NCP571 D

NCP571, NCV571
150 mA CMOS Low Iq Low
Output Voltage Regulator
The NCP571 series of fixed output low dropout linear regulators are
designed for handheld communication equipment and portable battery
powered applications which require low quiescent current. The
NCP571 series features an ultra−low quiescent current of 4.0 mA.
Each device contains a voltage reference unit, an error amplifier, a
PMOS power transistor, resistors for setting output voltage, current
limit, and temperature limit protection circuits.
The NCP571 has been designed to be used with low cost ceramic
capacitors and requires a minimum output capacitor of 0.1 mF. The
device is housed in the TSOP−5 or DFN6 surface mount package.
Standard voltage versions are 0.8 V, 0.9 V, 1.0 V and 1.2 V.
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6
5
1
1
TSOP−5
SN SUFFIX
CASE 483
DFN6
MN SUFFIX
CASE 506BA
Features
•
•
•
•
•
•
•
Low Quiescent Current of 4.0 mA Typical
Maximum Operating Voltage of 12 V
Low Output Voltage Option down to 0.8 V
High Accuracy Output Voltage of 3.0%
Industrial Temperature Range of −40°C to +85°C
(NCV571, TA = −40°C to +125°C)
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb−Free Devices
MARKING DIAGRAMS
XXXAYWG
G
XXX
A
Y
W
M
G
Typical Applications
• Battery Powered Instruments
• Hand−Held Instruments
• Camcorders and Cameras
1
XX MG
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
Vin
Vout
1
5
Thermal
Shutdown
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
Driver w/
Current
Limit
+
Enable
ON
3
OFF
GND
2
Figure 1. Representative Block Diagram
© Semiconductor Components Industries, LLC, 2014
June, 2014 − Rev. 5
1
Publication Order Number:
NCP571/D
NCP571, NCV571
PIN CONNECTIONS
TSOP−5 package
Vin
1
GND
2
Enable
3
DFN6 package
Vout 1
5 Vout
6 Vin
NC 2
EP
4 Enable
GND 3
4 NC
5 NC
(Top View)
(Top View)
PIN FUNCTION DESCRIPTION
DFN6
TSOP−5
Pin Name
Description
1
5
Vout
Regulated output voltage.
2
4
NC
No Internal Connection. It is recommended to connect this pin to GND potential.
3
2
GND
4
3
Enable
5
−
NC
No Internal Connection. It is recommended to connect this pin to GND potential.
6
1
Vin
Positive power supply input voltage.
EP
−
EP
No Internal Connection. It is recommended to connect this pin to GND potential.
Power supply ground.
This input is used to place the device into low−power standby. When this input is
pulled low, the device is disabled. If this function is not used, Enable pin should be
connected to Vin.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage
Vin
0 to 12
V
Enable Voltage
VEN
−0.3 to Vin + 0.3
V
Output Voltage
Vout
−0.3 to Vin + 0.3
V
Power Dissipation
PD
Internally Limited
W
Operating Junction Temperature
TJ
+150
°C
TA
−40 to +85
−40 to +125
°C
Operating Ambient Temperature
NCP571
NCV571
Tstg
−55 to +150
°C
ESD Capability, Human Body Model (Note 1)
ESDHBM
2000
V
ESD Capability, Machine Mode (Note 1)
ESDMM
200
V
ESD Capability, Charged Device Model (Note 1)
ESDCDM
1000
V
Storage Temperature
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model (Jedec Standard)
2. Latchup capability (85°C) $100 mA DC with trigger voltage.
THERMAL CHARACTERISTICS
Rating
Junction−to−Ambient
PSIJ−Lead 2
Junction−to−Ambient
PSIJ−Lead 2
NOTE:
Symbol
Test Conditions
TSOP−5
RqJA
TSOP−5
YJ−L2
DFN6
RqJA
DFN6
YJ−L2
Typical Value
Unit
1 oz Copper Thickness, 100 mm2
250
°C/W
1 oz Copper Thickness, 100
mm2
68
°C/W
1 oz Copper Thickness, 100
mm2
190
°C/W
1 oz Copper Thickness, 100
mm2
84
°C/W
Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following
boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12.
