REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 09 – 32 and appendix A. - phn 02-02-11 Thomas M. Hess B Add Case outline U and T. Editorial changes throughout. - phn 03-06-03 Thomas M. Hess C Change maximum supply voltage range from 3.6 V to 4.0 V and from 5.5 V to 6.0 V, in 1.3. Correct testing conditions for Input/Output leakage cold sparing, IICS and IOCS, in table 1. Correct unit values for output short circuit current, IOSN and IOSP in table 1. Change footnote 2, 3 4, and 5 in table 1. Add seating plane values to case U ant T. - phn 04-07-20 Thomas M. Hess D Add device type 33 and case outline M, N, 4, 5, 6, 7, 8. Update boilerplate in according with MIL-PRF-38535 requirement. Editorial changes throughout. phn 07-01-24 Thomas M. Hess REV SHEET REV D D D D D D D D D D D D D D D D D D SHEET 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 REV D D D D D D D D D D D D D D D D D D D D SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 REV STATUS REV D B D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Phu H. Nguyen STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil CHECKED BY Phu H. Nguyen APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A Thomas M. Hess DRAWING APPROVAL DATE MICROCIRCUIT, DIGITAL, CMOS, MH1, GATE ARRAY, MONOLITHIC SILICON 01-07-26 REVISION LEVEL D SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 . 1 OF 5962-01B01 52 5962-E174-07 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN) in the applicable Altered Item Drawing (AID). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. Customizations (personalizations) for each design, including circuit organization, electrical performance characteristics, and test conditions, shall be specified in an Altered Item Drawing (AID) (see 3.3 herein). 1.2 PIN. The PIN is as shown in the following example: 5962 R Federal stock class designator \ RHA designator (see 1.2.1) 01B01 01 Q X X Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead Finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 02 03 04 05 06 07 08 TH1099ER TH1156ER TH1242ER TH1332ER TH1099ES TH1156ES TH1242ES TH1332ES 1/ 1/ 1/ 1/ 2/ 2/ 2/ 2/ 3/ 3/ 3/ 3/ 3/ 3/ 3/ 3/ 988,000 sites available MH1RT 1,558,000 sites available MH1RT 2,422,000 sites available MH1RT 3,319,000 sites available MH1RT 988,000 sites available MH1RT 1,558,000 sites available MH1RT 2,422,000 sites available MH1RT 3,319,000 sites available MH1RT 09 10 11 12 13 14 15 16 TH1M099ER TH1M156ER TH1M242ER TH1M332ER TH1M099ES TH1M156ES TH1M242ES TH1M332ES 1/ 1/ 1/ 1/ 2/ 2/ 2/ 2/ 4/ 4/ 4/ 4/ 4/ 4/ 4/ 4/ composite 988,000 sites MH1RT composite 1,558,000 sites MH1RT composite 2,422,000 sites MH1RT composite 3,319,000 sites MH1RT composite 988,000 sites MH1RT composite 1,558,000 sites MH1RT composite 2,422,000 sites MH1RT composite 3,319,000 sites MH1RT STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL B SHEET 2 Device type Generic number Circuit function 17 18 19 20 21 22 23 24 TH1099R TH1156R TH1242R TH1332R TH1099S TH1156S TH1242S TH1332S 1/ 1/ 1/ 1/ 2/ 2/ 2/ 2/ 3/ 3/ 3/ 3/ 3/ 3/ 3/ 3/ 988,000 sites available MH1 1,558,000 sites available MH1 2,422,000 sites available MH1 3,319,000 sites available MH1 988,000 sites available MH1 1,558,000 sites available MH1 2,422,000 sites available MH1 3,319,000 sites available MH1 25 26 27 28 29 30 31 32 TH1M099R TH1M156R TH1M242R TH1M332R TH1M099S TH1M156S TH1M242S TH1M332S 1/ 1/ 1/ 1/ 2/ 2/ 2/ 2/ 4/ 4/ 4/ 4/ 4/ 4/ 4/ 4/ composite 988,000 sites composite 1,558,000 sites composite 2,422,000 sites composite 3,319,000 sites composite 988,000 sites composite 1,558,000 sites composite 2,422,000 sites composite 3,319,000 sites 33 TH1256A MH1 MH1 MH1 MH1 MH1 MH1 MH1 MH1 FPGA conversion 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835, and as follows: Outline letter X Y Z U T M N 4 5 6 7 8 Descriptive designator Terminals See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 196 256 352 349 472 196 256 352 349 472 256 208 Package style Quad flatpack unformed leads Quad flatpack unformed leads Quad flatpack with non conductive tie bar Column grid array + interposer SCI Column grid array + interposer SCI Quad flatpack unformed leads – grounded lid Quad flatpack unformed leads – grounded lid Quad flatpack with non conductive tie bar – grounded lid Column grid array + interposer SCI – grounded lid Column grid array + interposer SCI – grounded lid Unformed leads quad flat pack with tie bar – grounded lid Unformed leads quad flat pack with tie bar – grounded lid 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. ________ 1/ 2/ 3/ 4/ These devices are capable of operating at 2.5, 3.0, 3.3 V. See table I for limits. These devices are capable of operating at 2.5, 3.0, 3.3 V and I/O are Tolerant/Compliant 5.0 V. See table I for limits. Device will be customized at metal levels. Device will be customized at base wafer and metal levels. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 3 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VDD) ....................................................... -0.5 V to 4.0 V Supply voltage range (VCC) ....................................................... -0.5 V to 6.0 V 3/ Input voltage range Low voltage range (VIN) ................................................ -0.5 V to VDD + 0.5 V 5 V compliant (VIN).......................................................... -0.5 V to VCC + 0.5 V 5 V tolerance (VIN) .......................................................... -0.5 V to 6.0 V Input pin current (IIN) Signal pin........................................................................ -10.0 mA to 10.0 mA Power pin........................................................................ -60 mA to 60 mA Lead temperature (soldering 10 sec) ......................................... +300oC 4/ Storage temperature range (Ts) ................................................. -65oC to +150oC Maximum junction temperature (TJ) .......................................... +175oC 1.4 Recommended operating conditions. Supply voltage range 1(VDD) ...................................................... Supply voltage range 2(VDD) ...................................................... Supply voltage range 3(VDD) ...................................................... Supply voltage range – interface IO (VCC) .................................. Ambient temperature (TA) .......................................................... 2.7 V to 3.3 V 2.3 V to 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V -55oC to 125oC 3/ 1.5 Radiation features. Maximum total dose available ................................................................................. 100 Krads 5/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. . Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 1/ 2/ 3/ 4/ 5/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. All voltages referenced to ground unless otherwise specified. VCC range is applicable to the inner peripheral interface when compliant buffers are used. Duration 10 sec maximum at a distance not less than 1.6 mm. Unless otherwise specified in the AID. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 4 2.2 Non Government Publications. The following document(s) form a part of this document to the extent specified herin. Unless otherwise specified, the issues of the documents(s) which are DOD adopted are those listed in the DODISS cited in the solicitation JEDEC PUB 95-1 – Design Requirements for Generic matrix Trays. (Applications for copies should be addressed to the Electronic Industry Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or at http://www.jedec.org) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q, and V shall be in accordance with MILPRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.3 AID requirements. All AIDs written against this SMD shall be sent to DSCC-VA. The following items shall be provided to the device manufacturer by the customer as part of an AID. Items 3.3.3 through 3.3.9 form a part of the manufacturer's design database/database archive. These items shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. As such, these items will not appear in the AID in the traditional sense. 3.3.1 Terminal connections and pin assignments. 3.3.2 Package type (see 1.2.4). 3.3.3 Functional block diagram (or equivalent VHDL behavioral description). 3.3.4 Logic diagram ( or equivalent structural VHDL description). 3.3.5 Pin function description. 3.3.6 Design tape # or design document name (i.e., net list). 3.3.7 Design functional tape # or name. 3.3.8 Test functional tape # or name. 3.3.9 Switching waveform(s). 3.3.10 Fault coverage. The extent of fault coverage is controlled by the quality of the customers design input, therefore fault coverage shall be specified by the customer. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 5 3.3.11 Device electrical performance characteristics. Device electrical performance characteristics shall include dc parametric (see table I herein for minimum requirements), functional, input to output ac parameters and any other data which would be considered required by a design engineer. All electrical performance characteristics apply over the full recommended case operating temperature range and specified test load conditions. 3.3.12 Maximum power dissipation. Maximum power dissipation shall be in accordance with the application specific design. 3.3.13 RHA post-irradiated electricals. For RHA devices supplied to this drawing, the RHA post irradiated electricals shall be specified in the AID. 3.4 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.5 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.6 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q, and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. The AID number shall be added to the marking by the manufacturer. 3.6.