NCP57302 D

NCP57302, NCV57302
3.0 A, Very Low-Dropout
(VLDO) Fast Transient
Response Regulator
Features












Output Current in Excess of 3.0 A
Minimum Operating Input Voltage 1.8 V for Full 3 A Output Current
315 mV Typical Dropout Voltage at 3.0 A
Adjustable Output Voltage Range from 1.24 V to 13 V
Low Ground Current
Fast Transient Response
Stable with Ceramic Output Capacitor
Logic Compatible Enable Pin
Current Limit, Reverse Current and Thermal Shutdown Protection
Operation up to 13.5 V Input Voltage
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb−Free Devices
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MARKING
DIAGRAMS
TAB
1
5
D2PAK
CASE 936A
y
57302
AWLYWWG
1
EN
VIN
GND
VOUT
ADJ
The NCP57302 is a high precision, very low dropout (VLDO), low
minimum input voltage and low ground current positive voltage
regulator that is capable of providing an output current in excess of
3.0 A with a typical dropout voltage of 315 mV at 3.0 A load current
and input voltage from 1.8 V and up. The device is stable with ceramic
output capacitors. The device can withstand up to 18 V max input
voltage.
Internal protection features consist of output current limiting,
built−in thermal shutdown and reverse output current protection.
Logic level enable pin is available. The NCP57302 is an adjustable
voltage device and is available in D2PAK−5 package.
y
A
WL
Y
WW
G
= P (NCP), V (NCV)
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
Applications






Consumer and Industrial Equipment Point of Regulation
Servers and Networking Equipment
FPGA, DSP and Logic Power supplies
Switching Power Supply Post Regulation
Battery Chargers
Functional Replacement for Industry Standard MIC29300,
MIC39300, MIC37300 with Improved Minimum Input Voltage
Specification
 Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 2
1
Publication Order Number:
NCP57302/D
NCP57302, NCV57302
TYPICAL APPLICATIONS
NCP57302
VIN
+
CIN
1.3 V
VIN
VOUT
EN
ADJ
GND
R1
R2
+
COUT
47 mF, Ceramic
Figure 1. Adjustable Regulator
PIN FUNCTION DESCRIPTION
Pin Number
Pin Name
Pin Function
1
EN
Enable Input: CMOS and TTL logic compatible. Logic high = enable; Logic low = shutdown.
2
VIN
Input voltage which supplies both the internal circuitry and the current to the output load
3
GND
Ground
TAB
TAB
TAB is connected to ground.
4
VOUT
5
ADJ
Linear Regulator Output.
Adjustable Regulator Feedback Input. Connect to output voltage resistor divider central node.
ABSOLUTE MAXIMUM RATINGS
Symbol
Rating
Value
Unit
0 to 18
V
VIN
Supply Voltage
VEN
Enable Input Voltage
0 to 18
V
VOUT – VIN
Reverse VOUT – VIN Voltage (EN = Shutdown or VIN = 0 V) (Note 1)
0 to 6.5
V
PD
Power Dissipation (Notes 2 and 3)
Internally Limited
TJ
Junction Temperature
–40 v TJ v +125
C
TS
Storage Temperature
–65 v TJ v +150
C
2000
200
V
ESD Rating (Notes 4 and 5)
Human Body Model
Machine Model
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: All voltages are referenced to GND pin unless otherwise noted.
1. The ENABLE pin input voltage must be  0.8 V or VIN must be connected to ground potential.
2. PD(max) = (TJ(max) – TA) / RqJA, where RqJA depends upon the printed circuit board layout.
3. This protection is not guaranteed outside the Recommended Operating Conditions.
4. Devices are ESD sensitive. Handling precautions recommended..
5. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model (HBM) tested per AEC*Q100*002 (EIA/JESD22*A114C)
ESD Machine Model (MM) tested per AEC*Q100*003 (EIA/JESD22*A115C)
This device contains latch*up protection and exceeds 100 mA per JEDEC Standard JESD78.
