Datasheet 4.5V to 25V Input 1ch Synchronous Buck DC/DC Controller BD95601MUV-LB General Description Key Specifications This is the product guarantees long time support in industrial market. BD95601MUV-LB is a high current buck regulator that produces low output voltage (0.75V to 2.0V) from a wide input voltage range (4.5V to 25V).High efficiency is realized using external N channel MOSFETs. 3 TM Using H Reg , Rohm’s advanced proprietary control method that uses constant on-time control to provide ultra-high transient responses to load changes. SLLM (Simple Light Load Mode) technology is added to improve efficiency with light loads giving high efficiency over a wide load range. Soft start functionality, short circuit protection with timer latch, over current protection and tracking are all included features. This switching regulator was designed for low voltage high current power supplies. VIN Input Voltage Range: VCC Input Voltage Range: VDD Input Voltage Range: Output Voltage Range: Standby Current: Operating Temperature Range: Package 4.5V to 25V 4.5V to 5.5V 4.5V to 5.5V 0.75V to 2.0V 0μA (Typ) -10°C to +85°C W(Typ) x D(Typ) x H(Max) 4.00mm x 4.00mm x 1.00mm VQFN020V4040 Features Long Time Support Product for Industrial Applications. Adjustable Light Load and Selectable Continuous Modes. Multifunctional Protection Circuits. -Thermal Shut down (TSD). -Under Voltage Lock Out (UVLO). -Over Current Protection (OCP). -Over Voltage Protection (OVP). -Short Circuit Protection (SCP). Adjustable Soft Start. Power Good Output. 200kHz to 500kHz Switching Frequency. VQFN020V4040 Applications FPGA, POL application. Mobile PC, Desktop PC, LCD-TV, Digital Components etc. Industrial Equipment. Typical Application Circuit +12V C6 R7 REG1_5V 17 16 OUT VIN BOOT EN_1MGT 1 SS 2 EN/SLLM HG 15 C12 18 C11 19 C1 C4 C10 20 PGOOD EN_1 R6 GND R8 PG_2 C5 PG_1 1V Q1 1VMGT SW 14 L1 U1 R1 EN_2 3 ILIM 4 VCC 5 FB R13 VDD 13 BD95371MUV BD95601MUV-LB 1.2V C8 1.35/1.5V C3 EN_1.8 C14 EN_1.35/1.5 C13 EN_1.2 1.8V VOUT FREQ FS IS- IS+ 7 8 9 10 2V Q2 PGND 11 C7 R5 R12 R10 JP1 R3 LG 12 6 R20 R18 R4 C2 R2 R11 GND PGND Figure 1. Application Circuit ○Product structure : Silicon monolithic integrated circuit www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays 1/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 PGND LG VDD HG Pin Configuration SW BD95601MUV-LB 15 14 13 12 11 BOOT 16 10 Is+ VIN 17 9 Is- OUT 18 8 FS 2 3 4 5 FB 1 VCC 6 VOUT ILIM GND 20 EN/SLLM 7 FREQ SS PGOOD 19 Figure 2. Pin Configuration Pin Description Pin No. Pin Name 1 SS 2 EN/SLLM 3 ILIM 4 VCC 5 FB 6 VOUT Output Voltage Monitor input. 7 FREQ 8 FS 9 Is- 10 Is+ 11 PGND 12 LG 13 VDD 14 SW 15 HG 16 BOOT 17 VIN 18 OUT 19 PGOOD 20 GND Current Sense Amplifier Output. Frequency input. A resistor sets the switching frequency. The frequency can be set from 200kHz to 500kHz. Input Current Sense Amplifier input. FREQ pin is output. Output Current Sense Amplifier input. If the voltage between this pin and VOUT pin reaches the specified voltage level (setting at ILIM pin), the switching is turned OFF. Ground pin for Low-side FET driver. This is the pin to drive the gate of the Low-side FET. This voltage swings between VDD and PGND. High-speed gate driving for