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NCP571, NCV571
Vin
1
NC
2
C1
0.1 mF
Vout
Vout 5
Vin
GND
EN
4
3
C2
0.1 mF
GND
GND
Enable
Figure 2. Typical Application Schematic for TSOP−5 Package
ELECTRICAL CHARACTERISTICS
(Vin = Vout(nom) + 1.0 V, VEN = Vin, Cin = 1.0 mF, Cout = 1.0 mF, TA = 25°C, unless otherwise noted)
Symbol
Min
Output Voltage (TA = 25°C, Iout = 10 mA)
0.8 V
0.9 V
1.0 V
1.2 V
Vout
− 3%
0.776
0.873
0.970
1.164
Output Voltage (TA = −40°C to +85°C for NCP571 or TA = −40°C to
+125°C for NCV571, Iout = 10 mA) (Note 5)
0.8 V
0.9 V
1.0 V
1.2 V
Vout
Characteristic
Typ
Max
Unit
V
0.8
0.9
1.0
1.2
+ 3%
0.824
0.927
1.030
1.236
+ 4%
V
− 4%
0.768
0.864
0.960
1.152
0.8
0.9
1.0
1.2
0.832
0.936
1.040
1.248
Line Regulation (Vin = Vout + 1.0 V to 12 V, Iout = 10 mA)
Regline
−
10
30
mV
Load Regulation (Iout = 10 mA to 150 mA, Vin = Vout + 2.0 V)
Regload
−
40
65
mV
Output Current (Vout = (Vout at Iout = 100 mA) − 3%)
0.8 V (Vin = 3.0 V)
0.9 V (Vin = 3.0 V)
1.0 V (Vin = 3.0 V)
1.2 V (Vin = 3.0 V)
Io(nom)
150
150
150
150
−
−
−
−
−
−
−
−
−
−
−
−
730
650
550
350
850
750
650
450
−
−
0.1
4.0
1.0
8.0
−
100
−
1.3
−
−
−
−
0.3
160
160
160
160
260
260
260
260
600
600
600
600
Dropout Voltage (Iout = 10 mA, Measured at Vout − 3.0%)
0.8 V
0.9 V
1.0 V
1.2 V
mA
Vin−Vout
Quiescent Current
(Enable Input = 0 V)
(Enable Input = Vin = 3 V, Iout = 1.0 mA to 150 mA and
Vin = Enable Input = 3 V, Iout = 150 mA)
IQ
Output Voltage Temperature Coefficient
Tc
Enable Input Threshold Voltage
(Voltage Increasing, Output Turns On, Logic High)
(Voltage Decreasing, Output Turns Off, Logic Low)
mV
uA
Vth(en)
Output Short Circuit Current (Vout = 0 V) (Note 4)
0.8 V (Vin = 3.0 V)
0.9 V (Vin = 3.0 V)
1.0 V (Vin = 3.0 V)
1.2 V (Vin = 3.0 V)
V
Iout(max)
mA
3. Maximum package power dissipation limits must be observed.
PD +
T J(max) * T A
R qJA
4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
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ppm/°C
NCP571, NCV571
5. NCP571
NCV571
Tlow = −40°C Thigh = +85°C
Tlow = −40°C Thigh = +125°C.