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.7 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.8 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.9 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.10 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.11 Microcircuit group assignment for device class M. Device classes M devices covered by this drawing shall be in microcircuit group number 123 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 6 TABLE I. Electrical performance characteristics. Test Symbol Low level input current (w/o pull-up or pull-down resistor) Low level input current Pull-up resistor PRU1 2/ Low level input current Pull-down resistor PRD1 High level input current (w/o pull-up or pull-down resistor) High level input current Pull-up resistor PRU1 High level input current Pull-down resistor PRD1 3/ High impedance state output current Low level input voltage High level input voltage Input leakage current cold sparing Output leakage current cold sparing Output low voltage 4/ Output high voltage 5/ Output short circuit current 6/ Output short circuit current 6/ Input capacitance Output capacitance I/O capacitance 6/ 6/ 6/ IIL IILPU IILPD IIH IIHPU IIHPD IOZ VIL VIH IICS IOCS VOL VOH IOSN IOSP Conditions 1/ -55°C ≤ TC ≤ 125°C 2.3 V ≤ VDD ≤ 2.7 V unless otherwise specified for device operate at VDD = 2.5 V VIN = VSS, CMOS buffers VIN = VSS, CMOS buffers VIN = VSS, CMOS buffers VIN = VDD, CMOS buffers VIN = VDD, CMOS buffers VIN = VDD, CMOS buffers VIN = VDD or VSS, VDD = VDD max, All buffers CMOS buffers Group A Subgroups Limits Device type Units Min Max 1,2,3 All -1 1 µA 1,2,3 All 70 230 µA 1,2,3 All -5 5 µA 1,2,3 All -1 1 µA 1,2,3 All -5 5 µA 1,2,3 All 70 540 µA 1,2,3 All -1 1 0.3 VDD 1,2,3 All 1,2,3 All 1,2,3 All -2 2 µA 1,2,3 All -2 2 µA 1,2,3 All 0.4 V 1,2,3 All 1,2,3 All 15 mA 1,2,3 4 4 4 All All All All 8 2.4 5.6 6.6 mA CMOS buffers 0.7 VDD VDD = VSS = 0 V, VIN = 0 to VDD max, PICZ buffers VDD = VSS = 0 V, VOUT = 0 to VDD max, PO11Z buffers IOL = 0.8 mA, VDD = VDD min, PO11 buffers IOH = -0.6 mA, VDD = VDD min, PO11 buffers PO11 output at low level shortened to VDD PO11 output at high level shortened to VSS CIN COUT CI/O µA V V V 2.0 pF pF pF See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Symbol Low level input current (w/o pull-up or pull-down resistor) Low level input current Pull-up resistor PRU1 2/ Low level input current Pull-down resistor PRD1 High level input current (w/o pull-up or pull-down resistor) High level input current Pull-up resistor PRU1 High level input current Pull-down resistor PRD1 3/ High impedance state output current IIL Low level input voltage IILPU IILPD IIH IIHPU IIHPD IOZ VIL High level input voltage VIH Input leakage current cold sparing IICS Output leakage current cold sparing IOCS Output low voltage VOL 4/ Output high voltage 5/ Output short circuit current Output short circuit current Input capacitance Output capacitance I/O capacitance 6/ 6/ 6/ VOH 6/ 6/ IOSN IOSP Conditions 1/ -55°C ≤ TC ≤ 125°C 2.7 V ≤ VDD ≤ 3.3 V unless otherwise specified for device operate at VDD = 3.0 V Group A Subgroups VIN = VSS, CMOS buffers VIN = VSS, CMOS buffers VIN = VSS, CMOS buffers VIN = VDD, CMOS buffers VIN = VDD, CMOS buffers VIN = VDD, CMOS buffers VIN = VDD or VSS, VDD = VDD max, All buffers, no pull resistor CMOS buffers Device type Units Limits Min Max 1,2,3 All -1 1 µA 1,2,3 All 108 330 µA 1,2,3 All -5 5 µA 1,2,3 All -1 1 µA 1,2,3 All -5 5 µA 1,2,3 All 108 825 µA 1,2,3 All -1 1 µA 1,2,3 All 0.8 V 1,2,3 All 2.0 1,2,3 All -2 2 µA 1,2,3 All -2 2 µA 1,2,3 All 0.4 V 1,2,3 All 1,2,3 All 21 mA 1,2,3 4 4 4 All All All All 12 2.4 5.6 6.6 mA CMOS buffers VDD = VSS = 0 V, VIN = 0 to VDD max, PICZ buffers VDD = VSS = 0 V, VOUT = 0 to VDD max, PO11Z buffers IOL = 1 mA, VDD = VDD min, PO11 buffers IOH = -0.8 mA, VDD = VDD min, PO11 buffers PO11 output at low level shortened to VDD PO11 output at high level shortened to VSS CIN COUT CI/O V V 2.4 pF pF pF See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 8 TABLE I. Electrical performance characteristics - Continued. Test Symbol Low level input current (w/o pull-up or pull-down resistor) Low level input current Pull-up resistor PRU1 2/ Low level input current Pull-down resistor PRD1 High level input current (w/o pull-up or pull-down resistor) High level input current Pull-up resistor PRU1 High level input current Pull-down resistor PRD1 3/ High impedance state output current Low level input voltage IIL IILPU IILPD IIH IIHPU IIHPD IOZ VIL High level input voltage VIH Input leakage current cold sparing IICS Output leakage current cold sparing IOCS Output low voltage VOL 4/ Output high voltage 5/ Output short circuit current Output short circuit current Input capacitance Output capacitance I/O capacitance Conditions 1/ -55°C ≤ TC ≤ 125°C 3.0 V ≤ VDD ≤ 3.6 V unless otherwise specified for device operate at VDD = 3.3 V 6/ 6/ 6/ VOH 6/ 6/ IOSN IOSP Group A Subgroups VIN = VSS, CMOS buffers VIN = VSS, CMOS buffers VIN = VSS, CMOS buffers VIN = VDD, CMOS buffers VIN = VDD, CMOS buffers VIN = VDD, CMOS buffers VIN = VDD or VSS, VDD = VDD max, All buffers CMOS buffers Device type Units Limits Min Max 1,2,3 All -1 1 µA 1,2,3 All 120 400 µA 1,2,3 All -5 5 µA 1,2,3 All -1 1 µA 1,2,3 All -5 5 µA 1,2,3 All 150 900 µA 1,2,3 All -1 1 µA 1,2,3 All 0.8 V 1,2,3 All 2.0 1,2,3 All -2 2 µA 1,2,3 All -2 2 µA 1,2,3 All 0.4 V 1,2,3 All 1,2,3 All 23 mA 1,2,3 4 4 4 All All All All 13 2.4 5.6 6.6 mA CMOS buffers VDD = VSS = 0 V, VIN = 0 to VDD max, PICZ buffers VDD = VSS = 0 V, VOUT = 0 to VDD max, PO11Z buffers IOL = 2 mA, VDD = VDD min, PO11 buffers IOH = -1.8 mA, VDD = VDD min, PO11 buffers PO11 output at low level shortened to VDD PO11 output at high level shortened to VSS CIN COUT CI/O V V 2.4 pF pF pF See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 9 TABLE I. Electrical performance characteristics – Continued. Test Symbol Low level input current (w/o pull-up or pull-down resistor) Low level input current Pull-up resistor PRU1 2/ Low level input current Pull-down resistor PRD1 High level input current (w/o pull-up or pull-down resistor) IIL IILPU IILPD IIH High level input current Pull-up resistor PRU1 IIHPU High level input current Pull-down resistor PRD1 3/ IIHPD High impedance state output current Low level input voltage High level input voltage Input leakage current cold sparing Output leakage current cold sparing Output low voltage 4/ Output high voltage 5/ IOZ VIL VIH IICS IOCS VOL VOH Conditions 1/ -55°C ≤ TC ≤ 125°C 2.3 V ≤ VDD ≤ 3.6 V 7/ 4.5 V ≤ VCC ≤ 5.5 V 8/ unless otherwise specified for bi-voltage operating devices VIN = VSS, CMOS buffers VIN = VSS, CMOS buffers VIN = VSS, CMOS buffers VIN = VCC, VDD = VDD max, VCC = VCC max, CMOS buffers VIN = VCC, VDD = VDD max, VCC = VCC max, CMOS buffers VIN = VCC, VDD = VDD max, VCC = VCC max, CMOS buffers VIN = VCC or VSS, VDD = VDD max, VCC = VCC max, All buffers CMOS buffers Group A Subgroups Device type Limits Min Max 1,2,3 9/ -1 1 µA 1,2,3 9/ 180 690 µA 1,2,3 9/ -5 5 µA 1,2,3 9/ -1 1 µA 1,2,3 9/ -5 5 µA 1,2,3 9/ 30 400 µA 1,2,3 9/ -1 1 µA 1,2,3 9/ 0.8 V 1,2,3 9/ 2.0 1,2,3 9/ -2 2 µA 1,2,3 9/ -2 2 µA 1,2,3 9/ 0.4 V 1,2,3 9/ CMOS buffers VCC = VSS = 0 V, VIN = 0 to VDD max, PICZ buffers VDD = VSS = 0 V, VOUT = 0 to VDD max, PO11Z buffers VDD = VDD min, VCC = VCC min, VDD = VDD min (3.0 V / 3.3 V), VCC = VCC min Units V V 2.4 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 10 TABLE I. Electrical performance characteristics – Continued. Conditions Test 1/ -55°C ≤ TA ≤ 125°C Symbol 2.3 V ≤ VDD ≤ 3.6 V Group A Subgroups 7/ Device type 4.5 V ≤ VCC ≤ 5.5 V 8/ unless otherwise specified for bi-voltage operating devices Output high voltage 5/ Output short circuit current VOH 6/ Output short circuit current IOSN 6/ IOSP Threshold trigger input voltage 6/ VT+ Threshold trigger input voltage 6/ VT- Limits Min VDD = VDD min (2.5 V), VCC = VCC min 1,2,3 9/ PO11 output at low level shortened to VCC 1,2,3 9/ PO11 output at high level shortened to VSS 1,2,3 9/ 9/ Units Max V 2.0 28 mA 17 mA 2.0 V 9/ 0.8 9/ V Input capacitance 6/ CIN 4 2.4 pF Output capacitance 6/ COUT 4 9/ 5.6 pF I/O capacitance 6/ CI/O 4 9/ 6.6 pF See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 11 TABLE I. Electrical performance characteristics – Continued. Notes: 1/ Devices supplied to this drawing will meet all levels M, D, P, L and R of irradiation. However, this device is only tested at the 'R' level. Pre and Post irradiation values are identical unless otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level, TA = +25 C. Post irradiation electrical parameters shall be as specified in the AID. 2/ Standard pull-ups: PRU# where # = [1-31] index for Ron: Ron = # x R0 = 19 kΩ typ (12 to 30 kΩ ) in 2.5 V range. Ron = # x R0 = 15 kΩ typ (10 to 25 kΩ ) in 3.0 V range. Ron = # x R0 = 14 kΩ typ ( 9 to 25 kΩ ) in 3.3 V range. 5 V tolerant/compliant pull-ups: PRU# where # = [1-31] index for Ron: Ron = # x R0 = 14 kΩ typ ( 8 to 25kΩ ) in each range. 3/ Standard pull-downs: PRD# where # = [1-31] index for Ron: Ron = # x R0 = 11 kΩ typ (5 to 30 kΩ ) in 2.5 V range. Ron = # x R0 = 9 kΩ typ (4 to 25 kΩ ) in 3.0 V range. Ron = # x R0 = 8 kΩ typ ( 4 to 20 kΩ ) in 3.3 V range. 5 V tolerant/compliant pull-downs: PRD# where # = [1-31] index for Ron: Ron = # x R0 = 36 kΩ typ (17 to 80 kΩ ) in 2.5 V range. Ron = # x R0 = 23 kΩ typ (11 to 55 kΩ ) in 3.0 V range. Ron = # x R0 = 19 kΩ typ (9 to 45 kΩ ) in 3.3 V range. 4/ Output buffers: PO$# where $ = [1-12] quantity of output driving capability of p-channels. # = [1-12] quantity of output driving capability of n-channels. Standard buffers (including cold sparing) IO = 1.6, 1.8, 2.0 mA measured at VOL = 0.4, 0.4, 0.4 V in 2.5, 3.0, 3.3 V range respectively. Tolerance buffers (including cold sparing) IO = 1.0, 1.3, 1.4 mA measured at VOL = 0.4, 0.4, 0.4 V in 2.5, 3.0, 3.3 V range respectively. Compliant buffers (VCC = 4.5 V) IO = 1.1, 1.4, 1.6 mA measured at VOL = 0.4, 0.4, 0.4 V in 2.5, 3.0, 3.3 V range respectively. 5/ Output buffers: PO$# where $ = [1-12] quantity of output driving capability of p-channels. # = [1-12] quantity of output driving capability of n-channels. Standard buffers (including cold sparing) IO = -1.6, -1.8, -2.0 mA measured at VOH = 2.0, 2.4, 2.4 V in 2.5, 3.0, 3.3 V range respectively. Tolerance buffers (including cold sparing) IO = -1.0, -1.3, -1.4 mA measured at VOH = 2.0, 2.4, 2.4 V in 2.5, 3.0, 3.3 V range respectively. Compliant buffers (VCC = 4.5 V) IO = -1.1, -1.4, -1.6 mA measured at VOH = 2.0, 2.4, 2.4 V in 2.5, 3.0, 3.3 V range respectively. 6/ Tested at initial design and after major process changes, otherwise guaranteed. 7/ 5 V tolerant buffers. 8/ 5 V compliant buffers. 9/ Device types 5-8, 13-16,21-24, 29-32. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 12 CASE X Symbol Millimeters Inches Min Max Min Max A 2.13 2.65 .084 .104 A1 1.83 2.24 .072 A2 0.203 REF .088 .008 REF C 0.102 0.203 .004 .008 D/E 46.73 47.94 1.840 1.887 D1/E1 34.03 34.54 1.340 e 0.635 BSC f L 0.20 REF 6.35 .008 REF 6.70 N1/N2 1.360 .025 BSC .250 49 .264 49 FIGURE 1. Case Outline. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 13 Case Y Millimeters Symbol Inches Min Max Min Max A 2.41 3.18 .095 .125 C 0.10 0.20 .004 .008 D/D1 53.23 55.74 2.095 2.195 E/E1 36.83 37.34 1.450 1.470 e 0.508 BSC .020 BSC f 0.15 0.25 .006 .010 A1 2.06 2.56 .081 .101 A2 0.05 0.36 .002 .014 L 8.20 9.20 .323 .362 N1/N2 64 64 FIGURE 1. Case Outline – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 14 CASE Z Symbol A1 A2 b c D1/E1 e F Millimeters Min Max 2.35 3.15 0.05 0.35 0.19 0.25 0.11 0.20 47.52 48.48 0.50 Basic 4.50 5.50 Inches Min Max .092 .124 .002 .014 .007 .010 .004 .009 1.871 1.908 .0196 Basic .177 .217 Symbol G J K L L1 m Millimeters Min Max 2.50 2.60 0.75 1.05 0.50 74.85 76.40 74.60 75.40 2.50 2.65 Inches Min Max .098 .104 .029 .041 .020 2.947 3.008 2.937 2.969 .098 .104 FIGURE 1. Case Outline – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 15 Case U Millimeters Symbol Inches Min Max Min Max A 4.30 5.90 .169 .232 A1 1.40 1.85 .055 .073 A2 2.40 3.45 .094 .136 b 0.79 0.99 .031 .040 D/E 24.80 25.20 .976 .992 D1/E1 22.86 (1.27 x 18) .900 (.05 x 18) e 1.27 REF .050 REF NOTES: 1. 2. 3. 4. 5. 6. 