NLX2G32 Dual 2-Input OR Gate The NLX2G32 is a high performance dual 2−input OR Gate operating from a 1.65 V to 5.5 V supply. Features • • • • • • • • • • Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs LVTTL Compatible − Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7WZ32 Chip Complexity: FET = 120 These are Pb−Free Devices http://onsemi.com MARKING DIAGRAMS YM 1 ULLGA8 1.45 x 1.0 CASE 613AA 1 ULLGA8 1.6 x 1.0 CASE 613AB ATM G ULLGA8 1.95 x 1.0 CASE 613AC ATM G 1 A1 8 1 VCC B1 2 7 Y1 Y2 3 6 B2 GND 4 5 A2 A1 B1 w1 Y2 XM XM 1 XX M G = Specific Device Code = Date Code = Pb−Free Package ORDERING INFORMATION Function 1 A1 2 B1 3 Y2 4 GND A B Y 5 A2 L L L 6 B2 L H H 7 Y1 H L H 8 VCC H H H July, 2012 − Rev. 1 1 Figure 2. Logic Symbol Pin © Semiconductor Components Industries, LLC, 2012 UDFN8 1.6 x 1.0 CASE 517BY XM Y1 A2 B2 PIN ASSIGNMENT 1 UDFN8 1.95 x 1.0 CASE 517CA IEEE/IEC Figure 1. Pinout UDFN8 1.45 x 1.0 CASE 517BZ FUNCTION TABLE Input See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Output Y=A+B 1 Publication Order Number: NLX2G32/D NLX2G32 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage *0.5 to )7.0 V VI DC Input Voltage *0.5 to )7.0 V VO DC Output Voltage *0.5 to )7.0 V IIK DC Input Diode Current VI < GND *50 mA IOK DC Output Diode Current VO < GND *50 mA IO DC Output Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Ground Pin $100 mA TSTG Storage Temperature Range *65 to )150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 5) $500 mA (Note 1) 260 °C )150 °C 250 °C/W 250 mW Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Min Max Unit 1.65 1.5 5.5 5.5 V (Note 6) 0 5.5 V (HIGH or LOW State) 0 VCC V *40 )85 °C 0 0 0 0 20 20 10 5 ns/V Operating Data Retention Only VCC = 1.8 V $0.15 V VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V 6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level. http://onsemi.com 2 NLX2G32 DC ELECTRICAL CHARACTERISTICS VCC Symbol Parameter Condition (V) Min 0.75 VCC 0.7 VCC VIH HIGH Level Input Voltage 1.65 to 1.95 VIL LOW Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VOH HIGH Level Output Voltage VIN = VIH VOL Low−Level Output Voltage VIN = VIL TA = −405C to +855C TA = +255C Typ Max Min 0.75 VCC 0.7 VCC 0.3 VCC 1.65 2.3 3.0 4.5 1.55 2.2 2.9 4.4 1.65 2.3 3.0 4.5 1.55 2.2 2.9 4.4 IOH = −4 mA IOH = −8 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 2.3 3.0 3.0 4.5 1.29 1.9 2.4 2.3 3.8 1.52 2.15 2.8 2.68 4.2 1.20 1.9 2.4 2.3 3.8 IOL = 100 mA 1.65 2.3 3.0 4.5 0 0 0 0 0.1 0.1 0.1 0.1 IOH = 4 mA IOH = 8 mA IOH = 16 mA IOH = 24 mA IOH = 32 mA 1.65 2.3 3.0 3.0 4.5 0.08 0.1 0.15 0.22 0.22 0.24 0.3 0.4 0.55 0.55 Input Leakage Current VIN = VCC or GND IOFF Power OFF Leakage Current ICC Quiescent Supply Current Unit V 0.3 VCC IOH = −100 mA IIN Max V V V 0 to 5.5 $0.1 $1.0 VIN or VOUT = 5.5 V 0.0 1.0 10 VIN = VCC or GND 5.5 1.0 10 mA mA AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns VCC Symbol tPLH Parameter Propagation Delay (Figure 3 and 4) tPHL TA = 255C *405C v TA v 855C Condition (V) Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 1.8 $ 0.15 2.5 $ 0.2 2.0 1.0 8.0 3.5 9.5 5.8 2.0 1.0 10.5 6.2 ns RL = 1 MW, CL = 15 pF 3.3 $ 0.3 0.8 2.6 3.9 0.8 