10) These flags indicate the result of ID checks. Some commands cannot be accepted without an ID code check. •Data reception time out (SR9) This flag indicates when a time out error is generated during data reception. If this flag is attached during data reception, the received data is discarded and the MCU returns to the command wait state. Table 17 Definition of each bit of status register 1 (SRD1) SRD1 bits Status name SR15 (bit7) Boot update completed bit SR14 (bit6) SR13 (bit5) SR12 (bit4) Reserved Reserved Checksum match bit SR11 (bit3) SR10 (bit2) ID check completed bits SR9 (bit1) Data reception time out SR8 (bit0) Reserved Rev.1.01 Aug 02, 2004 page 81 of 96 Definition “1” Update completed “0” Not Update Match 00 01 Mismatch Not verified Verification mismatch 10 11 Reserved Verified Time out Normal operation - - 7517 Group Full Status Check Results from executed erase and program operations can be known by running a full status check. Figure 82 shows a flowchart of the full status check and explains how to remedy errors which occur. Read status register SR4 = 1 and SR5 = 1 ? YES Command sequence error NO SR5 = 0 ? NO Erase error Execute the clear status register command (5016) to clear the status register. Try performing the operation one more time after confirming that the command is entered correctly. Should an erase error occur, the block in error cannot be used. YES SR4 = 0 ? NO Program error Should a program error occur, the block in error cannot be used. YES End (Erase, program) Note: When one of SR5 to SR4 is set to “1” , none of the program, erase all blocks commands is accepted. Execute the clear status register command (5016) before executing these commands. Fig. 82 Full status check flowchart and remedial procedure for errors Rev.1.01 Aug 02, 2004 page 82 of 96 7517 Group Example Circuit Application for Standard Serial I/O Mode Figure 83 shows a circuit application for the standard serial I/O mode. Control pins will vary according to a programmer, therefore see a programmer manual for more information. P41 Clock input SCLK BUSY output SRDY1 (BUSY) Data input RXD Data output TXD VPP power source input CNVss M37517F8 Notes 1: Control pins and external circuitry will vary according to peripheral unit. For more information, see the peripheral unit manual. 2: In this example, the Vpp power supply is supplied from an external source (writer). To use the user’s power source, connect to 4.5 V to 5.5 V. 3: It is necessary to apply Vcc to SCLK pin only when reset is released. Fig. 83 Example circuit application for standard serial I/O mode Rev.1.01 Aug 02, 2004 page 83 of 96 7517 Group Flash memory Electrical characteristics Table 18 Absolute maximum ratings Symbol VCC Parameter Input voltage VI Ratings Unit –0.3 to 6.5 V –0.3 to VCC +0.3 V Conditions Power source voltage P00–P07, P10–P17, P20, P21, P24–P27, P30–P35, P40–P45, ADVREF, AVCC, ISENS1 VI Input voltage P22, P23 VI Input voltage RESET, XIN VI Input voltage CNVSS VO Output voltage P00–P07, P10–P17, P20, P21, P24–P27, P30–P35, P40–P45, XOUT VO Output voltage P22, P23 Pd Power dissipation Topr Tstg Operating temperature Storage temperature All voltages are based on VSS. Output transistors are cut off. –0.3 to 5.8 V –0.3 to VCC +0.3 V –0.3 to 6.5 V –0.3 to VCC +0.3 V –0.3 to 5.8 V 300 mW 25±5 –40 to 125 °C °C Ta = 25 °C Table 19 Flash memory mode Electrical characteristics (Ta = 25 oC, VCC = 4.5 to 5.5V