7. All dimensions and tolerance conform to ANSI Y14.5 – 1994. Solder column position designation per JEDEC publication 95-1 standard procedures and practices SP-010. “e” represents the basic solder column grid pitch. Dimension b is measured at the maximum solder column diameter, parallel to primary datum. Primary datum and seating plane are defined by the ends of the solder columns. The A1 corner must be identified on the top surface of the package by using a corner chamfer, ink or metallized markings, indentation, or other feature of package body, lid or integral heat slug. Solder column array may be depopulated by any method, provided there is no pattern shifting. Depopulation is the omission of solder columns from a full matrix. Figure 1. Case Outline – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 16 Case T Symbol Millimeters Inches Min Max Min Max A 4.30 5.90 .169 .232 A1 1.40 1.85 .055 .073 A2 2.60 3.45 .102 .136 b 0.79 0.99 .031 .040 D/E 28.77 29.23 1.133 1.151 D1/E1 26.67 (1.27 x 21) 1.05 (.05 x 21) e 1.27 REF .050 REF NOTES: 1. 2. 3. 4. 5. 6. 7. All dimensions and tolerance conform to ANSI Y14.5 – 1994. Solder column position designation per JEDEC publication 95-1 standard procedures and practices SP-010. “e” represents the basic solder column grid pitch. Dimension b is measured at the maximum solder column diameter, parallel to primary datum. Primary datum and seating plane are defined by the ends of the solder columns. The A1 corner must be identified on the top surface of the package by using a corner chamfer, ink or metallized markings, indentation, or other feature of package body, lid or integral heat slug. Solder column array may be depopulated by any method, provided there is no pattern shifting. Depopulation is the omission of solder columns from a full matrix. Figure 1. Case Outline – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 17 CASE M Symbol A A1 A2 C D/E Millimeters Min Max 2.13 2.65 1.83 2.24 0.203 REF 0.102 0.203 46.73 47.94 Inches Min Max .084 .104 .072 .088 .008 REF .004 .008 1.840 1.887 Millimeters Min Max 34.03 34.54 0.635 BSC 0.20 REF 6.35 6.70 49 Symbol D1/E1 e f L N1/N2 Inches Min Max 1.340 1.360 .025 BSC .008 REF .250 .264 49 NOTE: 1. Lid is connected to ground. FIGURE 1. Case Outline - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 18 Case N Millimeters Symbol Inches Min Max Min Max A 2.41 3.18 .095 .125 C 0.10 0.20 .004 .008 D/D1 53.23 55.74 2.095 2.195 E/E1 36.83 37.34 1.450 1.470 e 0.508 BSC .020 BSC f 0.15 0.25 .006 .010 A1 2.06 2.56 .081 .101 A2 0.05 0.36 .002 .014 L 8.20 9.20 .323 .362 N1/N2 64 64 NOTE: 1. Lid is connected to ground. FIGURE 1. Case Outline – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 19 CASE 4 Symbol A1 A2 b c D1/E1 e F Millimeters Min Max 2.35 3.15 0.05 0.35 0.19 0.25 0.11 0.20 47.52 48.48 0.50 Basic 4.50 5.50 Inches Min Max .092 .124 .002 .014 .007 .010 .004 .009 1.871 1.908 .0196 Basic .177 .217 Symbol G J K L L1 m Millimeters Min Max 2.50 2.60 0.75 1.05 0.50 74.85 76.40 74.60 75.40 2.50 2.65 Inches Min Max .098 .104 .029 .041 .020 2.947 3.008 2.937 2.969 .098 .104 NOTE: 1. Lid is connected to ground. FIGURE 1. Case Outline – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 20 Case 5 Millimeters Symbol Inches Min Max Min Max A 4.30 5.90 .169 .232 A1 1.40 1.85 .055 .073 A2 2.40 3.45 .094 .136 b 0.79 0.99 .031 .040 D/E 24.80 25.20 .976 .992 D1/E1 22.86 (1.27 x 18) .900 (.05 x 18) e 1.27 REF .050 REF NOTES: 1. 2. 3. 4. 5. 6. 7. 8. All dimensions and tolerance conform to ANSI Y14.5 – 1994. Solder column position designation per JEDEC publication 95-1 standard procedures and practices SP-010. “e” represents the basic solder column grid pitch. Dimension b is measured at the maximum solder column diameter, parallel to primary datum. Primary datum and seating plane are defined by the ends of the solder columns. The A1 corner must be identified on the top surface of the package by using a corner chamfer, ink or metallized markings, indentation, or other feature of package body, lid or integral heat slug. Solder column array may be depopulated by any method, provided there is no pattern shifting. Depopulation is the omission of solder columns from a full matrix. Lid is connected to ground. Figure 1. Case Outline – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 21 Case 6 Symbol Millimeters Inches Min Max Min Max A 4.30 5.90 .169 .232 A1 1.40 1.85 .055 .073 A2 2.60 3.45 .102 .136 b 0.79 0.99 .031 .040 D/E 28.77 29.23 1.133 1.151 D1/E1 26.67 (1.27 x 21) 1.05 (.05 x 21) e 1.27 REF .050 REF NOTES: 1. 2. 3. 4. 5. 6. 7. 8. All dimensions and tolerance conform to ANSI Y14.5 – 1994. Solder column position designation per JEDEC publication 95-1 standard procedures and practices SP-010. “e” represents the basic solder column grid pitch. Dimension b is measured at the maximum solder column diameter, parallel to primary datum. Primary datum and seating plane are defined by the ends of the solder columns. The A1 corner must be identified on the top surface of the package by using a corner chamfer, ink or metallized markings, indentation, or other feature of package body, lid or integral heat slug. Solder column array may be depopulated by any method, provided there is no pattern shifting. Depopulation is the omission of solder columns from a full matrix. Lid is connected to ground. Figure 1. Case Outline – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 22 Case 7 Symbol A A1 A2 b c E1/D1 E2/D2 D3 Millimeters Min Max 2.50 3.22 2.06 2.56 0.20 BSC 0.20 TYP 0.10 0.20 35.64 36.36 31.50 BSC 65.90 BSC Inches Min Max .090 .127 .001 .101 .008 BSC .008 TYP .004 .008 1.403 1.431 1.240 BSC 2.594 BSC Symbol E4 E5 e L3 J K F Millimeters Min Max 70.00 BSC 74.60 75.40 0.50 BSC 56.30 BSC 0.77 1.03 0.25 7.05 8.45 Inches Min Max 2.756 BSC 2.937 2.968 .020 BSC 2.217 BSC .030 .040 .010 .277 .332 NOTE: 1. Lid is connected to ground. FIGURE 1. Case Outline – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 23 Case 8 Symbol A A1 A2 b c E1/D1 E2/D2 D3 Millimeters Min Max 2.40 3.20 2.06 2.56 0.20 BSC 0.20 TYP 0.10 0.20 28.96 29.46 25.50 BSC 65.90 BSC Inches Min Max .095 .126 .001 .101 .008 BSC .008 TYP .004 .008 1.14 1.16 1.004 BSC 2.594 BSC Symbol E4 E5 e L3 J K F Millimeters Min Max 70.00 BSC 74.60 75.40 0.50 BSC 56.30 BSC 0.76 1.02 0.25 7.05 8.45 Inches Min Max 2.756 BSC 2.937 2.968 .020 BSC 2.217 BSC .030 .040 .010 .277 .332 NOTE: 1. Lid is connected to ground. FIGURE 1. Case Outline – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 24 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q, and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, D or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535 appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the functionality of the device. For device classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 25 TABLE II. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MILSTD-883, method 5005, table I) Device class M 1,7,9 1,2,3,7,8,9,10,11 1/ 1,7,9 Subgroups (in accordance with MIL-PRF-38535, table III) Device class Q 1,7,9 Device class V 1,7,9 1,2,3,7,8,9, 10,11 1/ 1,7,9 1,2,3,7,8,9, 10,11 2/ 1,7,9 1,7,9 1,7,9 1,7,9 1,7,9 1,7,9 1,7,9 1,7,9 1,7,9 1,7,9 1/ PDA applies to subgroup 1. 2/ PDA applies to subgroups 1 and 7. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, D, or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MILSTD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 26 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). RHA levels for device classes M, Q, and V shall be as specified in MIL-I-38535. a. End-point electrical parameters shall be as specified in table II herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25oC ±5oC, after exposure, to the subgroups specified in table II herein. c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied. 4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method 1019 condition “B” unless otherwise specified in the AID. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.1.2 Substitutability. Device class Q will replace device class M. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 27 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 10. SCOPE 10.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QML plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part or Identification Number (PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN. 10.2 PIN. The PIN is as shown in the following example: 5962 ⏐ ⏐ ⏐ Federal stock class designator \ R ⏐ ⏐ ⏐ RHA designator (see 10.2.1) 01B01 01 ⏐ ⏐ ⏐ Device type (see 10.2.2) / Q ⏐ ⏐ ⏐ Device class designator (see 10.2.3) 9 ⏐ ⏐ ⏐ Die code A ⏐ ⏐ ⏐ Die Details (see 10.2.4) \/ Drawing number 10.2.1 RHA designator. Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die. 10.2.2 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number 01 02 03 04 05 06 07 08 MH1099ER MH1156ER MH1242ER MH1332ER MH1099ES MH1156ES MH1242ES MH1332ES 09 10 11 12 13 14 15 16 MH1M099ER MH1M156ER MH1M242ER MH1M332ER MH1M099ES MH1M156ES MH1M242ES MH1M332ES STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 Circuit function 988,000 sites available MH1RT 1,558,000 sites available MH1RT 2,422,000 sites available MH1RT 3,319,000 sites available MH1RT 988,000 sites available MH1RT 1,558,000 sites available MH1RT 2,422,000 sites available MH1RT 3,319,000 sites available MH1RT 1/ 1/ composite 988,000 sites MH1RT composite 1,558,000 sites MH1RT composite 2,422,000 sites MH1RT composite 3,319,000 sites MH1RT composite 988,000 sites MH1RT composite 1,558,000 sites MH1RT composite 2,422,000 sites MH1RT composite 3,319,000 sites MH1RT 1/ 1/ SIZE 5962-01B01 A REVISION LEVEL D SHEET 28 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Device type Generic number 17 18 19 20 21 22 23 24 MH1099R MH1156R MH1242R MH1332R MH1099S MH1156S MH1242S MH1332S 25 26 27 28 29 30 31 32 MH1M099R MH1M156R MH1M242R MH1M332R MH1M099S MH1M156S MH1M242S MH1M332S Circuit function 988,000 sites available MH1 1,558,000 sites available MH1 2,422,000 sites available MH1 3,319,000 sites available MH1 988,000 sites available MH1 1,558,000 sites available MH1 2,422,000 sites available MH1 3,319,000 sites available MH1 1/ 1/ composite 988,000 sites MH1 composite 1,55,000 sites MH1 composite 2,422,000 sites MH1 composite 3,319,000 sites MH1 composite 988,000 sites MH1 composite 1,558,000 sites MH1 composite 2,422,000 sites MH1 composite 3,319,000 sites MH1 1/ 1/ 10.2.3 Device class designator. Device class Q or V Device requirements documentation Certification and qualification to the die requirements of MIL-PRF-38535 10.2.4. Die Details. The die details designation shall be a unique letter which designates the die’s physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product and variant supplied to this appendix. 10.2.4.1 Die physical dimensions. Die type 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 Figure number A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 29 Die type Figure number 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available 10.2.4.2. Die bonding pad locations and electrical functions. Die type 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 Figure number A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available ______ 1/ Not yet available as die only STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 30 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 10.2.4.3. Interface materials. Die type 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 Figure number A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 31 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 10.2.4.4. Assembly related information. Die type 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 Figure number A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available A-1 A-2 A-3 A-4 reserved – not yet available 10.3. Absolute maximum ratings. See paragraph 1.3 within the body of this drawing for details. 