REVISIONS LTR DATE (YR-MO-DA) APPROVED A Add new device types 05-08. - phn DESCRIPTION 08-11-17 Thomas M. Hess B Add case outline N and 4. - phn 09-12-02 Thomas M. Hess C Add device type 09 and 10. Add case outline 5 and 6. Update the boilerplate to current requirements as specified in MIL-PRF-38535. - phn Add case outline 7. - phn 11-06-10 David J. Corbett 12-12-03 Thomas M. Hess D REV SHEET REV D D D D D D D D SHEET 15 16 17 18 19 20 21 22 REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil Phu H. Nguyen STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Phu H. Nguyen APPROVED BY Thoma M. Hess DRAWING APPROVAL DATE 06-07-18 REVISION LEVEL AMSC N/A D DSCC FORM 2233 APR 97 MICROCIRCUIT, DIGITAL, GATE ARRAY, CMOS, ATC18RHA CELL BASED, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET 1 OF 5962-06B02 19 5962-E113-13 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) \/ Drawing number 06B02 / 01 M X X Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 02 03 04 1/ 1/ 1/ 1/ ATC18RHA95_216 ATC18RHA95_324 ATC18RHA95_404 ATC18RHA95_504 1.0 Mgates available 2.2 Mgates available 3.5 Mgates available 5.5 Mgates available 05 06 07 08 1/ 1/ 1/ 1/ ATC18RHA95_216 ATC18RHA95_324 ATC18RHA95_404 ATC18RHA95_504 1.0 Mgates available 2.2 Mgates available 3.5 Mgates available 5.5 Mgates available 09 10 1/ 1/ ATC18RHA95_544 ATC18RHA95_544 6.5 Mgates available 6.5 Mgates available 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class M Q or V Device requirements documentation Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Certification and qualification to MIL-PRF-38535 _______ 1/ Device types 01-04, 09 will have I/O33 supplied at 3.3 V only and device types 05-08, 10 will have I/O33 supplied at 2.5 V. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Y Z U T M N 4 5 6 7 Descriptive designator See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 Terminals Package style 160 196 256 352 349 472 349 472 625 625 352 Quad flatpack unformed leads Quad flatpack unformed leads Quad flatpack unformed leads Quad flatpack with non conductive tie bar Column grid array and interposer SCI Column grid array and interposer SCI Land grid array Land grid array Land grid array Land grid array Quad flatpack with non conductive tie bar 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 2/ 3/ Supply voltage range (VDD1) .............................................................. Supply voltage range (VDD2) .............................................................. Input voltage range (VIN) ................................................................... Input pin current (IIN): Signal pin ................................................................................... Power pin ................................................................................... Lead temperature (soldering 10 sec) ................................................ Storage temperature range (TS) ....................................................... Maximum junction temperature (TJ) ................................................. -0.3 to 2.0 V -0.3 to 4.0 V -0.3 to 4.0 V 4/ 5/ 5/ -10 mA to 10 mA -60 mA to 60 mA +300°C 6/ -65°C to +150°C +175°C 1.4 Recommended operating conditions. Supply voltage range (VDD1) .............................................................. Supply voltage range (VDD2) .............................................................. Input voltage range (VIN) ................................................................... Ambient temperature (TA) ................................................................. 