MBRS4201T3 D

MBRS4201T3G,
NRVBS4201T3G
200V, 4A Schottky
Fast Soft-Recovery
Power Rectifier
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SMC Power Surface Mount Package
Features
 Lower Forward Voltage than any Ultrafast Rectifier:






VF < 0.61 V at 150C
Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns
Soft Recovery Characteristics: Softness Factor (tb/ta)  1
Highly Stable Over Temperature
AEC−Q101 Qualified and PPAP Capable
NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
These are Pb-Free Packages*
SCHOTTKY RECTIFIER
4 AMPS, 200 VOLTS
SMC
CASE 403
PLASTIC
Benefits




Significantly Reduced EMI
Eliminates the Need of Snubber Circuits
Low Switching and Heat Losses
Improved Thermal Management
MARKING DIAGRAM
AYWW
B421G
G
Applications
 Engine and Convenience Control Systems
 Motor Controls
 Battery Chargers and Switching Power Supplies
Mechanical Characteristics







Small Compact Surface Mount Package with J–Bend Leads
Rectangular Package for Automated Handling
Weight: 217 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Maximum for 10 Seconds
ESD Ratings:
 Machine Model = A
 Human Body Model = 1C
Polarity: Notch in Plastic Body Indicates Cathode Lead
B421
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Package
Shipping†
MBRS4201T3G
SMC
(Pb−Free)
2,500 /
Tape & Reel
NRVBS4201T3G
SMC
(Pb−Free)
2,500 /
Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 5
1
Publication Order Number:
MBRS4201T3/D
MBRS4201T3G, NRVBS4201T3G
MAXIMUM RATINGS
Symbol
Value
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Characteristic
VRRM
VRWM
VR
200
Average Rectified Forward Current
(Rated VR, TL = 70C)
IF(AV)
Nonrepetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
Operating Junction Temperature
TJ
4
100
−55 to +150
Unit
V
A
A
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead
Symbol
Value
Unit
RqJL
11
C/W
Symbol
Value
Unit
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage
(IF = 4 A, TJ = 25C)
(IF = 4 A, TJ = 150C)
VF
Maximum Instantaneous Reverse Current (Rated VR)
(Rated DC Voltage, TJ = 25C)
(Rated DC Voltage, TJ = 150C)
IR
Maximum Reverse Recovery Time
(IF = 1.0 A, di/dt = 100 A/ms, VR = 30 V)
trr
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2
0.86
0.61
V
1.0
5.0
mA
mA
35
ns
MBRS4201T3G, NRVBS4201T3G
100
IF, FORWARD CURRENT (A)
IF, FORWARD CURRENT (A)
100
10
150C
25C
100C
1
0.1
150C
1
25C
100C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
VF, INSTANTANEOUS VOLTAGE (V)
VF, INSTANTANEOUS VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.2
1.0E−01
IR, MAXIMUM REVERSE CURRENT (A)
1E−2
1.0E−02
150C
1E−3
1E−4
TC = 150C
1.0E−03
100C
1E−5
TC = 25C
1.0E−04
1E−6
1E−7
1.0E−05
25C
1E−8
0
20
40
60
80
1.0E−06
0
100 120 140 160 180200
20
40
60
80
VR, REVERSE VOLTAGE (V)
100
10
0
20
40
60
120 140 160 180 200
Figure 4. Maximum Reverse Current
1000
1
100
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
C, CAPACITANCE (pF)
1E−9
0.2
1.1 1.2
1E−1
IR, REVERSE CURRENT (A)
10
80
100 120 140 160 180 200
VR, REVERSE VOLTAGE (V)
Figure 5. Typical Capacitance
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3
6
5
DC
4
SQUAREWAVE
3
2
1
0
0
20
40
60
80
100
120
140
160
PFO, AVERAGE POWER DISSIPATION (W)
7
5.0
4.5
4.0
3.5
3.0
2.5
SQUAREWAVE
2.0
DC
1.5
1.0
0.5
0
0
1
2
3
4
5
TL, LEAD TEMPERATURE (C)
IO, AVERAGE FORWARD CURRENT
Figure 6. Derating Curve
Figure 7. Power Dissipation
2.5
2.0
1.5
I, CURRENT (A)
IF, AVERAGE FORWARD CURRENT (A)
MBRS4201T3G, NRVBS4201T3G
1.0
200 V Ultrafast
MBRS4201
0.5
ON Semiconductor MBRS4201
eliminates reverse recovery
oscillations present in Ultrafast
devices in the market, particularly at
hot temperatures.
*Test Conditions:
IF = 1 A, dI/dT = 100 A/ms,
VR = 30 V
0
−0.5
−1.0
−1.5
−2.0
−2.5
T, TIME (10 ns/div)
Figure 8. Reverse Recovery Time* (tRR) at 1255C
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4
6
MBRS4201T3G, NRVBS4201T3G
PACKAGE DIMENSIONS
SMC
CASE 403−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03.
HE
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
MIN
1.90
0.05
2.92
0.15
5.59
6.60
7.75
0.76
MILLIMETERS
NOM
MAX
2.13
2.41
0.10
0.15
3.00
3.07
0.23
0.30
5.84
6.10
6.86
7.11
7.94
8.13
1.02
1.27
0.51 REF
MIN
0.075
0.002
0.115
0.006
0.220
0.260
0.305
0.030
INCHES
NOM
0.084
0.004
0.118
0.009
0.230
0.270
0.313
0.040
0.020 REF
MAX
0.095
0.006
0.121
0.012
0.240
0.280
0.320
0.050
A
L
L1
c
A1
SOLDERING FOOTPRINT*
4.343
0.171
3.810
0.150
2.794
0.110
SCALE 4:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
MBRS4201T3/D