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Product / Package Information
Environmental Compliance Information
Package
Body Size
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
SOIC_N_EP (2.41 EP)
150 mil
8
100 Sn
Yes
Yes
No
Yes
Materials Declaration
Molding Compound
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol Novolac
Antimony Trioxide
Brominated Resin
Carbon Black
CAS#
Weight (g)
60676-86-0
Proprietary
9003-35-4
1309-64-4
40039-93-8
1333-86-4
3.96 E-02
3.44 E-03
1.84 E-03
6.88 E-04
2.29 E-04
1.38 E-04
4.59 E-02
CAS#
Weight (g)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
2.88 E-02
6.73 E-04
3.73 E-05
7.16 E-06
2.95 E-02
Homogeneous Material Level
Percentage (%)
PPM
86.2
862000
7.5
75000
4
40000
1.5
15000
0.5
5000
0.3
3000
100
1000000
Percentage (%)
50.03
4.35
2.32
0.87
0.29
0.17
58.04
Homogeneous Material Level
Percentage (%)
PPM
97.57
975706
2.28
22789
0.13
1263
0.02
242
100.00
1000000
Percentage (%)
36.46
0.85
0.05
0.01
37.36
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Percentage (%)
0.54
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Percentage (%)
2.27
Homogeneous Material Level
Percentage (%)
PPM
99.99
1000000
Percentage (%)
0.29
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Percentage (%)
0.82
Homogeneous Material Level
Percentage (%)
PPM
77.71
777100
3.11
31100
3.11
31100
3.11
31100
3 11
3.11
31100
3.11
31100
3.11
31100
3.11
31100
0.52
5200
100.00
1000000
Percentage (%)
0.52
0.02
0.02
0.02
0 02
0.02
0.02
0.02
0.02
0.004
0.68
PPM
Percentage (%)
100.00
PPM
Component Level
PPM
500269
43527
23214
8705
2902
1741
580359
Leadframe
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
Component Level
PPM
364560
8515
472
91
373637
Internal Leadframe Plating
Description
Precious metals
Substance
Silver
CAS#
Weight (g)
7440-22-4
4.29 E-04
Component Level
PPM
5426
External Leadframe Plating
Substance
Description
Tin & its alloys
Tin
CAS#
Weight (g)
7440-31-5
1.80 E-03
Component Level
PPM
22717
Bond Wires
Description
Precious metals
Substance
Gold
CAS#
Weight (g)
7440-57-5
2.30 E-04
Component Level
PPM
2909
Chip
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
Weight (g)
7440-21-3
6.48 E-04
Component Level
PPM
8197
Die Attach
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Subtotal
Substance
Silver
Epichlorohydrin-formaldehyde-phenol copolymer
Epoxy resin, epichlorohydrin-dimer fatty acid
Butyrolactone, gammaPoly(oxypropylene)diamine
2,6-Diglycidyl phenyl allyl ether oligomer
Organosilane
Copper(II) oxide
Epoxy resin modifier
CAS#
Weight (g)
7440-22-4
9003-36-5
68475-94-5
96-48-0
9046 10 0
9046-10-0
Unassigned
TS ref# 10001
1317-38-0
TS ref# 10038
4.15 E-04
1.66 E-05
1.66 E-05
1.66 E-05
1 66 E
1.66
E-05
05
1.66 E-05
1.66 E-05
1.66 E-05
2.78 E-06
5.34 E-04
Weight (g)
7.91 E-02
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Component Level
5249
210
210
210
210
210
210
210
35
6755
1000000