View detail for

Reliability
Monitor
Report
High Temperature Operating Life
Data Retention Bake
Temperature Cycle
Temperature & Humidity Bias/ HAST
Steam Pressure Pot
First QUARTER 2016
Table of Contents
1. Executive Summary
1
2. HTOL (sorted by product BU)
2
3. HTOL (sorted by technology)
3
4. Data Retention Bake (sorted by product BU)
4
5. Data Retention Bake (sorted by technology)
5
6. Temperature Cycle
6
7. Temperature Humidity Bias & HAST
7
8. Steam Pressure Pot
8
9. Failure Rate Calculations
9
10. Definitions
10
RELIABILITY MONITOR
Reliability Monitor Report
Date:
January 29th, 2016
Executive Summary
The intent of the Reliability Monitor Program is to measure the reliability of previously
qualified devices on a quarterly basis. This is achieved by selecting representative
devices within a process, package or business unit and performing a series of reliability
tests to ensure that the reliability has maintained over time. Listed below are the
overall results for the last quarter.
1.
High Temperature Operating Life (125° - 150°C; 0 failures)
Failure Rate: 6 FITS (827,192 device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Also, Thermal and Voltage Acceleration are used to compute the overall
acceleration factor. Weighted acceleration factors (WAF) for a group of products are
calculated by taking the weighted average of each device’s acceleration factor multiplied
by its corresponding device hours. All failures were inconclusive.
2.
Data Retention Bake (150°C; 0 failures)
Failure Rate: 10 FITS (820,000 device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Since there is no bias applied during testing and the stress temperature is fixed for
all devices at 150°C, the acceleration factor is 117 for all groupings.
3.
Temperature Cycle (-65°C to 150°C, 500 cycles) *
Failure Rate: 0.00% (0 failures out of 1,400 units)
4.
Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) *
Failure Rate: 0.00% (0 failures out of 2.096M device-hours)
Note: A 20:1 Acceleration Factor is used to combine HAST results with THB).
5.
Steam Pressure Pot (121°C/100%RH) *
Failure Rate: 0.00% (0 failures out of 240 units)
RELIABILITY MONITOR
1
High Temperature Operating Life
(sorted by FAMILY)
48 Hours
REJ
SS
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ SS
BU
QTR
ASIC
4
LAST 4Q
0
45
0
45
0
45
0
MEMORY
4
LAST 4Q
0
0
350
350
0
0
350
350
0
0
80
80
MCU
4
LAST 4Q
0
0
1,948
3,164
0
0
639
1,855
0
0
RFA
4
LAST 4Q
0
4,820
0
462
4
LAST 4Q
0
0
2,298
8,379
0
0
989
2,712
ATMEL
Device-Hours*
WAF
EFR PPM
FITS
45
45,000
213
0
95
0
0
80
80
125,360
125,360
193
193
0
0
38
38
639
1,855
0
0
639
1,174
701,832
1,577,332
193
203
0
0
7
3
0
462
0
462
671,184
193
0
7
0
0
719
2,442
0
0
719
1,761
827,192
2,418,876
193
200
0
0
6
2
RELIABILITY MONITOR
2
High Temperature Operating Life
(sorted by TECHNOLOGY)
48 Hours
REJ
SS
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
2K Hours
REJ
SS
TECH
QTR
92K
4
LAST 4Q
0
0
330
330
0
0
80
80
0
0
80
80
0
0
80
80
0
0
75K
4
LAST 4Q
0
1,829
0
363
0
363
0
363
4
LAST 4Q
0
798
0
798
0
798
0
66K
4
LAST 4Q
0
0
888
888
0
0
79
79
0
0
79
79
59.9K
4
LAST 4Q
0
40
0
40
0
59K
4
LAST 4Q
0
0
400
480
0
0
400
480
58.97K
4
LAST 4Q
0
1,600
0
58.8K
4
LAST 4Q
0
0
330
419
46K
4
LAST 4Q
0
0
45.2K
4
LAST 4Q
35.9K
19.6K
66.2K
ATMEL
Device-Hours*
WAF
EFR PPM
FITS
0
0
92,000
92,000
193
193
0
0
52
52
0
0
433,368
203
0
10
157
0
0
477,500
213
0
9
0
0
79
79
0
0
0
0
117,832
117,832
193
0
40
#DIV/0!
40
0
0
0
0
20,000
213
0
215
0
0
400
480
0
0
400
480
0
0
0
0
400,000
480,000
193
193
0
0
12
10
154
0
154
0
154
0
0
223,408
193
0
21
0
0
80
169
0
0
80
169
0
0
80
169
0
0
0
0
92,000
181,000
193
203
0
0
52
25
270
270
0
0
270
270
0
0
0
0
0
0
0
0
0
0
0
0
45,360
45,360
193
0
105
#DIV/0!
