Data Sheet

UBA2080; UBA2080A; UBA2081
Half-bridge driver IC
Rev. 3 — 18 June 2012
Product data sheet
1. General description
The UBA2080(A) and UBA2081 are high voltage monolithic integrated circuits made using
the latch-up free Silicon-On-Insulator (SOI) process. The circuit is designed for driving
MOSFETs in a half-bridge configuration.
2. Features and benefits




Latch-up free and robust half bridge driver
Output driver capability: IO(sink) = 400 mA and IO(source) = 200 mA
Maximum frequency 800 kHz
UBA2080:
 Outputs in phase with HIN and LIN inputs
 Overlap protection
 UBA2081:
 Outputs in phase with CLK input
 Adjustable dead-time
 Low active shutdown input
3. Applications
 Driver (via external MOSFETs) for any kind of load in a half-bridge configuration
 UBA2080A:
 Selectable between UBA2080 and UBA2081 functionality
 Thermally enhanced package for high frequency operation.
4. Ordering information
Table 1.
Ordering information
Type number
UBA2080P
Package
Name
Description
Version
DIP8
plastic dual in-line package; 8 leads
SOT97-1
SO8
plastic small outline package; 8 leads
SOT96-1
SO14
plastic small outline package; 14 leads
SOT108-1
UBA2081P
UBA2080T
UBA2081T
UBA2080AT
UBA2080; UBA2080A; UBA2081
NXP Semiconductors
Half-bridge driver IC
5. Block diagram
FS
VDD
ULVO
ULVO
LOGIC
HIN
R1
R2 S
HS DRIVER
SH
LEVEL SHIFTER
LS DRIVER
LIN
OVERLAP
PROTECTION
GL
GND
SEL
Fig 1.
GH
aaa-001102
Block diagram (UBA2080 and UBA2080A with select = GND)
FS
VDD
ULVO
ULVO
LOGIC
CLK
R1
R2 S
HS DRIVER
SH
LEVEL SHIFTER
LS DRIVER
SD
GH
NON-OVERLAP
GL
GND
Vref
SEL
Fig 2.
aaa-001107
Block diagram (UBA2080A and UBA2081 with select = VDD)
Refer to Figure 7 and Figure 8 for detailed information on the required application
components.
UBA2080_UBA2081
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 18 June 2012
© NXP B.V. 2012. All rights reserved.
2 of 15
UBA2080; UBA2080A; UBA2081
NXP Semiconductors
Half-bridge driver IC
6. Pinning information
6.1 Pinning
GND
1
14 SEL
GND
2
13 GND
SD/LIN
3
12 VDD
11 GL
GL
GND
4
7
SH
CLK/HIN
5
3
6
GH
FS
6
9
GND
4
5
FS
GH
7
8
SH
1
GND
2
LIN
HIN
UBA2080
aaa-001121
Fig 3.
UBA2080A
8
VDD
10 GND
8
GL
7
SH
3
6
GH
4
5
FS
VDD
1
GND
2
SD
CLK
aaa-001126
aaa-001134
UBA2080: Pin
configuration DIP8 and
SO8 package
Fig 4.
UBA2080A: Pin
configuration SO14
package
UBA2081
Fig 5.
UBA2081: Pin
configuration DIP8 and
SO8 package
6.2 Pin description
Table 2.
Symbol
Pin description UBA2080/UBA2081 DIP8 and SO8
Pin
UBA2080
(DIP8/SO8)
Product data sheet
UBA2081
(DIP8/SO8)
VDD
1
IC supply
GND
2
IC ground and low-side driver return
LIN
3
-
low-side driver logic input
SD
-
3
low active analog shutdown input and non-overlap time
setting
HIN
4
-
high-side driver logic input
CLK
-
4
clock logic input
FS
5
floating supply voltage
GH
6
high-side MOSFET gate
SH
7
high-side MOSFET source
GL
8
low-side MOSFET gate
Table 3.
UBA2080_UBA2081
Description
Pin description UBA2080AT (SO14)
Symbol
Pin
Description
GND
1, 2, 4, 9, 10, 13
IC ground and low side driver return
SD/LIN
3
low-side driver logic input or low active shutdown and
non-overlap time setting
CLK/HIN
5
high-side driver logic input or clock logic input
FS
6
floating supply voltage
SH
8
high-side MOSFET source
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 18 June 2012
© NXP B.V. 2012. All rights reserved.