the Low-side FET is achieved using an output MOS (3Ω when LG is high, 0.5Ω when LG is low.). This is the power supply pin to drive the Low-side FET. It is recommended that 10μF bypass capacitor be used to compensate for peak current during the FET on/off transition. This is the ground pin for High-side FET. The maximum absolute rating is 30V from ground. This is the pin to drive the gate of the High-side FET. The status of the switching swings between BOOT and SW. High-speed gate driving for High-side FET is achieved using an output MOS (3Ω when HG is high, 2Ω when HG is low). This is the power supply pin to drive the High-side FET. The maximum absolute ratings are 35V from ground and 7V from SW. The switching waveform sweeps from (VIN+VDD) to VDD by BOOT operation. 3 TM This is the pin for H Reg control. It determines necessary on-time by monitoring input voltage. It is recommended to connect 1kΩ / 0.1μF CR filter. This is the output pin of output voltage control amp. Please connect a resistor and capacitor to ground in series. It is recommended that a 0.01μF capacitor be established in normal operation. Power Good output. This pin outputs a high-level when the FB pin voltage is above 63% of the reference voltage. This is an open drain pin and therefore requires an external pull-up. Ground pin of control circuit. It is the same as FIN potential. FIN FIN www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Function Soft Start Time input. The rise time is set by a capacitor connected between SS and ground. At startup, a fixed current flows into the SS capacitor. Output voltage is controlled until the SS input reaches the reference voltage of 0.75V. Enable and Mode Selection Input. Voltage on this input selects the operating mode. Standby Mode: < 0.8V Continuous Mode: 2.3V – 3.8V Light Load Mode: 4.2V – 5.5V Coil Current Limit input. A 100KΩ resistor should be connected between this input and ground. IC Internal Circuits Power input. Output Voltage Sense input. A resistor divider to this input sets the output voltage. Backside thermal pad. Please connect to the Ground. 2/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Block Diagram VIN VDD 4 EN/SLLM VCC 17 1 BG + EN SCP REF×0.56 SS×0.56 FB VOUT 3 REF BOOT Soft Start Block + Q VOUT 14 Driver SLLM S VIN HG 15 OVP SW Circuit SLLM 18 FB 5 SS REF + + + FREQ 7 OVP + - 9 10 ls- Is+ Current Limit ILIM ls+ UVLO ILIM SCP TSD FS 8 + - VOUT PGND 16 SLLM R OUT GND GND VDD TM H Reg Controller Block EN/UVLO 20 SS REF×1.2 FB 2.5ms Delay BG SS TSD Thermal Protection UVLO + - Reference Block 2 VIN Is+ 6 REF ×0.63 FB 3 VDD 13 12 LG 11 PGND 19 + - PGOOD ILIM Figure 3. Block Diagram www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Rating Unit Condition Input Voltage 1 VCC 7 V Note 1, Note 2 Input Voltage 2 VDD 7 V Note 1, Note 2 Input Voltage 3 VIN 28 V Note 1, Note 2 BOOT Voltage BOOT 35 V Note 1, Note 2 BOOT-SW 7 V Note 1, Note 2 HG-SW 7 V Note 1, Note 2 BOOT-SW Voltage HG-SW Voltage LG Voltage LG VDD V VOUT/Is+/Is- VCC V EN Input Voltage EN 7 V Note 1 Power Dissipation 1 Pd1 0.34 W Note 3 Power Dissipation 2 Pd2 0.70 W Note 4 Power Dissipation 3 Pd3 2.20 W Note 5 Power Dissipation 4 Pd4 3.56 W Note 6 Operating Temperature Range Topr -10 