10.4 Recommended operating conditions. See paragraph 1.4 within the body of this drawing for details. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 32 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 20. APPLICABLE DOCUMENTS. 20.1 Government specifications, standards, and handbooks. . Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 20.2. Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 30. REQUIREMENTS 30.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not effect the form, fit or function as described herein. 30.2 Design, construction and physical dimensions. The design, construction and physical dimensions shall be as specified in MIL-PRF-38535 and the manufacturer’s QM plan, for device classes Q and V and herein. 30.2.1 Die physical dimensions. The die physical dimensions shall be as specified in 10.2.4.1 and on figure A-1. 30.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be as specified in 10.2.4.2 and on figure A-1. 30.2.3 Interface materials. The interface materials for the die shall be as specified in 10.2.4.3 and on figure A-1. 30.2.4 Assembly related information. The assembly related information shall be as specified in 10.2.4.4 and figure A-1. 30.2.5 Truth table(s). The truth table(s) shall be as defined within paragraph 3.2.3. of the body of this document. 30.2.6 Radiation exposure circuit. The radiation exposure circuit shall be as defined within paragraph 3.2.4. of the body of this document. 30.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this document. 30.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing sufficient to make the packaged die capable of meeting the electrical performance requirements in table I. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 33 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 30.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN listed in 10.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535. 30.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML38535 listed manufacturer in order to supply to the requirements of this drawing (see 60.4 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein. 30.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuit die delivered to this drawing. 40. QUALITY ASSURANCE PROVISIONS 40.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modifications in the QM plan shall not effect the form, fit or function as described herein. 40.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the manufacturer’s QM plan. As a minimum it shall consist of: a) Wafer lot acceptance for Class V product using the criteria defined within H.3.2.3 as approved by the manufacturers TRB and the Qualifying activity. b) 100% wafer probe (see paragraph 30.4). c) 100% internal visual inspection to the applicable class Q or V criteria defined within MIL-STD-883 test method 2010 or the alternate procedures allowed within MIL-STD-883 test method 5004. 40.3 Conformance inspection. 40.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see 30.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified within paragraphs 4.4.4.1, 4.4.4.1.1., 4.4.4.2, 4.4.4.3, 4.4.4.4 and 4.4.4.5. 50. DIE CARRIER 50.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer’s QM plan or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and electrostatic protection. 60 NOTES 60.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications and logistics purposes. 60.2 Comments. Comments on this appendix should be directed to DSCC-VA, Columbus, Ohio, 43216-5000 or telephone (614)-692-0547. 60.3 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined within MILPRF-38535 and MIL-STD-1331. 60.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed within QML-38535 have submitted a certificate of compliance (see 30.6 herein) to DSCC-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 34 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Due to the complexity of the device , a graphical representation of the pad locations is not available .This figure shall be maintained and available from the device manufacturer. See subsequent pages for a table of pad locations. Die bonding pad locations and electrical functions – mask number 5542 Die physical dimensions. Die size: 8 624 x 8 624 microns ( with scribe line) Die thickness: 475 microns Interface materials. Top metallization: Aluminium + Copper Backside metallization: bare silicon Glassivation. Type: Oxinitride Thickness: 21,000 Angstroms Substrate: Single crystal silicon Assembly related information. Substrate potential: not connected Special assembly instructions: None Pads list : 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. X X X X X X X X X X 3866.5 3771.5 3676.5 3581.6 3486.6 3391.6 3296.6 3201.6 3106.6 3011.6 Y Y Y Y Y Y Y Y Y Y 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. X X X X X X X X X X 2916.6 2821.6 2726.6 2631.7 2536.7 2441.7 2346.7 2251.7 2156.7 2061.7 Y Y Y Y Y Y Y Y Y Y 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. X X X X X X X X X X 1966.7 1871.7 1776.7 1681.8 1586.8 1491.8 1396.8 1301.8 1206.8 1111.8 Y Y Y Y Y Y Y Y Y Y 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. X X X X X X X X X X 1016.8 921.8 826.8 731.9 636.9 541.9 446.9 351.9 256.9 161.9 Y Y Y Y Y Y Y Y Y Y 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 FIGURE A-1. Die bonding pad locations and electrical functions. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 35 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 41. 42. 43. 44. 45. 46. 47. 48. 49. 50. X X X X X X X X X X 66.9 -28.1 -123.1 -218.1 -313.0 -408.0 -503.0 -598.0 -693.0 -788.0 Y Y Y Y Y Y Y Y Y Y 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 81. 82. 83. 84. 85. 86. 87. 88. 89. 90. X X X X X X X X X X -3732.7 -3827.7 -3922.7 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 Y Y Y Y Y Y Y Y Y Y 4090.5 4090.5 4090.5 3866.5 3771.5 3676.5 3581.6 3486.6 3391.6 3296.6 51. 52. 53. 54. 55. 56. 57. 58. 59. 60. X X X X X X X X X X -883.0 -978.0 -1073.0 -1168.0 -1262.9 -1357.9 -1452.9 -1547.9 -1642.9 -1737.9 Y Y Y Y Y Y Y Y Y Y 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 91. 92. 93. 94. 95. 96. 97. 98. 99. 100. X X X X X X X X X X -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 Y Y Y Y Y Y Y Y Y Y 3201.6 3106.6 3011.6 2916.6 2821.6 2726.6 2631.7 2536.7 2441.7 2346.7 61. 62. 63. 64. 65. 66. 67. 68. 69. 70. X X X X X X X X X X -1832.9 -1927.9 -2022.9 -2117.8 -2212.8 -2307.8 -2402.8 -2497.8 -2592.8 -2687.8 Y Y Y Y Y Y Y Y Y Y 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 101. 102. 103. 104. 105. 106. 107. 108. 109. 110. X X X X X X X X X X -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 Y Y Y Y Y Y Y Y Y Y 2251.7 2156.7 2061.7 1966.7 1871.7 1776.7 1681.8 1586.8 1491.8 1396.8 71. 72. 73. 74. 75. 76. 77. 78. 79. 80. X X X X X X X X X X -2782.8 -2877.8 -2972.8 -3067.8 -3162.7 -3257.7 -3352.7 -3447.7 -3542.7 -3637.7 Y Y Y Y Y Y Y Y Y Y 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 111. 112. 113. 114. 115. 116. 117. 118. 119. 120. X X X X X X X X X X -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 Y Y Y Y Y Y Y Y Y Y 1301.8 1206.8 1111.8 1016.8 921.8 826.8 731.9 636.9 541.9 446.9 FIGURE A-1. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 36 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 121. 122. 123. 124. 125. 126. 127. 128. 129. 130. X X X X X X X X X X -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 Y Y Y Y Y Y Y Y Y Y 351.9 256.9 161.9 66.9 -28.1 -123.1 -218.1 -313.0 -408.0 -503.0 161. 162. 163. 164. 165. 166. 167. 168. 169. 170. X X X X X X X X X X -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -3866.5 -3771.5 -3676.5 -3581.6 Y Y Y Y Y Y Y Y Y Y -3447.7 -3542.7 -3637.7 -3732.7 -3827.7 -3922.7 -4090.5 -4090.5 -4090.5 -4090.5 131. 132. 133. 134. 135. 136. 137. 138. 139. 140. X X X X X X X X X X -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 Y Y Y Y Y Y Y Y Y Y -598.0 -693.0 -788.0 -883.0 -978.0 -1073.0 -1168.0 -1262.9 -1357.9 -1452.9 171. 172. 173. 174. 175. 176. 177. 178. 179. 180. X X X X X X X X X X -3486.6 -3391.6 -3296.6 -3201.6 -3106.6 -3011.6 -2916.6 -2821.6 -2726.6 -2631.7 Y Y Y Y Y Y Y Y Y Y -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 141. 142. 143. 144. 145. 146. 147. 148. 149. 150. X X X X X X X X X X -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 Y Y Y Y Y Y Y Y Y Y -1547.9 -1642.9 -1737.9 -1832.9 -1927.9 -2022.9 -2117.8 -2212.8 -2307.8 -2402.8 181. 182. 183. 184. 185. 186. 187. 188. 189. 190. X X X X X X X X X X -2536.7 -2441.7 -2346.7 -2251.7 -2156.7 -2061.7 -1966.7 -1871.7 -1776.7 -1681.8 Y Y Y Y Y Y Y Y Y Y -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 151. 152. 153. 154. 155. 156. 157. 158. 159. 160. X X X X X X X X X X -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 Y Y Y Y Y Y Y Y Y Y -2497.8 -2592.8 -2687.8 -2782.8 -2877.8 -2972.8 -3067.8 -3162.7 -3257.7 -3352.7 191. 192. 193. 194. 195. 196. 197. 198. 199. 200. X X X X X X X X X X -1586.8 -1491.8 -1396.8 -1301.8 -1206.8 -1111.8 -1016.8 -921.8 -826.8 -731.9 Y -4090.5 Y -4090.5 Y -4090.5 Y -4090.5 Y -4090.5 Y -4090.5 Y -4090.5 Y -4090.5 Y -4090.5 Y -4090.5 FIGURE A-1. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 37 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 201. 202. 203. 204. 205. 206. 207. 208. 209. 210. X X X X X X X X X X -636.9 -541.9 -446.9 -351.9 -256.9 -161.9 -66.9 28.1 123.1 218.1 Y -4090.5 Y -4090.5 Y -4090.5 Y -4090.5 Y -4090.5 Y -4090.5 Y -4090.5 Y -4090.5 Y -4090.5 Y -4090.5 241. 242. 243. 244. 245. 246. 247. 248. 249. 250. X X X X X X X X X X 3162.7 3257.7 3352.7 3447.7 3542.7 3637.7 3732.7 3827.7 3922.7 4090.5 Y Y Y Y Y Y Y Y Y Y -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -3866.5 211. 212. 213. 214. 215. 216. 217. 218. 219. 220. X X X X X X X X X X 313.0 408.0 503.0 598.0 693.0 788.0 883.0 978.0 1073.0 1168.0 Y Y Y Y Y Y Y Y Y Y -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 251. 252. 253. 254. 255. 256. 257. 258. 259. 260. X X X X X X X X X X 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 Y Y Y Y Y Y Y Y Y Y -3771.5 -3676.5 -3581.6 -3486.6 -3391.6 -3296.6 -3201.6 -3106.6 -3011.6 -2916.6 221. 222. 223. 224. 225. 226. 227. 228. 229. 230. X X X X X X X X X X 1262.9 1357.9 1452.9 1547.9 1642.9 1737.9 1832.9 1927.9 2022.9 2117.8 Y Y Y Y Y Y Y Y Y Y -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 261. 262. 263. 264. 265. 266. 267. 268. 269. 270. X X X X X X X X X X 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 Y Y Y Y Y Y Y Y Y Y -2821.6 -2726.6 -2631.7 -2536.7 -2441.7 -2346.7 -2251.7 -2156.7 -2061.7 -1966.7 231. 232. 233. 234. 235. 236. 237. 238. 239. 240. X X X X X X X X X X 2212.8 2307.8 2402.8 2497.8 2592.8 2687.8 2782.8 2877.8 2972.8 3067.8 Y Y Y Y Y Y Y Y Y Y -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 -4090.5 271. 