PANASONICBATTERY NN30195A

NN30195A
VIN = 4.5 V to 5.6 V, 6 A
Synchronous DC-DC Step down Regulator
comprising of Controller IC and Power MOSFET
FEATURES
DESCRIPTION
z High-Speed Response DC-DC Step Down Regulator
Circuit that employs Hysteretic Control System
z Two 25 mΩ (Typ.)
MOSFETs for High Efficiency at 6 A
z SKIP (discontinuous) Mode for Light Load Efficiency
z Up to 6 A Output Current
z Input VoltageRange : AVIN : 4.5 V to 5.6 V
PVIN : 2.9 V to 5.6 V
Output Voltage Range : 0.6 V to 3.5 V
Selectable Switching Frequency 500 kHz , 1 MHz , 2
MHz
z Adjustable Soft Start
z Low Operating and Standby Quiescent Current
z Open Drain Power Good Indication for Output Over ,
Under Voltage
z Built-in Under Voltage Lockout (UVLO),
Thermal Shut Down (TSD),
Over Voltage Detection (OVD),
Under Voltage Detection (UVD),
Over Current Protection (OCP),
Short Circuit Protection (SCP)
z HQFN024-A3-0404A ( Size : 4 mm X 4 mm, 0.5 mm
pitch ), 24pin Plastic Quad Flat Non-leaded Package
Heat Slug Down (QFN Type)
NN30195A is a synchronous DC-DC Step down
Regulator (1-ch) comprising of a Controller IC and two
power MOSFETs and employs the hysteretic control
system.
By this system, when load current changes suddenly, it
responds at high speed and minimizes the changes of
output voltage.
Since it is possible to use capacitors with small
capacitance and it is unnecessary to add external parts
for system phase compensation, this IC realizes
downsizing of set and reducing in the number of external
parts. Output voltage is adjustable by user.
Maximum current is 6 A.
APPLICATIONS
High Current Distributed Power Systems such as
・HDDs (Hard Disk Drives)
・SSDs (Solid State Drives)
・PCs
・Game consoles
・Servers
・Security Cameras
・Network TVs
・Home Appliances
・OA Equipment etc.
SIMPLIFIED APPLICATION
EFFICIENCY CURVE
VREG
Frequency = 500 kHz
100
90
CTL2
80
100k Ω
22μF
VOUT
BST
AVIN
NN30195A
AVIN
10μF
0.1μF
1μH
2k Ω
DCDCOUT 1.8V
LX
VFB
VREG
SS
70
60
FCCM/ Vo= 1.0V
FCCM/ Vo= 1.2V
FCCM/ Vo= 1.8V
FCCM/ Vo= 3.3V
SKIP/ Vo= 1.0V
SKIP/ Vo= 1.2V
SKIP/ Vo= 1.8V
SKIP/ Vo= 3.3V
50
40
30
22μF x 2
1k Ω
Efficiency (%)
PGOOD
20
AGND PGND
10
10nF
of mass production set is not guaranteed. You should
perform enough evaluation and verification on the
design of mass production set. You are fully
responsible for the incorporation of the above
application circuit and information in the design of
your equipment.
Publication date: October 2012
1
0.100
Notes) This application circuit is an example. The operation
0.010
0
0.001
1μF
10.000
CTL1
PVIN
1.000
PVIN
IOUT (A)
Condition )
VIN = 5.0 V, Vout = 1.0 V , 1.2 V , 1.8 V , 3.3 V,
Lo = 1 µH, Co = 44 µF (22 µF x 2), Frequency = 500 kHz
Ver. CEB
NN30195A
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Unit
Notes
Supply voltage
VIN
6.0
V
*1
Operating free-air temperature
Topr
– 40 to + 85
°C
*2
Operating junction temperature
Tj
– 40 to + 150
°C
*2
Storage temperature
Tstg
– 55 to + 150
°C
*2
Input Voltage Range
MODE,CTL1,CTL2,VFB,
VOUT
-0.3 to ( VIN + 0.3 )
V
*1, *3
LX,PGOOD
-0.3 to ( VIN + 0.3 )
V
*1, *3
HBM (Human Body Model)
2
kV
—
Output Voltage Range
ESD
Notes) Do not apply external currents and voltages to any pin not specifically mentioned.
This product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum rating.
This rating is the maximum rating and device operating at this range is not guaranteeable as it is higher than our stated
recommended operating range. When subjected under the absolute maximum rating for a long time, the reliability of the product
may be affected.
*1:The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
VIN is voltage for AVIN, PVIN.
*2:Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25 °C.
*3:( VIN + 0.3 ) V must not exceed 6 V.