to +85 °C Tstg -55 to +150 °C Tjmax +150 °C Output Voltage Storage Temperature Range Maximum Junction Temperature (Note 1) Not to exceed Pd. (Note 2) Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle. (Note 3) Derating in done 2.7 mW/°C for operating above Ta ≥ 25°C (when don’t mounted on a heat radiation board). (Note 4) Derating in done 5.6 mW/°C for operating above Ta ≥ 25°C (Mount on 1-layer 70.0mm x 70.0mm x 1.6mm board). Surface heat dissipation copper foil:10.29mm2. (Note 5) Derating in done 17.6 mW/°C for operating above Ta ≥ 25°C (Mount on 4-layer 70.0mm x 70.0mm x 1.6mm board Two sides heat dissipation copperfoil:10.29mm2. 2 or 3-layer : heat dissipation copper foil : 5505mm2). (Note 6) Derating in done 28.5 mW/°C for operating above Ta ≥ 25°C (Mount on 4-layer 70.0mm x 70.0mm x 1.6mm board) All layers heat dissipation copper foil:5505mm2. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta= 25°C) Parameter Symbol Min Typ Max Unit Input Voltage 1 VCC 4.5 - 5.5 V Input Voltage 2 VDD 4.5 - 5.5 V Input Voltage 3 VIN 4.5 - 25 V BOOT Voltage BOOT 4.5 - 30 V SW -0.7 - 25 V BOOT-SW 4.5 - 5.5 V EN 0 - 5.5 V IS+/IS- 0.7 - 2.7 V TONMIN - - 80 ns SW Voltage BOOT-SW Voltage EN Input Voltage Is Input Voltage MIN ON Time www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/22 Condition TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Electrical Characteristics (Unless otherwise specified VCC=5V VDD=5V EN=3V VIN=12V VOUT=1.05V RFS=36kΩ Ta=25°C) Parameter Symbol Min Typ Max Unit Conditions Whole Device VCC Bias Current VCC Stand-by Current VIN Bias Current VIN Stand-by Current ICC - 1500 1800 µA ICCSTB - 0 10 µA IIN - 30 80 µA EN= 0V IINSTB - 0 10 µA ENLOW GND - 0.8 V ENHIGH_CON 2.3 - 3.8 V ENHIGH_SLLM 4.5 - 5.5 V IEN - 15 25 µA EN= 3V VCC Threshold Voltage VCC_UVLO 3.7 4.0 4.2 V VCC:Sweep up VCC Hysteresis Voltage dVCC_ UVLO 100 160 220 mV EN Low Voltage EN High Voltage (Forced Continuous Mode) EN High Voltage (SLLM Mode) EN Bias Current EN= 0V Under Voltage Locked Out 3 H Reg TM VCC:Sweep down Control ON Time TON 194 219 244 ns MAX ON Time TONMAX - 3.5 - µs MIN OFF Time TOFFMIN - 490 700 ns HG High-side ON Resistance HGHON - 3.0 6.0 Ω HG Low-side ON Resistance HGLON - 2.0 4.0 Ω LG High-side ON Resistance LGHON - 3.0 6.0 Ω LG Low-side ON Resistance LGLON - 0.5 1.0 Ω SCP Start-up Voltage VSCP 0.345 0.420 0.495 V SCP Delay Time TSCP - 2.5 - ms VOVP 0.825 0.900 0.975 V ISS 1 2 3 µA VSS_STB - - 50 mV Setting Current IILIM - 10 - µA Current Limit Threshold Voltage VILIM 75 100 120 mV FET Driver SCP OVP FB Threshold Voltage Soft Start Charge Current Stand-by Voltage Current Limit RILIM= 100kΩ Output Voltage Sense Output Reference Voltage 1 REF1 0.743 0.750 0.757 V Is+ Input Voltage IS+ -1 0 1 µA LS+= 1.05V Is- Input Voltage IS- -1 0 1 µA LS-= 1.05V VPGOOD 0.38 0.47 0.56 V RONPGOOD - 50 150 Ω VF 0.4 0.5 0.6 V POWER GOOD FB Power Good Voltage Discharge ON Resistance Diode for BOOT VF Voltage www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/22 IF= 1mA TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Typical Performance Curves (Reference data) Figure 4. Efficiency (VIN= 7.5V) Figure 5. Efficiency (VIN= 12V) 0 VOUT (20mV/div) ⊿V=8.0mV IOUT (5.0A/div) 10µs/div Figure 