Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot Third QUARTER 2012 Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product BU) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7 7. Temperature Humidity Bias & HAST 8 8. Steam Pressure Pot 9 9. Failure Rate Calculations 10 10. Definitions 11 RELIABILITY MONITOR REPORT Reliability Monitor Report Date: Oct 11, 2013 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) ✓ Failure Rate: 15 FITS (1,099,572 device-hours) ✓ Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) ✓ Failure Rate: 24 FITS (320K device-hours) ✓ Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * ✓ Failure Rate: 0.00% (0 failures out of 320 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * ✓ Failure Rate: 0.00% (0 failures out of 4,490K device-hours) ✓ Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * ✓ Failure Rate: 0.00% (0 failures out of 320 units) RELIABILITY MONITOR REPORT * indicates that preconditioning is performed prior to the stress test. 1 High Temperature Operating Life (sorted by FAMILY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR APG 2 LAST 4Q 0 0 0 246 0 0 0 246 0 0 0 246 0 0 2 LAST 4Q 0 0 0 600 0 0 0 600 0 0 0 600 MEMORY 2 LAST 4Q 0 0 599 1,771 0 0 160 960 0 0 MCU 2 LAST 4Q 0 0 0 6,073 0 0 0 961 RFA 2 LAST 4Q 0 0 1,146 8,813 0 0 ATMEL 2 LAST 4Q 0 0 1,745 17,503 0 0 ASIC Device-Hours* WAF EFR PPM FITS 0 246 0 246,000 0 23 0 0 164 0 0 0 400 0 500,000 0 19 0 0 98 160 960 0 0 160 959 181,072 998,428 84 53 0 0 60 17 0 0 0 782 0 0 0 308 0 820,448 0 38 0 0 30 1,146 3,610 0 0 1,146 3,610 0 0 691 2,077 918,500 3,016,244 50 122 0 0 20 2 1,306 6,377 0 0 1,306 6,198 0 0 851 3,990 1,099,572 5,581,120 56 84 0 0 15 2 RELIABILITY MONITOR REPORT 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH UHF6 UHF 48 Hours REJ SS 2 0 153 LAST 4Q 0 153 QTR 168 Hours REJ SS 0 153 0 153 500 Hours REJ SS 0 153 0 153 1K Hours REJ SS 0 0 0 0 Device-Hours* WAF EFR PPM FITS 76,500 76,500 42 42 0 0 287 287 2 LAST 4Q 0 231 0 231 0 231 0 77 154,000 84 0 102 70 2 LAST 4Q 0 77 0 77 0 77 0 0 38,500 117 0 203 2 LAST 4Q 0 77 0 77 0 77 0 77 77,000 42 0 285 IL4-12KC_PC 2 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0 0 77 77 77,000 77,000 42 42 0 0 285 285 BD1-2_P 2 LAST 4Q 0 0 157 157 0 0 157 157 0 0 157 157 0 0 157 157 157,000 157,000 6 6 0 0 987 987 BCDMOS 2 LAST 4Q 0 0 76 76 0 0 76 76 0 0 76 76 0 0 0 0 38,000 38,000 3 3 0 0 9,538 9,538 77K 2 LAST 4Q 0 0 73 73 0 0 73 73 0 0 73 73 0 0 73 73 73,000 73,000 96 96 0 0 130 130 40009 2 LAST 4Q 0 154 0 154 0 154 0 154 154,000 142 0 42 75K 2 LAST 4Q 0 0 379 1,967 0 0 379 687 0 0 379 687 0 0 307 615 343,000 712,440 52 241 0 0 51 5 63K 2 LAST 4Q 0 0 599 599 0 0 160 160 0 0 160 160 0 0 160 160 181,072 181,072 84 84 0 0 60 60 58K 2 LAST 4Q 0 1,652 0 333 0 154 0 77 208,884 3 0 1,476 2 LAST 4Q 0 345 0 345 0 345 0 300 322,500 21 0 133 2 LAST 4Q 0 210 0 210 0 210 0 100 155,000 16 0 376 2 LAST 4Q 0 246 0 246 0 246 0 246 246,000 23 0 164 2 LAST 4Q 0 385 0 385 0 385 0 154 269,500 142 0 24 45.5K 2 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0 0 77 77 77,000 77,000 96 96 0 0 124 124 45.1 K 2 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0 0 0 0 38,500 38,500 42 42 0 0 571 571 SCMOS3 SAC2NV 57K 56K 46K 45.6K RELIABILITY MONITOR REPORT 3 High Temperature Operating Life (sorted by TECHNOLOGY) 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS TECH QTR 45201 2 LAST 4Q 0 154 0 154 0 154 0 2 LAST 4Q 0 231 