POWER DISSIPATION RATING
θJA
PD ( Ta = 25 °C)
PD ( Ta = 85 °C )
Notes
61.6 °C / W
2.03 W
1.06 W
*1
PACKAGE
24 pin Plastic Quad Flat Non-leaded Package
Heat Slug Down (QFN Type)
Note). For the actual usage, please refer to the PD-Ta characteristics diagram in the package specification, follow the power supply
voltage, load and ambient temperature conditions to ensure that there is enough margin and the thermal design does not
exceed the allowable value.
*1:Glass Epoxy Substrate ( 4 Layers ) [ Glass-Epoxy: 50 X 50 X 0.8 t ( mm ) ]
Die Pad Exposed , Soldered.
CAUTION
Although this has limited built-in ESD protection circuit, but permanent damage may occur on it.
Therefore, proper ESD precautions are recommended to avoid electrostatic damage to the MOS gates
2
Ver. CEB
NN30195A
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply voltage range
Input Voltage Range
Output Voltage Range
Pin Name
Min.
Typ.
Max.
Unit
Notes
AVIN
4.5
5.0
5.6
V
—
PVIN
2.9
5.0
5.6
V
—
MODE
– 0.3
—
VIN + 0.3
V
*1
CTL1
– 0.3
—
VIN + 0.3
V
*1
CTL2
– 0.3
—
VIN + 0.3
V
*1
LX
– 0.3
—
VIN + 0.3
V
*1
PGOOD
– 0.3
—
VIN + 0.3
V
*1
Note) Do not apply external currents and voltages to any pin not specifically mentioned.
Voltage values, unless otherwise specified, are with respect to GND. GND is voltage for AGND, PGND. AGND = PGND
VIN is voltage for AVIN, PVIN. AVIN = PVIN.
The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
*1 : ( VIN + 0.3 ) V must not be exceeded 6 V.
3
Ver. CEB
NN30195A
ELECRTRICAL CHARACTERISTICS
Co = 22 µF X 2, Lo= 1 µH, VOUT Setting = 1.0 V, VIN = AVIN = PVIN = 5 V, Switching Frequency = 1 MHz,
MODE = Low (Skip), Ta = 25 °C ± 2 °C unless otherwise noted.
Parameter
Symbol
Condition
Min
Limits
Typ
Max
Unit Note
Current Consumption
Consumption current at active
IVDDACT
CTL1 = 5 V, IOUT = 0 A
RFB1 = 1.0 kΩ
RFB2 = 1.5 kΩ
—
300
700
µA
—
Consumption current at standby
IVDDSTB
CTL1 = CTL2 = 0 V
—
—
2
µA
—
Logic Pin
CTL1 pin Low-level input voltage
VCTL1L
—
—
—
0.3
V
—
CTL1 pin High-level input voltage
VCTL1H
—
1.5
—
—
V
—
—
3.5
10.0
µA
—
CTL1 pin leak current
ILEAKCTL1
CTL1 = 5 V
CTL2 pin Low-level input voltage
VCTL2L
—
—
—
0.3
V
—
CTL2 pin High-level input voltage
VCTL2H
—
1.5
—
—
V
—
—
3.5
10.0
µA
—
CTL2 pin leak current
ILEAKCTL2
CTL2 = 5 V
MODE pin Low-level input voltage
VMODEL
—
—
—
VREG
× 0.3
V
—
MODE pin High-level input voltage
VMODEH
—
VREG
× 0.7
—
—
V
—
MODE pin leak current
ILEAKMD
MODE = 5 V
—
3.5
10.0
µA
—
VREG output voltage
VREGOUT
IVREG = – 6 mA
2.35
2.55
2.75
V
—
VREG drop out voltage
VREGDO
IVREG = 0 A to – 6 mA
—
—
50
mV
—
VREG
4
Ver. CEB
NN30195A
ELECRTRICAL CHARACTERISTICS ( Continued )
Co = 22 µF X 2, Lo= 1 µH, VOUT Setting = 1.0 V, VIN = AVIN = PVIN = 5 V, Switching Frequency = 1 MHz,
MODE = Low (Skip), Ta = 25 °C ± 2 °C unless otherwise noted.
