Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot Fourth QUARTER 2015 Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3 4. Data Retention Bake (sorted by product BU) 4 5. Data Retention Bake (sorted by technology) 5 6. Temperature Cycle 6 7. Temperature Humidity Bias & HAST 7 8. Steam Pressure Pot 8 9. Failure Rate Calculations 9 10. Definitions 10 RELIABILITY MONITOR Reliability Monitor Report Date: October 20th, 2015 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) Failure Rate: 6 FITS (840,184 device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) Failure Rate: 7 FITS (1.142M device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 1,422 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 2.844M device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 0 unit) RELIABILITY MONITOR 1 High Temperature Operating Life (sorted by FAMILY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR Device-Hours* WAF EFR PPM FITS ASIC 3 LAST 4Q 0 45 0 45 0 45 0 45 45,000 213 0 95 MCU 3 LAST 4Q 0 0 169 1,456 0 0 169 1,456 0 0 169 1,456 0 0 169 775 169,000 1,115,500 204 217 0 0 27 4 RFA 3 LAST 4Q 0 0 4,820 4,820 0 0 462 462 0 0 462 462 0 0 462 462 671,184 671,184 193 193 0 0 7 7 ATMEL 3 LAST 4Q 0 0 4,989 6,321 0 0 631 1,963 0 0 631 1,963 0 0 631 1,282 840,184 1,831,684 195 208 0 0 6 2 RELIABILITY MONITOR 2 High Temperature Operating Life (sorted by TECHNOLOGY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS 2K Hours REJ SS TECH QTR 75K 3 LAST 4Q 0 0 1,620 1,829 0 0 154 363 0 0 154 363 0 0 154 363 0 0 66.2K 3 LAST 4Q 0 798 0 798 0 798 0 157 0 Device-Hours* WAF EFR PPM FITS 0 0 224,368 433,368 193 203 0 0 21 10 0 477,500 213 0 9 59.9K 3 LAST 4Q 0 40 0 40 0 40 0 0 0 0 20,000 213 0 215 59K 3 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 0 0 80 80 0 0 0 0 80,000 80,000 193 193 0 0 59 59 58.97K 3 LAST 4Q 0 0 1,600 1,600 0 0 154 154 0 0 154 154 0 0 154 154 0 0 0 0 223,408 223,408 193 193 0 0 21 21 58.8K 3 LAST 4Q 0 0 89 89 0 0 89 89 0 0 89 89 0 0 89 89 0 0 0 0 89,000 89,000 213 213 0 0 48 48 58K 3 LAST 4Q 0 80 0 80 0 80 0 80 0 0 80,000 236 0 49 45.2K 3 LAST 4Q 0 0 1,600 1,600 0 0 154 154 0 0 154 154 0 0 154 154 0 0 0 0 223,408 223,408 193 193 0 0 21 21 35.4K 3 LAST 4Q 0 160 0 160 0 160 0 160 0 0 160,000 236 0 24 3 LAST 4Q 0 45 0 45 0 45 0 45 0 0 45,000 213 0 95 3 LAST 4Q 0 0 4,989 6,321 0 0 631 1,963 0 0 631 1,963 0 0 631 1,282 0 0 0 0 840,184 1,831,684 195 206 0 0 6 2 19.6K ATMEL RELIABILITY MONITOR 3 Data Retention Bake (sorted by FAMILY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR Device-Hours AF FITS ASIC 3 LAST 4Q 0 74 0 74 0 0 37,000 117 212 MCU 3 LAST 4Q 0 0 880 2,520 0 0 880 2,520 0 0 800 1,155 840,000 1,837,500 117 117 9 4 RFA 3 LAST 4Q 0 0 302 302 0 0 302 302 0 0 302 302 302,000 302,000 117 117 26 26 ATMEL 3 LAST 4Q 0 0 1,182 2,896 0 0 1,182 2,896 0 0 1,102 1,457 1,142,000 2,176,500 117 117 7 4 RELIABILITY MONITOR 4 Data Retention