NCP59300 D

NCP59300, NCV59300 Series
3.0 A, Very Low-Dropout
(VLDO) Fast Transient
Response Regulator series
The NCP59300 series are high precision, very low dropout
(VLDO), low ground current positive voltage regulators that are
capable of providing an output current in excess of 3.0 A with a typical
dropout voltage lower than 300 mV at 3.0 A load current. The devices
are stable with ceramic output capacitors. This series consists of fixed
voltage versions.
The NCP59300 series can withstand up to 18 V max input voltage.
Internal protection features consist of output current limiting,
built−in thermal shutdown and reverse output current protection.
Logic level enable and error flag pins are available on the 5−pin
version.
The NCP59300 series fixed voltage devices are available in
D2PAK−5 package, with devices in D2PAK−3 package planned in the
future.
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D2PAK 5
CASE 936A
D2PAK
CASE 936
MARKING DIAGRAMS
D2PAK
TAB
Features
y
59301−xx
AWLYWWG
1
D2PAK3
TAB
Applications
Consumer and Industrial Equipment Point of Regulation
Servers and Networking Equipment
FPGA, DSP and Logic Power supplies
Switching Power Supply Post Regulation
Battery Chargers
Functional Replacement for Industry Standard MIC29300,
MIC39300, MIC37300 Fixed Voltage Devices
1
VIN






xx
y
A
WL
Y
WW
G
VOUT
y
59300−xx
AWLYWWG
GND

Output Current in Excess of 3.0 A
300 mV Typical Dropout Voltage at 3.0 A
Fixed Output Voltage Options
Low Ground Current
Fast Transient Response
Stable with Ceramic Output Capacitor
Logic Compatible Enable and Error Flag Pins
Current Limit, Reverse Current and Thermal Shutdown Protection
Operation up to 13.5 V Input Voltage
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb−Free Devices
EN
VIN
GND
VOUT
FLG










= Voltage Version
= P (NCP), V (NCV)
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
 Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 4
1
Publication Order Number:
NCP59300/D
NCP59300, NCV59300 Series
TYPICAL APPLICATIONS
VIN = 3.0 V
+
CIN
NCP59301
VIN
VOUT
EN
FLG
VOUT = 2.5 V
VIN = 3.0 V
+
100k
+
COUT
47 mF, Ceramic
GND
CIN
NCP59300
VIN
VOUT = 2.5 V
VOUT
+
COUT
47 mF, Ceramic
GND
Figure 2. Fixed 2.5 V Regulator in D2PAK−3 Package
Figure 1. Fixed 2.5 V Regulator with Error Flag
PIN FUNCTION DESCRIPTION
Pin Number
D2PAK−5
Pin Number
D2PAK−3
Pin Name
1
−
EN
Enable Input: CMOS and TTL logic compatible. Logic high = enable; Logic low =
shutdown.
2
1
VIN
Input voltage which supplies both the internal circuitry and the current to the output
load
3
2
GND
Ground
TAB
TAB
TAB
TAB is connected to ground.
4
3
VOUT
5
−
FLG
Pin Function
Linear Regulator Output.
Error Flag Open collector output.
Active−low indicates an output fault condition.
ABSOLUTE MAXIMUM RATINGS
Symbol
Rating
Value
Unit
VIN
Supply Voltage
0 to 18
V
VEN
Enable Input Voltage
0 to 18
V
VFLG
Error Flag Open Collector Output Maximum Voltage
0 to 18
V
VOUT – VIN
Reverse VOUT – VIN Voltage (EN = Shutdown or VIN = 0 V) (Note 1)
0 to 6.5
V
PD
Power Dissipation (Notes 2 and 3)
Internally Limited
TJ
Junction Temperature
–40 v TJ v +125
C
TS
Storage Temperature
–65 v TJ v +150
C
2000
200
V
ESD Rating (Notes 4 and 5)
Human Body Model
Machine Model
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: All voltages are referenced to GND pin unless otherwise noted.