Parameter
Symbol
Condition
VFBTS
—
Min
Limits
Typ
Max
0.594
0.600
0.606
V
—
Unit Note
VFB
VFB comparator threshold
VFB pin leak current 1
ILEAKFB1
VFB = 0 V
–1
—
1
µA
—
VFB pin leak current 2
ILEAKFB2
VFB = 3.6 V
–1
—
1
µA
—
Under Voltage Lock Out
PVIN UVLO start voltage 1
VUVLODET1 PVIN = 5 V to 0 V
2.35
2.60
2.85
V
—
PVIN UVLO recover voltage 1
VUVLORMV1 PVIN = 0 V to 5 V
2.55
2.80
3.05
V
—
AVIN UVLO start voltage 2
VUVLODET2 AVIN = 5 V to 0 V
3.15
3.40
3.65
V
—
AVIN UVLO recover voltage 2
VUVLORMV2 AVIN = 0 V to 5 V
3.25
3.50
3.75
V
—
PGOOD
PGOOD Threshold 1
(VFB ratio for UVD detect)
PGOOD Hysteresis 1
(VFB ratio for UVD release)
PGOOD Threshold 2
(VFB ratio for OVD detect)
PGOOD Hysteresis 2
(VFB ratio for OVD release)
PGOOD ON resistance
VTHPG1
PGOOD : High to Low
78
85
92
%
—
VHYSPG1
PGOOD : Low to High
2
5
8
%
—
VTHPG2
PGOOD : High to Low
108
115
122
%
—
VHYSPG2
PGOOD : Low to High
2
5
8
%
—
CTL1 = CTL2 = 0 V
—
15
20
Ω
—
RPG
5
Ver. CEB
NN30195A
ELECRTRICAL CHARACTERISTICS ( Continued )
Co = 22 µF X 2, Lo= 1 µH, VOUT Setting = 1.0 V, VIN = AVIN = PVIN = 5 V, Switching Frequency = 1 MHz,
MODE = Low (Skip), Ta = 25 °C ± 2 °C unless otherwise noted.
Parameter
Symbol
DC-DC line regulation
DDREGIN
DC-DC load regulation
DDREGLD
Min
Limits
Typ
Max
PVIN = 4.5 V to 5.6 V
IOUT = – 3 A
—
0.5
1.5
%/V
—
IOUT = – 10 mA to – 6 A
—
3
—
%
*1
Condition
Unit Note
DC-DC
DC-DC efficiency 1
DDEFF1
IOUT = – 10 mA
—
70
—
%
*1
DC-DC efficiency 2
DDEFF2
IOUT = – 3 A
—
81
—
%
*1
DC-DC output ripple voltage 1
DDVRPL1
IOUT = – 20 mA
—
25
—
mV
[p-p]
*1
DC-DC output ripple voltage 2
DDVRPL2
IOUT = – 3 A
—
10
—
mV
[p-p]
*1
DC-DC load transient response
DDDVAC
IOUT = – 100 mA ↔ – 3 A
Δt = 0.5 A / µs
—
20
—
mV
*1
DC-DC High Side MOS ON
resistance
DDRONH
VGS = 5 V
—
25
50
mΩ
—
DC-DC Low Side MOS ON
resistance
DDRONL
VGS = 5 V
—
25
50
mΩ
—
DV = PVIN – VOUT
—
1.4
—
V
*1
MIN Input and output voltage
difference
DV
*1 :Typical Value checked by design.
6
Ver. CEB
NN30195A
ELECRTRICAL CHARACTERISTICS ( Continued )
Co = 22 µF X 2, Lo= 1 µH, VOUT Setting = 1.0 V, VIN = AVIN = PVIN = 5 V, Switching Frequency = 1 MHz,
MODE = Low (Skip), Ta = 25 °C ± 2 °C unless otherwise noted.
Parameter
Min
Limits
Typ
Max
—
9.0
—
A
*1
FB = 0.6 V to 0.0 V
55
70
85
%
—
Symbol
Condition
DC-DC output current limit
DDILMT
—
DC-DC Output GND Short
Protection Threshold
DDSHPTH
Unit Note
PROTECTION
Soft-Start Timing
SS Charge Current
ISSCHG
VSS = 0.3 V
–4
–2
—
µA
—
SS Discharge Resistance (Shut-down)
RSSDIS
CTL1 = CTL2 = 0 V
—
2
4
kΩ
—
DC-DC Switching Frequency 1
DDFSW1
IOUT = – 6 A
CTL1 = 0 V
CTL2 = 5 V
—
500
—
kHz
*1
DC-DC Switching Frequency 2
DDFSW2
IOUT = – 6 A
CTL1 = 5 V
CTL2 = 0 V
—
1000
—
kHz
*1
DC-DC Switching Frequency 3
DDFSW3
IOUT = – 6 A
CTL1 = 5 V
CTL2 = 5 V
—
2000
—
kHz
*1
Switching Frequency Adjustment
*1 :Typical Value checked by design.
