NCP58300 3.0A, Very Low-Dropout (VLDO) Fast Transient Response Regulator series http://onsemi.com MARKING DIAGRAMS TAB 5 D2PAK CASE 936A Features • Applications • • • • • • Consumer and Industrial Equipment Point of Regulation Servers and Networking Equipment FPGA, DSP and Logic Power supplies Switching Power Supply Post Regulation Battery Chargers Functional Replacement for Industry Standard MIC29300, MIC39300, MIC37300 © Semiconductor Components Industries, LLC, 2013 May, 2013 − Rev. 1 1 TAB 3 D2PAK3 CASE 936 y 58300−xx AWLYWWG 1 xx y z A WL Y WW G GND 1 VOUT Output Current in Excess of 3.0 A 370 mV Typical Dropout Voltage at 3.0 A Adjustable and Fixed Output Voltage Options Low Ground Current Fast Transient Response Stable with Tantalum Output Capacitor Logic Compatible Enable and Error Flag Pins Current Limit, Reverse Current and Thermal Shutdown Protection Operation up to 13.5 V Input Voltage Adjustable Device Output Voltage Range from 1.24 V to 12.9 V NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant 1 VIN • • • • • • • • • • • y 5830z−xx AWLYWWG 1 EN VIN GND VOUT FLG/ADJ The NCP58300 series are high precision, very low dropout (VLDO), low ground current positive voltage regulators that are capable of providing an output current in excess of 3.0 A with a typical dropout voltage lower than 370 mV at 3.0 A load current. The devices are stable with tantalum output capacitors. This series consists initially of an Adjustable output voltage version, with fixed voltage versions planned in the future. The NCP58300 series can withstand up to 18 V max input voltage. Internal protection features consist of output current limiting, built−in thermal shutdown and reverse output current protection. Logic level enable and error flag pins are available on the 5−pin version. The NCP58302 is an Adjustable voltage Device and is offered in D2PAK−5 package. = Voltage Version = P (NCP), V (NCV) = 1 (Fix Voltage), 2 (Adj) = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. Publication Order Number: NCP58300/D NCP58300 TYPICAL APPLICATIONS VIN = 3.0 V + CIN NCP58301 VIN VOUT EN FLG VOUT = 2.5 V 100k + + COUT 10 mF, Tantalum GND NCP58302 VIN CIN + ADJ R1 R2 + COUT 10 mF, Tantalum VOUT = 2.5 V VOUT CIN EN 1.3 V Figure 2. Adjustable Regulator NCP58300 VIN VOUT GND Figure 1. Fixed 2.5 Regulator with Error Flag VIN = 3.0 V VIN + COUT 10 mF, Tantalum GND Figure 3. Fixed 2.5 Regulator in D2PAK−3 Package PIN FUNCTION DESCRIPTION Pin Number D2PAK−5 Pin Number D2PAK−3 Pin Name 1 − EN Enable Input: CMOS and TTL logic compatible. Logic high = enable; Logic low = shutdown. 2 1 VIN Input voltage which supplies both the internal circuitry and the current to the output load 3 2 GND Ground TAB TAB TAB TAB is connected to ground. 4 3 VOUT 5 (Fixed) − FLG Error Flag Open collector output. Active−low indicates an output fault condition. 5 (Adj) − ADJ Adjustable Regulator Feedback Input. Connect to output voltage resistor divider central node. Pin Function Linear Regulator Output. http://onsemi.com 2 NCP58300 ABSOLUTE MAXIMUM RATINGS Value Unit VIN Symbol Supply Voltage Rating 0 to 18 V VEN Enable Input Voltage 0 to 18 V VFLG Error Flag open collector output Max. voltage 0 to 18 V VOUT – VIN Reverse VOUT – VIN Voltage (EN = Shutdown or VIN = 0 V) (Note 1) 0 to 6.5 V PD Power Dissipation (Notes 2 and 5) Internally Limited TJ Junction Temperature –40 v TJ v +125 °C TS Storage Temperature –65 v TJ v +150 °C 2000 200 V ESD Rating (Notes 3 and 4) Human Body Model Machine Model Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: All voltages are referenced to GND pin unless otherwise noted. 1. The ENABLE pin input voltage must be ≤ 0.8 V or VIN must be connected to ground potential. 2. PD(max) = (TJ(max) – TA) / RqJA, where RqJA depends upon the printed circuit board layout. 3. Devices are ESD sensitive. Handling precautions recommended.. 4. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model (HBM) tested per AEC*Q100*002 (EIA/JESD22*A114C) ESD Machine Model (MM) tested per AEC*Q100*003 (EIA/JESD22*A115C) This device contains latch*up protection and exceeds 100 mA per JEDEC Standard JESD78. 