NSS12500UW3

NSS12500UW3T2G
12 V, 8.0 A, Low VCE(sat)
PNP Transistor
ON Semiconductor’s e2 PowerEdge family of low VCE(sat)
transistors are miniature surface mount devices featuring ultra low
saturation voltage (VCE(sat)) and high current gain capability. These
are designed for use in low voltage, high speed switching applications
where affordable efficient energy control is important.
Typical applications are DC−DC converters and power management
in portable and battery powered products such as cellular and cordless
phones, PDAs, computers, printers, digital cameras and MP3 players.
Other applications are low voltage motor controls in mass storage
products such as disc drives and tape drives. In the automotive
industry they can be used in air bag deployment and in the instrument
cluster. The high current gain allows e2PowerEdge devices to be
driven directly from PMU’s control outputs, and the Linear Gain
(Beta) makes them ideal components in analog amplifiers.
• This is a Pb−Free Device
http://onsemi.com
12 VOLTS
8.0 AMPS
PNP LOW VCE(sat) TRANSISTOR
EQUIVALENT RDS(on) 55 mW
COLLECTOR
3
1
BASE
2
EMITTER
MAXIMUM RATINGS (TA = 25°C)
Symbol
Max
Unit
Collector-Emitter Voltage
VCEO
−12
Vdc
Collector-Base Voltage
VCBO
−12
Vdc
Emitter-Base Voltage
VEBO
−7.0
Vdc
IC
−5.0
Adc
A
Rating
Collector Current − Continuous
Collector Current − Peak
ICM
−8.0
Electrostatic Discharge
ESD
HBM Class 3B
MM Class C
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation, TA = 25°C
Derate above 25°C
PD (Note 1)
875
7.0
mW
mW/°C
RqJA (Note 1)
143
°C/W
PD (Note 2)
1.5
11.8
W
mW/°C
Thermal Resistance,
Junction−to−Ambient
RqJA (Note 2)
85
°C/W
Thermal Resistance,
Junction−to−Lead #3
RqJL (Note 2)
23
°C/W
Total Device Dissipation
(Single Pulse < 10 sec)
PDsingle
(Notes 2 & 3)
3.0
W
TJ, Tstg
−55 to
+150
°C
Thermal Resistance,
Junction−to−Ambient
Total Device Dissipation, TA = 25°C
Derate above 25°C
Junction and Storage
Temperature Range
3
WDFN3
CASE 506AU
2
1
MARKING DIAGRAM
VE M
G
1
VE = Specific Device Code
M = Date Code
G
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping†
NSS12500UW3T2G
WDFN3
(Pb−Free)
3000/
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ 100 mm2, 1 oz copper traces.
2. FR−4 @ 500 mm2, 1 oz copper traces.
3. Thermal response.
© Semiconductor Components Industries, LLC, 2007
March, 2007 − Rev. 1
1
Publication Order Number:
NSS12500UW3/D
NSS12500UW3T2G
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typical
Max
−12
−
−
−12
−
−
−7.0
−
−
−
−
−0.1
−
−
−0.1
250
250
250
200
180
−
−
300
300
250
−
−
−
−
−
−
−
−
−
−
−
−0.008
−0.055
−0.080
−0.135
−0.190
−0.200
−0.012
−0.070
−0.100
−0.170
−0.240
−0.260
−
0.760
−0.900
−
0.800
−0.900
100
−
−
Unit
OFF CHARACTERISTICS
Collector −Emitter Breakdown Voltage
(IC = −10 mAdc, IB = 0)
V(BR)CEO
Collector −Base Breakdown Voltage
(IC = −0.1 mAdc, IE = 0)
V(BR)CBO
Emitter −Base Breakdown Voltage
(IE = −0.1 mAdc, IC = 0)
V(BR)EBO
Collector Cutoff Current
(VCB = 12 Vdc, IE = 0)
ICBO
Emitter Cutoff Current
(VEB = −7.0 Vdc)
IEBO
Vdc
Vdc
Vdc
mAdc
mAdc
ON CHARACTERISTICS
hFE
DC Current Gain (Note 4)
(IC = −10 mA, VCE = −2.0 V)
(IC = −500 mA, VCE = −2.0 V)
(IC = −1.0 A, VCE = −2.0 V)
(IC = −2.0 A, VCE = −2.0 V)
(IC = −3.0 A, VCE = −2.0 V)
Collector −Emitter Saturation Voltage (Note 4)
(IC = −0.1 A, IB = −0.010 A) (Note 5)
(IC = −1.0 A, IB = −0.100 A)
(IC = −1.0 A, IB = −0.010 A)
(IC = −2.0 A, IB = −0.020 A)
(IC = −3.0 A, IB = −0.030 A)
(IC = −4.0 A, IB = −0.400 A)
VCE(sat)
Base −Emitter Saturation Voltage (Note 4)
(IC = −1.0 A, IB = −0.01 A)
VBE(sat)
Base −Emitter Turn−on Voltage (Note 4)
(IC = −2.0 A, VCE = −3.0 V)
VBE(on)
Cutoff Frequency
(IC = −100 mA, VCE = −5.0 V, f = 100 MHz)
fT
V
V
V
MHz
Input Capacitance (VEB = −0.5 V, f = 1.0 MHz)
Cibo
−
650
pF
Output Capacitance (VCB = −3.0 V, f = 1.0 MHz)
Cobo
−
210
pF
Delay (VCC = −10 V, IC = 750 mA, IB1 = 15 mA)
td
−
−
100
ns
Rise (VCC = −10 V, IC = 750 mA, IB1 = 15 mA)
tr
−
−
150
ns
Storage (VCC = −10 V, IC = 750 mA, IB1 = 15 mA)
ts
−
−
325
ns
Fall (VCC = −10 V, IC = 750 mA, IB1 = 15 mA)
