Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot Second QUARTER 2016 Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3 4. Data Retention Bake (sorted by product BU) 4 5. Data Retention Bake (sorted by technology) 5 6. Temperature Cycle 6 7. Temperature Humidity Bias & HAST 7 8. Steam Pressure Pot 8 9. Physical Dimension Results 9 10. Failure Rate Calculations 10 11. Definitions 11 RELIABILITY MONITOR Reliability Monitor Report Date: May 12th, 2016 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) Failure Rate: 7 FITS (680K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) Failure Rate: 4 FITS (1,833K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 2,899 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 5.900M device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 246 units) RELIABILITY MONITOR 1 High Temperature Operating Life (sorted by FAMILY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR MEMORY 1 LAST 4Q 0 0 286 636 0 0 286 636 0 0 286 366 0 0 MCU 1 LAST 4Q 0 0 394 7,724 0 0 394 2,023 0 0 394 2,023 RFA 1 LAST 4Q 0 4,820 0 462 0 1 LAST 4Q 0 0 680 13,180 0 0 680 3,121 0 0 ATMEL Device-Hours* WAF EFR PPM FITS 286 366 286,000 411,360 193 193 0 0 17 12 0 0 394 1,983 394,000 2,276,648 193 194 0 0 12 2 462 0 462 671,184 193 0 7 680 2,851 0 0 680 2,811 680,000 3,359,192 193 194 0 0 7 1 RELIABILITY MONITOR 2 High Temperature Operating Life (sorted by TECHNOLOGY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS 2K Hours REJ SS TECH QTR 92K 1 LAST 4Q 0 330 0 80 0 80 0 80 0 1 LAST 4Q 0 1,620 0 154 0 154 0 154 66K 1 LAST 4Q 0 0 80 968 0 0 80 159 0 0 80 159 0 0 65K 1 LAST 4Q 0 0 165 5,338 0 0 165 946 0 0 165 946 59.9K 1 LAST 4Q 0 40 0 40 0 59K 1 LAST 4Q 0 0 80 560 0 0 80 560 58.97K 1 LAST 4Q 0 1,600 0 1 LAST 4Q 0 419 57K 1 LAST 4Q 0 0 46K 1 LAST 4Q 45.2K 75K 58.8K 35.9K ATMEL Device-Hours* WAF EFR PPM FITS 0 92,000 193 0 52 0 0 224,368 193 0 21 80 159 0 0 0 0 80,000 197,832 193 193 0 0 59 24 0 0 165 946 0 0 0 0 165,000 1,156,816 193 193 0 0 29 4 40 0 0 0 0 20,000 213 0 215 0 0 80 560 0 0 80 560 0 0 0 0 80,000 560,000 193 193 0 0 59 8 154 0 154 0 154 0 0 223,408 193 0 21 0 169 0 169 0 169 0 0 181,000 203 0 25 266 266 0 0 266 266 0 0 266 266 0 0 266 266 0 0 0 0 266,000 266,000 193 193 0 0 18 18 0 0 89 359 0 0 89 359 0 0 89 89 0 0 89 89 0 0 0 0 89,000 134,360 193 193 0 0 53 35 1 LAST 4Q 0 1,600 0 154 0 154 0 154 0 0 223,408 193 0 21 1 LAST 4Q 0 80 0 80 0 80 0 80 0 0 80,000 193 0 59 1 LAST 4Q 0 0 680 13,180 0 0 680 3,121 0 0 680 2,851 0 0 680 2,811 0 0 0 0 680,000 3,359,192 193 193 0 0 7 1 RELIABILITY MONITOR 3 Data Retention Bake (sorted by FAMILY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR MEMORY 1 LAST 4Q 0 0 246 326 0 0 246 326 0 0 MCU 1 LAST 4Q 0 0 3,100 7,456 0 0 3,100 7,456 RFA 1 LAST 4Q 0 302 0 1 LAST 4Q 0 0 3,346 8,084 0 0 ATMEL Device-Hours AF FITS 0 0 123,000 163,000 117 117 64 48 0 0 320 1,120 1,710,000 4,288,000 117 117 5 2 302 0 302 302,000 117 26 3,346 8,084 0 0 320 1,422 1,833,000 4,753,000 117 117 4 2 RELIABILITY MONITOR 4 Data Retention Bake (sorted by TECHNOLOGY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS TECH QTR 92K 1 LAST 4Q 0 160 0 160 0 160 160,000 117 49 1 LAST 4Q 0 90 0 90 0 90 90,000 117 87 66K 1 LAST 4Q 0 0 240 320 0 0 240 320 0 0 240 240 240,000 280,000 117 117 33 28 65K 1 LAST 4Q 0 0 2,620 3,331 0 0 2,620 