6. Efficiency (VIN= 21V) www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 7. Transient Response Waveform (VIN= 5V) 6/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Typical Performance Curves (Reference data) - continued VCC (5V/div) VOUT (20mV/div) VOUT (500mV/div) ⊿V=7.6mV IOUT (5.0A/div) 400µs/div SW (5V/div) 10µs/div Figure 8. Transient Response Waveform (VIN= 5V) Figure 9. Power-up with VCC VIN (5V/div) VIN (5V/div) SW (5V/div) SW (5V/div) LG(5V/div) LG(5V/div) VOUT (200mV/div) VOUT (200mV/div) 20µs/div Figure 10. Line Regulation www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20µs/div Figure 11. Line Regulation 7/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Typical Performance Curves (Reference data) - continued EN (5V/div) SW (10V/div) VOUT (500mV/div) LG (5V/div) 400µs/div SCP delay time SW (5V/div) IOUT (5A/div) Figure 12. Power-up with EN Figure 13. OCP & SCP SW (5V/div) SW (5V/div) HG (5V/div) HG (5V/div) LG (5V/div) LG (5V/div) 1µs/div) 1µs/div) Figure 14. Switching Waveform (VIN= 5V, IOUT= 18A) www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 400µs/div Figure 15. Switching Waveform (VIN= 21V, IOUT= 18A) 8/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Description of Blocks 3 TM BD95601MUV-LB is a single channel synchronous buck regulator using H Reg , Rohm’s latest constant on-time controller technology. Fast load response is achieved by controlling the output voltage using a comparator without relying on the switching frequency. When VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the tON time interval. Thus, it serves to improve the regulator’s transient response. Activating the light load mode further increases efficiency by using VIN Simple Light Load Mode (SLLM) control. 3 H Reg TM Control Comparator for Output voltage control VOUT/VIN Circuit HG FB Driver Internal Reference Voltage REF VOUT SW LG Transient Circuit (Normal operation) When FB falls to a reference voltage (REF), 3 TM the drop is detected, activating the H Reg control system FB REF tON= HG VOUT x VIN 1 f [sec]・・・(1) HG output on-time is determined by the formula (1). When HG is off, LG is on until the output voltage becomes FB= REF. LG (VOUT drops due to a rapid load change) FB When VOUT drops due to a rapid load change, and the voltage remains below the output setting following the programmed tON time, the system quickly restores VOUT by extending the tON time, thus improving the transient response. Once VOUT is restored, the controller continues normal operation. REF Io tON+α HG LG www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Description of Blocks - continued (Light Load Control) FB In SLLM (EN/SLLM = 4.5V to 5.5V), SLLM function will operate when the LG pin is off and the coil current is lower than 0A (the current goes from VOUT to SW). When the FB input is lower than REF voltage again, HG will be enabled once again. REF HG LG 0A 3 TM *Attention: To affect the rapid transient response, the H Reg control monitors the current from the output capacitor to the load using the ESR of the output capacitor Do not use ceramic capacitors on COUT side of power supply. Ceramic bypass capacitors can be used near the individual loads if