Q2 2016 Reliability Monitor Report

Reliability
Monitor
Report
High Temperature Operating Life
Data Retention Bake
Temperature Cycle
Temperature & Humidity Bias/ HAST
Steam Pressure Pot
Second QUARTER 2016
Table of Contents
1. Executive Summary
1
2. HTOL (sorted by product BU)
2
3. HTOL (sorted by technology)
3
4. Data Retention Bake (sorted by product BU)
4
5. Data Retention Bake (sorted by technology)
5
6. Temperature Cycle
6
7. Temperature Humidity Bias & HAST
7
8. Steam Pressure Pot
8
9. Physical Dimension Results
9
10. Failure Rate Calculations
10
11. Definitions
11
RELIABILITY MONITOR
Reliability Monitor Report
Date:
May 12th, 2016
Executive Summary
The intent of the Reliability Monitor Program is to measure the reliability of previously
qualified devices on a quarterly basis. This is achieved by selecting representative
devices within a process, package or business unit and performing a series of reliability
tests to ensure that the reliability has maintained over time. Listed below are the
overall results for the last quarter.
1.
High Temperature Operating Life (125° - 150°C; 0 failures)
Failure Rate: 7 FITS (680K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Also, Thermal and Voltage Acceleration are used to compute the overall
acceleration factor. Weighted acceleration factors (WAF) for a group of products are
calculated by taking the weighted average of each device’s acceleration factor multiplied
by its corresponding device hours. All failures were inconclusive.
2.
Data Retention Bake (150°C; 0 failures)
Failure Rate: 4 FITS (1,833K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Since there is no bias applied during testing and the stress temperature is fixed for
all devices at 150°C, the acceleration factor is 117 for all groupings.
3.
Temperature Cycle (-65°C to 150°C, 500 cycles) *
Failure Rate: 0.00% (0 failures out of 2,899 units)
4.
Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) *
Failure Rate: 0.00% (0 failures out of 5.900M device-hours)
Note: A 20:1 Acceleration Factor is used to combine HAST results with THB).
5.
Steam Pressure Pot (121°C/100%RH) *
Failure Rate: 0.00% (0 failures out of 246 units)
RELIABILITY MONITOR
1
High Temperature Operating Life
(sorted by FAMILY)
48 Hours
REJ
SS
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ SS
BU
QTR
MEMORY
1
LAST 4Q
0
0
286
636
0
0
286
636
0
0
286
366
0
0
MCU
1
LAST 4Q
0
0
394
7,724
0
0
394
2,023
0
0
394
2,023
RFA
1
LAST 4Q
0
4,820
0
462
0
1
LAST 4Q
0
0
680
13,180
0
0
680
3,121
0
0
ATMEL
Device-Hours*
WAF
EFR PPM
FITS
286
366
286,000
411,360
193
193
0
0
17
12
0
0
394
1,983
394,000
2,276,648
193
194
0
0
12
2
462
0
462
671,184
193
0
7
680
2,851
0
0
680
2,811
680,000
3,359,192
193
194
0
0
7
1
RELIABILITY MONITOR
2
High Temperature Operating Life
(sorted by TECHNOLOGY)
48 Hours
REJ
SS
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
2K Hours
REJ
SS
TECH
QTR
92K
1
LAST 4Q
0
330
0
80
0
80
0
80
0
1
LAST 4Q
0
1,620
0
154
0
154
0
154
66K
1
LAST 4Q
0
0
80
968
0
0
80
159
0
0
80
159
0
0
65K
1
LAST 4Q
0
0
165
5,338
0
0
165
946
0
0
165
946
59.9K
1
LAST 4Q
0
40
0
40
0
59K
1
LAST 4Q
0
0
80
560
0
0
80
560
58.97K
1
LAST 4Q
0
1,600
0
1
LAST 4Q
0
419
57K
1
LAST 4Q
0
0
46K
1
LAST 4Q
45.2K
75K
58.8K
35.9K
ATMEL
Device-Hours*
WAF
EFR PPM
FITS
0
92,000
193
0
52
0
0
224,368
193
0
21
80
159
0
0
0
0
80,000
197,832
193
193
0
0
59
24
0
0
165
946
0
0
0
0
165,000
1,156,816
193
193
0
0
29
4
40
0
0
0
0
20,000
213
0
215
0
0
80
560
0
0
80
560
0
0
0
0
80,000
560,000
193
193
0
0
59
8
154
0
154
0
154
0
0
223,408
193
0
21
0
169
0
169
0
169
0
0
181,000
203
0
25
266
266
0
0
266
266