tf
−
−
200
ns
SWITCHING CHARACTERISTICS
4. Pulsed Condition: Pulse Width = 300 msec, Duty Cycle ≤ 2%.
5. Guaranteed by design but not tested.
http://onsemi.com
2
NSS12500UW3T2G
3.0
IC/IB = 10
VCE(sat), COLLECTOR EMITTER
SATURATION VOLTAGE (V)
VCE(sat), COLLECTOR EMITTER
SATURATION VOLTAGE (V)
0.5
0.4
0.3
VCE(sat) = 150°C
0.2
−55°C
0.1
0
25°C
0.001
0.01
0.1
1.0
VCE(sat) = −55°C
1.0
150°C
0.5
10
25°C
0.001
0.01
0.1
1.0
10
IC, COLLECTOR CURRENT (A)
Figure 1. Collector Emitter Saturation Voltage
vs. Collector Current
Figure 2. Collector Emitter Saturation Voltage
vs. Collector Current
1.4
VBE(sat), BASE EMITTER
SATURATION VOLTAGE (V)
150°C (5 V)
150°C (2 V)
500
400
25°C (5 V)
300
25°C (2 V)
−55°C (5 V)
200
−55°C (2 V)
100
0.001
0.01
0.1
1
1.0
−55°C
0.8
0.6
25°C
0.4
150°C
0.2
0.001
0.01
0.1
10
1.0
IC, COLLECTOR CURRENT (A)
IC, COLLECTOR CURRENT (A)
Figure 3. DC Current Gain vs.
Collector Current
Figure 4. Base Emitter Saturation Voltage vs.
Collector Current
1.2
VCE = −1.0 V
1.0
−55°C
0.8
25°C
0.6
150°C
0.4
0.2
0.001
1.2
0
10
VCE, COLLECTOR−EMITTER VOLTAGE (V)
hFE, DC CURRENT GAIN
VBE(on), BASE EMITTER TURN−ON VOLTAGE (V)
1.5
IC, COLLECTOR CURRENT (A)
600
0
2.0
0
700
0
IC/IB = 100
2.5
0.01
0.1
1.0
10
1.0
10 mA
100 mA 300 mA
IC = 500 mA
0.8
0.6
0.4
0.2
0
0.01
0.1
1.0
10
IC, COLLECTOR CURRENT (A)
IB, BASE CURRENT (mA)
Figure 5. Base Emitter Turn−On Voltage vs.
Collector Current
Figure 6. Saturation Region
http://onsemi.com
3
100
NSS12500UW3T2G
350
Cobo, OUTPUT CAPACITANCE (pF)
Cibo (pF)
600
550
500
450
400
350
300
250
200
0
1.0
2.0
4.0
3.0
5.0
Cobo (pF)
300
250
200
150
100
50
0
6.0
0
2.0
4.0
6.0
8.0
10
12
VEB, EMITTER BASE VOLTAGE (V)
VCB, COLLECTOR BASE VOLTAGE (V)
Figure 7. Input Capacitance
Figure 8. Output Capacitance
10
1.0 mS
1
10 mS
100 mS
IC (A)
Cibo, INPUT CAPACITANCE (pF)
650
1.0 S
Thermal
Limit
0.1
0.01
0.1
1
10
VCE (Vdc)
Figure 9. PNP Safe Operating Area
http://onsemi.com
4
100
14
NSS12500UW3T2G
PACKAGE DIMENSIONS
WDFN3
CASE 506AU−01
ISSUE O
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS
MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS
THE TERMINALS.
A
B
PIN ONE
REFERENCE
2X
0.10 C
2X
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
0.10 C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
E
MIN
0.70
0.00
0.25
1.40
0.90
0.35
MILLIMETERS
NOM
MAX
0.75
0.80
0.05
0.20 REF
0.30
0.35
2.00 BSC
1.50
1.60
2.00 BSC
1.00
1.10
1.30 BSC
0.35 REF
0.40
0.45
MIN
0.028
0.000
INCHES
NOM
0.030
0.008 REF
0.012
0.079 BSC
0.055
0.059
0.079 BSC
0.035
0.039
0.051 BSC
0.014 REF
0.014
0.016
0.010
MAX
0.031
0.002
0.014
0.063
0.043
0.018
TOP VIEW
SOLDERING FOOTPRINT*
A
0.10 C
1.300
2X
8X
0.08 C
SEATING
PLANE
(A3)
SIDE VIEW
A1
0.400
0.600
C
0.250
D2
e
2
1
2X
1.100
e/2
0.300
L
0.400
K
0.275
1.600
E2
3
3X
b
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NSS12500UW3/D