unless otherwise noted) Limits Parameter Symbol IPP1 IPP2 IPP3 VPP VCC Rev.1.01 VPP power source current (read) VPP power source current (program) VPP power source current (erase) VPP power source voltage VCC power source voltage Aug 02, 2004 page 84 of 96 Conditions Min. Max. Unit 4.5 100 60 30 5.5 µA mA mA V 4.5 5.5 V 3.0 3.6 V VPP = VCC VPP = VCC VPP = VCC Microcomputer mode operation at VCC = 2.7 to 5.5V Microcomputer mode operation at VCC = 2.7 to 3.6V Typ. 7517 Group ELECTRICAL CHARACTERISTICS Table 20 Absolute maximum ratings (Executing flash memory mode, flash memory electrical characteristics is applied.) Symbol VCC Parameter Ratings Unit –0.3 to 6.5 V –0.3 to VCC +0.3 V Conditions Power source voltage Input voltage VI P00–P07, P10–P17, P20, P21, P24–P27, P30–P35, P40–P45, ADVREF, AVCC, ISENS1 VI Input voltage P22, P23 VI VI Input voltage Input voltage RESET, XIN CNVSS VO Output voltage P00–P07, P10–P17, P20, P21, P24–P27, P30–P35, P40–P45, XOUT VO Output voltage P22, P23 Pd Power dissipation Topr Tstg All voltages are based on VSS. Output transistors are cut off. –0.3 to 5.8 V –0.3 to VCC +0.3 –0.3 to VCC +0.3 V V –0.3 to VCC +0.3 V –0.3 to 5.8 V 300 mW Operating temperature –20 to 85 °C Storage temperature –40 to 125 °C Ta = 25 °C Table 21 Recommended operating conditions (1) (VCC = 3.0 to 3.6 V, Ta = –20 to 85 °C, unless otherwise noted) Symbol VCC VSS ADVREF ADVSS VIA AVCC AVSS ISENS0 ISENS1 VIH Parameter Power source voltage At 4 MHz When using current integrator, over current detector, 32 kHz RC oscillation circuit Power source voltage A/D convert reference voltage A/D convert power source voltage Analog input voltage AN0–AN5, AN8–AN11 Analog power source voltage Analog power source voltage Analog input voltage Analog input voltage “H” input voltage P00–P07, P10–P17, P20–P27, P30–P35, P40–P45 VIH “H” input voltage (when I2C-BUS input level is selected) SDA1, SCL1 “H” input voltage (when I2C-BUS input level is selected) SDA2, SCL2 “H” input voltage (when SMBUS input level is selected) SDA1, SCL1 “H” input voltage (when SMBUS input level is selected) SDA2, SCL2 “H” input voltage RESET, XIN, CNVSS VIL “L” input voltage VIH VIH VIH VIH P00–P07, P10–P17, P20–P27, P30–P35, P40–P45 VIL “L” input voltage (when I2C-BUS input level is selected) SDA1, SDA2, SCL1, SCL2 “L” input voltage (when SMBUS input level is selected) SDA1, SDA2, SCL1, SCL2 “L” input voltage RESET, CNVSS VIL “L” input voltage VIL VIL Rev.1.01 Aug 02, 2004 page 85 of 96 XIN Limits Min. 3.0 Typ. Max. 3.3 3.6 3.234 3.3 3.366 VCC V VCC V V 3.366 V 0 ADVSS 3.234 3.3 V V 0 2.0 Unit V 0 V 0 -0.1 0.1 V 0.8VCC VCC V 0.7VCC 5.8 V 0.7VCC VCC V 1.4 5.8 V 1.4 VCC V 0.8VCC VCC V 0 0.2VCC V 0 0.3VCC V 0 0.6 V 0 0.2VCC 0.16VCC V 0 V 7517 Group Table 22 Recommended operating conditions (2) (VCC = 3.0 to 3.6 V, Ta = –20 to 85 °C, unless otherwise noted) Symbol ΣIOH(peak) ΣIOH(peak) Parameter “H” total peak output current P00–P07, P10–P17, P30–P35 (Note 1) “H” total peak output current P20, P21, P24–P27, P40–P45 (Note1) Limits Min. Typ. Max. Unit –80 –80 mA mA ΣIOL(peak) “L” total peak output current P00–P07, P30–P35 (Note 1) 80 mA ΣIOL(peak) “L” total peak output current P10–P17 (Note1) 80 mA ΣIOL(peak) “L” total peak output current P20–P27,P40–P45 (Note1) 80 mA ΣIOH(avg) “H” total average output current P00–P07, P10–P17, P30–P35 (Note1) –40 mA ΣIOH(avg) –40 mA ΣIOL(avg) “H” total average output current