1. The ENABLE pin input voltage must be  0.8 V or VIN must be connected to ground potential.
2. PD(max) = (TJ(max) – TA) / RqJA, where RqJA depends upon the printed circuit board layout.
3. This protection is not guaranteed outside the Recommended Operating Conditions.
4. Devices are ESD sensitive. Handling precautions recommended..
5. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model (HBM) tested per AEC*Q100*002 (EIA/JESD22*A114C)
ESD Machine Model (MM) tested per AEC*Q100*003 (EIA/JESD22*A115C)
This device contains latch*up protection and exceeds 100 mA per JEDEC Standard JESD78.
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2
NCP59300, NCV59300 Series
RECOMMENDED OPERATING CONDITIONS (Note 6)
Symbol
Rating
Value
Unit
2.24 to 13.5
V
Enable Input Voltage
0 to 13.5
V
VFLG
Error Flag Open Collector Voltage
0 to 13.5
V
TJ
Junction Temperature
–40 v TJ v +125
C
VIN
Supply Voltage
VEN
6. The device is not guaranteed to function outside it’s Recommended operating conditions.
ELECTRICAL CHARACTERISTICS
(TJ = 25C with VIN = VOUT nominal + 1 V; VEN = VIN; IL = 10 mA; bold values indicate –40C < TJ < +125C, unless noted.)
Parameter
Output Voltage Accuracy
Conditions
Min
IL = 10 mA
−1.5
10 mA < IOUT < 3 A , VOUT nominal + 1 v VIN v 13.5 V
−2.5
Typ
Max
Unit
+1.5
%
+2.5
%
Output Voltage Line Regulation
VIN = VOUT nominal + 1.0 V to 13.5 V; IL = 10 mA
0.02
0.5
%
Output Voltage Load Regulation
IL = 10 mA to 3 A
0.2
1
%
VIN – VOUT Dropout Voltage
(Note 7)
IL = 1.5 A
175
350
mV
IL = 3 A
300
500
mV
Ground Pin Current (Note 8)
IL = 3 A
60
90
120
mA
Ground Pin Current in Shutdown
VEN v 0.5 V
1.0
5
mA
Overload Protection Current Limit
VOUT = 0 V
3.5
5
A
Output Voltage Start−up Slope
VEN = VIN, IOUT = 10 mA, COUT = 47 mF (Note 9)
40
200
ms/V
ENABLE INPUT
Enable Input Signal Levels
Regulator enable
V
1.8
Regulator shutdown
Enable pin Input Current
VEN v 0.8 V (Regulator shutdown)
6.5 V > VEN w 1.8 V (Regulator enable)
1
15
0.8
V
2
4
mA
30
40
mA
1
2
mA
400
500
mV
FLAG OUTPUT
Iflg(leak)
Voh = 6 V
VFLG(LO)
VIN = 2.24 V, IFLG = 250 mA
VFLG
Low Threshold, % of VOUT
210
93
95
%
Hysteresis
2
%
High Threshold, % of VOUT
97
99.2
%
7. VDO = VIN – VOUT when VOUT decreases to 98% of its nominal output voltage with VIN = VOUT + 1 V. For output voltages below 1.74 V, dropout
voltage specification does not apply due to a minimum input operating voltage of 2.24 V.