272. 273. 274. 275. 276. 277. 278. 279. 280. X X X X X X X X X X 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 Y Y Y Y Y Y Y Y Y Y -1871.7 -1776.7 -1681.8 -1586.8 -1491.8 -1396.8 -1301.8 -1206.8 -1111.8 -1016.8 FIGURE A-1. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 38 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 281. 282. 283. 284. 285. 286. 287. 288. 289. 290. X X X X X X X X X X 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 Y Y Y Y Y Y Y Y Y Y -921.8 -826.8 -731.9 -636.9 -541.9 -446.9 -351.9 -256.9 -161.9 -66.9 311. 312. 313. 314. 315. 316. 317. 318. 319. 320. X X X X X X X X X X 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 Y Y Y Y Y Y Y Y Y Y 1927.9 2022.9 2117.8 2212.8 2307.8 2402.8 2497.8 2592.8 2687.8 2782.8 291. 292. 293. 294. 295. 296. 297. 298. 299. 300. X X X X X X X X X X 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 Y Y Y Y Y Y Y Y Y Y 28.1 123.1 218.1 313.0 408.0 503.0 598.0 693.0 788.0 883.0 321. 322. 323. 324. 325. 326. 327. 328. 329. 330. X X X X X X X X X X 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 Y Y Y Y Y Y Y Y Y Y 2877.8 2972.8 3067.8 3162.7 3257.7 3352.7 3447.7 3542.7 3637.7 3732.7 301. 302. 303. 304. 305. 306. 307. 308. 309. 310. X X X X X X X X X X 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 4090.5 Y Y Y Y Y Y Y Y Y Y 978.0 1073.0 1168.0 1262.9 1357.9 1452.9 1547.9 1642.9 1737.9 1832.9 331. 332. X X 4090.5 4090.5 Y Y 3827.7 3922.7 FIGURE A-1. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 39 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Due to the complexity of the device , a graphical representation of the pad locations is not available .This figure shall be maintained and available from the device manufacturer. See subsequent pages for a table of pad locations. Die bonding pad locations and electrical functions – mask number 5543 Die physical dimensions. Die size: 10 528 x 10 528 microns ( with scribe line) Die thickness: 475 microns Interface materials. Top metallization: Aluminium + Copper Backside metallization: bare silicon Glassivation. Type: Oxinitride Thickness: 21,000 Angstroms Substrate: Single crystal silicon Assembly related information. Substrate potential: not connected Special assembly instructions: None Pads list : 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. X X X X X X X X X X 4816.4 4721.4 4626.4 4531.4 4436.5 4341.5 4246.5 4151.5 4056.5 3961.5 Y Y Y Y Y Y Y Y Y Y 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. X X X X X X X X X X 3866.5 3771.5 3676.5 3581.6 3486.6 3391.6 3296.6 3201.6 3106.6 3011.6 Y Y Y Y Y Y Y Y Y Y 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 FIGURE A-2. Die bonding pad locations and electrical functions. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 40 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. X X X X X X X X X X 2916.6 2821.6 2726.6 2631.7 2536.7 2441.7 2346.7 2251.7 2156.7 2061.7 Y Y Y Y Y Y Y Y Y Y 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 61. 62. 63. 64. 65. 66. 67. 68. 69. 70. X X X X X X X X X X -883.0 -978.0 -1073.0 -1168.0 -1262.9 -1357.9 -1452.9 -1547.9 -1642.9 -1737.9 Y Y Y Y Y Y Y Y Y Y 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. X X X X X X X X X X 1966.7 1871.7 1776.7 1681.8 1586.8 1491.8 1396.8 1301.8 1206.8 1111.8 Y Y Y Y Y Y Y Y Y Y 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 71. 72. 73. 74. 75. 76. 77. 78. 79. 80. X X X X X X X X X X -1832.9 -1927.9 -2022.9 -2117.8 -2212.8 -2307.8 -2402.8 -2497.8 -2592.8 -2687.8 Y Y Y Y Y Y Y Y Y Y 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 41. 42. 43. 44. 45. 46. 47. 48. 49. 50. X X X X X X X X X X 1016.8 921.8 826.8 731.9 636.9 541.9 446.9 351.9 256.9 161.9 Y Y Y Y Y Y Y Y Y Y 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 81. 82. 83. 84. 85. 86. 87. 88. 89. 90. X X X X X X X X X X -2782.8 -2877.8 -2972.8 -3067.8 -3162.7 -3257.7 -3352.7 -3447.7 -3542.7 -3637.7 Y Y Y Y Y Y Y Y Y Y 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 51. 52. 53. 54. 55. 56. 57. 58. 59. 60. X X X X X X X X X X 66.9 -28.1 -123.1 -218.1 -313.0 -408.0 -503.0 -598.0 -693.0 -788.0 Y Y Y Y Y Y Y Y Y Y 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 91. 92. 93. 94. 95. 96. 97. 98. 99. 100. X X X X X X X X X X -3732.7 -3827.7 -3922.7 -4017.7 -4112.6 -4207.6 -4302.6 -4397.6 -4492.6 -4587.6 Y Y Y Y Y Y Y Y Y Y 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 FIGURE A-2. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 41 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 101. 102. 103. 104. 105. 106. 107. 108. 109. 110. X X X X X X X X X X -4682.6 -4777.6 -4872.6 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 Y Y Y Y Y Y Y Y Y Y 5040.4 5040.4 5040.4 4816.4 4721.4 4626.4 4531.4 4436.5 4341.5 4246.5 141. 142. 143. 144. 145. 146. 147. 148. 149. 150. X X X X X X X X X X -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 Y Y Y Y Y Y Y Y Y Y 1301.8 1206.8 1111.8 1016.8 921.8 826.8 731.9 636.9 541.9 446.9 111. 112. 113. 114. 115. 116. 117. 118. 119. 120. X X X X X X X X X X -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 Y Y Y Y Y Y Y Y Y Y 4151.5 4056.5 3961.5 3866.5 3771.5 3676.5 3581.6 3486.6 3391.6 3296.6 151. 152. 153. 154. 155. 156. 157. 158. 159. 160. X X X X X X X X X X -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 Y Y Y Y Y Y Y Y Y Y 351.9 256.9 161.9 66.9 -28.1 -123.1 -218.1 -313.0 -408.0 -503.0 121. 122. 123. 124. 125. 126. 127. 128. 129. 130. X X X X X X X X X X -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 Y Y Y Y Y Y Y Y Y Y 3201.6 3106.6 3011.6 2916.6 2821.6 2726.6 2631.7 2536.7 2441.7 2346.7 161. 162. 163. 164. 165. 166. 167. 168. 169. 170. X X X X X X X X X X -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 Y Y Y Y Y Y Y Y Y Y -598.0 -693.0 -788.0 -883.0 -978.0 -1073.0 -1168.0 -1262.9 -1357.9 -1452.9 131. 132. 133. 134. 135. 136. 137. 138. 139. 140. X X X X X X X X X X -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 Y Y Y Y Y Y Y Y Y Y 2251.7 2156.7 2061.7 1966.7 1871.7 1776.7 1681.8 1586.8 1491.8 1396.8 171. 172. 173. 174. 175. 176. 177. 178. 179. 180. X X X X X X X X X X -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 Y Y Y Y Y Y Y Y Y Y -1547.9 -1642.9 -1737.9 -1832.9 -1927.9 -2022.9 -2117.8 -2212.8 -2307.8 -2402.8 FIGURE A-2. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 42 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 181. 182. 183. 184. 185. 186. 187. 188. 189. 190. X X X X X X X X X X -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 Y Y Y Y Y Y Y Y Y Y -2497.8 -2592.8 -2687.8 -2782.8 -2877.8 -2972.8 -3067.8 -3162.7 -3257.7 -3352.7 221. 222. 223. 224. 225. 226. 227. 228. 229. 230. X X X X X X X X X X -3486.6 -3391.6 -3296.6 -3201.6 -3106.6 -3011.6 -2916.6 -2821.6 -2726.6 -2631.7 Y Y Y Y Y Y Y Y Y Y -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 191. 192. 193. 194. 195. 196. 197. 198. 199. 200. X X X X X X X X X X -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 Y Y Y Y Y Y Y Y Y Y -3447.7 -3542.7 -3637.7 -3732.7 -3827.7 -3922.7 -4017.7 -4112.6 -4207.6 -4302.6 231. 232. 233. 234. 235. 236. 237. 238. 239. 240. X X X X X X X X X X -2536.7 -2441.7 -2346.7 -2251.7 -2156.7 -2061.7 -1966.7 -1871.7 -1776.7 -1681.8 Y Y Y Y Y Y Y Y Y Y -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 201. 202. 203. 204. 205. 206. 207. 208. 209. 210. X X X X X X X X X X -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -4816.4 -4721.4 -4626.4 -4531.4 Y Y Y Y Y Y Y Y Y Y -4397.6 -4492.6 -4587.6 -4682.6 -4777.6 -4872.6 -5040.4 -5040.4 -5040.4 -5040.4 241. 242. 243. 244. 245. 246. 247. 248. 249. 250. X X X X X X X X X X -1586.8 -1491.8 -1396.8 -1301.8 -1206.8 -1111.8 -1016.8 -921.8 -826.8 -731.9 Y -5040.4 Y -5040.4 Y -5040.4 Y -5040.4 Y -5040.4 Y -5040.4 Y -5040.4 Y -5040.4 Y -5040.4 Y -5040.4 211. 212. 213. 214. 215. 216. 217. 218. 219. 220. X X X X X X X X X X -4436.5 -4341.5 -4246.5 -4151.5 -4056.5 -3961.5 -3866.5 -3771.5 -3676.5 -3581.6 Y Y Y Y Y Y Y Y Y Y -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 251. 252. 253. 254. 255. 256. 257. 258. 259. 260. X X X X X X X X X X -636.9 -541.9 -446.9 -351.9 -256.9 -161.9 -66.9 28.1 123.1 218.1 Y -5040.4 Y -5040.4 Y -5040.4 Y -5040.4 Y -5040.4 Y -5040.4 Y -5040.4 Y -5040.4 Y -5040.4 Y -5040.4 FIGURE A-2. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 43 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 261. 262. 263. 264. 265. 266. 267. 268. 269. 270. X X X X X X X X X X 313.0 408.0 503.0 598.0 693.0 788.0 883.0 978.0 1073.0 1168.0 Y Y Y Y Y Y Y Y Y Y -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 301. 302. 303. 304. 305. 306. 307. 308. 309. 310. X X X X X X X X X X 4112.6 4207.6 4302.6 4397.6 4492.6 4587.6 4682.6 4777.6 4872.6 5040.4 Y Y Y Y Y Y Y Y Y Y -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -4816.4 271. 272. 273. 274. 275. 276. 277. 278. 279. 280. X X X X X X X X X X 1262.9 1357.9 1452.9 1547.9 1642.9 1737.9 1832.9 1927.9 2022.9 2117.8 Y Y Y Y Y Y Y Y Y Y -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 311. 312. 313. 314. 315. 316. 317. 318. 319. 320. X X X X X X X X X X 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 Y Y Y Y Y Y Y Y Y Y -4721.4 -4626.4 -4531.4 -4436.5 -4341.5 -4246.5 -4151.5 -4056.5 -3961.5 -3866.5 281. 282. 283. 284. 285. 286. 287. 288. 289. 290. X X X X X X X X X X 2212.8 2307.8 2402.8 2497.8 2592.8 2687.8 2782.8 2877.8 2972.8 3067.8 Y Y Y Y Y Y Y Y Y Y -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 321. 322. 323. 324. 325. 326. 327. 328. 329. 330. X X X X X X X X X X 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 Y Y Y Y Y Y Y Y Y Y -3771.5 -3676.5 -3581.6 -3486.6 -3391.6 -3296.6 -3201.6 -3106.6 -3011.6 -2916.6 291. 292. 293. 294. 295. 296. 297. 298. 299. 300. X X X X X X X X X X 3162.7 3257.7 3352.7 3447.7 3542.7 3637.7 3732.7 3827.7 3922.7 4017.7 Y Y Y Y Y Y Y Y Y Y -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 -5040.4 331. 332. 333. 334. 335. 336. 337. 338. 339. 340. X X X X X X X X X X 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 Y Y Y Y Y Y Y Y Y Y -2821.6 -2726.6 -2631.7 -2536.7 -2441.7 -2346.7 -2251.7 -2156.7 -2061.7 -1966.7 FIGURE A-2. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 44 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 341. 342. 343. 344. 345. 346. 347. 348. 349. 350. X X X X X X X X X X 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 Y Y Y Y Y Y Y Y Y Y -1871.7 -1776.7 -1681.8 -1586.8 -1491.8 -1396.8 -1301.8 -1206.8 -1111.8 -1016.8 381. 382. 383. 384. 385. 386. 387. 388. 389. 390. X X X X X X X X X X 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 Y Y Y Y Y Y Y Y Y Y 1927.9 2022.9 2117.8 2212.8 2307.8 2402.8 2497.8 2592.8 2687.8 2782.8 351. 352. 353. 354. 355. 356. 357. 358. 359. 360. X X X X X X X X X X 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 Y Y Y Y Y Y Y Y Y Y -921.8 -826.8 -731.9 -636.9 -541.9 -446.9 -351.9 -256.9 -161.9 -66.9 391. 392. 393. 394. 395. 396. 397. 398. 399. 400. X X X X X X X X X X 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 Y Y Y Y Y Y Y Y Y Y 2877.8 2972.8 3067.8 3162.7 3257.7 3352.7 3447.7 3542.7 3637.7 3732.7 361. 362. 363. 364. 365. 366. 367. 