5. This protection is not guaranteed outside the Recommended Operating Conditions. RECOMMENDED OPERATING CONDITIONS (Note 6) Symbol Rating Value Unit 13.5 V VIN Maximum Supply Voltage VEN Enable Input Voltage 0 to 13.5 V VFLG Error Flag Open Collector Voltage 0 to 13.5 V TJ Junction Temperature –40 v TJ v +125 °C 6. The device is not guaranteed to function outside it’s Recommended operating conditions. http://onsemi.com 3 NCP58300 ELECTRICAL CHARACTERISTICS TJ = 25°C with VIN = VOUT nominal + 1 V; VEN = VIN; IL = 10 mA; bold values indicate –40°C < TJ < +125°C, unless noted. Conditions Parameter Output Voltage Accuracy Min Typ Max Unit IL = 10 mA −1 +1 % 10 mA < IOUT < 3.0 A , VOUT nominal + 1 v VIN v 13.5 V −2 +2 % 0.5 % Output Voltage Line Regulation VIN = VOUT nominal + 1.0 V to 13.5 V; IL = 10 mA 0.06 Output Voltage Load Regulation IL = 10 mA to 3.0 A , VIN = VOUT nominal + 5.0 V 0.2 1 % DVo / DT Output Voltage Temperature Coefficient (Note 9) 20 100 ppm/°C VIN – VOUT Dropout Voltage (Note 7) IL = 100 mA 80 175 mV IL = 1.5 A 250 IL = 3.0 A 370 600 mV IL = 1.5 A, VIN = VOUT nominal + 1.0 V 25 50 mA Ground Pin Current (Note 8) mV IL = 3.0 A 50 mA Ground Pin Current at Dropout VIN = VOUT − 0.5V , IL = 10 mA 1.7 mA Ground Pin Current in Shutdown VEN v 0.4 V 2.0 Overload Protection Current Limit VOUT = 0 V, VIN = VOUT nominal + 1.0 V 4.5 A Output Noise Voltage (10 Hz to 100 kHz), IL = 100 mA COUT = 10 mF COUT = 33 mF 400 260 mV (rms) Output Leakage Current Iflg(leak) Voh = 13.5 V 0.01 1 2 mA Output Low Voltage VFLG(LO) Device set for 5 V, VIN = 4.5 V, IFLG = 250 mA 220 300 400 mV Upper Threshold Voltage Device set for 5 V (Note 11) Upper Threshold Voltage Device set for 5 V (Note 11) 75 Hysteresis Device set for 5 V (Note 11) 15 10 30 mA FLAG OUTPUT 40 25 60 mV 95 140 mV mV ENABLE INPUT Enable Input Signal Levels Regulator enable V 2.4 Regulator shutdown Enable pin Input Current Regulator Output Current in Shutdown VEN + 0.8 V 0.8 V 2 4 mA VEN + 13.5 V 100 600 750 mA VEN ≤ 0.8 V and VIN ≤ 13.5 V, VOUT = 0 V 10 500 mA http://onsemi.com 4 NCP58300 ELECTRICAL CHARACTERISTICS TJ = 25°C with VIN = VOUT nominal + 1 V; VEN = VIN; IL = 10 mA; bold values indicate –40°C < TJ < +125°C, unless noted. Parameter Conditions Min Typ Max Unit 1.228 1.215 1.240 1.252 1.265 V REFERENCE NCP58302 ONLY Reference Voltage Adjust Pin Bias Current Reference Voltage Temperature Coefficient 50 (Note 10) Adjust Pin Bias Current Temperature Coefficient 120 nA 20 ppm/°C 0.1 nA/°C 7. VDO = VIN – VOUT when VOUT decreases to 99% of its nominal output voltage with VIN = VOUT + 1 V. 8. IIN = IGND + IOUT. 9. Output Voltage Temperature Coefficient is defined as worst case voltage change divided by the total temperature range. Guaranteed by design. 10. Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 4 W pulse for T = 10 ms. 11. Comparator thresholds are expressed in terms of a voltage differential at the Adjust terminal below the nominal reference voltage measured at 6V input. To express these thresholds in terms of output voltage change, multiply by the error amplifier gain = VOUT/VREF = (R1 + R2)/R2. For example, at a programmed output voltage of 5 V, the Error output is guaranteed to go low when the output drops by 95 mV x 5 V/1.240 V = 384 mV. Thresholds remain constant as a percent of VOUT as VOUT is varied, with the dropout warning occurring at typically 5% below nominal, 7.7% guaranteed. Package Conditions / PCB Footprint Thermal Resistance D2PAK–3, Junction−to−Case RqJC = 2.0°C/W D2PAK–5, Junction−to−Case RqJC = 2.0°C/W http://onsemi.com 5 NCP58300 TYPICAL CHARACTERISTICS 0.40 0.8 0.35 0.7 DROPOUT VOLTAGE (V) DROPOUT VOLTAGE (V) TJ = 25°C if not otherwise noted 0.30 0.25 0.20 0.15 0.10 IOUT = 3 A 0.6 0.5 0.4 0.3 0.2 0.1 0.05 0.00 0.0 0.5 1.0 1.5 2.0 2.5 0 −60 3.0 −30 0 Figure 4. Dropout Voltage vs. Output Current 4.0 IOUT = 10 mA 3.0 IOUT = 3 A 1.0 0.0 0 1 2 3 4 INPUT VOLTAGE (V) 5 150 30 20 VOUTnom = 1.24 V 10 0 6 0 1 2 OUTPUT