1.65 V to 1.95 V 4/ 3.0 V to 3.6 V or 2.3 V to 2.7 V 0 V to VDD2 V 5/ -55°C to +125°C 5/ 1.5 Radiation features. Maximum total dose available (Dose rate = 0.1 Rad(Si)/s) ............... 100 kRads (Si) 7/ _____ 2/ 3/ 4/ 5/ 6/ 7/ This absolute maximum ratings guarantees that the device will not be burned if those maximum voltages are applied during a very limited period of time. This is not a guarantee of functionality or reliability. The users must be warned that if a voltage exceeding the maximum (nominal +10%) and below this absolute maximum rating voltages, is applied to the devices, the reliability of the device will be affected. All voltages referenced to ground unless otherwise specified. For core. For interface, I/O’s. Duration 10 sec maximum at a distance not less than 1.6 mm. Unless otherwise specified in the AID. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 3 2. APPLICABLE DOCUMENTS Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. MIL-PRF-55681 - Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and as specified in figure 1. 3.3 AID requirements. All AIDs written against this SMD shall be sent to DLA Land and Maritime -VA. The following items shall be provided to the device manufacturer by the customer as part of an AID. Items 3.3.3 through 3.3.9 form a part of the manufacturer's design database/database archive. These items shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. As such, these items will not appear in the AID in the traditional sense. 3.3.1 Terminal connections and pin assignments. 3.3.2 Package type (see 1.2.4). 3.3.3 Functional block diagram (or equivalent HDL behavioral description). 3.3.4 Logic diagram (or equivalent structural HDL description or mutually agreed to net list). 3.3.5 Pin function description. 3.3.6 Design tape # or Design document name (i.e., net list). 3.3.7 Design functional tape # or name. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 4 3.3.8 Test functional tape # or name. 3.3.9 Switching waveform(s). 3.3.10 Fault coverage. The extent of fault coverage is controlled by the quality of the customers design input, therefore fault coverage shall be specified by the customer. 3.3.11 Burn-in circuit. 3.3.12 ESD class and voltage. 3.3.13 Device electrical performance characteristics (additions to Table I). Device electrical performance characteristics shall include dc parametric, functional, ac parameters and any other data which would be considered required by a design engineer. All electrical performance characteristics apply over the full recommended ambient operating temperature range and specified test load conditions. 3.3.14 Maximum power dissipation. Maximum power dissipation shall be in accordance with the application specific design. 3.3.15 RHA post-irradiated electrical. For RHA devices supplied to this drawing, the RHA post irradiated electrical shall be specified in the AID. 3.3.16 Radiation exposure circuit If applicable, the radiation exposure circuit shall be specified in the AID 3.4 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.5 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.6 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer’s PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. The AID number shall be added to the marking by the manufacturer. 