3.2
Vin = 6 V
3.0
2.8
GROUND CURRENT (mA)
GROUND CURRENT (mA)
3.2
Vin = 3 V
2.6
2.4
3.0
2.8
Vin = 6 V
2.6
Vin = 3 V
2.4
TA = 25°C
Vout = 0.8 V
2.2
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
2.2
0.00
0.16
TA = 25°C
Vout = 1.2 V
0.02
OUTPUT CURRENT (A)
0.08
0.10
0.12
0.14
0.16
Figure 4. Ground Pin Current vs. Output
Current
3.5
3.5
GROUND CURRENT (mA)
GROUND CURRENT (mA)
0.06
OUTPUT CURRENT (A)
Figure 3. Ground Pin Current vs. Output
Current
Vin = 6 V
3.0
2.5
Vin = 3 V
2.0
Vout = 0.8 V
Iout = 30 mA
1.5
−40
−20
0
20
40
60
80
3.0
Vin = 6 V
2.5
Vin = 3 V
2.0
Vout = 1.2 V
Iout = 30 mA
1.5
−40
100
−20
AMBIENT TEMPERATURE (°C)
3
2.5
GROUND CURRENT (mA)
3
2.5
2
1.5
1
TA = 25°C
Vout = 0.8 V
Iout = 30 mA
0
0
2
4
6
8
20
40
60
80
100
Figure 6. Ground Pin Current vs. Temperature
3.5
0.5
0
AMBIENT TEMPERATURE (°C)
Figure 5. Ground Pin Current vs. Temperature
GROUND CURRENT (mA)
0.04
10
2
1.5
1
TA = 25°C
Vout = 1.2 V
Iout = 30 mA
0.5
0
0
12
2
INPUT VOLTAGE (V)
4
6
8
10
INPUT VOLTAGE (V)
Figure 7. Ground Pin Current vs. Input Voltage
Figure 8. Ground Pin Current vs. Input Voltage
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12
NCP571, NCV571
1.4
1.0
TA = 25°C
TA = 25°C
0.8
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
1.2
0.6
Iout = 70 mA
Iout = 10 mA
0.4
0.2
0.0
Iout = 150 mA
0
2
4
6
8
INPUT VOLTAGE (V)
1.0
Iout = 70 mA
0.8
Iout = 10 mA
0.6
0.4
Iout = 150 mA
0.2
10
0.0
12
0
Figure 9. Output Voltage vs. Input Voltage
2
4
6
8
INPUT VOLTAGE (V)
10
Figure 10. Output Voltage vs. Input Voltage
Figure 11. Line Transient Response
Figure 12. Line Transient Response
3 V to 4 V
Figure 13. Line Transient Response
Figure 14. Line Transient Response
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12
NCP571, NCV571
Figure 15. Load Transient Response
VENA
Figure 16. Load Transient Response
VENA
VENA: 1 V/div
Figure 17. Enable Operation
VENA: 1 V/div
Figure 18. Enable Operation
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NCP571, NCV571
APPLICATIONS INFORMATION
A typical application circuit for the NCP571 series is
shown in Figure 2.
without fear of instabilities. Larger values improve noise
rejection and load regulation transient response.
Input Decoupling (C1)
Enable Operation
A 0.1 mF capacitor either ceramic or tantalum is
recommended and should be connected close to the NCP571
package. Higher values and lower ESR will improve the
overall line transient response.
The enable pin will turn on or off the regulator. These
limits of threshold are covered in the electrical specification
section of this data sheet. If the enable is not used then the
pin should be connected to Vin. It is not recommended to
leave this pin on air. In case the voltage of Enable signal is
higher then Input voltage of NCP571 device it is necessary
add an resistor divider in order to keep voltage at Enable pin
bellow Input voltage. A single gate device of VHC family
could be used for this logic level translation. The NL17SZ06
device could be chosen for non inverting open−drain buffer
as shown in Figure 19. Other possibility is using NL17SZ16
device as shown in Figure 20. More information is
mentioned in Application Note AND8101/D.
Output Decoupling (C2)
The NCP571 is a stable Regulator and does not require
any specific Equivalent Series Resistance (ESR) or a
minimum output current. Capacitors exhibiting ESRs
ranging from a few mW up to 3.0 W can thus safely be used.
The minimum decoupling value is 0.1 mF and can be
augmented to fulfill stringent load transient requirements.
The regulator accepts ceramic chip capacitors as well as
tantalum devices. Larger output capacitors can be used
NCP571
Vout
Vin
Vin
Vout
NC
GND
C1
Enable
0.1 mF
C2
0.1 mF
GND
GND
3.3 V
3.3 V
0V
Enable
NL17SZ06
Figure 19.
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NCP571, NCV571
NCP571
Vin
2.7 V
Vout
Vin
Vout
NC
GND
C1
Enable
C2
0.1 mF
0.1 mF
GND
GND
2.7 V
3.3 V
0V
0V
Enable
NL17SZ16
Figure 20.
Hints
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation applications.
The maximum dissipation the package can handle is given
by:
Please be sure the Vin and GND lines are sufficiently wide.