CURRENT (A) 3 Figure 7. Ground Current vs. Output Current 125 4 VOUTnom = 3.3 V RLOAD = 100 W GROUND CURRENT (mA) GROUND CURRENT (mA) 120 40 Figure 6. Dropout Characteristics 3 2 1 0 90 50 VOUTnom = 3.3 V VENABLE = VIN 2.0 60 Figure 5. Dropout Voltage vs. Temperature GROUND CURRENT (mA) OUTPUT VOLTAGE (V) 5.0 30 TEMPERATURE (°C) OUTPUT CURRENT (A) 0 2 4 6 8 100 75 50 25 0 10 VOUTnom = 3.3 V IOUT = 3 A 0 SUPPLY VOLTAGE (V) 2 4 6 8 SUPPLY VOLTAGE (V) Figure 8. Ground Current vs. Supply Voltage Figure 9. Ground Current vs. Supply Voltage http://onsemi.com 6 10 NCP58300 TYPICAL CHARACTERISTICS TJ = 25°C if not otherwise noted 8.0 GROUND CURRENT (mA) GROUND CURRENT (mA) 2.0 1.5 IOUT = 10 mA 1.0 0.5 0 −60 −30 0 30 60 90 TEMPERATURE (°C) 120 6.0 4.0 2.0 0 −60 150 IOUT = 250 mA Figure 10. Ground Current vs. Temperature −30 0 30 60 90 TEMPERATURE (°C) 3.40 VOUTnom = 3.3 V OUTPUT VOLTAGE (V) 3.38 GROUND CURRENT (mA) 150 Figure 11. Ground Current vs. Temperature 80 60 40 120 IOUT = 3 A 20 3.36 3.34 3.32 DEVICE 1 3.30 3.28 3.26 DEVICE 2 DEVICE 3 3.24 3.22 0 −60 −30 0 30 60 90 TEMPERATURE (°C) 120 3.20 −60 150 30 60 90 120 150 Figure 13. Output Voltage vs. Temperature 8 2 VOUT = 0 V VIN = 6 V 7 GROUND CURRENT (mA) SHORT CIRCUIT CURRENT (A) 0 TEMPERATURE (°C) Figure 12. Ground Current vs. Temperature 6 5 4 3 2 1 0 −60 −30 −30 0 30 60 90 120 1.5 1 RLOAD = 100 W 0.5 0 −0.5 −30 150 −20 −10 0 10 20 TEMPERATURE (°C) INPUT VOLTAGE (V) Figure 14. Short Circuit Current vs. Temperature Figure 15. Ground Current vs. Input Voltage http://onsemi.com 7 30 NCP58300 TYPICAL CHARACTERISTICS TJ = 25°C if not otherwise noted 50 15 12 ADJUST PIN CURRENT (nA) ENABLE CURRENT (mA) 18 VEN = 5 V 9 6 3 0 −60 VEN = 2 V −30 0 30 60 90 120 40 IOUT = 10 mA 30 20 10 0 −60 150 −30 0 30 60 90 120 150 TEMPERATURE (°C) TEMPERATURE (°C) Figure 16. Enable Current vs. Temperature Figure 17. Adjust Pin Current vs. Temperature http://onsemi.com 8 NCP58300 APPLICATIONS INFORMATION Output Capacitor and Stability The NCP58300 series requires an output capacitor for stable operation. The NCP58300 series is designed to operate with tantalum output capacitors. The recommended output capacitance value is 10 mF or greater. Higher value helps to improve transient response and noise reduction. The value of output capacitor is dependent upon the output current; lower currents allow smaller capacitors. When NCP58300 is disabled and (VOUT – VIN) voltage difference is less than 6.5 V in the application, the output structure of these regulators is able to withstand output voltage (backup battery as example) to be applied without reverse current flow. Of course the additional current flowing through the internal Feedback resistor divider at the NCP58300 Fix voltage versions needs to be included in the backup battery discharging calculations. Input Capacitor Adjustable Voltage Design An input capacitor of 0.1 mF or greater is recommended when the device is more than 4 inches away from the bulk supply capacitance, or when the supply is a battery. Small, surface−mount chip capacitors can be used for the bypassing. The capacitor should be place within 1 inch of the device for optimal performance. Larger values will help to improve ripple rejection by bypassing the input of the regulator, further improving the integrity of the output voltage. The NCP/NCV58302 Adjustable voltage Device Output voltage is set by the ratio of two external resistors as shown in Figure 18.The device maintains the voltage at the ADJ pin at 1.24 V referenced to ground. The current in R2 is then equal to1.24 V / R2, and the current in R1 is the current in R2 plus the ADJ pin bias current. The ADJ pin bias current flows from VOUT through R1 into the ADJ pin. NCP58302 VIN VIN Minimum Load Current VOUT VOUT + The NCP58300 regulator is specified between finite loads. A 7 mA minimum load current is necessary for proper operation. CIN + R1 EN COUT 10 mF, Tantalum ADJ GND Error Flag R2 Some NCP58300 series members feature an error flag circuit that monitors the output voltage and signals