3.6.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML” or “Q” as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C” as required in MIL-PRF-38535, appendix A. 3.7 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer’s product meets, for device classes Q and V, the requirements of MILPRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.8 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.9 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.10 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime’s agent, and the acquiring activity retain the option to review the manufacturer’s facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.11 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 123 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 5 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55°C ≤ TC ≤ +125°C 3.0 V ≤ VDD2 ≤ 3.6 V unless otherwise specified Group A Device subgroups type Limits Min Unit Max CMOS buffers 1, 2, 3 All 2 PCI buffers 1, 2, 3 All 0.5*V DD2 - CMOS buffers 1, 2, 3 All - 0.8 PCI buffers 1, 2, 3 All - 0.3*V DD2 VOH CMOS buffers IOH =-2, -4, -8, -12, -16 mA 1, 2, 3 All V DD2-0.4 - Low level output voltage VOL CMOS buffers IOL = 2, 4, 8, 12, 16 mA 1, 2, 3 All - 0.4 High level input current IIH CMOS buffers Vin = V DD2 max 1, 2, 3 All -1 1 µA High level input current with pull up IIHPU CMOS buffers Vin = V DD2 max 1, 2, 3 All -5 5 µA High level input current with pull down IIHPD CMOS buffers Vin = V DD2 max 1, 2, 3 All 600 µA IIL CMOS buffers Vin = VSS 1, 2, 3 All -1 1 µA Low level input current with pull up IILPU CMOS buffers Vin = VSS 1, 2, 3 All -400 Low level input current with pull down IILPD CMOS buffers Vin = VSS 1, 2, 3 All -5 5 µA High impedance state high level output current IOZH CMOS buffers Vin = VDD2 max 1, 2, 3 All -1 +1 µA High impedance state low level output current IOZL CMOS buffers Vin = VSS 1, 2, 3 All -1 +1 µA Cold sparing Input leakage current IICS V DD1 or VDD2 = VSS Vin = VDD2 max 1, 2, 3 All -1 +1 µA Cold sparing Output leakage current IOCS VDD2 = VSS Vout = VDD2 max 1, 2, 3 All -1 +1 µA Output short circuit current 2/ 3/ IOSN CMOS buffers – nn = 1 Vout =VDD2 1, 2, 3 All - 23 mA Output short circuit current 2/ 3/ IOSP CMOS buffers – nn = 1 Vout = Vss 1, 2, 3 All - 23 mA High level current IOH PCI, VOH = VDD2 - 0.4 V 1, 2, 3 All 16 - mA Low level current IOL PCI, VOL = 0.4 V 1, 2, 3 All 16 - mA Differential output voltage VOD LVDS PL33 TXZ 1, 2, 3 All 247 454 mV Common mode output voltage VOS LVDS PL33 TXZ 1, 2, 3 All 1125 1375 mV Input capacitance 2/ CI33 CMOS buffers 4 All 7 pF High-level input voltage VIH Low-level input voltage VIL High level output voltage Low level input current V V µA See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TC ≤ +125°C 2.3 V ≤ VDD2 ≤ 2.7 V unless otherwise specified Group A Device subgroups type Limits Min Unit Max High-level input voltage VIH CMOS buffers 1, 2, 3 All 2 Low-level input voltage VIL CMOS buffers 1, 2, 3 All - 0.7 High level output voltage VOH CMOS buffers IOH =-1.5, -3, -6, -9, -12 mA 1, 2, 3 All V DD2-0.4 - Low level output voltage VOL CMOS buffers IOL = 1.5, 3, 6, 9, 12 mA 1, 2, 3 All - 0.4 High level input current IIH CMOS buffers Vin = V DD2 max 1, 2, 3 All -1 1 µA High level input current with pull up IIHPU CMOS buffers Vin = V DD2 max 1, 2, 3 All -5 5 µA High level input current with pull down IIHPD CMOS buffers Vin = V DD2 max 