Bake (sorted by TECHNOLOGY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS TECH QTR 92K 3 LAST 4Q 0 0 160 160 0 0 160 160 0 0 160 160 160,000 160,000 117 117 49 49 75 3 LAST 4Q 0 0 90 205 0 0 90 205 0 0 90 205 90,000 205,000 117 117 87 38 66K 3 LAST 4Q 0 80 0 80 0 80 80,000 117 98 62.2K 3 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 80,000 80,000 117 117 98 98 59.9K 3 LAST 4Q 0 40 0 40 0 0 20,000 117 392 59K 3 LAST 4Q 0 0 560 560 0 0 560 560 0 0 560 560 560,000 560,000 117 117 14 14 58.97K 3 LAST 4Q 0 0 90 90 0 0 90 90 0 0 90 90 90,000 90,000 117 117 87 87 58.8K 3 LAST 4Q 0 0 80 80 0 0 80 80 0 0 0 0 40,000 40,000 117 117 196 196 58K 3 LAST 4Q 0 80 0 80 0 80 80,000 117 98 45.2K 3 LAST 4Q 0 0 122 122 0 0 122 122 0 0 122 122 122,000 122,000 117 117 64 64 35.4K 3 LAST 4Q 0 325 0 325 0 80 202,500 117 39 3 LAST 4Q 0 1,074 0 1,074 0 0 537,000 117 15 3 LAST 4Q 0 0 1,182 2,896 0 0 1,182 2,896 0 0 1,102 1,457 1,142,000 2,176,500 117 117 7 4 19.6K ATMEL RELIABILITY MONITOR Device-Hours AF FITS 5 Temperature Cycle 100 Cycles REJ SS 200 Cycles REJ SS 500 Cycles REJ SS 1K Cycles REJ SS PACKAGE QTR CBGA 3 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 0 0 0 0 0.00% 0.00% LQFP 3 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 0 0 0 0 0.00% 0.00% MLF / QFN 3 LAST 4Q 0 0 945 1,225 0 0 945 1,225 0 0 945 1,225 0 0 945 1,025 0.00% 0.00% PDIP 3 LAST 4Q 0 1,250 0 1,250 0 1,250 0 1,080 0.00% SOIC 3 LAST 4Q 0 0 77 257 0 0 77 257 0 0 77 257 0 0 77 77 0.00% 0.00% TFBGA 3 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 0 0 0 0 0.00% 0.00% TQFP 3 LAST 4Q 0 0 160 240 0 0 160 240 0 0 160 240 0 0 160 240 0.00% 0.00% UFBGA 3 LAST 4Q 0 80 0 80 0 80 0 80 0.00% 3 LAST 4Q 0 0 1,422 3,292 0 0 1,422 3,292 0 0 1,422 3,292 0 0 1,182 2,502 0.00% 0.00% ATMEL RELIABILITY MONITOR % Defective 6 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST 168 Hours 500 Hours 1K Hours 96 Hours REJ SS REJ SS REJ SS REJ SS PACKAGE QTR CBGA 3 LAST 4Q 0 0 0 0 0 0 0 0 80 80 160,000 160,000 0.00% 0.00% 3 LAST 4Q 0 0 0 0 0 0 0 0 80 80 160,000 160,000 0.00% 0.00% 3 LAST 4Q 0 0 0 0 0 0 0 0 945 1,195 1,890,000 2,390,000 0.00% 0.00% 3 LAST 4Q 0 0 0 0 0 0 0 250 500,000 0.00% 3 LAST 4Q 0 0 0 0 0 0 0 0 77 247 154,000 494,000 0.00% 0.00% 3 LAST 4Q 0 0 0 0 0 0 0 0 160 240 320,000 480,000 0.00% 0.00% 3 LAST 4Q 0 0 0 0 0 0 0 0 80 80 160,000 160,000 0.00% 0.00% 3 LAST 4Q 0 0 0 0 0 0 0 80 160,000 0.00% 3 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1,422 2,252 2,844,000 4,504,000 0.00% 0.00% LQFP MLF / QFN PDIP SOIC TQFP TFBGA UFBGA ATMEL RELIABILITY MONITOR Device-Hours* % Defective 7 Steam Pressure Pot 96 Hours REJ SS 168 Hours REJ SS 240 Hours REJ SS PACKAGE QTR PDIP 3 LAST 4Q 0 80 0 80 0 80 0.0% 3 LAST 4Q 0 0 0 80 0 0 0 80 0 0 0 80 #DIV/0! 0.00% ATMEL RELIABILITY MONITOR % Defective 8 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR 9 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR 10