8. IIN = IGND + IOUT.
9. Fixed Voltage Device Start−up Time = Output Voltage Start−up Slope x VOUT Nominal.
Package
Conditions / PCB Footprint
D2PAK–3, Junction−to−Case
Thermal Resistance
RqJC = 2.1C/W
D2PAK–5, Junction−to−Case
RqJC = 2.1C/W
mm2
D2PAK–3, Junction−to−Air
PCB with 100
2.0 oz Copper Heat Spreading Area
RqJA = 52C/W
D2PAK–5, Junction−to−Air
PCB with 100 mm2 2.0 oz Copper Heat Spreading Area
RqJA = 52C/W
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3
NCP59300, NCV59300 Series
TYPICAL CHARACTERISTICS
TJ = 25C if not otherwise noted
100
100
90
90
80
80
70
COUT = 100 mF
Ceramic
60
PSRR (dB)
PSRR (dB)
70
50
40
COUT = 47 mF
Ceramic
30
COUT = 100 mF
Ceramic
60
50
40
COUT = 47 mF
Ceramic
30
20
20
VIN = 3.5 V
10 VOUT = 2.5 V, IOUT = 3 A,
CIN = 0
0
10
100
1000
10k
FREQUENCY (Hz)
100k
VIN = 3.5 V
10 VOUT = 2.5 V, IOUT = 1 A,
CIN = 0
0
10
100
1000
10k
FREQUENCY (Hz)
1M
Figure 3. Power Supply Rejection Ratio
450
VOUTnom = 2.5 V
450
350
350
DROPOUT (mV)
DROPOUT (mV)
VOUTnom = 2.5 V
IOUT = 3 A
400
400
300
250
200
150
300
250
200
150
100
100
50
50
0
0.0
0.5
1.0
1.5
2.0
2.5
0
−50
3.0
−30
−10
10
30
50
70
90
110
OUTPUT CURRENT (A)
TEMPERATURE (C)
Figure 5. Dropout Voltage vs. Output Current
Figure 6. Dropout Voltage vs. Temperature
3.0
130
2.5
10 mA
2.0
GROUND CURRENT (mA)
2.5
OUTPUT VOLTAGE (V)
1M
Figure 4. Power Supply Rejection Ratio
500
10 mA
1A
3A
1.5
1.0
2A
0.5
0.0
100k
1
1.2
1.4
1.6 1.8 2
2.2 2.4 2.6
SUPPLY VOLTAGE (V)
2.8
2
1.5
1
0.5
0
3
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
SUPPLY VOLTAGE (V)
Figure 7. Dropout Characteristics (2.5 V)
Figure 8. Ground Current vs. Supply Voltage
(2.5 V)
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4
5
NCP59300, NCV59300 Series
TYPICAL CHARACTERISTICS
TJ = 25C if not otherwise noted
120
1.2
GROUND CURRENT (mA)
1.4
GROUND CURRENT (mA)
140
100
3A
80
60
40
2A
20
1A
0
0
1
2
3
SUPPLY VOLTAGE (V)
4
1
0.8
0.6
0.4
0.2
0
−50
5
35
80
GROUND CURRENT (mA)
GROUND CURRENT (mA)
90
30
25
20
15
10
VIN = 3.5 V
VOUT = 2.5 V, IOUT = 1.5 A
−30
−10
90
110
10
30
50
70
90
110
130
70
60
50
40
30
20
10
10
30
50
70
TEMPERATURE (C)
−10
Figure 10. Ground Current vs. Temperature
40
0
−50
−30
TEMPERATURE (C)
Figure 9. Ground Current vs. Supply Voltage
(2.5 V)
5
VIN = 3.5 V
VOUT = 2.5 V, IOUT = 10 mA
0
−50
130
Figure 11. Ground Current vs. Temperature
VIN = 3.5 V
VOUT = 2.5 V, IOUT = 3 A
−30
−10
10
30
50
70
TEMPERATURE (C)
90
110
130
Figure 12. Ground Current vs. Temperature
2.6
22
ENABLE CURRENT (mA)
OUTPUT VOLTAGE (V)
20
2.55
2.5
2.45
2.4
−50
VOUTNOM = 2.5 V
IOUT = 10 mA
−30
−10
10
18
VEN = 6.5 V
16
14
12
10
8
6
4
VEN = 1.8 V
2
30
50
70
90
110
0
−50
130
−30
−10
10
30
50
70
90
110
TEMPERATURE (C)
TEMPERATURE (C)
Figure 13. Output Voltage vs. Temperature
Figure 14. Enable Pin Input Current vs.
Temperature
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5
130
NCP59300, NCV59300 Series
FUNCTIONAL CHARACTERISTICS
Figure 15. Load Transient Response
Figure 16. Line Transient Response
Figure 17. Enable Transient Response
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6
NCP59300, NCV59300 Series
APPLICATIONS INFORMATION
Output Capacitor and Stability
Overcurrent and Reverse Output Current Protection
The NCP59300 series requires an output capacitor for
stable operation. The NCP59300 series is designed to
operate with ceramic output capacitors. The recommended
output capacitance value is 47 mF or greater. Such capacitors
help to improve transient response and noise reduction at
high frequency.