1, 2, 3 All 360 µA IIL CMOS buffers Vin = VSS 1, 2, 3 All -1 1 µA Low level input current with pull up IILPU CMOS buffers Vin = VSS 1, 2, 3 All -260 Low level input current with pull down IILPD CMOS buffers Vin = VSS 1, 2, 3 All -5 5 µA High impedance state high level output current IOZH CMOS buffers Vin = VDD2 1, 2, 3 All -1 +1 µA High impedance state low level output current IOZL CMOS buffers Vin = VSS 1, 2, 3 All -1 +1 µA Cold sparing Input leakage current IICS VDD2 = VSS Vin = VDD2 max 1, 2, 3 All -1 +1 µA Cold sparing Output leakage current IOCS VDD2 = VSS Vout = VDD2 max 1, 2, 3 All -1 +1 µA Output short circuit current 2/ 4/ IOSN CMOS buffers – nn = 1 Vout =VDD2 1, 2, 3 All - 14 mA Output short circuit current 2/ 4/ IOSP CMOS buffers – nn = 1 Vout = Vss 1, 2, 3 All - 14 mA Differential output voltage VOD LVDS PL25 TXZ 1, 2, 3 All 247 454 mV Common mode output voltage VOS LVDS PL25 TXZ 1, 2, 3 All 1125 1375 mV 4 All 7 pF Low level input current Input capacitance 2/ 1/ 2/ 3/ 4/ CI33 CMOS buffers V V µA Devices supplied to this drawing will meet all levels M, D, P, L and R of irradiation. However, this device is only tested at the 'R' level. Pre and Post irradiation values are identical unless otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level, TA = +25°C. Post irradiation electrical parameters shall be as specified in the AID. Tested at initial design and after major process changes, otherwise guaranteed IOSmax = 23, 46, 92, 138, 184 mA for nn = 1, 2, 4, 6, 8. IOSmax = 14, 28, 56, 84, 112 mA for nn = 1, 2, 4, 6, 8. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 7 Case X Note: Lid is connected to ground Symbol A A1 A2 C D D1 e Millimeter Min Max 1.96 2.66 1.70 2.10 0.10 0.30 0.10 0.20 37.90 39.30 26.90 27.50 0.650 BSC Dimensions Symbol Min Max .077 .105 E .067 .083 E1 .004 .012 f .004 .008 L 1.492 1.548 N1 1.059 1.083 N2 0.256 BSC Inch Millimeter Min Max 37.90 39.30 26.90 27.50 0.25 0.35 5.50 5.90 40 40 Inch Min Max 1.492 1.548 1.059 1.083 .010 .014 .216 .232 40 40 FIGURE 1. Case outline. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 8 Case Y Note: Lid is connected to ground Symbol A A1 A2 C D/E D1/E1 Millimeter Min Max 2.13 2.65 1.83 2.24 0.203 ref 0.102 0.203 46.73 47.94 34.03 34.54 Dimensions Inch Symbol Min Max .084 .104 e .072 .088 f .008 ref L .004 .008 N1 1.840 1.887 N2 1.340 1.360 Millimeter Min Max 0.635 BSC 0.20 REF 6.35 6.70 49 49 Inch Min Max .025 BSC .008 REF .250 .264 49 49 FIGURE 1. Case outline - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 9 Case Z Note: Lid is connected to ground Symbol A A1 A2 C D D1 E Millimeter Min Max 2.41 3.18 2.06 2.56 0.05 0.36 0.10 0.20 53.23 55.74 36.83 37.34 53.23 55.74 Dimensions Symbol Max .125 E1 .101 e .014 f .008 L 2.195 N1 1.470 N2 2.195 Inch Min .095 .081 .002 .004 2.095 1.450 2.095 Millimeter Min Max 36.83 37.34 0.508 bsc 0.15 0.25 8.20 9.20 64 64 Inch Min Max 1.450 1.470 0.20 bsc .006 .010 .323 .362 64 64 FIGURE 1. Case outline - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 10 Case U Note: Lid is connected to ground Symbol A A1 A2 b c D1/E1 e Millimeter Min Max 2.75 3.75 2.35 3.15 0.05 0.35 0.19 0.25 0.11 0.20 47.52 48.48 0.50 BASIC Dimensions Symbol Min Max .108 .148 F .092 .124 G .002 .014 J .007 .010 K .004 .008 L 1.871 1.908 L1 .019 BASIC m Inch Millimeter Min Max 4.50 5.50 2.50 2.60 0.75 1.05 0.50 74.85 76.40 74.60 75.40 2.50 2.65 Inch Min .177 .098 .029 2.947 2.937 .098 Max .217 .104 .041 .020 3.008 2.968 .104 FIGURE 1. Case outline - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 11 Case T Note: Lid is connected to ground Symbol A A1 A2 b Dimensions Inch Symbol Min Max .169 .232 D/E .055 .073 D1/E1 .094 .136 e .031 .040 Millimeter Min Max 4.30 5.90 1.40 1.85 2.40 3.45 0.79 0.99 Millimeter Min Max 24.80 25.20 22.86 TYP 1.27 REF Inch Min Max .976 .992 .900 TYP .050 REF FIGURE 1. Case outline - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 12 Case M Note: Lid is connected to ground Symbol A A1 A2 b Millimeter Min Max 4.30 5.90 1.40 1.85 2.60 3.45 0.79 0.99 Inch Min .169 .055 .102 .031 Dimensions Symbol Max .232 D/E .073 D1/E1 .136 e .040 Millimeter Min Max 28.77 29.23 26.67 TYP 1.27 REF Inch Min Max 1.133 1.151 1.05 TYP .050 REF FIGURE 1. Case outline - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 13 Case N Symbol A A1 D/E Dimensions Millimeters Symbol Min Max 2.27 24.85 3.40 2.77 25.15 Millimeters Min Max D1/E1 e 22.86 TYP 1.27 BSC FIGURE 1. Case outline - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 14 Case 4 Symbol A A1 D/E Dimensions Millimeters Symbol Min Max 2.27 28.85 3.07 2.77 29.15 Millimeters Min Max D1/E1 e 26.67 TYP 1.27 BSC FIGURE 1. Case outline - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 15 Case 5 Symbol A A1 D D1/E1 Dimensions Millimeters Symbol Min Max 2.27 2.77 0.41 0.47 28.85 29.15 24.00 TYP D2/E2 D3/E3 e Millimeters Min Max 24.39 24.87 23.80 23.96 1.00 BSC FIGURE 1. Case outline - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 16 Case 6 Symbol A A1 D/E D1/E1 D2/E2 Dimensions Millimeters Symbol Min Max 6.80 0.41 41.65 36.70 36.08 7.80 0.47 42.35 37.70 37.08 D3/E3 D4/E4 e e1 Millimeters Min Max 33.07 33.67 26.97 27.13 1.52 BSC 1.84 BSC FIGURE 1. Case outline - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 17 Case 7 L L1 G 2 PLS 264 177 265 176 D1/E1 352 89 1 88 m e b c SEE DETAIL A A2 A A1 DETAIL A Symbol A A1 A2 b c D1/E1 Dimensions Millimeters Symbol Min Max 0.75 2.49 0.19 0.19 0.10 47.67 1.05 2.03 0.69 0.25 0.17 48.33 e G L L1 m Millimeters Min Max 0.50 BSC 2.50 2.60 74.87 76.01 74.62 75.38 2.50 2.60 FIGURE 1. Case outline - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 18 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. For device class M subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device class Q and V, subgroups 7 and 8 tests shall be sufficient to verify the functionality of the device as described in the AID. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 19 TABLE II. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M 1, 7, 9 Device class Q 1, 7, 9 Device class V 1, 7, 9 1, 2, 3, 7, 8, 9, 10, 11 1/ 1, 2, 3, 7, 8, 9, 10, 11 1/ 1, 2, 3, 7, 8, 9, 10, 11 2/ 3/ 1, 2, 3, 4, 7, 8, 9, 10, 11 1, 2, 3, 4, 7, 8, 9, 10, 11 1, 2, 3, 4, 7, 8, 9, 10, 11 1, 7, 9 1, 7, 9 1, 7, 9 3/ 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9 Subgroups (in accordance with MIL-PRF-38535, table III) 1/ PDA applies to subgroup 1. 2/ PDA applies to subgroups 1 and 7. 3/ Delta limits, as specified in table III, shall be required where specified, and the delta limits shall be completed with reference to the zero hour electrical parameters. TABLE III. Burn-in and operating life test, delta parameter (+25°C) Parameter 1/ Quiescent supply current delta Input current low level Input current high level Symbol Delta limits ΔICC 2/ IIL ±100 nA IIH ±100 nA High impedance state high level output current IOZH ±100 nA High impedance state low level output current IOZL ±100 nA Output voltage low level VOL ±0.10 V Output voltage high level VOH ±0.10 V 1/ These parameters shall be recorded before and after required burn-in and life tests to determined delta limits. 