3,331 0 0 0 0 1,310,000 1,665,500 117 117 6 5 62.2K 1 LAST 4Q 0 80 0 80 0 80 80,000 117 98 1 LAST 4Q 0 40 0 40 0 0 20,000 117 392 59K 1 LAST 4Q 0 0 160 1,520 0 0 160 1,520 0 0 0 560 80,000 1,040,000 117 117 98 8 58.97K 1 LAST 4Q 0 90 0 90 0 90 90,000 117 87 1 LAST 4Q 0 160 0 160 0 0 80,000 117 98 56.8K 1 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 80,000 80,000 117 117 98 98 45.2K 1 LAST 4Q 0 122 0 122 0 122 122,000 117 64 35.9K 1 LAST 4Q 0 0 246 326 0 0 246 326 0 0 0 0 123,000 163,000 117 117 64 48 35.4K 1 LAST 4Q 0 765 0 765 0 0 382,500 117 20 1 LAST 4Q 0 1,000 0 1,000 0 0 500,000 117 16 1 LAST 4Q 0 0 3,346 8,084 0 0 3,346 8,084 0 0 320 1,422 1,833,000 4,753,000 117 117 4 2 75 59.9K 58.8K 19.6K ATMEL RELIABILITY MONITOR Device-Hours AF FITS 5 Temperature Cycle 100 Cycles REJ SS 200 Cycles REJ SS 500 Cycles REJ SS 1K Cycles REJ SS PACKAGE QTR CBGA 1 LAST 4Q 0 80 0 80 0 80 0 0 0.00% FPBGA 1 LAST 4Q 0 0 638 638 0 0 638 638 0 0 638 638 0 0 638 638 0.00% 0.00% LQFP 1 LAST 4Q 0 0 415 495 0 0 415 495 0 0 415 495 0 0 415 415 0.00% 0.00% MLF / QFN 1 LAST 4Q 0 0 800 2,905 0 0 800 2,905 0 0 800 2,905 0 0 800 2,825 0.00% 0.00% PDIP 1 LAST 4Q 0 1,085 0 1,085 0 1,085 0 1,000 0.00% 1 LAST 4Q 0 157 0 157 0 157 0 77 0.00% TFBGA 1 LAST 4Q 0 0 270 350 0 0 270 350 0 0 270 350 0 0 270 270 0.00% 0.00% TQFP 1 LAST 4Q 0 0 240 640 0 0 240 640 0 0 240 640 0 0 240 640 0.00% 0.00% UDFN 1 LAST 4Q 0 0 242 242 0 0 242 242 0 0 242 242 0 0 244 244 0.00% 0.00% WLSCP 1 LAST 4Q 0 0 294 294 0 0 294 294 0 0 294 294 0 0 294 294 0.00% 0.00% ATMEL 1 LAST 4Q 0 0 2,899 6,886 0 0 2,899 6,886 0 0 2,899 6,886 0 0 2,901 6,403 0.00% 0.00% SOIC RELIABILITY MONITOR % Defective 6 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST 168 Hours 500 Hours 1K Hours 96 Hours REJ SS REJ SS REJ SS REJ SS PACKAGE QTR CBGA 1 LAST 4Q 0 0 0 0 0 0 0 80 160,000 0.00% 1 LAST 4Q 0 0 0 0 0 0 0 0 636 636 1,272,000 1,272,000 0.00% 0.00% 1 LAST 4Q 0 0 0 0 0 0 0 0 392 472 784,000 944,000 0.00% 0.00% 1 LAST 4Q 0 0 0 0 0 0 0 0 869 2,622 1,738,000 5,244,000 0.00% 0.00% 1 LAST 4Q 0 0 0 0 0 0 0 165 330,000 0.00% 1 LAST 4Q 0 0 0 0 0 0 0 157 314,000 0.00% 1 LAST 4Q 0 0 0 0 0 0 0 0 240 640 480,000 1,280,000 0.00% 0.00% 1 LAST 4Q 0 0 0 0 0 0 0 0 285 365 570,000 730,000 0.00% 0.00% 1 LAST 4Q 0 0 0 0 0 0 0 0 240 240 480,000 480,000 0.00% 0.00% 1 LAST 4Q 0 0 0 0 0 0 0 0 288 288 576,000 576,000 0.00% 0.00% 1 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 2,950 5,665 5,900,000 11,330,000 0.00% 0.00% FPBGA LQFP MLF / QFN PDIP SOIC TQFP TFBGA UDFN WLSCP ATMEL RELIABILITY MONITOR Device-Hours* % Defective 7 Steam Pressure Pot 96 Hours REJ SS 168 Hours REJ SS 240 Hours REJ SS PACKAGE QTR MLF / QFN 1 LAST 4Q 0 160 0 160 0 160 0.0% 1 LAST 4Q 0 80 0 80 0 80 0.0% 1 LAST 4Q 0 80 0 80 0 80 0.0% UDFN 1 LAST 4Q 0 0 246 246 0 0 246 246 0 0 246 246 0.0% 0.0% ATMEL 1 LAST 4Q 0 0 246 566 0 0 246 566 0 0 246 566 0.00% 0.00% PDIP TQFP RELIABILITY MONITOR % Defective 8 PHYSICAL DIMENSION RESULTS QUARTER PACKAGE TYPE LEAD COUNT SAMPLE SIZE RESULT JEDEC STANDARD Q1 Q1 Q1 Q1 Q1 UDFN CQFP CQFP MQFP QFN 8 224 132 68 32 16 15 15 15 15 PASS PASS PASS PASS PASS JESD22-B100/B108 JESD22-B100/B108 JESD22-B100/B108 JESD22-B100/B108 JESD22-B100/B108 RELIABILITY MONITOR 9 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR 10 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR 11