0
1,600
0
154
0
154
0
154
0
0
223,408
193
0
21
4
LAST 4Q
0
0
80
80
0
0
80
80
0
0
80
80
0
0
80
80
0
0
0
0
80,000
80,000
193
193
0
0
59
59
4
LAST 4Q
0
45
0
45
0
45
0
45
0
0
45,000
213
0
95
4
LAST 4Q
0
0
2,298
8,379
0
0
989
2,712
0
0
719
2,442
0
0
719
1,761
0
0
0
0
827,192
2,418,876
193
198
0
0
6
2
RELIABILITY MONITOR
3
Data Retention Bake
(sorted by FAMILY)
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
BU
QTR
ASIC
4
LAST 4Q
0
74
0
74
0
MEMORY
4
LAST 4Q
0
0
80
80
0
0
80
80
MCU
4
LAST 4Q
0
0
1,560
3,920
0
0
RFA
4
LAST 4Q
0
302
4
LAST 4Q
0
0
1,640
4,376
ATMEL
Device-Hours
AF
FITS
0
37,000
117
212
0
0
0
0
40,000
40,000
117
117
196
196
1,560
3,920
0
0
0
995
780,000
2,457,500
117
117
10
3
0
302
0
302
302,000
117
26
0
0
1,640
4,376
0
0
0
1,297
820,000
2,836,500
117
117
10
3
RELIABILITY MONITOR
4
Data Retention Bake
(sorted by TECHNOLOGY)
168 Hours
REJ
SS
500 Hours
REJ
SS
1K Hours
REJ
SS
TECH
QTR
92K
4
LAST 4Q
0
160
0
160
0
160
160,000
117
49
4
LAST 4Q
0
205
0
205
0
205
205,000
117
38
66K
4
LAST 4Q
0
0
80
80
0
0
80
80
0
0
0
0
40,000
40,000
117
117
196
196
62.2K
4
LAST 4Q
0
80
0
80
0
80
80,000
117
98
4
LAST 4Q
0
40
0
40
0
0
20,000
117
392
59K
4
LAST 4Q
0
0
800
1,360
0
0
800
1,360
0
0
0
560
400,000
960,000
117
117
20
8
58.97K
4
LAST 4Q
0
90
0
90
0
90
90,000
117
87
58.8K
4
LAST 4Q
0
0
80
160
0
0
80
160
0
0
0
0
40,000
80,000
117
117
196
98
45.2K
4
LAST 4Q
0
122
0
122
0
122
122,000
117
64
35.9K
4
LAST 4Q
0
0
80
80
0
0
80
80
0
0
0
0
40,000
40,000
117
117
196
196
35.4K
4
LAST 4Q
0
0
600
925
0
0
600
925
0
0
0
80
300,000
502,500
117
117
26
16
19.6K
4
LAST 4Q
0
1,074
0
1,074
0
0
537,000
117
15
4
LAST 4Q
0
0
1,640
4,376
0
0
1,640
4,376
0
0
0
1,297
820,000
2,836,500
117
117
10
3
75
59.9K
ATMEL
RELIABILITY MONITOR
Device-Hours AF
FITS
5
Temperature Cycle
100 Cycles
REJ
SS
200 Cycles
REJ
SS
500 Cycles
REJ
SS
1K Cycles
REJ
SS
PACKAGE
QTR
CBGA
4
LAST 4Q
0
80
0
80
0
80
0
0
0.00%
4
LAST 4Q
0
80
0
80
0
80
0
0
0.00%
MLF / QFN
4
LAST 4Q
0
0
1,160
2,305
0
0
1,160
2,305
0
0
1,160
2,305
0
0
1,080
2,025
0.00%
0.00%
PDIP
4
LAST 4Q
0
1,250
0
1,250
0
1,250
0
1,080
0.00%
4
LAST 4Q
0
257
0
257
0
257
0
77
0.00%
4
LAST 4Q
0
80
0
80
0
80
0
0
0.00%
TQFP
4
LAST 4Q
0
0
240
400
0
0
240
400
0
0
240
400
0
0
240
400
0.00%
0.00%
ATMEL
4
LAST 4Q
0
0
1,400
4,452
0
0
1,400
4,452
0
0
1,400
4,452
0
0
1,320
3,582
0.00%
0.00%
LQFP
SOIC
TFBGA
RELIABILITY MONITOR
% Defective
6
Temperature Humidity Bias / HAST
Temperature Humidity Bias
HAST
168 Hours 500 Hours 1K Hours 96 Hours
REJ SS REJ SS REJ SS REJ SS
PACKAGE
QTR
CBGA
4
LAST 4Q
0
0
0
0
0
0
0
80
160,000
0.00%
4
LAST 4Q
0
0
0
0
0
0
0
80
160,000
0.00%
4
LAST 4Q
0
0
0
0
0
0
0
0
808
1,923
1,616,000
3,846,000
0.00%
0.00%
4
LAST 4Q
0
0
0
0
0
0
0
250
500,000
0.00%
4
LAST 4Q
0
0
0
0
0
0
0
247
494,000
0.00%
4
LAST 4Q
0
0
0
0
0
0
0
0
240
400
480,000
800,000
0.00%
0.00%
4
LAST 4Q
0
0
0
0
0
0
0
80
160,000
0.00%
4
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1,048
3,060
2,096,000
6,120,000
0.00%
0.00%
LQFP
MLF / QFN
PDIP
SOIC
TQFP
TFBGA
ATMEL
RELIABILITY MONITOR
Device-Hours* % Defective
7
Steam Pressure Pot
96 Hours
REJ
SS
168 Hours
REJ
SS
