DFN22 6*5*0.9 MM, 0.5 P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN22 6*5*0.9 MM, 0.5 P
CASE 506AF−01
ISSUE A
22
DATE 15 AUG 2005
1
SCALE 2:1
A
D
B
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINALS AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN 1 LOCATION
E
0.15 C
0.15 C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
TOP VIEW
0.10 C
A
0.08 C
SIDE VIEW
A1
(A3)
D2
22 X
22 X
L
e
1
C
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
11
1
E2
K
22
XXXXXXXX
XXXXXXXX
AWLYYWW
G
12
22 X
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
6.00 BSC
3.98
4.28
5.00 BSC
2.98
3.28
0.50 BSC
0.20
−−−
0.50
0.60
b
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
SOLDERING FOOTPRINT
4.300
0.169
0.980
0.039
XXXXX
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
5.770
0.227
3.130
0.123
0.340
0.013
0.280
22X 0.011
0.500
20X 0.020
SCALE 8:1
DOCUMENT NUMBER:
STATUS:
mm Ǔ
ǒinches
98AON12565D
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
http://onsemi.com
DFN22 6*5*0.9 MM, 0.5 P
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON12565D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED TO PRODUCTION. REQ. BY P. CELAYA.
27 OCT 2004
A
MODIFIED SOLDERING FOOTPRINT. REQ. BY
15 AUG 2005
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 01A
Case Outline Number:
506AF