0 231 0 231 2 LAST 4Q 0 631 0 231 0 40.2K 2 LAST 4Q 0 0 77 77 0 0 77 77 38.6 K 2 LAST 4Q 0 3,754 0 2 LAST 4Q 0 5,451 2 LAST 4Q 0 2 1 4 3 LAST 4Q 0 0 0 0 0 45102 40K 35K 34K ATMEL Device-Hours* WAF EFR PPM FITS 154 154,000 142 0 42 0 0 38,500 142 0 168 231 0 231 250,200 117 0 31 0 0 77 77 0 0 0 0 38,500 38,500 117 117 0 0 203 203 231 0 231 0 231 400,104 55 0 41 0 1,658 0 1,658 0 831 1,426,564 49 0 13 292 0 100 0 100 0 99 108,716 42 0 202 1,745 6,586 5,963 3,209 17,503 0 0 0 0 0 1,306 1,469 1,711 1,891 6,377 0 0 0 0 0 1,306 1,469 1,532 1,891 6,198 0 0 0 0 0 851 744 1,120 1,275 3,990 1,099,572 1,352,116 1,560,168 1,569,264 5,581,120 56 54 132 82 84 0 0 0 0 0 15 13 4 7 2 * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR REPORT 4 Data Retention Bake (sorted by FAMILY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS BU QTR Device-Hours AF FITS MEMORY 2 LAST 4Q 0 0 240 557 0 0 240 557 0 0 240 557 240,000 557,000 117 117 33 14 MCU 2 LAST 4Q 0 0 80 1,102 0 0 80 1,022 0 0 80 942 80,000 995,440 117 117 98 8 ATMEL 2 LAST 4Q 0 0 320 1,659 0 0 320 1,579 0 0 320 1,499 320,000 1,552,440 117 117 24 5 RELIABILITY MONITOR REPORT 5 Data Retention Bake (sorted by TECHNOLOGY) 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS TECH QTR 63 K 2 LAST 4Q 0 0 160 320 0 0 160 320 0 0 160 320 160,000 320,000 117 117 49 24 58K 2 LAST 4Q 0 234 0 154 0 154 167,440 117 47 37K 2 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 80,000 80,000 117 117 98 98 35K 2 LAST 4Q 0 788 0 788 0 708 748,000 117 10 34K 2 LAST 4Q 0 0 80 157 0 0 80 157 0 0 80 157 80,000 157,000 117 117 98 50 19K 2 LAST 4Q 0 80 0 80 0 80 80,000 117 98 2 LAST 4Q 0 0 320 1,659 0 0 320 1,579 0 0 320 1,499 320,000 1,552,440 117 117 24 5 ATMEL Device-Hours AF RELIABILITY MONITOR REPORT 6 FITS Temperature Cycle 100 Cycles REJ SS 200 Cycles REJ SS 500 Cycles REJ SS 1K Cycles REJ SS PACKAGE QTR BGA 2 LAST 4Q 0 80 0 80 0 80 0 80 0.00% 2 LAST 4Q 0 79 0 79 0 79 0 79 0.00% 2 LAST 4Q 0 237 0 232 0 160 0 160 0.00% PDIP 2 LAST 4Q 0 0 160 237 0 0 160 237 0 0 160 237 0 0 160 237 0.00% 0.00% PLCC 2 LAST 4Q 0 79 0 79 0 79 0 79 0.00% SOIC 2 LAST 4Q 0 0 160 320 0 0 160 320 0 0 160 320 0 0 160 320 0.00% 0.00% TQFP 2 LAST 4Q 0 308 0 149 0 77 0 72 0.00% 2 LAST 4Q 0 0 320 1,340 0 0 320 1,176 0 0 320 1,032 0 0 320 1,027 0.00% 0.00% LGA MLF / QFN ATMEL RELIABILITY MONITOR REPORT % Defective 7 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST 168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective REJ SS REJ SS REJ SS REJ SS PACKAGE QTR MLF / QFN 2 LAST 4Q 0 693 0 693 0 693 0 0 1,078 4,161 2,156,000 9,015,000 0.00% 0.00% 2 LAST 4Q 0 154 0 154 0 153 0 616 1,385,500 0.00% 2 LAST 4Q 0 308 0 308 0 154 0 0 231,000 0.00% 2 LAST 4Q 0 1,155 0 1,155 0 1,000 0 0 2,245 6,179 4,490,000 13,435,500 0.00% 0.00% TQFP TRANS ATMEL RELIABILITY MONITOR REPORT 8 Steam Pressure Pot 96 Hours REJ SS 168 Hours REJ SS 240 Hours REJ SS PACKAGE QTR BGA 2 LAST 4Q 0 80 0 80 0 80 0.0% 2 LAST 4Q 0 80 0 80 0 80 0.0% 2 LAST 4Q 0 234 0 157 0 156 0.0% PDIP 2 LAST 4Q 0 0 160 237 0 0 160 237 0 0 160 237 0.0% 0.0% PLCC 2 LAST 4Q 0 80 0 80 0 80 0.0% SOIC 2 LAST 4Q 0 0 160 320 0 0 160 320 0 0 160 320 0.0% 0.0% TQFP 2 LAST 4Q 0 296 0 0 0 0 0.0% 2 LAST 4Q 0 0 320 1,327 0 0 320 954 0 0 320 953 0.00% 0.00% LGA MLF / QFN ATMEL RELIABILITY MONITOR REPORT % Defective 9 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR REPORT 10 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR REPORT 11