7
Ver. CEB
NN30195A
CTL2
VREG
VFB
VOUT
Top View
SS
AVIN
PIN CONFIGURATION
18 17 16 15 14 13
PGOOD 19
12 CTL1
25
AGND
AGND 20
11 AGND
BST 21
10 MODE
22
PVIN
27
LX
26
PVIN
23
24
8
PGND
7
1
2
3 4
5 6
LX
PIN FUNCTIONS
Pin No.
9
Pin name
Type
Description
LX
Output
Power MOSFET output pin
PGND
Ground
Ground pin for Power MOSFET
10
MODE
Input
11
AGND
Ground
12
CTL1
Input
ON/OFF control pin 1 / Frequency selection pin
13
CTL2
Input
ON/OFF control pin 2 / Frequency selection pin
14
VREG
Output
15
VFB
Input
Comparator negative input pin
16
VOUT
Input
Output voltage sense pin
17
SS
Output
18
AVIN
19
PGOOD
Output
Power good open drain pin
20
AGND
Ground
Ground pin
21
BST
Output
Supply input pin for high side FET gate driver
1
2
3
4
5
6
7
8
9
Skip / FCCM mode select pin
Ground pin
LDO output pin (Power supply for internal control circuit)
Soft start capacitor connect pin
Power supply Power supply pin
22
23
PVIN
Power supply Power supply pin for Power MOSFET
24
25
AGND
26
PVIN
27
LX
Ground
Ground pin for radiation of heat
Power supply Power supply pin for radiation of heat
Output
Power MOSFET output pin for radiation of heat
Notes) Concerning detail about pin description, please refer to OPERATION and APPLICATION INFORMATION section.
8
Ver. CEB
NN30195A
FUNCTIONAL BLOCK DIAGRAM
SS
17
CTL1
CTL2
12
CTL1C
OSC
PVIN
AVIN
SS
18
22,23,24,26
Soft-Start
ON/OFF
13
FSEL
19
PGOOD
BGR
VREG
14
VREF
VREG
VREG:2.55V
+
-
0.6V +10%
VOUT
16
UVLO
OCP
SCP
TSD
AVIN
+
-
0.6V +10%
21
Fault
VFB
15
VREF
Aux
Timer
REF
0.6V Soft-Start
Current Sense
+
+
BS SW
HPD
ON
CMP
HGD
Control
Logic
Ton
Timer + Comp
FSEL
BST
Toff
Timer + Comp
LX
1,2,3,4,5,6,27
LPD
VIN
Coast
10
MODE
LGO
FCCM/Skip
PGND
7,8,9
11,20,25
AGND
Notes) This block diagram is for explaining functions. Part of the block diagram may be omitted, or it may be simplified.
9
Ver. CEB
NN30195A
OPERATION
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.
1. Protection
(1).Output Over-Current Protection (OCP) function
And Short-Circuit Protection (SCP) function
1) The Over Current Protection is activated at about 9 A
(Typ.) During the OCP, the output voltage continues to
drop at the specified current.
2) The Short-Circuit Protection function is implemented
when the output voltage decreases and the VFB pin
reaches to about 70 % of the set voltage of 0.6 V.
3) The SCP operates intermittently at 2 ms-ON, 16 ms
OFF intervals.
VFB
115 %
110 %
0.6 V
0.6 V
90 %
85 %
1 ms
1)
2)
1 ms
3)
4)
PGOOD
Note: PGOOD Pin is pulled up to VREG pin
Figure : OVD and UVD Operation
(3).Thermal Shut Down (TSD)
When the IC internal temperature becomes more than
about 140 °C, TSD operates and DCDC turns off.
1)
Ground short protection
hysteresis
Output Voltage [V]
Over Current Protection ( typ : 9 A )
6.1 A to 13 A
2)
3)
Intermittent
operation area
(Ground short
protection detection
about 70% of Vout )
2. Pin Setting
(1).Operating Mode Setting
The IC can operate at two different modes : Skip mode
and Forced Continuous Conduction mode (FCCM).
In Skip mode, the IC is working under pulse skipping
mechanism to improve efficiency at light load condition.
In FCCM mode, the IC is working at fixed frequency to
avoid EMI issues.
The Operating Mode can be set by MODE pin as follows.
Pendency
characteristics
about 1.5 A
Output current [A]
Figure : OCP and SCP Operation
(2).Over Voltage Detection (OVD) and Under Voltage
Detection (UVD)
1).The NMOS connected to the PGOOD pin turns ON
when the output voltage rises and the VFB pin voltage
reaches 115 % of its set voltage (0.6 V).
2).After (1) above, the NMOS connected to the PGOOD
pin is turned OFF after 1 ms when the output voltage
drops and the VFB pin voltage reaches 110 % of its set
voltage (0.6 V).
