NLU3G17 Triple Non-Inverting Schmitt-Trigger Buffer The NLU3G17 MiniGatet is an advanced high-speed CMOS triple non-inverting Schmitt-trigger buffer in ultra-small footprint. The NLU3G17 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. The NLU3G17 can be used to enhance noise immunity or to square up slowly changing waveforms. http://onsemi.com MARKING DIAGRAMS Features •High Speed: tPD = 4.0 ns (Typ) @ VCC = 5.0 V •Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C •Power Down Protection Provided on inputs •Balanced Propagation Delays •Overvoltage Tolerant (OVT) Input and Output Pins •Ultra-Small Packages •These are Pb-Free Devices IN A1 UDFN8 CASE 517AJ UZM G DM 1 ULLGA8 1.45 x 1.0 CASE 613AA 1 ULLGA8 1.6 x 1.0 CASE 613AB LXM G ULLGA8 1.95 x 1.0 CASE 613AC LXM G 1 VCC 8 1 8 OUT Y3 2 7 OUT Y1 IN A2 3 6 IN A3 GND 4 5 OUT Y2 1 UZ, D or LX = Specific Device Code M = Date Code G = Pb-Free Package PIN ASSIGNMENT Figure 1. Pinout (Top View) IN A1 1 IN A2 1 OUT Y2 IN A3 1 OUT Y3 OUT Y1 1 IN A1 2 OUT Y3 3 IN A2 4 GND 5 OUT Y2 6 IN A3 7 OUT Y1 8 VCC Figure 2. Logic Symbol FUNCTION TABLE A Y L H L H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2008 March, 2008 - Rev. 2 1 Publication Order Number: NLU3G17/D NLU3G17 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage -0.5 to +7.0 V VIN DC Input Voltage -0.5 to +7.0 V DC Output Voltage -0.5 to +7.0 V VIN < GND -20 mA VOUT < GND ±20 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±12.5 mA ICC DC Supply Current Per Supply Pin ±25 mA IGND DC Ground Current per Ground Pin ±25 mA TSTG Storage Temperature Range -65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL FR ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 Latchup Performance Above VCC and Below GND at 125°C (Note 2) UL 94 V-0 @ 0.125 in ±500 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Positive DC Supply Voltage VIN Digital Input Voltage VOUT Output Voltage TA Operating Free-Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V http://onsemi.com 2 Min Max Unit 1.65 5.5 V 0 5.5 V 0 5.5 V -55 +125 °C 0 0 No Limit No Limit ns/V NLU3G17 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Conditions TA = 25 5C TA = +855C VCC (V) Min Typ Max Min VT+ Positive Threshold Voltage 3.0 4.5 5.5 1.85 2.86 3.50 2.0 3.0 3.6 2.2 3.15 3.85 VT- Negative Threshold Voltage 3.0 4.5 5.5 0.9 1.35 1.65 1.5 2.3 2.9 1.65 2.46 3.05 0.9 1.35 1.65 VH Hysteresis Voltage 3.0 4.5 5.5 0.30 0.40 0.50 0.57 0.67 0.74 1.20 1.40 1.60 0.30 0.40 0.50 VOH Minimum High-Level Output Voltage 2.0 3.0 4.5 1.9 2.9 4.4 2.0 3.0 4.5 3.0 4.5 2.58 3.94 VOL Maximum Low-Level Output Voltage VIN w VT+MAX IOH = -50 mA VIN w VT+MAX IOH = -4 mA IOH = -8 mA VIN v VT-MIN IOL = 50 mA VIN v VT-MIN IOL = 4 mA IOL = 8 mA 2.0 3.0 4.5 0 0 0 Max TA = -555C to +1255C Min 2.2 3.15 3.85 Max Unit 2.2 3.15 3.85 V 0.9 1.35 1.65 1.20 1.40 1.60 0.30 0.40 0.50 1.9 2.9 4.4 1.9 2.9 4.4 2.48 3.80 2.34 3.66 V 1.20 1.40 1.60 V V 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V IIN Input Leakage Current 0 v VIN v 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA ICC Quiescent Supply Current 0 v VIN v VCC 5.5 1.0 10 40 mA AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Symbol tPLH, tPHL Parameter Propagation Delay, Input A to Output Y CIN Input Capacitance CPD Power Dissipation Capacitance (Note 3) VCC (V) Test Condition TA = 25 5C Min TA = +855C Typ Max Min TA = -555C to +1255C Max Min Max Unit ns 3.0 to 3.6 CL = 15 pF 7.0 12.8 1.0 15 1.0 17 CL = 50 pF 8.5 16.3 1.0 18.5 1.0 20.5 4.5 to 5.5 CL = 15 pF 4.0 8.6 1.0 10 1.0 11.5 CL = 50 pF 5.5 10.6 1.0 12 1.0 13.5 5.0 10 5.0 7.0 10 10 pF pF 3. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no-load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. http://onsemi.com 3 NLU3G17 OUTPUT INPUT VCC A or B 50% RL CL GND tPLH tPHL Y 50% VCC A 1-MHz square input wave is recommended for propagation delay tests. Figure 4. Test Circuit Figure 3. Switching Waveforms VH VCC VT+ VT- VIN VCC VH VT+ VT- VIN GND GND VOH VOH VOUT Vout VOL VOL (a) A Schmitt-Trigger Squares Up Inputs With Slow Rise and Fall Times (b) A Schmitt-Trigger Offers Maximum Noise Immunity Figure 5. Typical Schmitt-Trigger Applications ORDERING INFORMATION Package Shipping† UDFN8 (Pb-Free) 3000 / Tape & Reel NLU3G17AMX1TCG ULLGA8, 1.95 x 1.0, 0.5P (Pb-Free) 3000 / Tape & Reel NLU3G17BMX1TCG ULLGA8, 1.6 x 1.0, 0.4P (Pb-Free) 3000 / Tape & Reel NLU3G17CMX1TCG ULLGA8, 1.45 x 1.0, 0.35P (Pb-Free) 3000 / Tape & Reel Device NLU3G17MUTAG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NLU3G17 PACKAGE DIMENSIONS UDFN8 1.8x1.2, 0.4P CASE 517AJ-01 ISSUE O PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. A B D 0.10 C ÉÉÉ ÉÉÉ L1 E DETAIL A NOTE 5 0.10 C TOP VIEW (A3) 0.05 C DIM A A1 A3 b b2 D E e L L1 L2 A 0.05 C SIDE VIEW A1 e/2 e (b2) C DETAIL A 8X 1 4 8 5 SEATING PLANE L MOUNTING FOOTPRINT SOLDERMASK DEFINED (L2) BOTTOM VIEW MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 0.30 REF 1.80 BSC 1.20 BSC 0.40 BSC 0.45 0.55 0.00 0.03 0.40 REF 8X b 8X 0.10 M C A B 0.05 M C 0.66 7X 0.22 NOTE 3 1.50 1 0.32 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 NLU3G17 PACKAGE DIMENSIONS ULLGA8 1.45x1.0, 0.35P CASE 613AA-01 ISSUE A ÉÉÉ ÉÉÉ ÉÉÉ PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C A 8X 0.05 C SEATING PLANE SIDE VIEW A1 C e L MOUNTING FOOTPRINT SOLDERMASK DEFINED* 7X e/2 1 MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 7X 0.48 NOTE 4 8X 0.22 4 L1 1.18 8 5 8X b 0.53 0.10 C A B BOTTOM VIEW 0.05 C 1 PKG OUTLINE NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NLU3G17 PACKAGE DIMENSIONS ULLGA8 1.6x1.0, 0.4P CASE 613AB-01 ISSUE A PIN ONE REFERENCE 0.10 C 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉ ÉÉÉ ÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 8X 0.05 C MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40 SEATING PLANE SIDE VIEW C A1 MOUNTING FOOTPRINT SOLDERMASK DEFINED* 7X e/2 0.49 e 1 7X L NOTE 4 8X 0.26 4 L1 1.24 8 5 8X b 0.53 0.10 C A B BOTTOM VIEW 0.05 C NOTE 3 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NLU3G17 PACKAGE DIMENSIONS ULLGA8 1.95x1.0, 0.5P CASE 613AC-01 ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 A 8X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 7X e/2 e 7X L 0.49 NOTE 4 8X 0.30 4 1 L1 1.24 8 5 8X BOTTOM VIEW b 0.10 C A B 0.05 C 0.53 1 PKG OUTLINE NOTE 3 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 http://onsemi.com 8 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NLU3G17/D