240 Hours
REJ
SS
PACKAGE
QTR
MLF / QFN
4
LAST 4Q
0
0
160
160
0
0
160
160
0
0
160
160
0.0%
0.0%
PDIP
4
LAST 4Q
0
80
0
80
0
80
0.0%
TQFP
4
LAST 4Q
0
0
80
80
0
0
80
80
0
0
80
80
0.0%
0.0%
ATMEL
4
LAST 4Q
0
0
240
320
0
0
240
320
0
0
240
320
0.00%
0.00%
RELIABILITY MONITOR
% Defective
8
Failure Rate Calculations
Failure Rate:
χ2
λ =
where,
λ
χ2
α
n
AF
DH
=
=
=
=
=
=
(1 −
α
100
, 2⋅n + 2 )
⋅ 109
2 ⋅ AF ⋅ DH
Failure Rate (FITS)
Failure Estimate
Confidence Level (60% or 90%)
Number of Failures
Overall Acceleration Factor (TAF x VAF)
Device Hours
Thermal Acceleration:
TAF
where,
TAF
EA
k
T
f
s
P
θJA
=
=
=
=
=
=
=
=
= e

ea 
1
1
⋅
−

k  Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) 
Thermal Acceleration Factor
Activation Energy (eV)
Boltzman’s Constant (8.617 x 10-5 eV/°K)
Temperature (°K)
Field Conditions
Stress Conditions
Power Dissipation (W)
Thermal Resistance Coefficient - Junction to Ambient (°C/W)
Voltage Acceleration:
VAF
where,
VAF
Vs
Vn
Z
=
=
=
=
= eZ⋅
[ VS − Vn ]
Voltage Acceleration Factor
Stress Voltage (V)
Nominal Voltage (V)
Voltage Acceleration Constant (typically, 0.5 < Z < 1.0)
RELIABILITY MONITOR
9
Definitions
Data Retention Bake (DRB): This test is used to measure a device’s ability to retain
a charge for extended periods of time without applying voltage bias. Stressing
at high temperatures (150°C for plastic packages) accelerates any discharge
causing the memory state to change.
Failures In Time (FITS): This is the unit measure for expressing failure rates and is
identical to the expression PPM/K hours. For example, three failures out of a
million components tested for one thousand hours equates to 3 FITS.
High Temperature Operating Life (HTOL): The purpose of this test is to accelerate
thermally activated failure mechanisms through the use of high temperatures
(typically between 125°C and 150°C), increased voltage, and dynamic bias
conditions. Readouts at various time points are taken to determine the Early
Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in
defective parts per million (DPPM) and IFR is expressed in Failures in Time
(FITS at 55°C).
Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a
plastic packaged component’s ability to withstand harsh environmental
conditions with extreme temperature and humidity levels. The parts are
stressed to high temperature (130°C) and relative humidity (85%RH) conditions
in a biased state to achieve maximum acceleration.
Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged
component’s ability to withstand severe conditions of pressure (15 psig),
temperature (121°C), and humidity (100%RH).
Temperature Cycle (TC): This test is used to measure a product’s sensitivity to
thermal stresses due to differences in expansion and contraction characteristics
of the die and mold compound by repeated alternating temperature dwells
between high and low temperature extremes.
Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is
identical to HAST. The only difference is that HAST accelerates THB by a factor
of 20:1 due to the increase in temperature during test.
RELIABILITY MONITOR
10