368. 369. 370. X X X X X X X X X X 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 Y Y Y Y Y Y Y Y Y Y 28.1 123.1 218.1 313.0 408.0 503.0 598.0 693.0 788.0 883.0 401. 402. 403. 404. 405. 406. 407. 408. 409. 410. X X X X X X X X X X 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 Y Y Y Y Y Y Y Y Y Y 3827.7 3922.7 4017.7 4112.6 4207.6 4302.6 4397.6 4492.6 4587.6 4682.6 371. 372. 373. 374. 375. 376. 377. 378. 379. 380. X X X X X X X X X X 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 5040.4 Y Y Y Y Y Y Y Y Y Y 978.0 1073.0 1168.0 1262.9 1357.9 1452.9 1547.9 1642.9 1737.9 1832.9 411. 412. X X 5040.4 5040.4 Y Y 4777.6 4872.6 FIGURE A-2. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 45 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Due to the complexity of the device , a graphical representation of the pad locations is not available .This figure shall be maintained and available from the device manufacturer. See subsequent pages for a table of pad locations. Die bonding pad locations and electrical functions – mask number 5544 Die physical dimensions. Die size: 13 097 x 13 097 microns ( with scribe line) Die thickness: 475 microns Interface materials. Top metallization: Aluminium + Copper Backside metallization: bare silicon Glassivation. Type: Oxinitride Thickness: 21,000 Angstroms Substrate: Single crystal silicon Assembly related information. Substrate potential: not connected Special assembly instructions: None Pads list : 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. X X X X X X X X X X 6003.8 5908.8 5813.8 5718.8 5623.8 5528.8 5433.9 5338.9 5243.9 5148.9 Y Y Y Y Y Y Y Y Y Y 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. X X X X X X X X X X 5053.9 4958.9 4863.9 4768.9 4673.9 4578.9 4484.0 4389.0 4294.0 4199.0 Y Y Y Y Y Y Y Y Y Y 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 FIGURE A-3. Die bonding pad locations and electrical functions . STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 46 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. X X X X X X X X X X 4104.0 4009.0 3914.0 3819.0 3724.0 3629.0 3534.1 3439.1 3344.1 3249.1 Y Y Y Y Y Y Y Y Y Y 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 61. 62. 63. 64. 65. 66. 67. 68. 69. 70. X X X X X X X X X X 304.4 209.4 114.4 19.4 -75.6 -170.6 -265.5 -360.5 -455.5 -550.5 Y Y Y Y Y Y Y Y Y Y 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. X X X X X X X X X X 3154.1 3059.1 2964.1 2869.1 2774.1 2679.1 2584.2 2489.2 2394.2 2299.2 Y Y Y Y Y Y Y Y Y Y 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 71. 72. 73. 74. 75. 76. 77. 78. 79. 80. X X X X X X X X X X -645.5 -740.5 -835.5 -930.5 -1025.5 -1120.5 -1215.4 -1310.4 -1405.4 -1500.4 Y Y Y Y Y Y Y Y Y Y 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 41. 42. 43. 44. 45. 46. 47. 48. 49. 50. X X X X X X X X X X 2204.2 2109.2 2014.2 1919.2 1824.2 1729.2 1634.3 1539.3 1444.3 1349.3 Y Y Y Y Y Y Y Y Y Y 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 81. 82. 83. 84. 85. 86. 87. 88. 89. 90. X X X X X X X X X X -1595.4 -1690.4 -1785.4 -1880.4 -1975.4 -2070.4 -2165.3 -2260.3 -2355.3 -2450.3 Y Y Y Y Y Y Y Y Y Y 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 51. 52. 53. 54. 55. 56. 57. 58. 59. 60. X X X X X X X X X X 1254.3 1159.3 1064.3 969.3 874.3 779.3 684.4 589.4 494.4 399.4 Y Y Y Y Y Y Y Y Y Y 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 91. 92. 93. 94. 95. 96. 97. 98. 99. 100. X X X X X X X X X X -2545.3 -2640.3 -2735.3 -2830.3 -2925.3 -3020.3 -3115.2 -3210.2 -3305.2 -3400.2 Y Y Y Y Y Y Y Y Y Y 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 FIGURE A-3. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 47 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 101. 102. 103. 104. 105. 106. 107. 108. 109. 110. X X X X X X X X X X -3495.2 -3590.2 -3685.2 -3780.2 -3875.2 -3970.2 -4065.1 -4160.1 -4255.1 -4350.1 Y Y Y Y Y Y Y Y Y Y 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 141. 142. 143. 144. 145. 146. 147. 148. 149. 150. X X X X X X X X X X -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 Y Y Y Y Y Y Y Y Y Y 4863.9 4768.9 4673.9 4578.9 4484.0 4389.0 4294.0 4199.0 4104.0 4009.0 111. 112. 113. 114. 115. 116. 117. 118. 119. 120. X X X X X X X X X X -4445.1 -4540.1 -4635.1 -4730.1 -4825.1 -4920.1 -5015.0 -5110.0 -5205.0 -5300.0 Y Y Y Y Y Y Y Y Y Y 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 151. 152. 153. 154. 155. 156. 157. 158. 159. 160. X X X X X X X X X X -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 Y Y Y Y Y Y Y Y Y Y 3914.0 3819.0 3724.0 3629.0 3534.1 3439.1 3344.1 3249.1 3154.1 3059.1 121. 122. 123. 124. 125. 126. 127. 128. 129. 130. X X X X X X X X X X -5395.0 -5490.0 -5585.0 -5680.0 -5775.0 -5870.0 -5964.9 -6059.9 -6227.8 -6227.8 Y Y Y Y Y Y Y Y Y Y 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6003.8 5908.8 161. 162. 163. 164. 165. 166. 167. 168. 169. 170. X X X X X X X X X X -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 Y Y Y Y Y Y Y Y Y Y 2964.1 2869.1 2774.1 2679.1 2584.2 2489.2 2394.2 2299.2 2204.2 2109.2 131. 132. 133. 134. 135. 136. 137. 138. 139. 140. X X X X X X X X X X -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 Y Y Y Y Y Y Y Y Y Y 5813.8 5718.8 5623.8 5528.8 5433.9 5338.9 5243.9 5148.9 5053.9 4958.9 171. 172. 173. 174. 175. 176. 177. 178. 179. 180. X X X X X X X X X X -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 Y Y Y Y Y Y Y Y Y Y 2014.2 1919.2 1824.2 1729.2 1634.3 1539.3 1444.3 1349.3 1254.3 1159.3 FIGURE A-3. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 48 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 181. 182. 183. 184. 185. 186. 187. 188. 189. 190. X -6227.8 X -6227.8 X -6227.8 X -6227.8 X -6227.8 X -6227.8 X -6227.8 X -6227.8 X -6227.8 X -6227.8 Y Y Y Y Y Y Y Y Y Y 1064.3 969.3 874.3 779.3 684.4 589.4 494.4 399.4 304.4 209.4 221. 222. 223. 224. 225. 226. 227. 228. 229. 230. X X X X X X X X X X -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 Y Y Y Y Y Y Y Y Y Y -2735.3 -2830.3 -2925.3 -3020.3 -3115.2 -3210.2 -3305.2 -3400.2 -3495.2 -3590.2 191. 192. 193. 194. 195. 196. 197. 198. 199. 200. X X X X X X X X X X -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 Y Y Y Y Y Y Y Y Y Y 114.4 19.4 -75.6 -170.6 -265.5 -360.5 -455.5 -550.5 -645.5 -740.5 231. 232. 233. 234. 235. 236. 237. 238. 239. 240. X X X X X X X X X X -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 Y Y Y Y Y Y Y Y Y Y -3685.2 -3780.2 -3875.2 -3970.2 -4065.1 -4160.1 -4255.1 -4350.1 -4445.1 -4540.1 201. 202. 203. 204. 205. 206. 207. 208. 209. 210. X X X X X X X X X X -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 Y Y Y Y Y Y Y Y Y Y -835.5 -930.5 -1025.5 -1120.5 -1215.4 -1310.4 -1405.4 -1500.4 -1595.4 -1690.4 241. 242. 243. 244. 245. 246. 247. 248. 249. 250. X X X X X X X X X X -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 Y Y Y Y Y Y Y Y Y Y -4635.1 -4730.1 -4825.1 -4920.1 -5015.0 -5110.0 -5205.0 -5300.0 -5395.0 -5490.0 211. 212. 213. 214. 215. 216. 217. 218. 219. 220. X X X X X X X X X X -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 Y Y Y Y Y Y Y Y Y Y -1785.4 -1880.4 -1975.4 -2070.4 -2165.3 -2260.3 -2355.3 -2450.3 -2545.3 -2640.3 251. 252. 253. 254. 255. 256. 257. 258. 259. 260. X X X X X X X X X X -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6003.8 -5908.8 -5813.8 -5718.8 Y Y Y Y Y Y Y Y Y Y -5585.0 -5680.0 -5775.0 -5870.0 -5964.9 -6059.9 -6227.8 -6227.8 -6227.8 -6227.8 FIGURE A-3. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 49 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 261. 262. 263. 264. 265. 266. 267. 268. 269. 270. X X X X X X X X X X -5623.8 -5528.8 -5433.9 -5338.9 -5243.9 -5148.9 -5053.9 -4958.9 -4863.9 -4768.9 Y Y Y Y Y Y Y Y Y Y -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 301. 302. 303. 304. 305. 306. 307. 308. 309. 310. X X X X X X X X X X -1824.2 -1729.2 -1634.3 -1539.3 -1444.3 -1349.3 -1254.3 -1159.3 -1064.3 -969.3 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 271. 272. 273. 274. 275. 276. 277. 278. 279. 280. X X X X X X X X X X -4673.9 -4578.9 -4484.0 -4389.0 -4294.0 -4199.0 -4104.0 -4009.0 -3914.0 -3819.0 Y Y Y Y Y Y Y Y Y Y -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 311. 312. 313. 314. 315. 316. 317. 318. 319. 320. X X X X X X X X X X -874.3 -779.3 -684.4 -589.4 -494.4 -399.4 -304.4 -209.4 -114.4 -19.4 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 281. 282. 283. 284. 285. 286. 287. 288. 289. 290. X X X X X X X X X X -3724.0 -3629.0 -3534.1 -3439.1 -3344.1 -3249.1 -3154.1 -3059.1 -2964.1 -2869.1 Y Y Y Y Y Y Y Y Y Y -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 321. 322. 323. 324. 325. 326. 327. 328. 329. 330. X X X X X X X X X X 75.6 170.6 265.5 360.5 455.5 550.5 645.5 740.5 835.5 930.5 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 Y -6227.8 291. 292. 293. 294. 295. 296. 297. 298. 299. 300. X X X X X X X X X X -2774.1 -2679.1 -2584.2 -2489.2 -2394.2 -2299.2 -2204.2 -2109.2 -2014.2 -1919.2 Y Y Y Y Y Y Y Y Y Y -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 331. 332. 333. 334. 335. 336. 337. 338. 339. 340. X X X X X X X X X X 1025.5 1120.5 1215.4 1310.4 1405.4 1500.4 1595.4 1690.4 1785.4 1880.4 Y Y Y Y Y Y Y Y Y Y -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 FIGURE A-3. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 50 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 341. 342. 343. 344. 345. 346. 347. 348. 349. 350. X X X X X X X X X X 1975.4 2070.4 2165.3 2260.3 2355.3 2450.3 2545.3 2640.3 2735.3 2830.3 Y Y Y Y Y Y Y Y Y Y -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 381. 382. 383. 384. 385. 386. 387. 388. 389. 390. X X X X X X X X X X 5775.0 5870.0 5964.9 6059.9 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 Y Y Y Y Y Y Y Y Y Y -6227.8 -6227.8 -6227.8 -6227.8 -6003.8 -5908.8 -5813.8 -5718.8 -5623.8 -5528.8 351. 352. 353. 354. 355. 356. 357. 358. 359. 360. X X X X X X X X X X 2925.3 3020.3 3115.2 3210.2 3305.2 3400.2 3495.2 3590.2 3685.2 3780.2 Y Y Y Y Y Y Y Y Y Y -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 391. 392. 393. 394. 395. 396. 397. 398. 399. 400. X X X X X X X X X X 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 Y Y Y Y Y Y Y Y Y Y -5433.9 -5338.9 -5243.9 -5148.9 -5053.9 -4958.9 -4863.9 -4768.9 -4673.9 -4578.9 361. 362. 363. 364. 365. 366. 367. 368. 369. 370. X X X X X X X X X X 3875.2 3970.2 4065.1 4160.1 4255.1 4350.1 4445.1 4540.1 4635.1 4730.1 Y Y Y Y Y Y Y Y Y Y -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 401. 402. 403. 404. 405. 406. 407. 408. 409. 410. X X X X X X X X X X 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 Y Y Y Y Y Y Y Y Y Y -4484.0 -4389.0 -4294.0 -4199.0 -4104.0 -4009.0 -3914.0 -3819.0 -3724.0 -3629.0 371. 372. 373. 374. 375. 376. 377. 378. 379. 380. X X X X X X X X X X 4825.1 4920.1 5015.0 5110.0 5205.0 5300.0 5395.0 5490.0 5585.0 5680.0 Y Y Y Y Y Y Y Y Y Y -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 -6227.8 411. 412. 413. 414. 415. 416. 417. 418. 419. 420. X X X X X X X X X X 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 Y Y Y Y Y Y Y Y Y Y -3534.1 -3439.1 -3344.1 -3249.1 -3154.1 -3059.1 -2964.1 -2869.1 -2774.1 -2679.1 FIGURE A-3. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 51 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-01B01 Pads list : 421. 422. 423. 424. 425. 426. 427. 428. 429. 430. X X X X X X X X X X 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 Y Y Y Y Y Y Y Y Y Y -2584.2 -2489.2 -2394.2 -2299.2 -2204.2 -2109.2 -2014.2 -1919.2 -1824.2 -1729.2 431. 432. 433. 434. 435. 436. 437. 438. 439. 440. X X X X X X X X X X 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 Y Y Y Y Y Y Y Y Y Y -1634.3 -1539.3 -1444.3 -1349.3 -1254.3 -1159.3 -1064.3 -969.3 -874.3 -779.3 441. 442. 443. 444. 445. 446. 447. 448. 449. 450. X X X X X X X X X X 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 Y Y Y Y Y Y Y Y Y Y -684.4 -589.4 -494.4 -399.4 -304.4 -209.4 -114.4 -19.4 75.6 170.6 451. 452. 453. 454. 455. 456. 457. 458. 459. 460. X X X X X X X X X X 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 Y Y Y Y Y Y Y Y Y Y 265.5 360.5 455.5 550.5 645.5 740.5 835.5 930.5 1025.5 1120.5 461. 462. 463. 464. 465. 466. X X X X X X 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 Y Y Y Y Y Y 1215.4 1310.4 1405.4 1500.4 1595.4 1690.4 467. 468. 469. 470. X X X X 6227.8 6227.8 6227.8 6227.8 Y Y Y Y 1785.4 1880.4 1975.4 2070.4 471. 472. 473. 474. 475. 476. 477. 478. 479. 480. X X X X X X X X X X 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 Y Y Y Y Y Y Y Y Y Y 2165.3 2260.3 2355.3 2450.3 2545.3 2640.3 2735.3 2830.3 2925.3 3020.3 481. 482. 483. 484. 485. 486. 487. 488. 489. 490. X X X X X X X X X X 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 Y Y Y Y Y Y Y Y Y Y 3115.2 3210.2 3305.2 3400.2 3495.2 3590.2 3685.2 3780.2 3875.2 3970.2 491. 492. 493. 494. 495. 496. 497. 498. 499. 500. X X X X X X X X X X 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 Y Y Y Y Y Y Y Y Y Y 4065.1 4160.1 4255.1 4350.1 4445.1 4540.1 4635.1 4730.1 4825.1 4920.1 501. 502. 503. 504. 505. 506. 507. 508. 509. 510. 511. 512. X X X X X X X X X X X X 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 6227.8 Y Y Y Y Y Y Y Y Y Y Y Y 5015.0 5110.0 5205.0 5300.0 5395.0 5490.0 5585.0 5680.0 5775.0 5870.0 5964.9 6059.9 FIGURE A-3. Die bonding pad locations and electrical functions - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01B01 A REVISION LEVEL D SHEET 52 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 07-01-24 Approved sources of supply for SMD 5962-01B01 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard microcircuit drawing PIN 1/ 5962-01B0101QZC 5962-01B0101QYC 5962-01B0101QXC 5962-01B0101QUB 5962-01B0101Q4C 5962-01B0101QNC 5962-01B0101QMC 5962-01B0101Q5B 5962-01B0101Q9A Vendor CAGE number F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ TH1099ERHabcYCMQ TH1099ERHabcKZMQ TH1099ERHabcK9MQ TH1099ERHabc2EMQ TH1099ERHabcYFMQ TH1099ERHabcKAMQ TH1099ERHabcKBMQ TH1099ERHabc2HMQ TH1099ERHabcDDMQ 5962-01B0101VZC 5962-01B0101VYC 5962-01B0101VXC 5962-01B0101VUB 5962-01B0101V4C 5962-01B0101VNC 5962-01B0101VMC 5962-01B0101V5B 5962-01B0101V9A 5962R01B0101VZC 5962R01B0101VYC 5962R01B0101VXC 5962R01B0101VUB 5962R01B0101V4C 5962R01B0101VNC 5962R01B0101VMC 5962R01B0101V5B F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1099ERHabcYCSV TH1099ERHabcKZSV TH1099ERHabcK9SV TH1099ERHabc2ESV TH1099ERHabcYFSV TH1099ERHabcKASV TH1099ERHabcKBSV TH1099ERHabc2HSV TH1099ERHabcDDSV TH1099ERHabcYCSR TH1099ERHabcKZSR TH1099ERHabcK9SR TH1099ERHabc2ESR TH1099ERHabcYFSR TH1099ERHabcKASR TH1099ERHabcKBSR TH1099ERHabc2HSR 5962-01B0102QZC 5962-01B0102QYC 5962-01B0102QTB 5962-01B0102QUB 5962-01B0102Q4C 5962-01B0102QNC 5962-01B0102Q6B 5962-01B0102Q5B 5962-01B0102Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1156ERHabcYCMQ TH1156ERHabcKZMQ TH1156ERHabc2CMQ TH1156ERHabc2EMQ TH1156ERHabcYFMQ TH1156ERHabcKAMQ TH1156ERHabc2GMQ TH1156ERHabc2HMQ TH1156ERHabcDDMQ 5962-01B0102VZC 5962-01B0102VYC 5962-01B0102VTB 5962-01B0102VUB 5962-01B0102V4C 5962-01B0102VNC F7400 F7400 F7400 F7400 F7400 F7400 TH1156ERHabcYCSV TH1156ERHabcKZSV TH1156ERHabc2CSV TH1156ERHabc2ESV TH1156ERHabcYFSV TH1156ERHabcKASV Standard microcircuit drawing PIN 1/ 5962-01B0102V6B 5962-01B0102V5B 5962-01B0102V9A 5962R01B0102VZC 5962R01B0102VYC 5962R01B0102VTB 5962R01B0102VUB 5962R01B0102V4C 5962R01B0102VNC 5962R01B0102V6B 5962R01B0102V5B Vendor CAGE number F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ TH1156ERHabc2GSV TH1156ERHabc2HSV TH1156ERHabcDDSV TH1156ERHabcYCSR TH156ERHabcKZSR TH1156ERHabc2CSR TH1156ERHabc2ESR TH1156ERHabcYFSR TH156ERHabcKASR TH1156ERHabc2GSR TH1156ERHabc2HSR 5962-01B0103QZC 5962-01B0103QYC 5962-01B0103QTB 5962-01B0103QUB 5962-01B0103Q4C 5962-01B0103QNC 5962-01B0103Q6B 5962-01B0103Q5B 5962-01B0103Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1242ERHabcYCMQ TH1242ERHabcKZMQ TH1242ERHabc2CMQ TH1242ERHabc2EMQ TH1242ERHabcYFMQ TH1242ERHabcKAMQ TH1242ERHabc2GMQ TH1242ERHabc2HMQ TH1242ERHabcDDMQ 5962-01B0103VZC 5962-01B0103VYC 5962-01B0103VTB 5962-01B0103VUB 5962-01B0103V4C 5962-01B0103VNC 5962-01B0103V6B 5962-01B0103V5B 5962-01B0103V9A 5962R01B0103VZC 5962R01B0103VYC 5962R01B0103VTB 5962R01B0103VUB 5962R01B0103V4C 5962R01B0103VNC 5962R01B0103V6B 5962R01B0103V5B F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1242ERHabcYCSV TH1242RHabcKZSV TH1242ERHabc2CSV TH1242ERHabc2ESV TH1242ERHabcYFSV TH1242RHabcKASV TH1242ERHabc2GSV TH1242ERHabc2HSV TH1242ERHabcDDSV TH1242ERHabcYCSR TH1242ERHabcKZSR TH1242ERHabc2CSR TH1242ERHabc2ESR TH1242ERHabcYFSR TH1242ERHabcKASR TH1242ERHabc2GSR TH1242ERHabc2HSR 5962-01B0104QZC 5962-01B0104QTB 5962-01B0104Q4C 5962-01B0104Q6B F7400 F7400 F7400 F7400 TH1332ERHabcYCMQ TH1332ERHabc2CMQ TH1332ERHabcYFMQ TH1332ERHabc2GMQ 5962-01B0104Q9A F7400 TH1332ERHabcDDMQ 5962-01B0104VZC 5962-01B0104VTB 5962-01B0104V4C 5962-01B0104V6B 5962-01B0104V9A F7400 F7400 F7400 F7400 F7400 TH1332ERHabcYCSV TH1332ERHabc2CSV TH1332ERHabcYFSV TH1332ERHabc2GSV TH1332ERHabcDDSV Standard microcircuit drawing PIN 1/ 5962R01B0104VZC 5962R01B0104VTB 5962R01B0104V4C 5962R01B0104V6B Vendor CAGE number F7400 F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ TH1332ERHabcYCSR TH1332ERHabc2CSR TH1332ERHabcYFSR TH1332ERHabc2GSR 5962-01B0105QZC 5962-01B0105QYC 5962-01B0105QXC 5962-01B0105QUB 5962-01B0105Q4C 5962-01B0105QNC 5962-01B0105QMC 5962-01B0105Q5B 5962-01B0105Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1099ESHabcYCMQ TH1099ESHabcKZMQ TH1099ESHabcK9MQ TH1099ESHabc2EMQ TH1099ESHabcYFMQ TH1099ESHabcKAMQ TH1099ESHabcKBMQ TH1099ESHabc2HMQ TH1099ESHabcDDMQ 5962-01B0105VZC 5962-01B0105VYC 5962-01B0105VXC 5962-01B0105VUB 5962-01B0105V4C 5962-01B0105VNC 5962-01B0105VMC 5962-01B0105V5B 5962-01B0105V9A 5962R01B0105VZC 5962R01B0105VYC 5962R01B0105VXC 5962R01B0105VUB 5962R01B0105V4C 5962R01B0105VNC 5962R01B0105VMC 5962R01B0105V5B F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1099ESHabcYCSV TH1099ESHabcKZSV TH1099ESHabcK9SV TH1099ESHabc2ESV TH1099ESHabcYFSV TH1099ESHabcKASV TH1099ESHabcKBSV TH1099ESHabc2HSV TH1099ESHabcDDSV TH1099ESHabcYCSR TH1099ESHabcKZSR TH1099ESHabcK9SR TH1099ESHabc2ESR TH1099ESHabcYFSR TH1099ESHabcKASR TH1099ESHabcKBSR TH1099ESHabc2HSR 5962-01B0106QZC 5962-01B0106QYC 5962-01B0106QTB 5962-01B0106QUB 5962-01B0106Q4C 5962-01B0106QNC 5962-01B0106Q6B 5962-01B0106Q5B 5962-01B0106Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1156ESHabcYCMQ TH1156ESHabcKZMQ TH1156ESHabc2CMQ TH1156ESHabc2EMQ TH1156ESHabcYFMQ TH1156ESHabcKAMQ TH1156ESHabc2GMQ TH1156ESHabc2HMQ TH1156ESHabcDDMQ 5962-01B0106VZC 5962-01B0106VYC 5962-01B0106VTB 5962-01B0106VUB 5962-01B0106V4C 5962-01B0106VNC 5962-01B0106V6B 5962-01B0106V5B F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1156ESHabcYCSV TH1156ESHabcKZSV TH1156ESHabc2CSV TH1156ESHabc2ESV TH1156ESHabcYFSV TH1156ESHabcKASV TH1156ESHabc2GSV TH1156ESHabc2HSV Standard microcircuit drawing PIN 1/ 5962-01B0106V9A 5962R01B0106VZC 5962R01B0106VYC 5962R01B0106VTB 5962R01B0106VUB 5962R01B0106V4C 5962R01B0106VNC 5962R01B0106V6B 5962R01B0106V5B Vendor CAGE number F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ TH1156ESHabcDDSV TH1156ESHabcYCSR TH1156ESHabcKZSR TH1156ESHabc2CSR TH1156ESHabc2ESR TH1156ESHabcYFSR TH1156ESHabcKASR TH1156ESHabc2GSR TH1156ESHabc2HSR 5962-01B0107QZC F7400 TH1242ESHabcYCMQ 5962-01B0107QYC F7400 TH1242ESHabcKZMQ 5962-01B0107QTB F7400 TH1242ESHabc2CMQ 5962-01B0107QUB TH1242ESHabc2EMQ 5962-01B0107Q4C F7400 F7400 TH1242ESHabcYFMQ 5962-01B0107QNC F7400 TH1242ESHabcKAMQ 5962-01B0107Q6B F7400 TH1242ESHabc2GMQ 5962-01B0107Q5B F7400 TH1242ESHabc2HMQ 5962-01B0107Q9A F7400 TH1242ESHabcDDMQ 5962-01B0107VZC F7400 TH1242ESHabcYCSV 5962-01B0107VYC F7400 TH1242ESHabcKZSV 5962-01B0107VTB F7400 TH1242ESHabc2CSV 5962-01B0107VUB TH1242ESHabc2ESV 5962-01B0107V4C F7400 F7400 TH1242ESHabcYFSV 5962-01B0107VNC F7400 TH1242ESHabcKASV 5962-01B0107V6B F7400 TH1242ESHabc2GSV 5962-01B0107V5B F7400 TH1242ESHabc2HSV 5962-01B0107V9A F7400 TH1242ESHabcDDSV 5962R01B0107VZC F7400 TH1242ESHabcYCSR 5962R01B0107VYC F7400 TH1242ESHabcKZSR 5962R01B0107VTB F7400 TH1242ESHabc2CSR 5962R01B0107VUB TH1242ESHabc2ESR 5962R01B0107V4C F7400 F7400 TH1242ESHabcYFSR 5962R01B0107VNC F7400 TH1242ESHabcKASR 5962R01B0107V6B F7400 TH1242ESHabc2GSR 5962R01B0107V5B F7400 TH1242ESHabc2HSR 5962-01B0108QZC 5962-01B0108QTB 5962-01B0108Q4C 5962-01B0108Q6B 5962-01B0108Q9A F7400 F7400 F7400 F7400 F7400 TH1332ESHabcYCMQ TH1332ESHabc2CMQ TH1332ESHabcYFMQ TH1332ESHabc2GMQ TH1332ESHabcDDMQ Standard microcircuit drawing PIN 1/ 5962-01B0108VZC 5962-01B0108VTB 5962-01B0108V4C 5962-01B0108V6B 5962-01B0108V9A 5962R01B0108VZC 5962R01B0108VTB 5962R01B0108V4C 5962R01B0108V6B Vendor CAGE number F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ TH1332ESHabcYCSV TH1332ESHabc2CSV TH1332ESHabcYFSV TH1332ESHabc2GSV TH1332ESHabcDDSV TH1332ESHabcYCSR TH1332ESHabc2CSR TH1332ESHabcYFSR TH1332ESHabc2GSR 5962-01B0109QZC 5962-01B0109QYC 5962-01B0109QXC 5962-01B0109QUB 5962-01B0109Q4C 5962-01B0109QNC 5962-01B0109QMC 5962-01B0109Q5B 5962-01B0109Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1M099ERHabcYCMQ TH1M099ERHabcKZMQ TH1M099ERHabcK9MQ TH1M099ERHabc2EMQ TH1M099ERHabcYFMQ TH1M099ERHabcKAMQ TH1M099ERHabcKBMQ TH1M099ERHabc2HMQ TH1M099ERHabcDDMQ 5962-01B0109VZC 5962-01B0109VYC 5962-01B0109VXC 5962-01B0109VUB 5962-01B0109V4C 5962-01B0109VNC 5962-01B0109VMC 5962-01B0109V5B 5962-01B0109V9A 5962R01B0109VZC 5962R01B0109VYC 5962R01B0109VXC 5962R01B0109VUB 5962R01B0109V4C 5962R01B0109VNC 5962R01B0109VMC 5962R01B0109V5B F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1M099ERHabcYCSV TH1M099ERHabcKZSV TH1M099ERHabcK9SV TH1M099ERHabc2ESV TH1M099ERHabcYFSV TH1M099ERHabcKASV TH1M099ERHabcKBSV TH1M099ERHabc2HSV TH1M099ERHabcDDSV TH1M099ERHabcYCSR TH1M099ERHabcKZSR TH1M099ERHabcK9SR TH1M099ERHabc2ESR TH1M099ERHabcYFSR TH1M099ERHabcKASR TH1M099ERHabcKBSR TH1M099ERHabc2HSR 5962-01B0110QZC 5962-01B0110QYC 5962-01B0110QTB 5962-01B0110QUB 5962-01B0110Q4C 5962-01B0110QNC 5962-01B0110Q6B 5962-01B0110Q5B 5962-01B0110Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1M156ERHabcYCMQ TH1M156ERHabcKZMQ TH1M156ERHabc2CMQ TH1M156ERHabc2EMQ TH1M156ERHabcYFMQ TH1M156ERHabcKAMQ TH1M156ERHabc2GMQ TH1M156ERHabc2HMQ TH1M156ERHabcDDMQ Standard microcircuit drawing PIN 1/ 5962-01B0110VZC 5962-01B0110VYC 5962-01B0110VTB 5962-01B0110VUB 5962-01B0110V4C 5962-01B0110VNC 5962-01B0110V6B 5962-01B0110V5B 5962-01B0110V9A 