3 of 15
UBA2080; UBA2080A; UBA2081
NXP Semiconductors
Half-bridge driver IC
Table 3.
Pin description UBA2080AT (SO14) …continued
Symbol
Pin
Description
GH
7
high-side MOSFET gate
GL
11
low-side MOSFET gate
VDD
12
IC supply
SEL
14
select UBA2080 or UBA2081 functionality; only connect to
GND or VDD
7. Functional description
7.1 Start-up state
The IC enters the start-up state when the supply voltage on pin VDD increases. In the
start-up state, the high-side power transistor is non-conducting and the low-side power
transistor is switched on. The internal circuit is reset and the capacitor on the bootstrap pin
FS is charged. The start-up state is defined until the value of VDD = the VDD(start) value.
After which the IC switches to the oscillation state.
The circuit enters the start-up state again when the voltage on pin VDD < VDD(stop).
7.2 UBA2080 oscillation state
In the oscillation state, the output voltage of the GL and GH drivers depend on the logical
signals HIN and LIN (see Table 4).
To prevent cross conduction in the half-bridge MOSFETs, the combination HIN = LIN = 1
is not allowed. Both GL and GH are LOW under this condition.
Table 4.
7.3
UBA2080 Logic table
State
HIN
LIN
GH
GL
Start-up
-
-
LOW
HIGH
Oscillation
0
0
LOW
LOW
Oscillation
0
1
LOW
HIGH
Oscillation
1
0
HIGH
LOW
Oscillation
1
1
LOW
LOW
UBA2081 oscillation state
In the oscillation state, the output voltage of the GL and GH drivers depend on the logical
signals CLK and SD (see Table 5).
Table 5.
UBA2080_UBA2081
Product data sheet
UBA2081 Logic table
State
CLK
SD
GH
GL
Start-up
-
-
LOW
HIGH
Oscillation
0
0
LOW
HIGH
Oscillation
1
0
HIGH
LOW
Oscillation
0
1
LOW
LOW
Oscillation
1
1
LOW
LOW
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 18 June 2012
© NXP B.V. 2012. All rights reserved.
4 of 15
NXP Semiconductors
UBA2080; UBA2080A; UBA2081
Half-bridge driver IC
7.4 UBA2081 non-overlap time
The external resistor (RSD) on pin SD sets the non-overlap time of the UBA2081. The
relationship between this resistor value and actual dead-time is listed in Figure 6.
It is essential to add a 10 nF to 100 nF decoupling capacitor across RSD to ensure a noise
immune dead-time system.
aaa-001135
3000
tno
(ns)
2000
1000
0
Fig 6.
0
1
2
RSD (MΩ)
3
Non-overlap time versus SD resistor (RSD)
7.5 UBA2081 shutdown protection
When the voltage at pin SD is pulled below VIH, the internal sink drivers of the pins GL and
GH are immediately enabled to switch off the external power MOSFETs.
The shutdown comparator has a hysteresis of Vhys(SD) to avoid multiple switching.
Preferably, pin SD is pulled low via a collector of a transistor (see application schematic)
to avoid loading of this pin (Influences the non-overlap time settings) at normal operation.
7.6 UBA2080 overlap protection
The internal logic takes care that the GL driver and GH driver are both set to LOW in this
situation to avoid that HIN = LIN = 1 causes a cross current in the external half-bridge.
7.7 UBA2080A select function
Pin SEL enables the selection of either the UBA2080 or the UBA2081 functionality.
SEL = 0 gives the UBA2080 functionality. SEL = VDD gives the UBA2081 functionality.
UBA2080_UBA2081
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 18 June 2012
© NXP B.V. 2012. All rights reserved.