The NCP59300 regulator is fully protected from damage
due to output current overload conditions. When NCP59300
output is overloaded, Output Current limiting is provided.
This limiting is linear; output current during overload
conditions is constant. These features are advantageous for
powering FPGAs and other ICs having current consumption
higher than nominal during their startup.
Thermal shutdown disables the NCP59300 device when
the die temperature exceeds the maximum safe operating
temperature.
When NCP59300 is disabled and (VOUT – VIN) voltage
difference is less than 6.5 V in the application, the output
structure of these regulators is able to withstand output
voltage (backup battery as example) to be applied without
reverse current flow. Of course the additional current
flowing through the Feedback resistor divider inside the
NCP59300 Fixed voltage devices (30 mA typically at
nominal output voltage) needs to be included in the backup
battery discharging calculations.
Input Capacitor
An input capacitor of 1.0 mF or greater is recommended
when the device is more than 4 inches away from the bulk
supply capacitance, or when the supply is a battery. Small,
surface−mount chip capacitors can be used for the
bypassing. The capacitor should be place within 1 inch of
the device for optimal performance. Larger values will help
to improve ripple rejection by bypassing the input of the
regulator, further improving the integrity of the output
voltage.
Minimum Load Current
The NCP59300 regulator is specified between finite
loads. A 10 mA minimum load current is necessary for
proper operation.
Thermal Considerations
The power handling capability of the device is limited by
the maximum rated junction temperature (125C). The PD
total power dissipated by the device has two components,
Input to output voltage differential multiplied by Output
current and Input voltage multiplied by GND pin current.
Error Flag
Some NCP59300 series members feature an error flag
circuit that monitors the output voltage and signals an error
condition when the voltage is 5% below the nominal output
voltage. The error flag is an open−collector output that can
sink up to 5 mA typically during a VOUT fault condition.
The FLG output is overload protected when a short circuit
of the pullup load resistor occurs in the application. This is
guaranteed in the full range of FLG output voltage Max
ratings (see Max Ratings table). Please be aware operation in
this mode is not recommended, power dissipated in the device
can impact on output voltage precision and other device
characteristics.
P D + ǒV IN * V OUTǓ @ I OUT ) V IN @ I GND
(eq. 1)
The GND pin current value can be found in Electrical
Characteristics table and in Typical Characteristics graphs.
The Junction temperature TJ is
T J + T A ) P D @ R qJA
(eq. 2)
where TA is ambient temperature and RqJA is the Junction to
Ambient Thermal Resistance of the NCP/NCV59300
device mounted on the specific PCB.
To maximize efficiency of the application and minimize
thermal power dissipation of the device it is convenient to
use the Input to output voltage differential as low as possible.
The static typical dropout characteristics for various
output voltage and output current can be found in the Typical
Characteristics graphs.
Enable Input
Some NCP59300 series members also feature an enable
input for on/off control of the device. It’s shutdown state
draws “zero” current from input voltage supply (only
microamperes of leakage). The enable input is TTL/CMOS
compatible for simple logic interface, but can be connected
up to VIN.