4.3 1.2 3.2 4.8 1.2 5.2 0.5 1.9 3.1 0.5 3.3 0.8 2.5 3.7 0.8 4.0 RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF 5.0 $ 0.5 RL = 500 W, CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (Note 7) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 9 pF 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 11 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NLX2G32 tf = 3 ns tf = 3 ns 90% INPUT A and B 50% VCC 90% 50% 10% 10% tPHL INPUT OUTPUT GND RL tPLH CL VOH OUTPUT Y 50% 50% A 1−MHz square input wave is recommended for propagation delay tests. VOL Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Package Type Tape and Reel Size† NLX2G32AMX1TCG ULLGA, 1.95x1 (Pb−Free) 178 mm, 3000 Units / Tape & Reel NLX2G32BMX1TCG ULLGA, 1.6x1 (Pb−Free) 178 mm, 3000 Units / Tape & Reel NLX2G32CMX1TCG ULLGA, 1.45x1 (Pb−Free) 178 mm, 3000 Units / Tape & Reel NLX2G32DMUTCG UDFN8, 1.95 x 1.0, 0.5P (Pb−Free) 3000 Units / Tape & Reel NLX2G32EMUTCG UDFN8, 1.6 x 1.0, 0.4P (Pb−Free) 3000 Units / Tape & Reel NLX2G32FMUTCG UDFN8, 1.45 x 1.0, 0.35P (Pb−Free) 3000 Units / Tape & Reel Device Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NLX2G32 PACKAGE DIMENSIONS UDFN8 1.6x1.0, 0.4P CASE 517BY ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40 L 8X 0.26 4 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.53 NOTE 3 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 1 PKG OUTLINE NLX2G32 PACKAGE DIMENSIONS UDFN8 1.45x1.0, 0.35P CASE 517BZ ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉ ÉÉ E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X 0.48 e/2 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 L 8X 0.22 4 L1 1.18 8 5 BOTTOM VIEW 8X 0.53 b 0.10 M C A B 0.05 M C NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 1 PKG OUTLINE NLX2G32 PACKAGE DIMENSIONS UDFN8 1.95x1.0, 0.5P CASE 517CA ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 L 8X 0.30 4 1 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.54 NOTE 3 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 1 PKG OUTLINE NLX2G32 PACKAGE DIMENSIONS ULLGA8 1.45x1.0, 0.35P CASE 613AA ISSUE A ÉÉÉ ÉÉÉ ÉÉÉ PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C A 8X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 7X 0.48 8X 0.22 e/2 e 1 7X L NOTE 4 4 1.18 L1 0.53 8 5 8X b 0.05 C PKG OUTLINE 0.35 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 8 NLX2G32 PACKAGE DIMENSIONS ULLGA8 1.6x1.0, 0.4P CASE 613AB ISSUE A PIN ONE REFERENCE 0.10 C 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉ ÉÉÉ ÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 8X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40 7X 0.49 e/2 e 1 4 8 5 7X L NOTE 4 1.24 L1 0.53 8X b 0.05 C 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 8X 0.26 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 9 NLX2G32 PACKAGE DIMENSIONS ULLGA8 1.95x1.0, 0.5P CASE 613AC ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 A 8X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW 7X C A1 0.49 8X 0.30 e/2 e 7X L NOTE 4 4 1 1.24 L1 0.53 8 5 8X BOTTOM VIEW b 0.10 C A B 0.05 C 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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