an error condition when the voltage is 5% below the nominal output voltage. The error flag is an open−collector output that can sink up to 10 mA during a VOUT fault condition. The FLG output is overload protected when a short circuit of the pullup load resistor occurs in the application. This is guaranteed in the full range of FLG output voltage Max ratings (see Max Ratings table). ǒ Ǔ R1 ) I ADJ @ R1 R2 Figure 18. Adjustable Voltage Operation V OUT + 1.24 V @ 1 ) For the R2 resistor value up to 15 kW the IADJ current impact can be neglected and the R1 resistor value can be calculated y: Enable Input R1 + R2 Some NCP58300 series members also feature an enable input for on/off control of the device. It’s shutdown state draws “zero” current from input voltage supply (only microamperes of leakage). The enable input is TTL/CMOS compatible for simple logic interface, but can be connected up to VIN. ǒ V OUT 1.24 Ǔ *1 (eq. 1) Where VOUT is the desired nominal output voltage. Thermal Considerations The power handling capability of the device is limited by the maximum rated junction temperature (125°C). The PD total power dissipated by the device has two components, Input to output voltage differential multiplied by Output current and Input voltage multiplied by GND pin current. Overcurrent and Reverse Output Current Protection The NCP58300 regulator is fully protected from damage due to output current overload conditions. When NCP58300 output is overloaded, Output Current limiting is provided. This limiting is linear; output current during overload conditions is constant. The device is also capable to withstand power−on or enable start−up with output shorted to ground for the full Recommended Operating Conditions range. These features are advantageous for powering FPGAs and other ICs having current consumption higher than nominal during their startup. Thermal shutdown disables the NCP58300 device when the die temperature exceeds the maximum safe operating temperature. P D + ǒV IN * V OUTǓ @ I OUT ) V IN @ I GND (eq. 2) The GND pin current value can be found in Electrical Characteristics table and in Typical Characteristics graphs. The Junction temperature TJ is T J + T A ) P D @ R qJA (eq. 3) where TA is ambient temperature and RθJA is the Junction to Ambient Thermal Resistance of the NCP/NCV58300 device mounted on the specific PCB. http://onsemi.com 9 NCP58300 ORDERING INFORMATION Device NCP58302DSADJR4G Output Current 3.0 A Output Voltage ADJ Junction Temp. Range Package Shipping† −40°C to +125°C D2PAK−5 800 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 10 NCP58300 PACKAGE DIMENSIONS D2PAK 5 CASE 936A−02 ISSUE D TERMINAL 6 −T− OPTIONAL CHAMFER A U U1 E S K B V V1 H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 6. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. 1 2 3 4 5 M D 0.010 (0.254) G M P N T DIM A B C D E G H K L M N P R S U V U1 V1 L R C SOLDERING FOOTPRINT* 8.38 0.33 INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.067 BSC 0.539 0.579 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN 0.297 0.305 0.038 0.046 1.702 0.067 10.66 0.42 16.02 0.63 3.05 0.12 SCALE 3:1 1.016 0.04 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.702 BSC 13.691 14.707 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN 7.544 7.747 0.965 1.168 NCP58300 PACKAGE DIMENSIONS D2PAK CASE 936−03 ISSUE C −T− K OPTIONAL CHAMFER A TERMINAL 4 E U S B F V H 1 2 3 M J D 0.010 (0.254) M T L DIM A B C D E F G H J K L M N P R S U V P N G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. R SOLDERING FOOTPRINT* C 10.49 8.38 INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.051 REF 0.100 BSC 0.539 0.579 0.125 MAX 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 _ 5 REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.295 REF 2.540 BSC 13.691 14.707 3.175 MAX 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 _ 5 REF 2.946 REF 5.080 MIN 6.350 MIN 16.155 2X 3.504 2X 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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