RECOMMENDED OPERATING CONDITIONS (Note 6)
Symbol
Rating
Value
Unit
VIN
Supply Voltage
1.8 to 13.5
V
VEN
Enable Input Voltage
0 to 13.5
V
TJ
Junction Temperature
–40 v TJ v +125
C
6. The device is not guaranteed to function outside it’s Recommended operating conditions.
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NCP57302, NCV57302
ELECTRICAL CHARACTERISTICS
TJ = 25C with VIN = VOUT nominal + 0.6 V; VEN = VIN; IL = 10 mA; bold values indicate –40C < TJ < +125C, unless noted. (Note 7)
Parameter
Output Voltage Accuracy
Conditions
Min
Typ
Max
Unit
IL = 10 mA
−1.5
+1.5
%
10 mA < IOUT < 3 A , VOUT nominal + 0.6 V v VIN v 13.5 V
−2.5
+2.5
%
0.5
%
Output Voltage Line Regulation
VIN = VOUT nominal + 0.6 V to 13.5 V; IL = 10 mA
Output Voltage Load Regulation
IL = 10 mA to 3 A
0.2
1
%
VIN – VOUT Dropout Voltage
(Note 8)
IL = 1.0 A (Note 10)
182
295
mV
IL = 1.5 A
220
350
mV
IL = 2.0 A (Note 10)
250
410
mV
IL = 3.0 A
315
520
mV
Ground Pin Current (Note 9)
IL = 3.0 A
60
90
120
mA
Ground Pin Current in Shutdown
VEN v 0.5 V
1.0
5
mA
Overload Protection Current Limit
VOUT = 0 V
3.5
5
A
Start−up Time
VEN = VIN, VOUT nominal = 2.5 V, IOUT = 10 mA,
COUT = 47 mF
100
500
ms
1.240
1.259
1.271
V
100
200
350
nA
Reference Voltage
0.02
1.221
1.209
Adjust Pin Bias Current
ENABLE INPUT
Enable Input Signal Levels
Regulator enable
V
1.4
Regulator shutdown
Enable pin Input Current
VEN v 0.8 V (Regulator shutdown)
6.5 V > VEN w 1.4 V (Regulator enable)
15
0.8
V
2
4
mA
30
40
mA
7. VOUTnominal can be set by external resistor divider in the application. Tested for VOUTnominal = 1.240 V unless noted.
8. VDO = VIN – VOUT when VOUT decreases to 98% of its nominal output voltage with VIN = VOUT + 1 V. Tested for VOUTnominal = 2.5 V.
9. IIN = IGND + IOUT.
10. Guaranteed by design.
Package
Conditions / PCB Footprint
D2PAK–5, Junction−to−Case
D2PAK–5, Junction−to−Air
Thermal Resistance
RqJC = 2.1C/W
PCB with 100
mm2
2.0 oz Copper Heat Spreading Area
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RqJA = 52C/W
NCP57302, NCV57302
TYPICAL CHARACTERISTICS
TJ = 25C if not otherwise noted
100
100
90
90
80
80
70
COUT = 100 mF
Ceramic
60
PSRR (dB)
PSRR (dB)
70
50
40
COUT = 47 mF
Ceramic
30
VIN = 3.5 V
20 V
OUT = 2.5 V,
10 IOUT = 3 A,
CIN = 0
0
10
100
1000
10k
FREQUENCY (Hz)
COUT = 100 mF
Ceramic
60
50
40
100k
VIN = 3.5 V
20 V
OUT = 2.5 V,
10 IOUT = 1 A,
CIN = 0
0
10
100
1M
Figure 2. Power Supply Rejection Ratio
1M
350
+25C
300
250
−40C
200
3A
400
DROPOUT (mV)
DROPOUT (mV)
450
+125C
400
150
2A
350
300
1A
250
200
150
100
100
50
50
VOUTnom = 2.5 V
0
0.0
0.5
1.0
1.5
2.0
2.5
0
−50
3.0
VOUTnom = 2.5 V
−30
−10
10
30
50
70
90
110
OUTPUT CURRENT (A)
TEMPERATURE (C)
Figure 4. Dropout Voltage vs. Output Current
Figure 5. Dropout Voltage vs. Temperature
130
3.0
1.4
10 mA
2.5
1A
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
100k
500
450
3A
1.0
0.8
0.6
2A
0.4
0.2
0
1
1000
10k
FREQUENCY (Hz)
Figure 3. Power Supply Rejection Ratio
500
1.2
COUT = 47 mF
Ceramic
30
VOUTnom = 1.24 V
1.2
1.4
1.6
