DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage MBD128 BGA2031/1 MMIC variable gain amplifier Product specification Supersedes data of 2000 Mar 02 2001 Feb 05 NXP Semiconductors Product specification MMIC variable gain amplifier BGA2031/1 FEATURES PINNING High gain PIN DESCRIPTION Excellent adjacent channel power rejection 1 RFin Small SMD package 2 CTRL Low dissipation. 3 VS1 4 VS2 + RFout APPLICATIONS 5 GND General purpose variable gain amplifier for low voltage and medium power 6 GND Driver for power amplifiers in systems that require good linearity, such as CDMA, both cellular band (850 MHz) and PCS (1.9 GHz). This is because of the high output power and good linearity. VS1 handbook, halfpage 6 5 4 RFin VS2+RFout GND DESCRIPTION CTRL Silicon Monolitic Microwave Integrated Circuit (MMIC) 2 stage variable gain amplifier in double polysilicon technology in a 6-pin SOT363 SMD plastic package for low voltage medium power applications. 1 2 3 BIAS CIRCUIT Top view MAM440 Marking code: A3 Fig.1 Simplified outline (SOT363) and symbol. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT VS1 supply voltage 3 3.3 V VS2 supply voltage 3 3.3 V IS supply current; pins 3 and 4 VCTRL = 0 0 10 A VCTRL = 2.7 V; VS = 3 V 51 63 mA VCTRL = 2.4 V; VS = 3 V 30 37 mA PL load power at 1 dB gain compression point; f = 1.9 GHz 13 dBm ACPR adjacent channel power rejection f = 1.9 GHz; PL = 10 dBm 49 dBc f = 836 MHz; PL = 8 dBm 48 dBc Gp G power gain gain control range f = 1.9 GHz; PL = 12 dBm 23 dB f = 836 MHz; PL = 8 dBm 24 dB f = 836 MHz; PL = 8 dBm 62 dB CAUTION This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. 2001 Feb 05 2 NXP Semiconductors Product specification MMIC variable gain amplifier BGA2031/1 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VS DC supply voltage 3.3 V VCTRL control voltage < VS V ICTRL control current 1.2 mA IS1 supply current; pin 3 27 mA IS2 supply current; pin 4 50 mA PD drive power +10 dBm Ptot total power dissipation 200 mW Tstg storage temperature Ts 80 C 65 +150 C Tj operating junction temperature 150 C THERMAL CHARACTERISTICS SYMBOL PARAMETER thermal resistance from junction to solder point Rth j-s MLD490 300 handbook, halfpage Ptot (mW) 200 100 0 0 50 100 150 Ts (°C) 200 Fig.2 Power derating. 2001 Feb 05 3 VALUE UNIT 350 K/W NXP Semiconductors Product specification MMIC variable gain amplifier BGA2031/1 CHARACTERISTICS Tj = 25 C; ZS = ZL = 50 ; VS = 3 V; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT f frequency range 800 2500 MHz VS1 supply voltage 2.7 3 3.3 V VS2 supply voltage 2.7 3 3.3 V IS supply current; pins 3 and 4 ICTRL control current VCTRL = 0; PD = 0 mW 0 10 A VCTRL = 2.7 V; VS = 3 V; PD = 0 mW 37 51 63 mA VCTRL = 2.4 V; VS = 3 V; PD = 0 mW 23 30 37 mA VCTRL = 2.7 V 0.7 0.92 1.1 mA 1850 1950 MHz f = 1900 MHz f frequency range Gp power gain VCTRL = 2.7 V; PL = 12 dBm 23 dB G gain control range 0 < VCTRL < 2.7 V 56 dB GCS gain control slope note 1 21 dB/V ACPR adjacent channel power 1.23 MHz offset; BWACP = 30 kHz; BWcarrier = 1.23 MHz; PL = 10 dBm rejection 49 dBc 1.98 MHz offset; BWACP = 30 kHz; BWcarrier = 1.23 MHz; PL = 10 dBm 74 dBc dBm PL load power at 1 dB gain compression point 13 VSWRIN input VSWR VCTRL = 2.7 V 1:3.5 VSWROUT output VSWR VCTRL = 2.7 V 1:1.3 824 849 MHz f = 836 MHz f frequency range Gp power gain VCTRL = 2.7 V; PL = 8 dBm 24 dB G gain control range 0 < VCTRL < 2.7 V 62 dB GCS gain control slope note 1 22 dB/V ACPR adjacent channel power 885 kHz offset; BWACP = 30 kHz; BWcarrier = 1.23 MHz; PL = 8 dBm rejection 49 dBc 1.98 MHz offset; BWACP = 30 kHz; BWcarrier = 1.23 MHz; PL = 8 dBm 74 dBc dBm PL load power at 1 dB gain compression point 11 VSWRIN input VSWR VCTRL = 2.7 V 1:2 VSWROUT output VSWR VCTRL = 2.7 V 1:1.4 Note 1. GCS = (G at VCTRL = 2.5 V G at VCTRL = 1.5 V) / (VCTRL = 2.5 V VCTRL = 1.5V) 2001 Feb 05 4 NXP Semiconductors Product specification MMIC variable gain amplifier BGA2031/1 MLD491 60 MLD492 16 handbook, halfpage handbook, halfpage IS (mA) PL (dBm) 40 8 20 0 836 MHz −8 −30 0 0 1 2 VCTRL (V) 3 VS = 3 V. Fig.3 1900 MHz −26 −22 −18 −14 −10 PD (dBm) VS = 3 V; VCTRL = 2.7 V. Total supply current as a function of control voltage; typical values. Fig.4 MLD493 40 Load power as a function of drive power; typical values. MLD494 40 Gp (dB) handbook, halfpage handbook, halfpage Gp (dB) 20 20 0 0 −20 −20 −40 −40 0 1 2 VCTRL (V) −60 3 0 1 VS = 3 V; PD = 14 dBm; f = 1.9 GHz. VS = 3 V; PD = 14 dBm; f = 836 MHz. Fig.5 Fig.6 Power gain as a function of control voltage; typical values. 2001 Feb 05 5 2 VCTRL (V) 3 Power gain as a function of control voltage; typical values. NXP Semiconductors Product specification MMIC variable gain amplifier BGA2031/1 MLD495 0 MLD496 0 handbook, halfpage handbook, halfpage ACPR (dBc) ACPR (dBc) −20 −20 offset = 1.23 MHz offset = 0.885 MHz −40 −40 offset = 1.98 MHz offset = 1.98 MHz −60 −60 −80 −20 −10 0 PL (dBm) −80 −20 10 −10 VS = 3 V; f = 1.9 GHz; PD = 12.8 dBm. VS = 3.6 V; f = 836 MHz; PD = 16 dBm. Fig.7 Fig.8 Adjacent channel power rejection as a function of load power; typical values. MLD497 160 GCS handbook, halfpage (dB/V) 120 80 40 836 MHz 1900 MHz 0 −40 0 1 2 VCTRL (V) 3 VS = 3 V; PD = 14 dBm. Fig.9 Gain control slope as a function of control voltage; typical values. 2001 Feb 05 6 0 PL (dBm) 10 Adjacent channel power rejection as a function of load power; typical values. NXP Semiconductors Product specification MMIC variable gain amplifier BGA2031/1 ELECTRICAL BLOCK DIAGRAM handbook, full pagewidth VS2 R2 VS1 C3 C2 RF input L1 RF output L2 Bias-T DC-block R1 BIAS CIRCUIT VCTRL C1 MGU298 Fig.10 Test diagram. List of components (see Fig.10) COMPONENT C1 DESCRIPTION VALUE multilayer ceramic chip capacitor DIMENSIONS 10 nF 0603 C2 multilayer ceramic chip capacitor 22 nF 0603 C3 multilayer ceramic chip capacitor 1.5 nF 0603 L1, L2 stripline; note 1 50 R1 SMD resistor 22 ; 0.16 W 0603 R2 SMD resistor 2.4 ; 0.16 W 0603 Note 1. The striplines are on a gold plated double copper-clad printed-circuit board (r = 6.15), board thickness = 0.64 mm, copper thickness = 35 m, gold thickness = 5 m. 2001 Feb 05 7 NXP Semiconductors Product specification MMIC variable gain amplifier BGA2031/1 PACKAGE OUTLINE Plastic surface-mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION SOT363 2001 Feb 05 REFERENCES IEC JEDEC JEITA SC-88 8 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 NXP Semiconductors Product specification MMIC variable gain amplifier BGA2031/1 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. DEFINITIONS Product specification The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. DISCLAIMERS Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. 2001 Feb 05 9 NXP Semiconductors Product specification MMIC variable gain amplifier BGA2031/1 Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 2001 Feb 05 10 NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: [email protected] © NXP B.V. 2010 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R77/02/pp11 Date of release: 2001 Feb 05