3).The NMOS connected to the PGOOD pin turns ON
when the output voltage drops and the VFB pin
voltage reaches 85 % of its set voltage (0.6 V).
4).After (3) above, the NMOS connected to the PGOOD
pin is turned OFF after 1 ms when the output voltage
drops and the VFB pin voltage reaches 90 % of its set
voltage (0.6 V).
10
MODE pin
Mode
Low
Skip
High
FCCM
(2).Switching Frequency Setting
The IC can operate at three different frequency : 1000
kHz, 500 kHz and 2000 kHz.
The Switching Frequency can be set by CTL1 & CTL2
pin as follows.
CTL1 pin
Low
Low
High
High
CTL2 pin
Low
High
Frequency [kHz]
0 ( DCDC OFF)
500
Low
High
1000
2000
Ver. CEB
NN30195A
OPERATION ( Continued )
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.
3. Output Voltage Setting
The Output Voltage can be set by external resistance of
FB pin, and its calculation is as follows.
(VIN = 5 V, IOUT = 0 A, FCCM, Fsw = 1 MHz)
VOUT = ( 1 +
RFB2
) × 0.6
0.6
× Css
2μ
When Css is set at 10 nF, soft-start time is
approximately 3 ms.
VOUT
RFB1
Soft Start Time(sec) =
RFB1
VFB ( 0.6 V )
CTL1
or
CTL2
RFB2
2.2 V
2.55 V
VREG
Below resistors are recommended for following popular
output voltage.
UVLO
VOUT [V]
3.3
1.8
1.0
RFB1 [Ω]
4.5 k
2.0 k
1.0 k
RFB2 [Ω]
1.0 k
1.0 k
1.5 k
Soft Start Time (s)
SS
0.6 V
VFB
Note: RFB2 can be set to a maximum value of 10 kΩ.
A larger FBR2 value will be more susceptible
to noise.
VFB comparator threshold is adjusted to ± 1 %, but the
actual output voltage accuracy becomes more than ±
1 % due to the influence from the circuits other than VFB
comparator.
In the case of VOUT setting = 1.0 V, the actual output
voltage accuracy becomes ± 2 %.
(VIN = 5.0 V, IOUT = 0 A, FCCM, Fsw = 1 MHz).
4. Soft Start Setting
Soft Start function maintains the smooth control of the
output voltage during start up by adjusting soft start
time. When the CTL1 or CTL2 (or both) pin becomes
High, the current (2 µA) begin to charge toward the
external capacitor (Css) of SS pin, and the voltage of
SS pin increases straightly.
Because the voltage of FB pin is controlled by the
voltage of SS pin during start up, the voltage of FB
increase straightly to the regulation voltage (0.6 V)
together with the voltage of SS pin and keep the
regulation voltage after that. On the other hand, the
voltage of SS pin increase to about 2.8 V and keep the
voltage. The calculation of Soft Start Time is as follows.
11
VOUT
Figure : Soft Start Operation
5. Power ON / OFF sequence
(1) When the CTL1/2 pin is set to “High” after the VIN
settles, UVLO is released if VIN exceeds its threshold,
then the VREG starts up.
(2) When VREG voltage exceeds its threshold, the
SOFT START sequence is enabled. The capacitor
connected to the SS pin begins to charge and the SS pin
voltage increases linearly.
(3) The VOUT pin (DCDC Output) voltage increases at
the same rate as the SS pin. Normal operation begins
after the VOUT pin reaches the set voltage.
(4) When the CTL1/2 pin is set to “Low”, VREG and
UVLO stop operation. The VOUT pin / SS pin voltage
starts to drop and the VOUT pin discharge by internal
MOSFET (R = 50 Ω).
Note: The SS pin capacitor should be discharged
completely before restarting the startup sequence. An
incomplete discharge process might result in an
overshoot of the output voltage.
Ver. CEB
NN30195A
OPERATION ( Continued )
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.
Vo(Eo)
VIN
Q1
Ei
CTL1 / 2
VREG
IL
Lo
Ic
Io
Co
Q2
2.55 V
2.2 V
Rc
UVLO
SS
Given the desired input and output voltages, the inductor
value and operating frequency determine the ripple
Current.