desired. www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/22 COUT LOAD TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Timing Chart The Soft start function is exercised when the EN/SLLM input is set to high. Current control takes effect at startup enabling a moderate output voltage “ramping.” Soft start timing and incoming current are calculated with the following: formulas (2) and (3) below. Soft-start function EN tSS SS Soft start time tSS= 0.75(Typ) x CSS 2µA(Typ) FB IIN [sec] ・・・(2) CSS (pF) Soft start time(ms) 12000 5 27000 10 51000 20 Inrush current IIN = CO x VOUT tSS x VOUT [A] ・・・(3) VIN (CSS: Soft start capacitor CO: Output capacitor) Timer Latch Type Short Circuit Protection REF x 0.7 Short circuit protection is enabled when FB falls to or below REF X 0.7. Once the programmed time period has elapsed, the output is latched off to prevent destruction of the circuit. Output voltage can be restored either by cycling the EN pin or disabling UVLO. Short circuit protection time is programmed at 2.5msec (Typ). FB tSCP SCP EN/UVLO Over Current Voltage Protection tON tON tMAX During normal operation, if FB is less than REF, HG is high during the time tON, but when the coil current exceeds the ILIMIT threshold, HG is set to off. The next pulse returns to normal operation if the output voltage drops after the maximum on-time or IL becomes lower than ILIMIT. HG LG ILIMIT IL www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Selection of Components Externally Connected 1. Inductor (L) Selection The inductor value is a major influence on the output ripple current. As formula (4) below indicates, the greater the inductor or the switching frequency, the lower the ripple current. ΔIL ΔIL= VIN (VIN - VOUT) x VOUT L x VIN x f [A]・・・(4) Generally, lower inductance values offer faster response times but also result in increased output ripple and lower efficiency. IL 0.47μH to 2.2μH are a recommended range of values. VOUT L The peak current rating of the coil is approximated by formula (5). Please select an inductor equal to or higher than this value. CO PGND (VIN-VOUT) x VOUT PGND ILPEAK= IOUTMAX + Output ripple current 2 x L x VIN x f [A]・・・(5) *Passing a current larger than inductor’s rated current will cause magnetic saturation in the inductor and decrease system efficiency. When selecting the inductor, be sure to allow enough margin to assure that peak currents do not exceed the inductor rated current value. *To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance. 2. Output Capacitor (Co) Selection VIN VOUT L The output capacitor should be determined by equivalent series resistance and equivalent series inductance so that the output ripple voltage is 30mV or more. The rating of the capacitor is set with sufficient margin given the output voltage. ESR Load ESL CEXT ΔVOUT= ESR x ΔIL+ESL×ΔIL / tON・・・(6) Co PGND ΔIL: Output ripple current ESR: Equivalent series resistance, ESL: Equivalent series inductance PGND Output capacitor Please give due consideration to the conditions in formula (7) below for the output capacitor, bearing in mind that the output start-up time must be established within the soft start timeframe. Capacitors used as bypass capacitors are connected to the load side affect the overall output capacitance ( CEXT, figure above). Please set the soft start time or over-current detection value, regarding these capacities. CO+ CEXT ≤ tSS x (Limit- IOUT) VOUT tSS: Soft start time Limit: Over current detection ・・・(7) If an inappropriate capacitor is used, OCP may be detected during activation and may cause startup malfunctions. 