P20, P21, P24–P27, P40–P45 (Note1) “L” total average output current P00–P07, P30–P35 (Note1) 40 mA ΣIOL(avg) “L” total average output current P10–P17 (Note 1) 40 mA ΣIOL(avg) IOH(peak) “L” total average output current P20–P27,P40–P45 (Note1) 40 mA “H” peak output current –10 mA IOL(peak) “L” peak output current P00–P07, P20–P27, P30–P35, P40–P45 (Note 2) IOL(peak) IOH(avg) “L” peak output current P10–P17 (Note 2) 10 20 mA mA “H” average output current P00–P07, P10–P17, P20, P21, P24–P27, P30–P35, P40–P45 (Note 3) –5 mA “L” average output current “L” average output current P00–P07, P20–P27, P30–P35, P40–P45 (Note 3) P10–P17 (Note 3) 5 mA IOL(avg) IOL(avg) f(XIN) P00–P07, P10–P17, P20, P21, P24–P27, P30–P35, P40–P45 (Note 2) Internal clock oscillation frequency (VCC = 3.0 to 3.6V) (Note 4) 15 mA 4 MHz Notes 1: The total output current is the sum of all the currents flowing through all the applicable ports. The total average current is an average value measured over 100 ms. The total peak current is the peak value of all the currents. 2: The peak output current is the peak current flowing in each port. 3: The average output current IOL(avg), IOH(avg) are average value measured over 100 ms. 4: When the oscillation frequency has a duty cycle of 50%. Rev.1.01 Aug 02, 2004 page 86 of 96 7517 Group Table 23 Electrical characteristics (VCC = 3.0 to 3.6 V, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted) Limits Symbol VOH Parameter Test conditions Min. Typ. Max. Unit VCC –1.0 “H” output voltage P00–P07, P10–P17, P20, P21, P24–P27, P30–P35, P40–P45 (Note) IOH = –1.0 mA VCC = 3.0–3.6 V “L” output voltage P00–P07, P20–P27, P30–P35, P40–P45 IOL = 1.0 mA VCC = 3.0–3.6 V 1.0 V VOL “L” output voltage P10–P17 IOL = 10 mA VCC = 3.0–3.6 V 1.0 V VT+–VT– Hysteresis CNTR0, CNTR1, INT0–INT3 0.4 V VT+–VT– Hysteresis RxD, SCLK 0.5 V VT+–VT– IIH Hysteresis 0.3 V VOL V RESET “H” input current P00–P07, P10–P17, P20, P21, P24–P27, P30–P35, P40–P45 VI = VCC IIH IIH IIH “H” input current ISENS0, ISENS1 “H” input current RESET, CNVSS “H” input current IIL “L” input current P00–P07, P10–P17, P20–P27 P30–P35, P40–P45 “L” input current ISENS0, ISENS1 VI = VCC VI = VSS XIN 5.0 µA VI = VCC 1.0 VI = VCC 5.0 µA µA µA 4 –5.0 µA VI = VSS –1.0 “L” input current RESET,CNVSS VI = VSS –5.0 IIL “L” input current XIN VI = VSS µA µA µA VRAM RAM hold voltage 3.6 V IIL IIL When clock stopped –4 2.0 Note: P25 is measured when the P25/TXD P-channel output disable bit of the UART control register (bit 4 of address 001B16) is “0”. Rev.1.01 Aug 02, 2004 page 87 of 96 7517 Group Table 24 Electrical characteristics (1) (VCC = 3.0 to 3.6 V, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted) Symbol ICC Limits Parameter Test conditions Max. Power source current High-speed mode f(XIN) = 4 MHz or high-speed on-chip oscillation f(XCIN) = 32.768 kHz or 32 kHz RC oscillation Output transistors “off” Current integrator and over current detector stopped 2.5 5.0 High-speed mode f(XIN) = 4 MHz or high-speed on-chip oscillation (in WIT state) f(XCIN) = 32.768 kHz or 32 kHz RC oscillation Output transistors “off” Current integrator and over current detector stopped 0.6 mA Low-speed mode f(XIN) = stopped f(XCIN) = 32.768 kHz or 32kHz RC oscillation Output transistors “off” Current integrator and over current detector stopped 200 µA Low-speed mode f(XIN) = stopped f(XCIN) = 32.768 kHz or 32kHz RC oscillation (in WIT state) Output transistors “off” Current integrator and over current detector stopped 50 µA Middle-speed mode f(XIN) = 4 MHz or high-speed on-chip oscillation f(XCIN) = stopped Output transistors “off” Current integrator and over current detector stopped 1.7 Middle-speed mode f(XIN) = 4 MHz or high-speed on-chip oscillation (in WIT state) f(XCIN) = stopped Output transistors “off” Current integrator and over current detector stopped 0.7 mA 800 µA Increment when A/D conversion is executed f(XIN) = 4 MHz or high-speed on-chip oscillation Rev.1.01 Unit Typ. Aug 02, 2004 page 88 of 96 Min. 3.0 mA mA 7517 Group Table 25 Electrical characteristics (2) (VCC = 3.0 to 3.6 V, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted) Limits Symbol ICC Parameter Power source current Test conditions Max. 1000 1600 µA Short current detector Increment when over current detector Over current detector is executed. Wake up current detector 80 110 µA 80 110 µA 90 120 µA Short current detector + over current detector 80 110 µA Short current detector + wake up current detector 90 120 µA Over current detector + wake up current detector 90 120 µA Short current detector + over current detector + wake up current detector 90 120 µA 0.1 1.0 µA 10 µA Increment when current integrator is executed All oscillation stopped Ta = 25 °C (in STP state) Output Ta = 85 °C transistors “off” Rev.1.01 Aug 02, 2004 Unit Typ. page 89 of 96 Min. 7517 Group Table 26 High-speed on-chip oscillation circuit electrical characteristics (VCC = AVCC = 3.3 V ±2 %, VSS = AVSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted) Parameter Symbol Test conditions f4MCR Oscillating frequency VCC=3.3V f4MCRS Oscillating frequency shift by temperature VCC=AVCC=3.3V, –20 to 85 °C Limits Min. 2.75 Typ. 4.0 Max. 5.8 0.3 Unit MHz %/°C Table 27 32 kHz RC oscillation circuit electrical characteristics (VCC = AVCC = 3.3 V ±2 %, VSS = AVSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted) Parameter Symbol Test conditions – External register, and capacitor tolerance Total tolerance of the resistor and capacitor – Oscillating frequency adjustment resolution – Oscillating frequency shift by VCC voltage – Oscillating frequency shift by temperature – Oscillating frequency shift by VCC voltage and temperature Rev.1.01 Aug 02, 2004 page 90 of 96 Limits Min. Typ. 10 0.04 Max. 15 0.07 Ta=25 °C 0.5 VCC=AVCC=3.3V, –20 to 85 °C 0.5 Unit % kHz % % 2 % 7517 Group Table 28 A/D converter characteristics (VCC = 3.0 to 3.6 V, VSS = AVSS = 0 V, Ta = –20 to 85 °C, f(XIN) = 4MHz, f(XCIN) = 32 kHz, unless otherwise noted) Symbol Limits Test conditions Parameter Min. Typ. Unit Max. – Resolution 10 bit – Absolute accuracy (excluding quantization error) ±4 LSB 61 tc(φ) tCONV Conversion time RLADDER Ladder resistor Reference power source input current IVREF High-speed mode, middle-speed mode Low-speed mode VREF “on” VREF = 3.3 V 40 40 µs 35 kΩ 100 140 µA 5.0 5.0 µA 0.5 VREF “off” II(AD) A/D port input current µA Table 29 Current integrator electrical characteristics (VCC = AVCC = 3.3 V ±2 %, VSS = AVSS = 0V, Ta = –20 to 85 °C, f(XIN) = 4 MHz, f(XCIN) = 32 kHz) Parameter Symbol t INF Integrate period V ISENS1 ISENS1 input range t CAL Caribration time Limits Test conditions Min. Typ. 125 Unit Max. ms –0.2 0.2 V 15.625 125 ms t CONV INF AD conversion time at AD conversion connection mode 12 15 18 µs AD Integrate coefficient of integrator for discharge 0.68 1.00 1.35 µV•sec AC