5 of 15
UBA2080; UBA2080A; UBA2081
NXP Semiconductors
Half-bridge driver IC
8. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDD
supply voltage
nominal
0
15.5
V
VFS
voltage on pin FS
VSH
voltage on pin SH
VSH
VSH + 15.5
V
source high-side MOSFET
−3
+600
V
t < 1 μs
−14
+600
V
Vi(HIN)
input voltage on pin HIN
logic input for high-side driver
0
15.5
V
Vi(LIN)
input voltage on pin LIN
logic input for low-side driver
0
15.5
V
Vi(SEL)
input voltage on pin SEL
0
15.5
V
VCLK
voltage on pin CLK
logic input for output drivers
0
15.5
V
Vi(SD)
input voltage on pin SD
logic input for output drivers and
analog input for non-overlap setting
0
15.5
V
SR
slew rate
on pin SH; repetitive
−6
+6
V/ns
Tj
junction temperature
−40
+150
°C
Tamb
ambient temperature
−40
+150
°C
Tstg
storage temperature
−55
+150
°C
VESD
electrostatic discharge
voltage
-
1
kV
-
2
kV
-
250
V
[1]
human body model:
pins FS, GH and SH
pins VDD, HIN, LIN, SD, CLK, SEL
[2]
machine model:
all pins
[1]
In accordance with the Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
[2]
In accordance with the Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 1.5 kΩ series resistor and a
0.75 μH inductor.
9. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
thermal resistance from junction to ambient
in free air
thermal resistance from junction to ambient
in free air
Typ
Unit
[1]
160
K/W
[1]
100
K/W
SO8
Rth(j-a)
SO14 and DIP8
Rth(j-a)
[1]
In accordance with IEC 60747-1.
UBA2080_UBA2081
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 18 June 2012
© NXP B.V. 2012. All rights reserved.
6 of 15
UBA2080; UBA2080A; UBA2081
NXP Semiconductors
Half-bridge driver IC
10. Characteristics
Table 8.
Characteristics
Tj = 25 °C; all voltages are measured with respect to SGND; VDD = 12.8 V; positive currents flow into the IC.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
FS = GH = SH = 600 V
-
-
10
μA
High-voltage supply
Ileak
leakage current
Start-up state
IVDD
current on pin VDD
420
520
620
μA
VDD(start)
start supply voltage
11
12
13
V
VDD(stop)
stop supply voltage
VDD(hys)
hysteresis of supply voltage
start-to-stop
8
8.5
9
V
3
3.5
4
V
Pin LIN input
VIH
HIGH-level input voltage
1.6
2.2
2.8
V
Vhys(LIN)
hysteresis voltage on pin LIN
-
400
-
mV
II(LIN)
input current on pin LIN
-
0
1
μA
VIH
HIGH-level input voltage
1.6
2.2
2.8
V
Vhys(HIN)
hysteresis voltage on pin HIN
-
400
-
mV
II(HIN)
input current on pin HIN
-
0
1
μA
VIH
HIGH-level input voltage
2.7
-
-
V
VIL
LOW-level input voltage
-
-
0.8
V
II(CLK)
input current on pin CLK
-
0
1
μA
1.6
2.2
2.8
V
Pin HIN input
Pin CLK input
Pin SD input
VIH
HIGH-level input voltage
to activate shutdown
Vhys(SD)
hysteresis voltage on pin SD
tno
non-overlap time
-
400
-
mV
RSD = 100 kΩ; typical minimum
-
140
-
ns
RSD = 3 MΩ; typical maximum
-
2.4
-
μs
-
0
1
μA
Pin SEL input
II(SEL)
input current on pin SEL
gate drivers
IO(source)
output source current
VFS = VVDD = 12 V; VSH = 0 V;
VGH = VGL = 8 V
-
200
-
mA
IO(sink)
output sink current
VFS = VVDD = 12 V; VSH = 0 V;
VGH = VGL = 4 V
-
400
-
mA
Vd(bs)
bootstrap diode voltage
Id(bs) = 20 mA
-
2.3
-
V
VUVLO
undervoltage lockout voltage
reset
3.6
4.2
4.8
V
IFS
current on pin FS
VFS = VVDD = 12 V; VSH = 0 V
27
32
37
μA
propagation delay
UBA2080; matching;
C(GL) = C(GH) = 0, propagation time
difference between GL and GH.
-
50
-
ns
Timing
tPD
UBA2080_UBA2081
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 18 June 2012
© NXP B.V. 2012. All rights reserved.
7 of 15
UBA2080; UBA2080A; UBA2081
NXP Semiconductors
Half-bridge driver IC
Table 8.