3. Input Capacitor (Cin) Selection VIN The input capacitor selected must have low enough ESR to fully support high output ripple so as to prevent extreme over current conditions. The formula for ripple current IRMS is given in (8) below. Cin VOUT L IRMS= IOUT x VOUT (VIN -VOUT) VIN [A]・・・(8) CO IOUT PGND Where VIN = 2 x VOUT, IRMS= PGND 2 Input capacitor A ceramic capacitor is recommended to reduce ESR loss and maximize efficiency. www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Selection of Components Externally Connected - continued 4. MOSFET selection The High-side and Low-side drivers are designed to activate N channel MOSFETs having low on-resistance. The chosen MOSFET may result in the loss described below, please select a proper FET for each considering the input-output and load current. VIN High-side MOSFET < Loss of High-side MOSFET > VOUT L PHigh-side= PRON+PTRAN Co VOUT = PGND 2 x RON x IOUT + VIN (Tr+Tf) x VIN x IOUT x f 6 ・・・(9) PGND Low-side MOSFET (Ron: On-resistance of FET, f: Switching frequency, Tr: Rise time, Tf: Fall time) < Loss of High-side MOSFET > PLow-side= PRON = VIN -VOUT VIN x RON x IOUT 2 ・・・(10) The High-side MOSFET generates loss when switching, along with the loss due to on-resistance. Good efficiency is achieved by selecting a MOSFET with low on-resistance and low Qg (gate total charge amount). Recommended MOSFETs for various current values are as follows: Output current High-side MOSFET Low-side MOSFET to 5A RQ3E080GN RQ3E080GN 5 to 8A RQ3E120GN RQ3E150GN 8 to 10A RQ3E150GN RQ3E180GN 5. Set Point Output Voltage This IC operates such that output voltage is REF ≌ FB. <Output Voltage> VOUT = (R1+R2) R2 x REF(0.7V) Setting resistance are selected from 10kΩ to 50kΩ, because of external Noise resistant and feedback current. Please refer to constant the following for typical output voltage. Output voltage 1.0V R1 R2 10kΩ 30kΩ 1.2V 18kΩ+1.8kΩ 33kΩ 1.35V 24kΩ 30kΩ 1.5V 24kΩ 12kΩ(30kΩ//20kΩ) 1.8V 39kΩ+3kΩ 30kΩ 2.0V 36kΩ+0.68kΩ 22kΩ www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Selection of Components Externally Connected - continued 6. Selecting resistance for over current setting (A) High-precision current detection circuit (use a low value resistor) VIN HG L R VOUT ILMIT= 0.1 [A]・・・(11) R IL Co LG (R: Detection resistor) PGND PGND Please make sure that 100kΩ is used for RILIM. IS+ VOUT Current limit ILIM RILIM 100kΩ GND (B) Low loss current detection circuit (Use DCR of L) VIN IL HG L ILMIT=0.1 x RL VOUT rxC However, RL = r LG Co C PGND PGND IS+ [A]・・・(12) L L rxC (RL: DCR value of inductor) Must be adjusted so that the power dissipation into the r. About 47kΩ to 330kΩ. Please make sure that 100kΩ is used for RILIM. VOUT Current limit ILIM RILIM 100kΩ GND IL detect point As shown in the diagram to the left, if the voltage between Is+ and VOUT exceed the ILMIT, the High-side FET gate is set