MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ChipFETt CASE 1206A−03 ISSUE K 8 DATE 19 MAY 2009 1 SCALE 1:1 D 8 7 q 6 L 5 HE 5 6 7 8 4 3 2 1 E 1 2 3 e1 4 b e DIM A b c D E e e1 L HE q c A 0.05 (0.002) STYLE 1: PIN 1. DRAIN 2. DRAIN 3. DRAIN 4. GATE 5. SOURCE 6. DRAIN 7. DRAIN 8. DRAIN STYLE 2: PIN 1. SOURCE 1 2. GATE 1 3. SOURCE 2 4. GATE 2 5. DRAIN 2 6. DRAIN 2 7. DRAIN 1 8. DRAIN 1 STYLE 3: PIN 1. ANODE 2. ANODE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. CATHODE 8. CATHODE STYLE 4: PIN 1. COLLECTOR 2. COLLECTOR 3. COLLECTOR 4. BASE 5. EMITTER 6. COLLECTOR 7. COLLECTOR 8. COLLECTOR MILLIMETERS NOM MAX 1.05 1.10 0.30 0.35 0.15 0.20 3.05 3.10 1.65 1.70 0.65 BSC 0.55 BSC 0.28 0.35 0.42 1.80 1.90 2.00 5° NOM MIN 1.00 0.25 0.10 2.95 1.55 INCHES NOM 0.041 0.012 0.006 0.120 0.065 0.025 BSC 0.022 BSC 0.011 0.014 0.071 0.075 5° NOM MIN 0.039 0.010 0.004 0.116 0.061 MAX 0.043 0.014 0.008 0.122 0.067 0.017 0.079 STYLE 6: STYLE 5: PIN 1. ANODE PIN 1. ANODE 2. DRAIN 2. ANODE 3. DRAIN 3. DRAIN 4. GATE 4. DRAIN 5. SOURCE 5. SOURCE 6. DRAIN 6. GATE 7. DRAIN 7. CATHODE 8. CATHODE / DRAIN 8. CATHODE GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MOLD GATE BURRS SHALL NOT EXCEED 0.13 MM PER SIDE. 4. LEADFRAME TO MOLDED BODY OFFSET IN HORIZONTAL AND VERTICAL SHALL NOT EXCEED 0.08 MM. 5. DIMENSIONS A AND B EXCLUSIVE OF MOLD GATE BURRS. 6. NO MOLD FLASH ALLOWED ON THE TOP AND BOTTOM LEAD SURFACE. 2.032 0.08 xxx MG G 2.362 0.093 0.65 0.025 PITCH xxx = Specific Device Code M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 8X 8X 0.66 0.026 0.457 0.018 mm Ǔ ǒinches Basic Style OPTIONAL SOLDERING FOOTPRINTS ON PAGE 2 DOCUMENT NUMBER: STATUS: 98AON03078D ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 ChipFET http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 3 ChipFETt CASE 1206A−03 ISSUE K DATE 19 MAY 2009 ADDITIONAL SOLDERING FOOTPRINTS* 1 2.032 0.08 2.032 0.08 1 4X 0.457 0.018 2X 1.092 0.043 1.727 0.068 2.362 0.093 2.362 0.093 0.65 0.025 PITCH 4X 2X 2X 0.457 0.018 0.66 0.026 mm Ǔ ǒinches Styles 1 and 4 2.032 0.08 1.118 0.044 mm Ǔ ǒinches Style 2 2.032 0.08 2X 0.66 0.026 1 2X 0.66 0.026 1 1.092 0.043 2X 0.66 0.026 1.092 0.043 2.362 0.093 2.362 0.093 0.65 0.025 PITCH 2X 0.65 0.025 PITCH 1.118 0.044 0.457 0.018 ǒ mm inches 1.118 0.044 Ǔ 2X 0.457 0.018 mm Ǔ ǒinches Style 5 Style 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: STATUS: 98AON03078D ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 ChipFET http://onsemi.com 2 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 2 OFXXX 3 DOCUMENT NUMBER: 98AON03078D PAGE 3 OF 3 ISSUE REVISION DATE F ADDED STYLE 4. REQ. BY M. SWEADOR. 30 DEC 2004 G ADDED NOMINAL VALUES. REQ BY HONG XIAO. 18 JUL 2005 H CHANGED STYLE 3. ADDED STYLE 5. CHANGED DIMENSIONS TO ALL SOLDERING FOOTPRINTS FOR CONSISTENCY AND ADDED SOLDERING FOOTPRINT STYLE 5. REQ. BY S. WINSTON. 25 OCT 2006 J ADDED STYLE 6. REQ. BY S. BRUTCHER. 17 JAN 2008 K CORRECTED ALL PIN STYLE SOLDERING FOOTPRINT MM PITCH VALUE FROM 0.635 TO 0.65. REQ. BY E. ROMERO. 19 MAY 2009 ChipFET is a trademark of Vishay Siliconix. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2009 May, 2009 − Rev. 03K Case Outline Number: 1206A