0.6
× Css
Soft Start Time (s) =
2µ
0.6 V
ΔIL =
Eo ⋅ (Ei − Eo )
Ei ⋅ Lo ⋅ f
VFB
Iox =
VOUT
0.2
× Css + 1.25 m
Delay Time (s) =
2µ
PGOOD
(1) (2) (3)
(4)
Figure : Power ON/OFF sequence
Highest efficiency operation is obtained at low frequency
with small ripple current. However, achieving this
requires a large inductor. There is a trade-off among
component size, efficiency and operating frequency. A
reasonable starting point is to choose a ripple current
that is about 40 % of IOUT(MAX). The largest ripple
current occurs at the highest VIN. To guarantee that
ripple current does not exceed a specified maximum, the
inductance should be chosen according to:
Lo ≥
6. Inductor and Output Capacitor Setting
ΔIL
2
Eo ⋅ (Ei − Eo )
@ Ei = Ei_max
2 Ei ⋅ Iox ⋅ f
And its maximum current rating is
IL
Io
IL_max = Io_max +
The selection of COUT is primarily determined by the
ESR (Rc) required to minimize voltage ripple and load
transients. The output ripple Vrpl is approximately
bounded by:
0
⊿IL/2
0
Ic
Vrpl = Vop − Vob = Ei ⋅
⊿IL/2
Vo
Eo
ΔIL
(@ Ei = Ei_max)
2
Vrpl
= Ei ⋅
ΔIL
Co ⋅ Rc 2
+
2 Lo
8Co ⋅ f
Co ⋅ Rc 2
Eo ⋅ (Ei − Eo )
+
2 Lo
8Ei ⋅ Lo ⋅ Co ⋅ f 2
From the above equation, to achieve desired output
ripple, low ESR ceramic capacitors are recommended,
and its required RMS current rating is:
Ton
T=1/f
Ic(rms)_max =
12
ΔIL
(@ Ei = Ei_max)
2 3
Ver. CEB
NN30195A
OPERATION ( Continued )
7.Start / Stop sequence
Start / Stop control of NN30195A is performed by CTL1 pin. The start / stop sequence is as follows. (Css=10 nF)
VIN
(Pin)
CTL1/2
(Pin)
1.23V
VREF
(Int)
0.75V
UVLO
(Int)
OSC stop
CLK
(Int)
2.55V
VREG
(Pin)
2.2V
75us
2.4ms
Soft-Start
VFB
(Pin)
POG
(Pin)
0.6V
90%
2.25ms
Power Good Flap
Start / Stop sequence in case that CTL1/2 pin is connected to power supply (VIN) is as follows. (Css=10 nF)
VIN
(Pin)
CTL1/2
(Pin)
3.5V
3.4V
VIN
0.75V
VREF
(Int)
1.23V
UVLO
(Int)
OSC stop
CLK
(Int)
VREG
(Pin)
VFB
(Pin)
2.55V
2.2V
75us
2.4ms
Soft-Start
90%
0.6V
Power Good Flap
POG
(Pin)
2.25ms
Note) All values given in the above figure are typical values.
13
Ver. CEB
NN30195A
TYPICAL CHARACTERISTICS CURVES
(1) Output Ripple Voltage
Condition : VIN=5V,Vout = 1.0V,Frequency = 1000kHz,Skip Mode
I Load = 0A
I Load = 1A
Vout
Vout
LX
LX
I Load = 3A
I Load = 6A
Vout
Vout
LX
LX
14
Ver. CEB
NN30195A
TYPICAL CHARACTERISTICS CURVES ( Continued )
(1) Output Ripple Voltage ( Continued )
Condition : VIN=5V,Vout = 1.0V,Frequency = 1000kHz,FCCM Mode
I Load = 0A
I Load = 1A
Vout
Vout
LX
LX
I Load = 3A
I Load = 6A
Vout
Vout
LX
LX
15
Ver. CEB
NN30195A
TYPICAL CHARACTERISTICS CURVES ( Continued )
(2) Load transient
Condition : VIN = 5.0 V, Vout = 1.0 V, Frequency = 1 MHz, Iout = 10 mA ÅÆ 6 A ( 0.5 A / μs )
Skip Mode
VOUT (50 mV/div)
FCCM Mode
35.1mV
30.4mV
VOUT (50 mV/div)
27.1mV
44.1mV
IOUT (5 A/div)
IOUT (5 A/div)
Time (100 us/div)
Time (100 us/div)