low. Because the peak value of inductor current is detected and corresponds to the saturation time of inductor, the reliability of the system is improved. ILIMIT 0 t www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Application Example +12V C6 R7 REG1_5V 17 16 OUT VIN BOOT C1 EN_1MGT 1 SS 2 EN/SLLM HG 15 C12 18 C11 19 C4 C10 20 PGOOD EN_1 R6 GND R8 PG_2 C5 PG_1 1V Q1 1VMGT SW 14 L1 U1 R1 3 EN_2 ILIM R13 C8 VDD 13 BD95371MUV BD95601MUV-LB 1.35/1.5V C3 EN_1.8 1.2V C14 EN_1.35/1.5 C13 EN_1.2 1.8V IS- IS+ FB FS 5 LG 12 FREQ VCC VOUT JP1 6 7 8 9 10 2V Q2 PGND 11 C7 R5 R12 R10 R3 4 R20 R18 R4 C2 R2 R11 GND PGND Figure 16. BD95601MUV-LB Basic Application Circuit Bills of Materials Reference Designator Manufacturer Configuration (mm) GRM155R71E223KA61 MURATA 1005 GRM188R61A105KA61 MURATA 1608 25V, X5R, ±10% GRM32DR61E106KA12 MURATA 3225 0.47µF 10V, X5R, ±10% GRM188R61A474KA61 MURATA 1608 Ceramic Capacitor 0.01µF 25V, X7R, ±10% GRM155R71E103KA01 MURATA 1005 C7 Ceramic Capacitor 10pF 50V, CH, ±5% GRM1552C1H100JA01 MURATA 1005 C8 Ceramic Capacitor 1000pF 50V, X5R, ±10% GRM155R61H102KA01 MURATA 1005 C10 Ceramic Capacitor 0.1µF 50V, X5R, ±10% GRM155R61E104KA87 MURATA 1005 C11, C12 Ceramic Capacitor 10µF 35V, X5R, ±10% GRM32ER6YA106KA12 MURATA 3225 L1 Inductor 0.56µH ±20%, 14.2A(L=-20%), DCR=3.2mΩmax FDU0650-H-R56M TOKO 7667 Q1 MOSFET - N-ch, Vdss 30V, Id 15A, Ron 4.7mΩ RQ3E150GN ROHM 3333 Q2 MOSFET - N-ch, Vdss 30V, Id 18A, Ron 3.3mΩ RQ3E180GN ROHM 3333 R1 Resistor 100kΩ 1/16W, 50V, 5% MCR01MZPJ104 ROHM 1005 R2 Resistor 10Ω 1/16W, 50V, 5% MCR01MZPJ100 ROHM 1005 R5 Resistor 36kΩ 1/16W, 50V, 5% MCR01MZPJ363 ROHM 1005 R6 Resistor 3.3Ω 1/16W, 50V, 5% MCR01MZPJ3R3 ROHM 1005 R7 Resistor 1kΩ 1/16W, 50V, 5% MCR01MZPJ102 ROHM 1005 R8 Resistor 2.7kΩ 1/16W, 50V, 5% MCR01MZPJ272 ROHM 1005 R10 Resistor 510Ω 1/16W, 50V, 5% MCR01MZPJ511 ROHM 1005 R11, R12 Resistor 100Ω 1/16W, 50V, 5% MCR01MZPJ101 ROHM 1005 R13 Resistor 100kΩ 1/16W, 50V, 5% MCR01MZPJ104 ROHM 1005 U1 IC - Buck DC/DC Controller BD95601MUV-LB ROHM VQFN020V4040 Type Value C1 Ceramic Capacitor 0.022µF 25V, X7R, ±10% C2 Ceramic Capacitor 1µF 10V, X5R, ±10% C3 Ceramic Capacitor 10µF C4 Ceramic Capacitor C5, C6 www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Manufacturer Part Number Description 15/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB VOUT=1.0V, IOUT=6A Reference Designator C13, C14 Manufacturer Part Number Type Value Description POSCAP 470µF 2.5V, ±20%, ESR 6mΩmax 2R5TPF470M6L Manufacturer Configuration (mm) SANYO 7343 JP1 Jumper n/a Not applicable - - - R3 Resistor 30kΩ 1/16W, 50V, 0.5% MCR01MZPD3002 ROHM 1005 R4 Resistor 10kΩ 1/16W, 50V, 0.5% MCR01MZPD1002 ROHM 1005 R18 Resistor 0Ω Jumper, 1A, 50mΩmax MCR01MZPJ000 ROHM 1005 R20 Resistor n/a Not applicable - - - Manufacturer Configuration (mm) SANYO 7343 - - VOUT=1.2V, IOUT=4A Reference Designator C13, C14 Manufacturer Part Number Type Value Description 2.5V, ±20%, ESR 6mΩmax 2R5TPF470M6L Not applicable - POSCAP 470µF JP1 Jumper n/a R3 Resistor 30kΩ 1/16W, 50V, 0.5% MCR01MZPD3002 ROHM 1005 R4 Resistor 18kΩ 1/16W, 50V, 0.5% MCR01MZPD1802 ROHM 1005 R18 Resistor 0Ω Jumper, 1A, 50mΩmax MCR01MZPJ000 ROHM 1005 R20 Resistor n/a Not applicable - - - Type Value Description Manufacturer