5962R01B0110VZC 5962R01B0110VYC 5962R01B0110VTB 5962R01B0110VUB 5962R01B0110V4C 5962R01B0110VNC 5962R01B0110V6B 5962R01B0110V5B Vendor CAGE number F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ TH1M156ERHabcYCSV TH1M156ERHabcKZSV TH1M156ERHabc2CSV TH1M156ERHabc2ESV TH1M156ERHabcYFSV TH1M156ERHabcKASV TH1M156ERHabc2GSV TH1M156ERHabc2HSV TH1M156ERHabcDDSV TH1M156ERHabcYCSR TH1M156ERHabcKZSR TH1M156ERHabc2CSR TH1M156ERHabc2ESR TH1M156ERHabcYFSR TH1M156ERHabcKASR TH1M156ERHabc2GSR TH1M156ERHabc2HSR 5962-01B0111QZC 5962-01B0111QYC 5962-01B0111QTB 5962-01B0111QUB 5962-01B0111Q4C 5962-01B0111QNC 5962-01B0111Q6B 5962-01B0111Q5B 5962-01B0111Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1M242ERHabcYCMQ TH1M242ERHabcKZMQ TH1M242ERHabc2CMQ TH1M242ERHabc2EMQ TH1M242ERHabcYFMQ TH1M242ERHabcKAMQ TH1M242ERHabc2GMQ TH1M242ERHabc2HMQ TH1M242ERHabcDDMQ 5962-01B0111VZC 5962-01B0111VYC 5962-01B0111VTB 5962-01B0111VUB 5962-01B0111V4C 5962-01B0111VNC 5962-01B0111V6B 5962-01B0111V5B 5962-01B0111V9A 5962R01B0111VZC 5962R01B0111VYC 5962R01B0111VTB 5962R01B0111VUB 5962R01B0111V4C 5962R01B0111VNC 5962R01B0111V6B 5962R01B0111V5B F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1M242ERHabcYCSV TH1M242ERHabcKZSV TH1M242ERHabc2CSV TH1M242ERHabc2ESV TH1M242ERHabcYFSV TH1M242ERHabcKASV TH1M242ERHabc2GSV TH1M242ERHabc2HSV TH1M242ERHabcDDSV TH1M242ERHabcYCSR TH1M242ERHabcKZSR TH1M242ERHabc2CSR TH1M242ERHabc2ESR TH1M242ERHabcYFSR TH1M242ERHabcKASR TH1M242ERHabc2GSR TH1M242ERHabc2HSR 5962-01B0112QZC 5962-01B0112QTB 5962-01B0112Q4C 5962-01B0112Q6B 5962-01B0112Q9A F7400 F7400 F7400 F7400 F7400 TH1M332ERHabcYCMQ TH1M332ERHabc2CMQ TH1M332ERHabcYFMQ TH1M332ERHabc2GMQ TH1M332ERHabcDDMQ Standard microcircuit drawing PIN 1/ 5962-01B0112VZC 5962-01B0112VTB 5962-01B0112V4C 5962-01B0112V6B 5962-01B0112V9A 5962R01B0112VZC 5962R01B0112VTB 5962R01B0112V4C 5962R01B0112V6B Vendor CAGE number F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ TH1M332ERHabcYCSV TH1M332ERHabc2CSV TH1M332ERHabcYFSV TH1M332ERHabc2GSV TH1M332ERHabcDDSV TH1M332ERHabcYCSR TH1M332ERHabc2CSR TH1M332ERHabcYFSR TH1M332ERHabc2GSR 5962-01B0113QZC 5962-01B0113QYC 5962-01B0113QXC 5962-01B0113QUB 5962-01B0113Q4C 5962-01B0113QNC 5962-01B0113QMC 5962-01B0113Q5B 5962-01B0113Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1M099ESHabcYCMQ TH1M099ESHabcKZMQ TH1M099ESHabcK9MQ TH1M099ESHabc2EMQ TH1M099ESHabcYFMQ TH1M099ESHabcKAMQ TH1M099ESHabcKBMQ TH1M099ESHabc2HMQ TH1M099ESHabcDDMQ 5962-01B0113VZC 5962-01B0113VYC 5962-01B0113VXC 5962-01B0113VUB 5962-01B0113V4C 5962-01B0113VNC 5962-01B0113VMC 5962-01B0113V5B 5962-01B0113V9A 5962R01B0113VZC 5962R01B0113VYC 5962R01B0113VXC 5962R01B0113VUB 5962R01B0113V4C 5962R01B0113VNC 5962R01B0113VMC 5962R01B0113V5B F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1M099ESHabcYCSV TH1M099ESHabcKZSV TH1M099ESHabcK9SV TH1M099ESHabc2ESV TH1M099ESHabcYFSV TH1M099ESHabcKASV TH1M099ESHabcKBSV TH1M099ESHabc2HSV TH1M099ESHabcDDSV TH1M099ESHabcYCSR TH1M099ESHabcKZSR TH1M099ESHabcK9SR TH1M099ESHabc2ESR TH1M099ESHabcYFSR TH1M099ESHabcKASR TH1M099ESHabcKBSR TH1M099ESHabc2HSR 5962-01B0114QZC 5962-01B0114QYC 5962-01B0114QTB 5962-01B0114QUB 5962-01B0114Q4C 5962-01B0114QNC 5962-01B0114Q6B 5962-01B0114Q5B 5962-01B0114Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1M156ESHabcYCMQ TH1M156ESHabcKZMQ TH1M156ESHabc2CMQ TH1M156ESHabc2EMQ TH1M156ESHabcYFMQ TH1M156ESHabcKAMQ TH1M156ESHabc2GMQ TH1M156ESHabc2HMQ TH1M156ESHabcDDMQ Standard microcircuit drawing PIN 1/ 5962-01B0114VZC 5962-01B0114VYC 5962-01B0114VTB 5962-01B0114VUB 5962-01B0114V4C 5962-01B0114VNC 5962-01B0114V6B 5962-01B0114V5B 5962-01B0114V9A 5962R01B0114VZC 5962R01B0114VYC 5962R01B0114VTB 5962R01B0114VUB 5962R01B0114V4C 5962R01B0114VNC 5962R01B0114V6B 5962R01B0114V5B Vendor CAGE number F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ TH1M156ESHabcYCSV TH1M156ESHabcKZSV TH1M156ESHabc2CSV TH1M156ESHabc2ESV TH1M156ESHabcYFSV TH1M156ESHabcKASV TH1M156ESHabc2GSV TH1M156ESHabc2HSV TH1M156ESHabcDDSV TH1M156ESHabcYCSR TH1M156ESHabcKZSR TH1M156ESHabc2CSR TH1M156ESHabc2ESR TH1M156ESHabcYFSR TH1M156ESHabcKASR TH1M156ESHabc2GSR TH1M156ESHabc2HSR 5962-01B0115QZC 5962-01B0115QYC 5962-01B0115QTB 5962-01B0115QUB 5962-01B0115Q4C 5962-01B0115QNC 5962-01B0115Q6B 5962-01B0115Q5B 5962-01B0115Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1M242ESHabcYCMQ TH1M242ESHabcKZMQ TH1M242ESHabc2CMQ TH1M242ESHabc2EMQ TH1M242ESHabcYFMQ TH1M242ESHabcKAMQ TH1M242ESHabc2GMQ TH1M242ESHabc2HMQ TH1M242ESHabcDDMQ 5962-01B0115VZC 5962-01B0115VYC 5962-01B0115VTB 5962-01B0115VUB 5962-01B0115V4C 5962-01B0115VNC 5962-01B0115V6B 5962-01B0115V5B 5962-01B0115V9A 5962R01B0115VZC 5962R01B0115VYC 5962R01B0115VTB 5962R01B0115VUB 5962R01B0115V4C 5962R01B0115VNC 5962R01B0115V6B 5962R01B0115V5B F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1M242ESHabcYCSV TH1M242ESHabcKZSV TH1M242ESHabc2CSV TH1M242ESHabc2ESV TH1M242ESHabcYFSV TH1M242ESHabcKASV TH1M242ESHabc2GSV TH1M242ESHabc2HSV TH1M242ESHabcDDSV TH1M242ESHabcYCSR TH1M242ESHabcKZSR TH1M242ESHabc2CSR TH1M242ESHabc2ESR TH1M242ESHabcYFSR TH1M242ESHabcKASR TH1M242ESHabc2GSR TH1M242ESHabc2HSR 5962-01B0116QZC 5962-01B0116QTB 5962-01B0116Q4C 5962-01B0116Q6B 5962-01B0116Q9A F7400 F7400 F7400 F7400 F7400 TH1M332ESHabcYCMQ TH1M332ESHabc2CMQ TH1M332ESHabcYFMQ TH1M332ESHabc2GMQ TH1M332ESHabcDDMQ Standard microcircuit drawing PIN 1/ 5962-01B0116VZC 5962-01B0116VTB 5962-01B0116V4C 5962-01B0116V6B 5962-01B0116V9A 5962R01B0116VZC 5962R01B0116VTB 5962R01B0116V4C 5962R01B0116V6B Vendor CAGE number F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ TH1M332ESHabcYCSV TH1M332ESHabc2CSV TH1M332ESHabcYFSV TH1M332ESHabc2GSV TH1M332ESHabcDDSV TH1M332ESHabcZCSR TH1M332ESHabc2CSR TH1M332ESHabcYFSR TH1M332ESHabc2GSR 5962-01B0117QZC 5962-01B0117QYC 5962-01B0117QXC 5962-01B0117QUB 5962-01B0117Q4C 5962-01B0117QNC 5962-01B0117QMC 5962-01B0117Q5B 5962-01B0117Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1099RabcYCMQ TH1099RabcKZMQ TH1099RabcK9MQ TH1099Rabc2EMQ TH1099RabcYFMQ TH1099RabcKAMQ TH1099RabcKBMQ TH1099Rabc2HMQ TH1099RabcDDMQ 5962-01B0118QZC 5962-01B0118QYC 5962-01B0118QTB 5962-01B0118QUB 5962-01B0118Q4C 5962-01B0118QNC 5962-01B0118Q6B 5962-01B0118Q5B 5962-01B0118Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1156RabcYCMQ TH1156RabcKZMQ TH1156Rabc2CMQ TH1156Rabc2EMQ TH1156RabcYFMQ TH1156RabcKAMQ TH1156Rabc2GMQ TH1156Rabc2HMQ TH1156RabcDDMQ 5962-01B0119QZC 5962-01B0119QYC 5962-01B0119QTB 5962-01B0119QUB 5962-01B0119Q4C 5962-01B0119QNC 5962-01B0119Q6B 5962-01B0119Q5B 5962-01B0119Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1242RabcYCMQ TH1242RabcKZMQ TH1242Rabc2CMQ TH1242Rabc2EMQ TH1242RabcYFMQ TH1242RabcKAMQ TH1242Rabc2GMQ TH1242Rabc2HMQ TH1242RabcDDMQ 5962-01B0120QZC 5962-01B0120QTB 5962-01B0120Q4C 5962-01B0120Q6B 5962-01B0120Q9A F7400 F7400 F7400 F7400 F7400 TH1332RabcYCMQ TH1332Rabc2CMQ TH1332RabcYFMQ TH1332Rabc2GMQ TH1332RabcDDMQ Standard microcircuit drawing PIN 1/ 5962-01B0121QZC 5962-01B0121QYC 5962-01B0121QXC 5962-01B0121QUB 5962-01B0121Q4C 5962-01B0121QNC 5962-01B0121QMC 5962-01B0121Q5B 5962-01B0121Q9A Vendor CAGE number F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ TH1099SabcYCMQ TH1099SabcKZMQ TH1099SabcK9MQ TH1099Sabc2EMQ TH1099SabcYFMQ TH1099SabcKAMQ TH1099SabcKBMQ TH1099Sabc2HMQ TH1099SabcDDMQ 5962-01B0122QZC 5962-01B0122QYC 5962-01B0122QTB 5962-01B0122QUB 5962-01B0122Q4C 5962-01B0122QNC 5962-01B0122Q6B 5962-01B0122Q5B 5962-01B0122Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1156SabcYCMQ TH1156SabcKZMQ TH1156Sabc2CMQ TH1156Sabc2EMQ TH1156SabcYFMQ TH1156SabcKAMQ TH1156Sabc2GMQ TH1156Sabc2HMQ TH1156SabcDDMQ 5962-01B0123QZC 5962-01B0123QYC 5962-01B0123QTB 5962-01B0123QUB 5962-01B0123Q4C 5962-01B0123QNC 5962-01B0123Q6B 5962-01B0123Q5B 5962-01B0123Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1242SabcYCMQ TH1242SabcKZMQ TH1242Sabc2CMQ TH1242Sabc2EMQ TH1242SabcYFMQ TH1242SabcKAMQ TH1242Sabc2GMQ TH1242Sabc2HMQ TH1242SabcDDMQ 5962-01B0124QZC 5962-01B0124QTB 5962-01B0124Q4C 5962-01B0124Q6B 5962-01B0124Q9A F7400 F7400 F7400 F7400 F7400 TH1332SabcYCMQ TH1332Sabc2CMQ TH1332SabcYFMQ TH1332Sabc2GMQ TH1332SabcDDMQ 5962-01B0125QZC 5962-01B0125QYC 5962-01B0125QXC 5962-01B0125QUB 5962-01B0125Q4C 5962-01B0125QNC 5962-01B0125QMC 5962-01B0125Q5B 5962-01B0125Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1M099RDabcYCMQ TH1M099RDabcKZMQ TH1M099RDabcK9MQ TH1M099RDabc2EMQ TH1M099RDabcYFMQ TH1M099RDabcKAMQ TH1M099RDabcKBMQ TH1M099RDabc2HMQ TH1M099RDabcDDMQ Standard microcircuit drawing PIN 1/ 5962-01B0126QZC 5962-01B0126QYC 5962-01B0126QTB 5962-01B0126QUB 5962-01B0126Q4C 5962-01B0126QNC 5962-01B0126Q6B 5962-01B0126Q5B 5962-01B0126Q9A Vendor CAGE number F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ TH1M156RDabcYCMQ TH1M156RDabcKZMQ TH1M156RDabc2CMQ TH1M156RDabc2EMQ TH1M156RDabcYFMQ TH1M156RDabcKAMQ TH1M156RDabc2GMQ TH1M156RDabc2HMQ TH1M156RDabcDDMQ 5962-01B0127QZC 5962-01B0127QYC 5962-01B0127QTB 5962-01B0127QUB 5962-01B0127Q4C 5962-01B0127QNC 5962-01B0127Q6B 5962-01B0127Q5B 5962-01B0127Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1M242RDabcYCMQ TH1M242RDabcKZMQ TH1M242RDabc2CMQ TH1M242RDabc2EMQ TH1M242RDabcYFMQ TH1M242RDabcKAMQ TH1M242RDabc2GMQ TH1M242RDabc2HMQ TH1M242RDabcDDMQ 5962-01B0128QZC 5962-01B0128QTB 5962-01B0128Q4C 5962-01B0128Q6B 5962-01B0128Q9A F7400 F7400 F7400 F7400 F7400 TH1M332RDabcYCMQ TH1M332RDabc2CMQ TH1M332RDabcYFMQ TH1M332RDabc2GMQ TH1M332RDabcDDMQ 5962-01B0129QZC 5962-01B0129QYC 5962-01B0129QXC 5962-01B0129QUB 5962-01B0129Q4C 5962-01B0129QNC 5962-01B0129QMC 5962-01B0129Q5B 5962-01B0129Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1M099SDabcYCMQ TH1M099SDabcKZMQ TH1M099SDabcK9MQ TH1M099SDabc2EMQ TH1M099SDabcYFMQ TH1M099SDabcKAMQ TH1M099SDabcKBMQ TH1M099SDabc2HMQ TH1M099SDabcDDMQ 5962-01B0130QZC 5962-01B0130QYC 5962-01B0130QTB 5962-01B0130QUB 5962-01B0130Q4C 5962-01B0130QNC 5962-01B0130Q6B 5962-01B0130Q5B 5962-01B0130Q9A F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 TH1M156SDabcYCMQ TH1M156SDabcKZMQ TH1M156SDabc2CMQ TH1M156SDabc2EMQ TH1M156SDabcYFMQ TH1M156SDabcKAMQ TH1M156SDabc2GMQ TH1M156SDabc2HMQ TH1M156SDabcDDMQ Standard microcircuit drawing PIN 1/ 5962-01B0131QZC 5962-01B0131QYC 5962-01B0131QTB 5962-01B0131QUB 5962-01B0131Q4C 5962-01B0131QNC 5962-01B0131Q6B 5962-01B0131Q5B 5962-01B0131Q9A 1/ 2/ 3/ Vendor CAGE number F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ TH1M242SDabcYCMQ TH1M242SDabcKZMQ TH1M242SDabc2CMQ TH1M242SDabc2EMQ TH1M242SDabcYFMQ TH1M242SDabcKAMQ TH1M242SDabc2GMQ TH1M242SDabc2HMQ TH1M242SDabcDDMQ 5962-01B0132QZC 5962-01B0132QTB 5962-01B0132Q4C 5962-01B0132Q6B 5962-01B0132Q9A F7400 F7400 F7400 F7400 F7400 TH1M332SDabcYCMQ TH1M332SDabc2CMQ TH1M332SDabcYFMQ TH1M332SDabc2GMQ TH1M332SDabcDDMQ 5962-01B0133Q7C 5962-01B0133Q8C F7400 F7400 TH1256AabcYEMQ TH1256AabcYDMQ 5962-01B0133V7C 5962-01B0133V8C 5962R01B0133V7C 5962R01B0133V8C F7400 F7400 F7400 F7400 TH1256AabcYESV TH1256AabcYDSV TH1256AabcYESR TH1256AabcYDSR The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. The “abc” is reserved to indicate the customer specific code. Vendor CAGE number F7400 Vendor name and address Atmel Nantes SA. BP 70602 44306 Nantes Cedex 3 France The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.