Condition : VIN = 5.0 V, Vout = 1.0 V, Frequency = 1 MHz, Iout = 2.5 A ÅÆ 5 A ( 0.15 A / μs )
Skip Mode
VOUT (50 mV/div)
FCCM Mode
VOUT (50 mV/div)
13.7mV
14.1mV
11.5mV
13.9mV
IOUT (2 A/div)
IOUT (2 A/div)
Time (100 us/div)
Time (100 us/div)
(3) Efficiency
Condition : Vin = 5 V, Vout = 1.05 V / 1.2 V / 1.8V / 3.3V / 5.0 V,
L = 4.7 μH, Cout = 66 μF (22 μF x 3), Frequency = 250 kHz
Condition : Vin = 5 V, Vout = 1.05 V / 1.2 V / 1.8V / 3.3V / 5.0 V,
L = 1 μH, Cout = 66 μF (22 μF x 3), Frequency = 750kHz
Frequency = 1000 kHz
90
90
80
80
70
70
60
Efficiency (%)
100
100
FCCM/ Vo= 1.0V
FCCM/ Vo= 1.2V
FCCM/ Vo= 1.8V
FCCM/ Vo= 3.3V
SKIP/ Vo= 1.0V
SKIP/ Vo= 1.2V
SKIP/ Vo= 1.8V
SKIP/ Vo= 3.3V
50
40
30
20
10
60
FCCM/ Vo= 1.0V
FCCM/ Vo= 1.2V
FCCM/ Vo= 1.8V
FCCM/ Vo= 3.3V
SKIP/ Vo= 1.0V
SKIP/ Vo= 1.2V
SKIP/ Vo= 1.8V
SKIP/ Vo= 3.3V
50
40
30
20
10
10.000
1.000
0.100
0.010
10.000
1.000
0.100
0.010
0.001
0
0
0.001
Efficiency (%)
Frequency = 500 kHz
IOUT (A)
IOUT (A)
16
Ver. CEB
NN30195A
TYPICAL CHARACTERISTICS CURVES ( Continued )
(4) Load regulation
Condition : VIN = 5.0 V, Vout = 1.0 V, Frequency = 500 kHz
Load Regulation_f = 500kHz (FCCM mode)
1.080
1.080
1.060
1.060
1.040
1.040
1.020
1.020
1.000
IOUT (A)
6.00
5.00
0.00
6.00
5.00
4.00
0.900
3.00
0.920
0.900
2.00
0.940
0.920
1.00
0.960
0.940
4.00
0.980
0.960
3.00
0.980
2.00
1.000
1.00
VOUT (V)
1.100
0.00
VOUT (V)
Load Regulation_f = 500kHz (skip m ode)
1.100
IOUT (A)
Condition : VIN = 5.0 V, Vout = 1.0 V, Frequency = 1 MHz
L o ad Reg u la tio n _f = 10 00kHz (FC C M m o d e)
Load Regulation_f = 1000kHz (skip mode)
1.100
1.100
1.080
1.080
1.060
1.040
1.020
1.020
1.000
IOUT (A)
6.00
5.00
0.00
6.00
5.00
4.00
0.900
3.00
0.920
0.900
2.00
0.940
0.920
1.00
0.960
0.940
4.00
0.980
0.960
3.00
0.980
2.00
1.000
1.00
VOUT (V)
1.040
0.00
VOUT (V)
1.060
IOUT (A)
(5) Line regulation
Condition : VIN = 5 V, Vout = 1.0 V, Frequency = 1 MHz, Iout = 1.5 A
Line Regulation_f = 1000kHz (FC CM m ode)
1.0
1.0
0.8
0.8
5.0
0.0
V IN (V )
4.0
0.0
5.0
0.0
4.0
0.2
3.0
0.2
2.0
0.4
1.0
0.4
3.0
0.6
2.0
0.6
1.0
VOUT (V)
1.2
0.0
VOUT (V)
Line Regulation_f = 1000kHz (skip m ode)
1.2
V IN (V )
17
Ver. CEB
NN30195A
TYPICAL CHARACTERISTICS CURVES ( Continued )
(6) start/shut down
Condition : VIN = 5.0 V, Vout = 1.0 V, Frequency = 1 MHz, SKIP mode, Iout = 0 A
EN (2 V/div)
EN (2 V/div)
SS (2 V/div)
SS (2 V/div)
VOUT (0.5 V/div)
VOUT (0.5 V/div)
Time (10 ms/div)
Time (10 ms/div)
Condition : VIN = 5.0 V, Vout = 1.0 V, Frequency = 1 MHz, FCCM mode, Iout = 0 A
EN (2 V/div)
EN (2 V/div)
SS (2 V/div)
SS (2 V/div)
VOUT (0.5 V/div)
VOUT (0.5 V/div)
Time (10 ms/div)
Time (10 ms/div)
Condition : VIN = 5.0 V, Vout = 1.0 V, Frequency = 1 MHz, SKIP mode, Rload = 0.5 Ω
EN (2 V/div)
EN (2 V/div)
SS (2 V/div)
SS (2 V/div)
VOUT (0.5 V/div)
VOUT (0.5 V/div)
Time (10 ms/div)
Time (10 ms/div)
Condition : VIN = 5.0 V, Vout = 1.0 V, Frequency = 1 MHz, FCCM mode, Rload = 0.5 Ω