0
0
266
266
0
0
266
266
0
0
0
0
266,000
266,000
193
193
0
0
18
18
0
0
89
359
0
0
89
359
0
0
89
89
0
0
89
89
0
0
0
0
89,000
134,360
193
193
0
0
53
35
1
LAST 4Q
0
1,600
0
154
0
154
0
154
0
0
223,408
193
0
21
1
LAST 4Q
0
80
0
80
0
80
0
80
0
0
80,000
193
0
59
1
LAST 4Q
0
0
680
13,180
0
0
680
3,121
0
0
680
2,851
0
0
680
2,811
0
0
0
0
680,000
3,359,192
193
193
0
0
7
1
RELIABILITY MONITOR
3
Data Retention Bake
(sorted by FAMILY)
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
BU
QTR
MEMORY
1
LAST 4Q
0
0
246
326
0
0
246
326
0
0
MCU
1
LAST 4Q
0
0
3,100
7,456
0
0
3,100
7,456
RFA
1
LAST 4Q
0
302
0
1
LAST 4Q
0
0
3,346
8,084
0
0
ATMEL
Device-Hours
AF
FITS
0
0
123,000
163,000
117
117
64
48
0
0
320
1,120
1,710,000
4,288,000
117
117
5
2
302
0
302
302,000
117
26
3,346
8,084
0
0
320
1,422
1,833,000
4,753,000
117
117
4
2
RELIABILITY MONITOR
4
Data Retention Bake
(sorted by TECHNOLOGY)
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
TECH
QTR
92K
1
LAST 4Q
0
160
0
160
0
160
160,000
117
49
1
LAST 4Q
0
90
0
90
0
90
90,000
117
87
66K
1
LAST 4Q
0
0
240
320
0
0
240
320
0
0
240
240
240,000
280,000
117
117
33
28
65K
1
LAST 4Q
0
0
2,620
3,331
0
0
2,620
3,331
0
0
0
0
1,310,000
1,665,500
117
117
6
5
62.2K
1
LAST 4Q
0
80
0
80
0
80
80,000
117
98
1
LAST 4Q
0
40
0
40
0
0
20,000
117
392
59K
1
LAST 4Q
0
0
160
1,520
0
0
160
1,520
0
0
0
560
80,000
1,040,000
117
117
98
8
58.97K
1
LAST 4Q
0
90
0
90
0
90
90,000
117
87
1
LAST 4Q
0
160
0
160
0
0
80,000
117
98
56.8K
1
LAST 4Q
0
0
80
80
0
0
80
80
0
0
80
80
80,000
80,000
117
117
98
98
45.2K
1
LAST 4Q
0
122
0
122
0
122
122,000
117
64
35.9K
1
LAST 4Q
0
0
246
326
0
0
246
326
0
0
0
0
123,000
163,000
117
117
64
48
35.4K
1
LAST 4Q
0
765
0
765
0
0
382,500
117
20
1
LAST 4Q
0
1,000
0
1,000
0
0
500,000
117
16
1
LAST 4Q
0
0
3,346
8,084
0
0
3,346
8,084
0
0
320
1,422
1,833,000
4,753,000
117
117
4
2
75
59.9K
58.8K
19.6K
ATMEL
RELIABILITY MONITOR
Device-Hours AF
FITS
5
Temperature Cycle
100 Cycles
REJ
SS
200 Cycles
REJ
SS
500 Cycles
REJ
SS
1K Cycles
REJ
SS
PACKAGE
QTR
CBGA
1
LAST 4Q
0
80
0
80
0
80
0
0
0.00%
FPBGA
1
LAST 4Q
0
0
638
638
0
0
638
638
0
0
638
638
0
0
638
638
0.00%
0.00%
LQFP
1
LAST 4Q
0
0
415
495
0
0
415
495
0
0
415
495
0
0
415
415
0.00%
0.00%
MLF / QFN
1
LAST 4Q
0
0
800
2,905
0
0
800
2,905
0
0
800
2,905
0
0
800
2,825
0.00%
0.00%
PDIP
1
LAST 4Q
0
1,085
0
1,085
0
1,085
0
1,000
0.00%
1
LAST 4Q
0
157
0
157
0
157
0
77
0.00%
TFBGA
1
LAST 4Q
0
0
270
350
0
0
270
350
0
0
270
350
0
0
270
270
0.00%
0.00%
TQFP
1
LAST 4Q
0
0
240
640
0
0
240
640
0
0
240
640
0
0
240
640
0.00%
0.00%
UDFN
1
LAST 4Q
0
0
242
242
0
0
242
242
0
0
242
242
0
0
244
244
0.00%
0.00%
WLSCP
1
LAST 4Q
0
0
294
294
0
0
294
294
0
0
294
294
0
0
294
294
0.00%
0.00%
ATMEL
1
LAST 4Q
0
0
2,899
6,886
0
0
2,899
6,886
0
0
2,899
6,886
0
0
2,901
6,403
0.00%
0.00%
SOIC
RELIABILITY MONITOR
% Defective
6
Temperature Humidity Bias / HAST
Temperature Humidity Bias
HAST
168 Hours 500 Hours 1K Hours 96 Hours
REJ SS REJ SS REJ SS REJ SS
PACKAGE
QTR
CBGA
1
LAST 4Q
0
0
0
0
0
0
0
80
160,000
0.00%
1
LAST 4Q
0
0
0
0
0
0
0
0
636
636
1,272,000
1,272,000
0.00%
0.00%
1
LAST 4Q
0
0
0
0
0
0
0
0
392
472
784,000
944,000
0.00%
0.00%
1
LAST 4Q
0
0
0
0
0
0
0
0
869
2,622
1,738,000
5,244,000
0.00%
0.00%
1
LAST 4Q
0
0
0
0
0
0
0
165
330,000
0.00%
1
LAST 4Q
0
0
0
0
0
0
0
157
314,000
0.00%
1
LAST 4Q
0
0
0
0
0
0
0
0
240
640
480,000
1,280,000
0.00%
0.00%
1
LAST 4Q
0
0
0
0
0
0
0
0
285
365
570,000
730,000
0.00%
0.00%
1
LAST 4Q
0
0
0
0
0
0
0
0
240
240
480,000
480,000
0.00%
0.00%
1
LAST 4Q
0
0
0
0
0
0
0
0
288
288
576,000
576,000
0.00%
0.00%
1
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,950
5,665
5,900,000
