Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot Third QUARTER 2015 Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3 4. Data Retention Bake (sorted by product BU) 4 5. Data Retention Bake (sorted by technology) 5 6. Temperature Cycle 6 7. Temperature Humidity Bias & HAST 7 8. Steam Pressure Pot 8 9. Failure Rate Calculations 9 10. Definitions 10 RELIABILITY MONITOR Reliability Monitor Report Date: July 16th, 2015 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) Failure Rate: 215 FITS (20K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) Failure Rate: 13 FITS (602.5K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 1,165 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 490K device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 80 units) RELIABILITY MONITOR 1 High Temperature Operating Life (sorted by FAMILY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR Device-Hours* WAF EFR PPM FITS ASIC 2 LAST 4Q 0 45 0 45 0 45 0 45 45,000 213 0 95 MCU 2 LAST 4Q 0 0 40 1,554 0 0 40 1,554 0 0 40 1,554 0 0 0 873 20,000 1,213,500 213 221 0 0 215 3 ATMEL 2 LAST 4Q 0 0 40 1,599 0 0 40 1,599 0 0 40 1,599 0 0 0 918 20,000 1,258,500 213 221 0 0 215 3 RELIABILITY MONITOR 2 High Temperature Operating Life (sorted by TECHNOLOGY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS 2K Hours REJ SS TECH QTR 75K 2 LAST 4Q 0 209 0 209 0 209 0 209 0 2 LAST 4Q 0 798 0 798 0 798 0 157 59.9K 2 LAST 4Q 0 0 40 40 0 0 40 40 0 0 40 40 0 0 58K 2 LAST 4Q 0 80 0 80 0 80 2 LAST 4Q 0 190 0 190 0 2 LAST 4Q 0 237 0 237 2 LAST 4Q 0 45 0 2 LAST 4Q 0 0 40 1,599 0 0 66.2K 46K 35.4K 19.6K ATMEL Device-Hours* WAF EFR PPM FITS 0 209,000 213 0 21 0 0 477,500 213 0 9 0 0 0 0 0 0 20,000 20,000 213 213 0 0 215 215 0 80 0 0 80,000 236 0 49 190 0 190 0 0 190,000 225 0 21 0 237 0 237 0 0 237,000 236 0 16 45 0 45 0 45 0 0 45,000 213 0 95 40 1,599 0 0 40 1,599 0 0 0 918 0 0 0 0 20,000 1,258,500 213 221 0 0 215 3 RELIABILITY MONITOR 3 Data Retention Bake (sorted by FAMILY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR Device-Hours AF FITS ASIC 2 LAST 4Q 0 74 0 74 0 0 37,000 117 212 MCU 2 LAST 4Q 0 0 1,205 1,802 0 0 1,205 1,802 0 0 0 517 602,500 1,159,500 117 117 13 7 ATMEL 2 LAST 4Q 0 0 1,205 1,876 0 0 1,205 1,876 0 0 0 517 602,500 1,196,500 117 117 13 7 RELIABILITY MONITOR 4 Data Retention Bake (sorted by TECHNOLOGY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS TECH QTR 75 2 LAST 4Q 0 115 0 115 0 115 115,000 117 68 2 LAST 4Q 0 160 0 160 0 160 160,000 117 49 59.9K 2 LAST 4Q 0 0 40 40 0 0 40 40 0 0 0 0 20,000 20,000 117 117 392 392 58K 2 LAST 4Q 0 80 0 80 0 80 80,000 117 98 35.4K 2 LAST 4Q 0 0 165 407 0 0 165 407 0 0 0 162 82,500 284,500 117 117 95 28 19.6K 2 LAST 4Q 0 0 1,000 1,074 0 0 1,000 1,074 0 0 0 0 500,000 537,000 117 117 16 15 ATMEL 2 LAST 4Q 0 0 1,205 1,876 0 0 1,205 1,876 0 0 0 517 602,500 1,196,500 117 117 13 7 66K RELIABILITY MONITOR Device-Hours AF FITS 5 Temperature Cycle 100 Cycles REJ SS 200 Cycles REJ SS 500 Cycles REJ SS 1K Cycles REJ SS PACKAGE QTR MLF / QFN 2 LAST 4Q 0 280 0 280 0 280 0 80 0.00% PDIP 2 LAST 4Q 0 0 1,085 1,250 0 0 1,085 1,250 0 0 1,085 1,250 0 0 1,000 1,080 0.00% 0.00% SOIC 2 LAST 4Q 0 0 80 180 0 0 80 180 0 0 80 180 0 0 0 0 0.00% 0.00% TQFP 2 LAST 4Q 0 80 0 80 0 80 0 80 0.00% 2 LAST 4Q 0 160 0 160 0 160 0 160 0.00% 2 LAST 4Q 0 0 1,165 1,950 0 0 1,165 1,950 0 0 1,165 1,950 0 0 1,000 1,400 0.00% 0.00% UFBGA ATMEL RELIABILITY MONITOR % Defective 6 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST 168 Hours 500 Hours 1K Hours 96 Hours REJ SS REJ SS REJ SS REJ SS PACKAGE QTR MLF / QFN 2 LAST 4Q 0 0 0 0 0 0 0 250 500,000 0.00% PDIP 2 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 165 250 330,000 500,000 0.00% 0.00% SOIC 2 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 80 170 160,000 340,000 0.00% 0.00% TQFP 2 LAST 4Q 0 0 0 0 0 0 0 80 160,000 0.00% 2 LAST 4Q 0 0 0 0 0 0 0 160 320,000 0.00% 2 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 245 910 490,000 1,820,000 0.00% 0.00% UFBGA ATMEL RELIABILITY MONITOR Device-Hours* % Defective 7 Steam Pressure Pot 96 Hours REJ SS 168 Hours REJ SS 240 Hours REJ SS PACKAGE QTR PDIP 2 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 0.0% 0.0% ATMEL 2 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 0.00% 0.00% RELIABILITY MONITOR % Defective 8 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR 9 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR 10