Characteristics …continued
Tj = 25 °C; all voltages are measured with respect to SGND; VDD = 12.8 V; positive currents flow into the IC.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tPD(LIN-GL)
propagation delay from LIN to
GL
UBA2080; C(GL) = 0 pF
-
240
-
ns
tPD(HIN-GH)
propagation delay from HIN to UBA2080; C(GH) = 0 pF
GH
-
180
-
ns
fmax
maximum frequency
800
-
-
kHz
11. Application information
HVIN
FS
from μC
HIN
GH
LIN
SH
UBA2080
VDD supply
CFS
to load
GL
VDD
CVDD
GND
aaa-001424
Fig 7.
Typical UBA2080 application
HVIN
FS
input clock
SD
GH
CLK
SH
UBA2081
tno
RSD
CFS
to load
GL
VDD
VDD supply
CVDD
GND
shutdown
aaa-001425
Remark: The capacitor connected to the SD pin ensures a noise immune dead-time.
Fig 8.
UBA2080_UBA2081
Product data sheet
Typical UBA2081 application
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 18 June 2012
© NXP B.V. 2012. All rights reserved.
8 of 15
UBA2080; UBA2080A; UBA2081
NXP Semiconductors
Half-bridge driver IC
12. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
inches
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Fig 9.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Package outline SOT96-1 (SO8)
UBA2080_UBA2081
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 18 June 2012
© NXP B.V. 2012. All rights reserved.
9 of 15
UBA2080; UBA2080A; UBA2081
NXP Semiconductors
Half-bridge driver IC
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
D
A2
A
A1
L
c
Z
w M
b1
e
(e 1)
b
MH
b2
5
8
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.02
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT97-1
050G01
MO-001
SC-504-8
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 10. Package outline SOT97-1 (DIP8)
UBA2080_UBA2081
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 18 June 2012
© NXP B.V. 2012. All rights reserved.
10 of 15
UBA2080; UBA2080A; UBA2081
NXP Semiconductors
Half-bridge driver IC
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.010 0.057
inches 0.069
0.004 0.049
0.05
0.244
0.039
0.041
0.228
0.016
0.028
0.024
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 11. Package outline SOT108-1 (SO14)
UBA2080_UBA2081
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 18 June 2012
© NXP B.V. 2012. All rights reserved.
11 of 15
UBA2080; UBA2080A; UBA2081
NXP Semiconductors
Half-bridge driver IC
13. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
UBA2080_UBA2081 v.3
20120618
Product data sheet
-
UBA2080_UBA2081 v.2
Modifications:
UBA2080_UBA2081 v.2
•
•
Data sheet status changed from Preliminary to Product.
Table 6 “Limiting values” has been updated.
Preliminary data sheet
-
UBA2080_UBA2081 v 1.1
UBA2080_UBA2081 v.1.1 20111206
Objective data sheet
-
UBA2080_UBA2081 v.1
UBA2080_UBA2081 v.1
Objective data sheet
-
UBA2080_UBA2081
Product data sheet
20120426
20111116
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 18 June 2012
© NXP B.V. 2012. All rights reserved.
12 of 15
UBA2080; UBA2080A; UBA2081
NXP Semiconductors
Half-bridge driver IC
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
UBA2080_UBA2081
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 18 June 2012
© NXP B.V. 2012. All rights reserved.
13 of 15
NXP Semiconductors
UBA2080; UBA2080A; UBA2081
Half-bridge driver IC
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
UBA2080_UBA2081
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 18 June 2012
© NXP B.V. 2012. All rights reserved.
14 of 15
NXP Semiconductors
UBA2080; UBA2080A; UBA2081
Half-bridge driver IC
16. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
8
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 4
UBA2080 oscillation state. . . . . . . . . . . . . . . . . 4
UBA2081 oscillation state . . . . . . . . . . . . . . . . 4
UBA2081 non-overlap time . . . . . . . . . . . . . . . 5
UBA2081 shutdown protection . . . . . . . . . . . . . 5
UBA2080 overlap protection. . . . . . . . . . . . . . . 5
UBA2080A select function . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal characteristics . . . . . . . . . . . . . . . . . . 6
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Application information. . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 18 June 2012
Document identifier: UBA2080_UBA2081