Integrate coefficient of integrator for charge 0.68 1.00 1.35 µV•sec t RD Reset time of integrator for discharge t RC Reset time of integrator for charge b' Count value at 0V input V REFD Internal reference voltage for discharge integrator 0.09 V REFC Internal reference voltage for charge integrator –0.11 – linearity error after reset time caribration 300 ns ns 300 –2400 2400 – 0.1 0.11 V –0.1 –0.09 V 1 % 3 % VCC = 3.3 V ±2 % Ta = 0 to 60 °C VCC = 3.3 V ±2 % Ta = -20 to 85 °C tINF tINF tCAL 2.45V Integrator output 1.65V 0.85V tRD, tRC tRD, tRC tRD, tRC tRD, tRC tRD, tRC Discharge signal for the integrator tCONVINF AD conversion signal Note : All signals are internals. Fig. 84 Current integrator timing diagram Rev.1.01 Aug 02, 2004 page 91 of 96 tCONVINF 7517 Group Count value Discharge nD – b = nREFD TINF • VISENS1 AD • VISENS1 n’D – b ’= ATD INF + tRD • VISENS1 b’ VREFC c -c) n’C = ACT+INFtRC• (V• (ISENS1 VISENS1-c) nC = TINF • (VISENS1-c) AC VISENS1 ISENS1 input voltage VREFD b= TINF • b’ TINF-tRD • b’ c= vREFD • b nREFD-b Charge Fig. 85 VISENS1-Count value characteristics of current integrator Table 30 Over current detector electrical characteristics (VCC = AVCC = 3.3V±2%, VSS =AVSS = 0V, Ta = –20 to 85 °C, f(XIN) = 4MHz, f(XCIN) = 32MHz) Parameter Symbol Conditions Limits Min. Typ. Max. Unit – Short current detect voltage error ±15 mV – Over current detect voltage error ±15 mV – Wake up detect voltage – Short current detect time error – Over current detect time error – Wake up detect time Rev.1.01 Aug 02, 2004 page 92 of 96 8 10 12 mV 30.5 µs 62.5 ms T.B.D. 58.6 7517 Group TIMING REQUIREMENTS Table 31 Timing requirements (VCC = 3.0 to 3.6 V, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted) Limits Parameter Symbol Min. Unit Max. Typ. tW(RESET) Reset input “L” pulse width 20 XIN cycles tC(XIN) External clock input cycle time 250 ns tWH(XIN) External clock input “H” pulse width 100 ns tWL(XIN) External clock input “L” pulse width 100 ns tC(CNTR) CNTR0, CNTR1 input cycle time 500 ns tWH(CNTR) CNTR0, CNTR1 input “H” pulse width 230 ns tWL(CNTR) CNTR0, CNTR1 input “L” pulse width INT0 to INT3 input “H” pulse width 230 230 ns tWH(INT) tWL(INT) INT0 to INT3 input “L” pulse width 230 ns tC(SCLK1) tWH(SCLK1) Serial I/O1 clock input cycle time (Note) Serial I/O1 clock input “H” pulse width (Note) 2000 950 ns ns ns tWL(SCLK1) Serial I/O1 clock input “L” pulse width (Note) 950 ns tsu(RxD-SCLK1) Serial I/O1 clock input set up time 400 ns th(SCLK1-RxD) Serial I/O1 clock input hold time 200 ns tC(SCLK2) Serial I/O2 clock input cycle time 2000 ns tWH(SCLK2) Serial I/O2 clock input “H” pulse width 950 ns tWL(SCLK2) Serial I/O2 clock input “L” pulse width ns tsu(SIN2-SCLK2) Serial I/O2 clock input set up time 950 400 th(SCLK2-SIN2) Serial I/O2 clock input hold time 300 ns ns Note : When f(XIN) = 4 MHz and bit 6 of address 001A16 is “1” (clock synchronous). Divide this value by four when f(XIN) = 8 MHz and bit 6 of address 001A16 is “0” (UART). SWITCHING CHARACTERISTICS Table 32 Switching characteristics (VCC = 3.0 to 3.6 V, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted) Parameter Symbol Test conditions Limits Min. tWH (SCLK1) Serial I/O1 clock output “H” pulse width tC(SCLK1)/2–50 tWL (SCLK1) Serial I/O1 clock output “L” pulse width Serial I/O1 output delay time (Note 1) tC(SCLK1)/2–50 td (SCLK1-TXD) tv (SCLK1-TXD) tr (SCLK1) Serial I/O1 output valid time (Note 1) tf (SCLK1) Serial I/O1 clock output falling time tWH (SCLK2) Serial I/O2 clock output “H” pulse width tC(SCLK2)/2–240 tWL (SCLK2) Serial I/O2 clock output “L” pulse width tC(SCLK2)/2–240 td (SCLK2-SOUT2) Serial I/O2 output delay time (Note 2) tv (SCLK2-SOUT2) Serial I/O2 output valid time (Note 2) tf (SCLK2) Serial I/O2 clock output falling time tr (CMOS) CMOS output rising time (Note 3) CMOS output falling time (Note 3) tf (CMOS) Typ. Max. ns ns 350 ns ns 50 ns 50 ns –30 Serial I/O1 clock output rising time Fig. 87 ns ns 400 0 Aug 02, 2004 page 93 of 96 ns ns 50 ns 20 50 ns 20 50 ns Notes 1: For tWH(SCLK1), tWL(SCLK1), when the P25/TXD P-channel output disable bit of the UART control register (bit 4 of address 001B16) is “0”. 2: When the P01/SOUT2 and P02/SCLK2 P-channel output disable bit of the Serial I/O2 control register (bit 7 of address 001516) is “0”. 3: The XOUT pin is excluded. Rev.1.01 Unit 7517 Group MULTI-MASTER I2C-BUS BUS LINE CHARACTERISTICS Table 33 Multi-master I2C-BUS bus line characteristics Symbol Standard clock mode High-speed clock mode Test conditions Max. Max. Min. Min. 1.3 4.7 Parameter tBUF Bus free time tHD;STA Hold time for START condition 4.0 tLOW Hold time for SCL clock = “0” 4.7 tR Rising time of both SCL and SDA signals tHD;DAT Data hold time tHIGH Hold time for SCL clock = “1” tF Falling time of both SCL and SDA signals tSU;DAT Data setup time tSU;STA Setup time for repeated START condition tSU;STO Setup time for STOP condition µs µs 0.6 µs 1.3 20+0.1Cb (Note) 300 ns 0 0 0.9 µs 4.0 0.6 1000 Fig. 86 Unit 300 20+0.1Cb (Note) µs ns 300 250 100 ns 4.7 0.6 µs 4.0 0.6 µs Note: Cb = total capacitance of 1 bus line SDA tHD:STA tBUF tLOW SCL P tR tF P Sr S tHD:STA tsu:STO tHD:DTA tHIGH tsu:DAT tsu:STA S: START condition Sr: RESTART condition P: STOP condition Fig. 86 Timing diagram of multi-master I2C-BUS Measurement output pin 100pF CMOS output Fig. 87 Circuit for measuring output switching characteristics Rev.1.01 Aug 02, 2004 page 94 of 96 7517 Group tC(CNTR) tWL(CNTR) tWH(CNTR) CNTR0 CNTR1 0.8VCC 0.2VCC tWH(INT) INT0 - INT3 tWL(INT) 0.8VCC 0.2VCC tW(RESET) RESET 0.8VCC 0.2VCC tC(XIN) tWL(XIN) tWH(XIN) 0.8VCC XIN 0.2VCC tC(SCLK1), tC(SCLK2) SCLK1 SCLK2 tf tWL(SCLK1), tWL(SCLK2) tWH(SCLK1), tWH(SCLK2) 0.8VCC 0.2VCC tsu(RXD-SCLK1), tsu(SIN2-SCLK2) RXD SIN2 tr th(SCLK1-RXD), th(SCLK2-SIN2) 0.8VCC 0.2VCC td(SCLK1-TXD), td(SCLK2-SOUT2 ) TXD SOUT2 Fig. 88 Timing diagram Rev.1.01 Aug 02, 2004 page 95 of 96 tv(SCLK1-TXD), tv(SCLK2-SOUT2 ) 7517 Group PACKAGE OUTLINE 48P6Q-A Plastic 48pin 7✕7mm body LQFP EIAJ Package Code LQFP48-P-77-0.50 Weight(g) – Lead Material Cu Alloy MD ME e JEDEC Code – b2 HD D 48 37 1 I2 Recommended Mount Pad 36 HE E Symbol 25 12 13 24 A F L1 A3 A2 e A A1 A2 b c D E e HD HE L L1 Lp y b Rev.1.01 x Detail F M Aug 02, 2004 L page 96 of 96 Lp c A1 A3 x y b2 I2 MD ME Dimension in Millimeters Min Nom Max – – 1.7 0.1 0.2 0 1.4 – – 0.17 0.22 0.27 0.105 0.125 0.175 6.9 7.0 7.1 6.9 7.0 7.1 0.5 – – 8.8 9.0 9.2 8.8 9.0 9.2 0.35 0.5 0.65 1.0 – – 0.6 0.75 0.45 0.25 – – – – 0.08 0.1 – – 0° 8° – 0.225 – – 1.0 – – 7.4 – – – – 7.4 REVISION HISTORY Rev. Date Description Page 1.00 Apr. 28, 2004 7517 Group Data Sheet – Summary First edition issued 1.01 Aug. 02, 2004 All pages Words standardized: On-chip oscillator, A/D converter, Serial interface Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. 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