SUPPLY VOLTAGE (V)
1.8
2.0
3A
1.5
1.0
2A
0.5
0.0
2
10 mA
1A
VOUTnom = 2.5 V
1
Figure 6. Dropout Characteristics
1.2
1.4
1.6 1.8 2
2.2 2.4 2.6
SUPPLY VOLTAGE (V)
Figure 7. Dropout Characteristics
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2.8
3
NCP57302, NCV57302
TYPICAL CHARACTERISTICS
TJ = 25C if not otherwise noted
1.4
VIN = 1.8 V
VOUT = 1.24 V
50
1.2
GROUND CURRENT (mA)
GROUND CURRENT (mA)
60
40
30
20
10
0
0
0.5
1
1.5
2
OUTPUT CURRENT (A)
2.5
1
0.8
0.6
0.4
0.2
0
3
VOUTnom = 1.24 V
10 mA
0
Figure 8. Ground Current vs. Output Current
0.5
1
1.5 2
2.5 3
3.5
SUPPLY VOLTAGE (V)
GROUND CURRENT (mA)
GROUND CURRENT (mA)
100
80
60
3A
40
2A
20
1A
VOUTnom = 2.5 V
10 mA
2
1.5
1
0.5
0
0
0.5
1
1.5 2
2.5 3
3.5
SUPPLY VOLTAGE (V)
4
4.5
5
0
Figure 10. Ground Current vs. Supply Voltage
0.5
1
1.5 2
2.5 3
3.5
SUPPLY VOLTAGE (V)
4
4.5
5
Figure 11. Ground Current vs. Supply Voltage
1.4
140
VOUTnom = 2.5 V
1.2
GROUND CURRENT (mA)
120
GROUND CURRENT (mA)
5
2.5
VOUTnom = 1.24 V
100
3A
80
60
40
2A
20
1A
0
4.5
Figure 9. Ground Current vs. Supply Voltage
120
0
4
0
1
2
3
SUPPLY VOLTAGE (V)
4
1
0.8
0.6
0.4
0.2
0
−50
5
VIN = 3.5 V
VOUT = 2.5 V,
IOUT = 10 mA
−30
−10
10
30
50
70
TEMPERATURE (C)
Figure 12. Ground Current vs. Supply Voltage
90
110
Figure 13. Ground Current vs. Temperature
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130
NCP57302, NCV57302
TYPICAL CHARACTERISTICS
40
90
35
80
GROUND CURRENT (mA)
GROUND CURRENT (mA)
TJ = 25C if not otherwise noted
30
25
20
15
10
5
0
−50
VIN = 3.5 V
VOUT = 2.5 V,
IOUT = 1.5 A
−30
−10
70
60
50
40
30
20
10
10
30
50
70
TEMPERATURE (C)
90
110
0
−50
130
Figure 14. Ground Current vs. Temperature
VIN = 3.5 V
VOUT = 2.5 V,
IOUT = 3 A
−30
−10
10
30
50
70
TEMPERATURE (C)
90
110
130
Figure 15. Ground Current vs. Temperature
2.6
22
ENABLE CURRENT (mA)
OUTPUT VOLTAGE (V)
20
2.55
2.5
2.45
2.4
−50
VOUTNOM = 2.5 V
IOUT = 10 mA
−30
−10
10
18
VEN = 6.5 V
16
14
12
10
8
6
4
VEN = 1.4 V
2
30
50
70
90
110
0
−50
130
−30
−10
10
30
50
70
90
110
TEMPERATURE (C)
TEMPERATURE (C)
Figure 16. Output Voltage vs. Temperature
Figure 17. Enable Pin Input Current vs.
Temperature
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130
NCP57302, NCV57302
FUNCTIONAL CHARACTERISTICS
Figure 18. Load Transient Response
Figure 19. Line Transient Response
Figure 20. Enable Transient Response
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NCP57302, NCV57302
APPLICATIONS INFORMATION
Output Capacitor and Stability
The device maintains the voltage at the ADJ pin at 1.24 V
referenced to ground. The current in R2 is then equal to
1.24 V / R2, and the current in R1 is the current in R2 plus
the ADJ pin bias current. The ADJ pin bias current flows
from VOUT through R1 into the ADJ pin.
The NCP57302 device requires an output capacitor for
stable operation. The NCP57302 is designed to operate with
ceramic output capacitors. The recommended output
capacitance value is 47 mF or greater. Such capacitors help
to improve transient response and noise reduction at high
frequency.