11,330,000
0.00%
0.00%
FPBGA
LQFP
MLF / QFN
PDIP
SOIC
TQFP
TFBGA
UDFN
WLSCP
ATMEL
RELIABILITY MONITOR
Device-Hours* % Defective
7
Steam Pressure Pot
96 Hours
REJ
SS
168 Hours
REJ
SS
240 Hours
REJ
SS
PACKAGE
QTR
MLF / QFN
1
LAST 4Q
0
160
0
160
0
160
0.0%
1
LAST 4Q
0
80
0
80
0
80
0.0%
1
LAST 4Q
0
80
0
80
0
80
0.0%
UDFN
1
LAST 4Q
0
0
246
246
0
0
246
246
0
0
246
246
0.0%
0.0%
ATMEL
1
LAST 4Q
0
0
246
566
0
0
246
566
0
0
246
566
0.00%
0.00%
PDIP
TQFP
RELIABILITY MONITOR
% Defective
8
PHYSICAL DIMENSION RESULTS
QUARTER
PACKAGE
TYPE
LEAD
COUNT
SAMPLE
SIZE
RESULT
JEDEC
STANDARD
Q1
Q1
Q1
Q1
Q1
UDFN
CQFP
CQFP
MQFP
QFN
8
224
132
68
32
16
15
15
15
15
PASS
PASS
PASS
PASS
PASS
JESD22-B100/B108
JESD22-B100/B108
JESD22-B100/B108
JESD22-B100/B108
JESD22-B100/B108
RELIABILITY MONITOR
9
Failure Rate Calculations
Failure Rate:
χ2
λ =
where,
λ
χ2
α
n
AF
DH
=
=
=
=
=
=
(1 −
α
100
, 2⋅n + 2 )
⋅ 109
2 ⋅ AF ⋅ DH
Failure Rate (FITS)
Failure Estimate
Confidence Level (60% or 90%)
Number of Failures
Overall Acceleration Factor (TAF x VAF)
Device Hours
Thermal Acceleration:
TAF
where,
TAF
EA
k
T
f
s
P
θJA
=
=
=
=
=
=
=
=
= e

ea 
1
1
⋅
−

k  Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) 
Thermal Acceleration Factor
Activation Energy (eV)
Boltzman’s Constant (8.617 x 10-5 eV/°K)
Temperature (°K)
Field Conditions
Stress Conditions
Power Dissipation (W)
Thermal Resistance Coefficient - Junction to Ambient (°C/W)
Voltage Acceleration:
VAF
where,
VAF
Vs
Vn
Z
=
=
=
=
= eZ⋅ [
VS − Vn ]
Voltage Acceleration Factor
Stress Voltage (V)
Nominal Voltage (V)
Voltage Acceleration Constant (typically, 0.5 < Z < 1.0)
RELIABILITY MONITOR
10
Definitions
Data Retention Bake (DRB): This test is used to measure a device’s ability to retain
a charge for extended periods of time without applying voltage bias. Stressing
at high temperatures (150°C for plastic packages) accelerates any discharge
causing the memory state to change.
Failures In Time (FITS): This is the unit measure for expressing failure rates and is
identical to the expression PPM/K hours. For example, three failures out of a
million components tested for one thousand hours equates to 3 FITS.
High Temperature Operating Life (HTOL): The purpose of this test is to accelerate
thermally activated failure mechanisms through the use of high temperatures
(typically between 125°C and 150°C), increased voltage, and dynamic bias
conditions. Readouts at various time points are taken to determine the Early
Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in
defective parts per million (DPPM) and IFR is expressed in Failures in Time
(FITS at 55°C).
Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a
plastic packaged component’s ability to withstand harsh environmental
conditions with extreme temperature and humidity levels. The parts are
stressed to high temperature (130°C) and relative humidity (85%RH) conditions
in a biased state to achieve maximum acceleration.
Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged
component’s ability to withstand severe conditions of pressure (15 psig),
temperature (121°C), and humidity (100%RH).
Temperature Cycle (TC): This test is used to measure a product’s sensitivity to
thermal stresses due to differences in expansion and contraction characteristics
of the die and mold compound by repeated alternating temperature dwells
between high and low temperature extremes.
Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is
identical to HAST. The only difference is that HAST accelerates THB by a factor
of 20:1 due to the increase in temperature during test.
RELIABILITY MONITOR
11