2/ Shall be specified in the AID. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 20 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). RHA levels for device classes M, Q and V shall be as specified in MIL-PRF-38535. End-point electrical parameters shall be as specified in table IIA herein. a. End-point electrical parameters shall be as specified in Table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the post-irradiation end-point electrical parameter limits as defined in Table I at TA = +25°C±5°C, after exposure, to the subgroups specified in Table IIA herein. 4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method 1019. 4.4.4.1.1 Accelerated annealing test. Accelerated aging tests shall be performed on all devices requiring a RHA level greater than 5k rads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I. Testing shall be performed at initial qualification and after any design or process changes which may affect the RHA response of the device. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 21 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-0547. 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime -VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DLA Land and Maritime -VA. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-06B02 A REVISION LEVEL D SHEET 22 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 12-11-03 Approved sources of supply for SMD 5962-06B02 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ 5962-06B0201QXC 5962-06B0201QYC 5962-06B0201QZC Vendor CAGE number F7400 F7400 F7400 Vendor Similar PIN 2/ 3/ ATC18R_216KExxx-MQ ATC18R_216KBxxx-MQ ATC18R_216KAxxx-MQ 5962-06B0201VXC 5962-06B0201VYC 5962-06B0201VZC 5962R06B0201VXC 5962R06B0201VYC 5962R06B0201VZC F7400 F7400 F7400 F7400 F7400 F7400 ATC18R_216KExxx-SV ATC18R_216KBxxx-SV ATC18R_216KAxxx-SV ATC18R_216KExxx-SR ATC18R_216KBxxx-SR ATC18R_216KAxxx-SR 5962-06B0202QYC 5962-06B0202QZC 5962-06B0202QUC 5962-06B0202QXC 5962-06B0202QTB 5962-06B0202QNC F7400 F7400 F7400 F7400 F7400 F7400 ATC18R_324KBxxx-MQ ATC18R_324KAxxx-MQ ATC18R_324YFxxx-MQ ATC18R_324KExxx-MQ ATC18R_3242Hxxx-MQ ATC18R_3242Uxxx-MQ 5962-06B0202VYC 5962-06B0202VZC 5962-06B0202VUC 5962-06B0202VXC 5962-06B0202VTB 5962-06B0202VNC F7400 F7400 F7400 F7400 F7400 F7400 ATC18R_324KBxxx-SV ATC18R_324KAxxx-SV ATC18R_324YFxxx-SV ATC18R_324KExxx-SV ATC18R_3242Hxxx-SV ATC18R_3242Uxxx-SV 5962R06B0202VYC 5962R06B0202VZC 5962R06B0202VUC 5962R06B0202VXC 5962R06B0202VTB 5962R06B0202VNC F7400 F7400 F7400 F7400 F7400 F7400 ATC18R_324KBxxx-SR ATC18R_324KAxxx-SR ATC18R_324YFxxx-SR ATC18R_324KExxx-SR ATC18R_3242Hxxx-SR ATC18R_3242Uxxx-SR Page 1 of 6 Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 3/ 5962-06B0203QZC 5962-06B0203QUC 5962-06B0203QTB 5962-06B0203QMB 5962-06B0203QNC 5962-06B0203Q4C 5962-06B0203Q5C 5962-06B0203Q6C F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 ATC18R_404KAxxx-MQ ATC18R_404YFxxx-MQ ATC18R_4042Hxxx-MQ ATC18R_4042Gxxx-MQ ATC18R_4042Uxxx-MQ ATC18R_4042Vxxx-MQ ATC18R_4042Kxxx-MQ ATC18R_4042Wxxx-MQ 5962-06B0203VZC 5962-06B0203VUC 5962-06B0203VTB 5962-06B0203VMB ATC18R_404KAxxx-SV ATC18R_404YFxxx-SV ATC18R_4042Hxxx-SV