Configuration (mm) 2.5V, ±20%, ESR 6mΩmax 2R5TPF470M6L SANYO 7343 Not applicable - - - VOUT=1.8V, IOUT=6A Reference Designator C13, C14 Manufacturer Part Number POSCAP 470µF JP1 Jumper n/a R3 Resistor 30kΩ 1/16W, 50V, 0.5% MCR01MZPD3002 ROHM 1005 R4 Resistor 39kΩ 1/16W, 50V, 0.5% MCR01MZPD3902 ROHM 1005 R18 Resistor 3kΩ 1/16W, 50V, 5% MCR01MZPJ302 ROHM 1005 R20 Resistor n/a Not applicable - - - Type Value Description Manufacturer Configuration (mm) 2.5V, ±20%, ESR 6mΩmax 2R5TPF470M6L SANYO 7343 0: 1.35V, 1: 1.5V - VOUT=1.35V, IOUT=4A Reference Designator C13, C14 POSCAP 470µF JP1 Jumper - R3 Resistor 30kΩ 1/16W, 50V, 0.5% R4 Resistor 24kΩ R18 Resistor 0Ω R20 Resistor 120kΩ Type Value Manufacturer Part Number - - MCR01MZPD3002 ROHM 1005 1/16W, 50V, 0.5% MCR01MZPD2402 ROHM 1005 Jumper, 1A, 50mΩmax MCR01MZPJ000 ROHM 1005 1/16W, 50V, 0.5% MCR01MZPD1203 ROHM 1005 Manufacturer Configuration (mm) SANYO 7343 VOUT=2.0V, IOUT=2A Reference Designator C13, C14 Manufacturer Part Number Description 6.3V, ±20%, ESR 18mΩmax 6TPE330MIL Not applicable - 18kΩ 1/16W, 50V, 0.5% 30kΩ POSCAP 330µF JP1 Jumper n/a R3 Resistor R4 Resistor R18 Resistor R20 Resistor - - MCR01MZPD1802 ROHM 1005 1/16W, 50V, 0.5% MCR01MZPD3002 ROHM 1005 0Ω Jumper, 1A, 50mΩmax MCR01MZPJ000 ROHM 1005 n/a Not applicable - - - www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Power Dissipation 4.0 PCB size: 74.2mm×74.2mm×1.6mmt Substrate(1): IC only 2 Substrate(2): 1-layer (copper foil density 0mm ) 2 Substrate(3): 4-layer (copper foil density 10.29 mm ) 2,3-layer (copper foil de density 5505mm2) 2 Substrate(4): 4-layer (copper foil density 5505 mm ) (4)3.56W Power Dissipation Pd (W) 3.5 3.0 Substrate(1):θja=367.6°C /W Substrate(2):θja=178.6°C /W Substrate(3):θja=56.6°C /W Substrate(4):θja=35.1°C /W 2.5 (3)2.20W 2.0 1.5 1.0 (2)0.70W 0.5 (1)0.34W 0.0 0 25 50 75 85 100 125 150 Ambient Temperature(℃) www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 17. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Ordering Information B D 9 5 6 0 1 Part Number M U Package MUV: VQFN V - L B H 2 Product class LB for Industrial applications Packaging and forming specification H2: Embossed tape and reel Marking Diagrams VQFN020V4040 (TOP VIEW) Part Number Marking 9 5 6 0 1 LOT Number 1PIN MARK www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Physical Dimension, Tape and Reel Information Package Name VQFN020V4040 <Tape and Reel information> Tape Quantity Direction of feed Embossed carrier tape 250pcs H2 The direction of the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand. Reel 1pin Direction of feed *Order quantity needs to be multiple of the minimum quantity. www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 BD95601MUV-LB Revision History Date Revision 6.Sep.2013 001 1.Apr.2014 002 Changes New Release Delete sentence “and log life cycle” in General Description and Futures. Change “Packaging and forming specification” from E2 to H2. www.rohm.co.jp © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/22 TSZ02201-0J1J0AZ00520-1-2 01.Apr.2014 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – SS © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – SS © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001