NCP57302
VIN
VIN
VOUT
VOUT
+
Input Capacitor
An input capacitor of 1.0 mF or greater is recommended
when the device is more than 4 inches away from the bulk
supply capacitance, or when the supply is a battery. Small,
surface−mount chip capacitors can be used for the
bypassing. The capacitor should be place within 1 inch of
the device for optimal performance. Larger values will help
to improve ripple rejection by bypassing the input of the
regulator, further improving the integrity of the output
voltage.
CIN
+
R1
EN
COUT
47 mF,
Ceramic
ADJ
GND
R2
ǒ
Ǔ
R1
) I ADJ @ R1
R2
Figure 21. Adjustable Voltage Operation
V OUT + 1.24 V @ 1 )
For the R2 resistor value up to 15 kW the IADJ current
impact can be neglected and the R1 resistor value can be
calculated y:
Minimum Load Current
The NCP57302 regulator is specified between finite
loads. A 10 mA minimum load current is necessary for
proper operation.
R1 + R2
Enable Input
NCP57302 regulators also feature an enable input for
on/off control of the device. It’s shutdown state draws “zero”
current from input voltage supply (only microamperes of
leakage). The enable input is TTL/CMOS compatible for
simple logic interface, but can be connected up to VIN.
ǒ
V OUT
1.24
Ǔ
*1
(eq. 1)
Where VOUT is the desired nominal output voltage.
Thermal Considerations
The power handling capability of the device is limited by
the maximum rated junction temperature (125C). The PD
total power dissipated by the device has two components,
Input to output voltage differential multiplied by Output
current and Input voltage multiplied by GND pin current.
Overcurrent and Reverse Output Current Protection
The NCP57302 regulator is fully protected from damage
due to output current overload and output short conditions.
When NCP57302 output is overloaded, Output Current
limiting is provided. This limiting is linear; output current
during overload or output short conditions is constant. These
features are advantageous for powering FPGAs and other
ICs having current consumption higher than nominal during
their startup.
Thermal shutdown disables the NCP57302 device when
the die temperature exceeds the maximum safe operating
temperature.
When NCP57302 is disabled and (VOUT – VIN) voltage
difference is less than 6.5 V in the application, the output
structure of these regulators is able to withstand output
voltage (backup battery as example) to be applied without
reverse current flow.
P D + ǒV IN * V OUTǓ @ I OUT ) V IN @ I GND
(eq. 2)
The GND pin current value can be found in Electrical
Characteristics table and in Typical Characteristics graphs.
The Junction temperature TJ is
T J + T A ) P D @ R qJA
(eq. 3)
where TA is ambient temperature and RqJA is the Junction to
Ambient Thermal Resistance of the NCP/NCV57302
device mounted on the specific PCB.
To maximize efficiency of the application and minimize
thermal power dissipation of the device it is convenient to
use the Input to output voltage differential as low as possible.
The static typical dropout characteristics for various
output voltage and output current can be found in the Typical
Characteristics graphs.
Adjustable Voltage Design
The NCP/NCV57302 Adjustable voltage Device Output
voltage is set by the ratio of two external resistors as shown
in Figure 21.
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NCP57302, NCV57302
ORDERING INFORMATION
Output
Current
Output
Voltage
Junction Temp. Range
Package
Shipping†
NCP57302DSADJR4G
3.0 A
ADJ
−40C to +125C
D2PAK−5
(Pb−Free)
800 / Tape & Reel
NCV57302DSADJR4G*
3.0 A
ADJ
−40C to +125C
D2PAK−5
(Pb−Free)
800 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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NCP57302, NCV57302
PACKAGE DIMENSIONS
D2PAK 5
CASE 936A−02
ISSUE C
−T−
OPTIONAL
CHAMFER
A
TERMINAL 6
E
U
S
K
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A
AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED 0.025
(0.635) MAXIMUM.
V
H
1 2 3 4 5
M
D
0.010 (0.254)
M
T
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.067 BSC
0.539
0.579
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
5 _ REF
0.116 REF
0.200 MIN
0.250 MIN
DIM
A
B
C
D
E
G
H
K
L
M
N
P
R
S
U
V
P
N
G
L
R
C
SOLDERING FOOTPRINT
8.38
0.33
MILLIMETERS
MIN
MAX
9.804
10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
1.702 BSC
13.691
14.707
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
5 _ REF
2.946 REF
5.080 MIN
6.350 MIN
1.702
0.067
10.66
0.42
16.02
0.63
3.05
0.12
SCALE 3:1
1.016
0.04
mm Ǔ
ǒinches
5−LEAD D2PAK
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NCP57302/D