ATC18R_4042Gxxx-SV 5962-06B0203VNC F7400 F7400 F7400 F7400 F7400 5962-06B0203V4C F7400 ATC18R_4042Vxxx-SV 5962-06B0203V5C F7400 ATC18R_4042Kxxx-SV 5962-06B0203V6C F7400 ATC18R_4042Wxxx-SV 5962R06B0203VZC 5962R06B0203VUC 5962R06B0203VTB 5962R06B0203VMB ATC18R_404KAxxx-SR ATC18R_404YFxxx-SR ATC18R_4042Hxxx-SR ATC18R_4042Gxxx-SR 5962R06B0203VNC F7400 F7400 F7400 F7400 F7400 5962R06B0203V4C F7400 ATC18R_4042Vxxx-SR 5962R06B0203V5C F7400 ATC18R_4042Kxxx-SR 5962R06B0203V6C F7400 ATC18R_4042Wxxx-SR 5962-06B0204QZC 5962-06B0204QUC 5962-06B0204QTB 5962-06B0204QMB ATC18R_504KAxxx-MQ ATC18R_504YFxxx-MQ ATC18R_5042Hxxx-MQ ATC18R_5042Gxxx-MQ 5962-06B0204QNC F7400 F7400 F7400 F7400 F7400 5962-06B0204Q4C F7400 ATC18R_5042Vxxx-MQ 5962-06B0204Q5C F7400 ATC18R_5042Kxxx-MQ 5962-06B0204Q6C F7400 ATC18R_5042Wxxx-MQ 5962-06B0204VZC 5962-06B0204VUC 5962-06B0204VTB 5962-06B0204VMB ATC18R_504KAxxx-SV ATC18R_504YFxxx-SV ATC18R_5042Hxxx-SV ATC18R_5042Gxxx-SV 5962-06B0204VNC F7400 F7400 F7400 F7400 F7400 5962-06B0204V4C F7400 ATC18R_5042Vxxx-SV 5962-06B0204V5C F7400 ATC18R_5042Kxxx-SV 5962-06B0204V6C F7400 ATC18R_5042Wxxx-SV Page 2 of 6 ATC18R_4042Uxxx-SV ATC18R_4042Uxxx-SR ATC18R_5042Uxxx-MQ ATC18R_5042Uxxx-SV Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 3/ 5962R06B0204VZC 5962R06B0204VUC 5962R06B0204VTB 5962R06B0204VMB ATC18R_504KAxxx-SR ATC18R_504YFxxx-SR ATC18R_5042Hxxx-SR ATC18R_5042Gxxx-SR 5962R06B0204VNC F7400 F7400 F7400 F7400 F7400 5962R06B0204V4C F7400 ATC18R_5042Vxxx-SR 5962R06B0204V5C F7400 ATC18R_5042Kxxx-SR 5962R06B0204V6C F7400 ATC18R_5042Wxxx-SR 5962-06B0205QXC 5962-06B0205QYC F7400 F7400 ATC18R_216KExxx-MQ ATC18R_216KBxxx-MQ 5962-06B0205QZC F7400 ATC18R_216KAabc-MQ 5962-06B0205VXC 5962-06B0205VYC F7400 F7400 F7400 ATC18R_216KExxx-SV ATC18R_216KBxxx-SV F7400 F7400 F7400 ATC18R_216KExxx-SR ATC18R_216KBxxx-SR F7400 F7400 F7400 F7400 ATC18R_324KBxxx-MQ ATC18R_324KAxxx-MQ ATC18R_324YFxxx-MQ 5962-06B0205VZC 5962R06B0205VXC 5962R06B0205VYC 5962R06B0205VZC 5962-06B0206QYC 5962-06B0206QZC 5962-06B0206QUC 5962-06B0206QXC 5962-06B0206QTB 5962-06B0206QNC 5962-06B0206VYC 5962-06B0206VZC 5962-06B0206VUC 5962-06B0206VXC 5962-06B0206VTB 5962-06B0206VNC 5962R06B0206VYC 5962R06B0206VZC 5962R06B0206VUC 5962R06B0206VXC 5962R06B0206VTB 5962R06B0206VNC F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 F7400 Page 3 of 6 ATC18R_5042Uxxx-SR ATC18R_216KAxxx-SV ATC18R_216KAxxx-SR ATC18R_324KExxx-MQ ATC18R_3242Hxxx-MQ ATC18R_3242Uxxx-MQ ATC18R_324KBxxx-SV ATC18R_324KAxxx-SV ATC18R_324YFxxx-SV ATC18R_324KExxx-SV ATC18R_3242Hxxx-SV ATC18R_3242Uxxx-SV ATC18R_324KBxxx-SR ATC18R_324KAxxx-SR ATC18R_324YFxxx-SR ATC18R_324KExxx-SR ATC18R_3242Hxxx-SR ATC18R_3242Uxxx-SR Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 3/ 5962-06B0207QZC 5962-06B0207QUC 5962-06B0207QTB 5962-06B0207QMB ATC18R_404KAxxx-MQ ATC18R_404YFxxx-MQ ATC18R_4042Hxxx-MQ ATC18R_4042Gxxx-MQ 5962-06B0207QNC F7400 F7400 F7400 F7400 F7400 5962-06B0207Q4C F7400 ATC18R_4042Vxxx-MQ 5962-06B0207Q5C F7400 ATC18R_4042Kxx-MQ 5962-06B0207Q6C F7400 ATC18R_4042Wxxx-MQ 5962-06B0207VZC 5962-06B0207VUC 5962-06B0207VTB 5962-06B0207VMB ATC18R_404KAxxx-SV ATC18R_404YFxxx-SV ATC18R_4042Hxxx-SV ATC18R_4042Gxxx-SV 5962-06B0207VNC F7400 F7400 F7400 F7400 F7400 5962-06B0207V4C F7400 ATC18R_4042Vxxx-SV 5962-06B0207V5C F7400 ATC18R_4042Kxx-SV 5962-06B0207V6C F7400 ATC18R_4042Wxxx-SV 5962R06B0207VZC 5962R06B0207VUC 5962R06B0207VTB 5962R06B0207VMB ATC18R_404KAxxx-SR