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7
NCP59300, NCV59300 Series
ORDERING INFORMATION
Output
Current
Output
Voltage
Junction Temp. Range
Package
Shipping†
NCP59300DS18R4G
3.0 A
1.8 V
−40C to +125C
D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCP59300DS25R4G
3.0 A
2.5 V
−40C to +125C
D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCP59300DS28R4G
3.0 A
2.8 V
−40C to +125C
D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCP59300DS30R4G
3.0 A
3.0 V
−40C to +125C
D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCP59300DS33R4G
3.0 A
3.3 V
−40C to +125C
D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCP59300DS50R4G
3.0 A
5.0 V
−40C to +125C
D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCV59300DS18R4G*
3.0 A
1.8 V
−40C to +125C
D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCV59300DS25R4G*
3.0 A
2.5 V
−40C to +125C
D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCV59300DS28R4G*
3.0 A
2.8 V
−40C to +125C
D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCV59300DS30R4G*
3.0 A
3.0 V
−40C to +125C
D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCV59300DS33R4G*
3.0 A
3.3 V
−40C to +125C
D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCV59300DS50R4G*
3.0 A
5.0 V
−40C to +125C
D2PAK−3
(Pb−Free)
Under Development
Contact Sales Office
NCP59301DS18R4G
3.0 A
1.8 V
−40C to +125C
D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCP59301DS25R4G
3.0 A
2.5 V
−40C to +125C
D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCP59301DS28R4G
3.0 A
2.8 V
−40C to +125C
D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCP59301DS30R4G
3.0 A
3.0 V
−40C to +125C
D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCP59301DS33R4G
3.0 A
3.3 V
−40C to +125C
D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCP59301DS50R4G
3.0 A
5.0 V
−40C to +125C
D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCV59301DS18R4G*
3.0 A
1.8 V
−40C to +125C
D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCV59301DS25R4G*
3.0 A
2.5 V
−40C to +125C
D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCV59301DS28R4G*
3.0 A
2.8 V
−40C to +125C
D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCV59301DS30R4G*
3.0 A
3.0 V
−40C to +125C
D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCV59301DS33R4G*
3.0 A
3.3 V
−40C to +125C
D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCV59301DS50R4G*
3.0 A
5.0 V
−40C to +125C
D2PAK−5
(Pb−Free)
800 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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8
NCP59300, NCV59300 Series
PACKAGE DIMENSIONS
D2PAK
CASE 936−03
ISSUE D
T
C
A
K
S
B
J
2
ES
DETAIL C
DETAIL C
3
F
G
SIDE VIEW
2X
TOP VIEW
D
0.010 (0.254)
N
M
P
R
C
OPTIONAL
CHAMFER
V
H
1
U
ED
OPTIONAL
CHAMFER
T
TERMINAL 4
L
SIDE VIEW
BOTTOM VIEW
DUAL GAUGE
CONSTRUCTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCHES.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
6. SINGLE GAUGE DESIGN WILL BE SHIPPED
AFTER FPCN EXPIRATION IN OCTOBER 2011.
SINGLE GAUGE
CONSTRUCTION
T
M
T
SEATING
PLANE
BOTTOM VIEW
DETAIL C
OPTIONAL CONSTRUCTIONS
SOLDERING FOOTPRINT*
10.490
8.380
16.155
2X
3.504
2X
1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
DIM
A
B
C
D
ED
ES
F
G
H
J
K
L
M
N
P
R
S
U
V
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.018
0.026
0.051 REF
0.100 BSC
0.539
0.579
0.125 MAX
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
5 _ REF
0.116 REF
0.200 MIN
0.250 MIN
MILLIMETERS
MIN
MAX
9.804 10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
0.457
0.660
1.295 REF
2.540 BSC
13.691 14.707
3.175 MAX
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
5 _ REF
2.946 REF
5.080 MIN
6.350 MIN
NCP59300, NCV59300 Series
PACKAGE DIMENSIONS
D2PAK 5
CASE 936A−02
ISSUE C
−T−
OPTIONAL
CHAMFER
A
TERMINAL 6
E
U
S
K
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A
AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED 0.025
(0.635) MAXIMUM.
V
H
1 2 3 4 5
M
D
0.010 (0.254)
M
T
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.067 BSC
0.539
0.579
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
5 _ REF
0.116 REF
0.200 MIN
0.250 MIN
DIM
A
B
C
D
E
G
H
K
L
M
N
P
R
S
U
V
P
N
G
L
R
C
SOLDERING FOOTPRINT
8.38
0.33
MILLIMETERS
MIN
MAX
9.804
10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
1.702 BSC
13.691
14.707
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
5 _ REF
2.946 REF
5.080 MIN
6.350 MIN
1.702
0.067
10.66
0.42
16.02
0.63
3.05
0.12
SCALE 3:1
1.016
0.04
mm Ǔ
ǒinches
5−LEAD D2PAK
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