When the impedance of these lines is high, there is a chance
to pick up noise or cause the regulator to malfunction.
Set external components, especially the output capacitor,
as close as possible to the circuit, and make leads as short as
possible.
PD +
T J(max) * T A
R qJA
If junction temperature is not allowed above the
maximum 125°C, then the NCP571 can dissipate up to
400 mW @ 25°C.
The power dissipated by the NCP571 can be calculated
from the following equation:
Thermal
As power across the NCP571 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature effect the rate of temperature rise for the part.
This is stating that when the NCP571 has good thermal
P tot + V in(max)ǒI GND ) I outǓ * V out * I out
If a 150 mA output current is needed then the ground
current from the data sheet is 4.0 mA.
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NCP571, NCV571
ORDERING INFORMATION
Nominal
Output Voltage
Marking
Package
Shipping†
NCP571SN08T1G
0.8
N6A
TSOP−5
(Pb−Free)
3000 / Tape & Reel
NCP571SN09T1G
0.9
N6E
TSOP−5
(Pb−Free)
3000 / Tape & Reel
NCP571SN10T1G
1.0
N6C
TSOP−5
(Pb−Free)
3000 / Tape & Reel
NCP571SN12T1G
1.2
N6D
TSOP−5
(Pb−Free)
3000 / Tape & Reel
NCV571SN08T1G*
0.8
N6F
TSOP−5
(Pb−Free)
3000 / Tape & Reel
NCV571SN09T1G*
0.9
N6G
TSOP−5
(Pb−Free)
3000 / Tape & Reel
NCV571SN10T1G*
1.0
N6H
TSOP−5
(Pb−Free)
3000 / Tape & Reel
NCV571SN12T1G*
1.2
N6J
TSOP−5
(Pb−Free)
3000 / Tape & Reel
NCP571MN08TBG
0.8
AC
DFN6
(Pb−Free)
3000 / Tape & Reel
NCP571MN09TBG
0.9
AD
DFN6
(Pb−Free)
3000 / Tape & Reel
NCP571MN10TBG
1.0
AE
DFN6
(Pb−Free)
3000 / Tape & Reel
NCP571MN12TBG
1.2
AA
DFN6
(Pb−Free)
3000 / Tape & Reel
NCV571MN08TBG*
0.8
AF
DFN6
(Pb−Free)
3000 / Tape & Reel
NCV571MN09TBG*
0.9
AG
DFN6
(Pb−Free)
3000 / Tape & Reel
NCV571MN10TBG*
1.0
AH
DFN6
(Pb−Free)
3000 / Tape & Reel
NCV571MN12TBG*
1.2
AJ
DFN6
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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NCP571, NCV571
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE K
NOTE 5
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
0.20 C A B
0.10 T
M
2X
0.20 T
B
5
1
4
2
S
3
K
B
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
END VIEW
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NCP571, NCV571
PACKAGE DIMENSIONS
DFN6, 2x2.2, 0.65P
CASE 506BA
ISSUE A
A
B
D
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L1
ÉÉÉ
ÉÉÉ
PIN ONE
REFERENCE
2X
0.10 C
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
TOP VIEW
ÉÉ
ÉÉ
EXPOSED Cu
2X
0.10 C
A
0.10 C
ÉÉ
ÇÇ
ÇÇ
A3
MOLD CMPD
A1
DETAIL B
DETAIL B
DIM
A
A1
b
D
D2
E
E2
e
K
L
L1
ALTERNATE
CONSTRUCTIONS
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20
0.30
2.00 BSC
1.10
1.30
2.20 BSC
0.70
0.90
0.65 BSC
0.20
−−−
0.25
0.35
0.00
0.10
7X
0.08 C
SOLDERING FOOTPRINT*
SIDE VIEW
A1
C
SEATING
PLANE
6X
L1
1.36
PACKAGE
OUTLINE
6X
0.58
D2
DETAIL A
6X
L
e
3
1
2.50
0.96
E2
1
K
6
4
6X
b
BOTTOM VIEW
6X
0.35
0.10 C A B
0.05 C
0.65
PITCH
DIMENSIONS: MILLIMETERS
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NCP571/D