ATC18R_404YFxxx-SR ATC18R_4042Hxxx-SR ATC18R_4042Gxxx-SR 5962R06B0207VNC F7400 F7400 F7400 F7400 F7400 5962R06B0207V4C F7400 ATC18R_4042Vxxx-SR 5962R06B0207V5C F7400 ATC18R_4042Kxx-SR 5962R06B0207V6C F7400 ATC18R_4042Wxxx-SR 5962-06B0208QZC 5962-06B0208QUC 5962-06B0208QTB 5962-06B0208QMB ATC18R_504KAxxx-MQ ATC18R_504YFxxx-MQ ATC18R_5042Hxxx-MQ ATC18R_5042Gxxx-MQ 5962-06B0208QNC F7400 F7400 F7400 F7400 F7400 5962-06B0208Q4C F7400 ATC18R_5042Vxxx-MQ 5962-06B0208Q5C F7400 ATC18R_5042Kxxx-MQ 5962-06B0208Q6C F7400 ATC18R_5042Wxxx-MQ 5962-06B0208VZC 5962-06B0208VUC 5962-06B0208VTB 5962-06B0208VMB ATC18R_504KAxxx-SV ATC18R_504YFxxx-SV ATC18R_5042Hxxx-SV ATC18R_5042Gxxx-SV 5962-06B0208VNC F7400 F7400 F7400 F7400 F7400 5962-06B0208V4C F7400 ATC18R_5042Vxxx-SV 5962-06B0208V5C F7400 ATC18R_5042Kxxx-SV 5962-06B0208V6C F7400 ATC18R_5042Wxxx-SV Page 4 of 6 ATC18R_4042Uxxx-MQ ATC18R_4042Uxxx-SV ATC18R_4042Uxxx-SR ATC18R_5042Uxxx-MQ ATC18R_5042Uxxx-SV Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 3/ 5962R06B0208VZC 5962R06B0208VUC 5962R06B0208VTB 5962R06B0208VMB ATC18R_504KAxxx-SR ATC18R_504YFxxx-SR ATC18R_5042Hxxx-SR ATC18R_5042Gxxx-SR 5962R06B0208VNC F7400 F7400 F7400 F7400 F7400 5962R06B0208V4C F7400 ATC18R_5042Vxxx-SR 5962R06B0208V5C F7400 ATC18R_5042Kxxx-SR 5962R06B0208V6C F7400 ATC18R_5042Wxxx-SR 5962-06B0209QUC F7400 ATC18R_544YFxxx-MQ 5962-06B0209Q4C F7400 ATC18R_5442Vxxx-MQ 5962-06B0209Q5C F7400 ATC18R_5442Kxxx-MQ 5962-06B0209Q6C F7400 ATC18R_5442Wxxx-MQ 5962-06B0209VUC F7400 ATC18R_544YFxxx-SV 5962-06B0209V4C F7400 ATC18R_5442Vxxx-SV 5962-06B0209V5C F7400 ATC18R_5442Kxxx-SV 5962-06B0209V6C F7400 ATC18R_5442Wxxx-SV 5962R06B0209VUC F7400 ATC18R_544YFxxx-SR 5962R06B0209V4C F7400 ATC18R_5442Vxxx-SR 5962R06B0209V5C F7400 ATC18R_5442Kxxx-SR 5962R06B0209V6C F7400 ATC18R_5442Wxxx-SR 5962-06B0210QUC F7400 ATC18R_544YFxxx-MQ 5962-06B0210Q4C F7400 ATC18R_5442Vxxx-MQ 5962-06B0210Q5C F7400 ATC18R_5442Kxxx-MQ 5962-06B0210Q6C F7400 ATC18R_5442Wxxx-MQ 5962-06B0210VUC F7400 ATC18R_544YFxxx-SV 5962-06B0210V4C F7400 ATC18R_5442Vxxx-SV 5962-06B0210V5C F7400 ATC18R_5442Kxxx-SV 5962-06B0210V6C F7400 ATC18R_5442Wxxx-SV 5962R06B0210VUC F7400 ATC18R_544YFxxx-SR 5962R06B0210V4C F7400 ATC18R_5442Vxxx-SR 5962R06B0210V5C F7400 ATC18R_5442Kxxx-SR 5962R06B0210V6C F7400 ATC18R_5442Wxxx-SR 5962-06B0202Q7C 5962-06B0202V7C 5962R06B0202V7C F7400 F7400 F7400 ATC18R_324BGxxx-MQ ATC18R_324BGxxx-SV ATC18R_324BGxxx-SR Page 5 of 6 ATC18R_5042Uxxx-SR 1/ 2/ 3/ 4/ Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor Similar PIN 2/ 3/ 5962-06B0203Q7C 5962-06B0203V7C 5962R06B0203V7C F7400 F7400 F7400 ATC18R_404BGxxx-MQ ATC18R_404BGxxx-SV ATC18R_404BGxxx-SR 5962-06B0206Q7C 5962-06B0206V7C 5962R06B0206V7C F7400 F7400 F7400 ATC18R_324BGxxx-MQ ATC18R_324BGxxx-SV ATC18R_324BGxxx-SR 5962-06B0207Q7C 5962-06B0207V7C 5962R06B0207V7C F7400 F7400 F7400 ATC18R_404BGxxx-MQ ATC18R_404BGxxx-SV ATC18R_404BGxxx-SR The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. Due to the nature of this SMD, the standard microcircuit drawing PIN and corresponding vendor similar PIN shall be specified in the AID. The “xxx” is reserved to indicate the customer specific code. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. No longer available from an approved source of supplied. Vendor CAGE number Vendor name and address F7400 Atmel Nantes La Chantrerie 44306 Nantes Cedex3 France The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. Page 6 of 6