EN (2 V/div)
EN (2 V/div)
SS (2 V/div)
SS (2 V/div)
VOUT (0.5 V/div)
VOUT (0.5 V/div)
Time (10 ms/div)
Time (10 ms/div)
18
Ver. CEB
NN30195A
TYPICAL CHARACTERISTICS CURVES ( Continued )
(7) Short Current Protection
Condition : VIN = 5.0 V, Vout = 1.0 V, Frequency = 1 MHz
Skip Mode
FCCM Mode
LX (5 V/div)
LX (5 V/div)
SS (2 V/div)
SS (2 V/div)
VOUT (1 V/div)
VOUT (1 V/div)
IOUT (10 A/div)
IOUT (10 A/div)
Time (10 ms/div)
Time (10 ms/div)
(8) Switching Frequency
Condition : Vin = 5.0 V, Vout = 1.0 V, Frequency = 1 MHz, Iout = 10 mA ~ 10 A
LX Average Frequency (MHz) Skip Mode
LX Average Frequency (MHz) FCCM Mode
1.2
LX Average Frequency (MHz)
LX Average Frequency (MHz)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1
0.8
0.6
0.4
0.2
0
0.01
0.1
1
10
0.01
ILOAD (A)
0.1
1
10
ILOAD (A)
Condition : Vout = 1.0 V, Frequency = 1 MHz, Iout = 3 A
LX Average Frequency (MHz) FCCM Mode
1.00
1.00
0.98
0.98
LX Average Frequency (MHz)
LX Average Frequency (M Hz)
LX Average Frequency (MHz) Skip Mode
0.96
0.94
0.92
0.90
0.88
0.86
0.84
0.96
0.94
0.92
0.90
0.88
0.86
0.84
0.82
0.82
0.80
0.80
4.4
4.6
4.8
5.0
VIN(V)
5.2
5.4
5.6
4.4
4.6
4.8
5.0
5.2
5.4
5.6
VIN(V)
19
Ver. CEB
NN30195A
TYPICAL CHARACTERISTICS CURVES ( Continued )
(9) Thermal Performance
Condition : VIN=5V , Vout = 1.0V , Frequency = 1000kHz , ILoad = 5A , FCCM Mode
20
Ver. CEB
NN30195A
APPLICATIONS INFORMATION
Condition : Vout = 1.0 V, Frequency = 1 MHz, SKIP mode
R-PG
PGOOD
C-AVIN1
C-AVIN2
LX
R-FB2
12
C-AVIN1
C-AVIN2
VOUT
C-DCDCOUT1
C-DCDCOUT2
C-DCDCOUT3
VOUT
VFB
R-FB1
CTL2
L-LX
C-VREG
VREG
C-SS
C-BST
VFB
R-FB2
L-LX
AVIN
VOUT
CTL1
11
AGND
MODE
PGND
10
C-PVIN2
C-PVIN3
R-FB1
16
15
6
13
5
14
4
9
C-SS
24
3
8
SS
VOUT
C-VREG
23
18
22
17
21
2
7
AVIN
C-DCDCOUT1
C-DCDCOUT2
BST
PVIN
AGND
20
1
LX
PVIN
AVIN
19
C-BST
C-PVIN2
C-PVIN3
PVIN
DCDCOUT
PGND
Figure : layout
Figure : Application circuit
Figure : Top Layer with silk screen
( Top View ) with Evaluation board
Figure : Bottom Layer with silk screen
( Bottom View ) with Evaluation board
Notes) This application circuit and layout is an example. The operation of mass production set is not guaranteed. You should perform
enough evaluation and verification on the design of mass production set. You are fully responsible for the incorporation of the
above application circuit and information in the design of your equipment.
21
Ver. CEB
NN30195A
APPLICATIONS INFORMATION ( Continued )
Reference Designator
QTY
Value
Manufacturer
Part Number
C-AVIN1
1
10 µF
Murata
GRM21BR71A106KE51L
C-AVIN2
1
0.1 µF
Murata
GRM188R72A104KA35L
C-BST
1
0.1 µF
Murata
GRM188R72A104KA35L
C-DCDCOUT
2
22 µF
Murata
GRM31CR71E226KE15L
C-PVIN2
1
22 µF
Murata
GRM31CR71A226KE15L
C-PVIN3
1
0.1 µF
Murata
GRM188R72A104KA35L
C-SS
1
10 nF
Murata
GRM188R72A103KA01L
C-VREG
1
1.0 µF
Murata
GRM188R71E105KA12L
L-LX
1
1.0 µH
Panasonic
ETQP3W1R0WFN
R-AVIN
1
0
Panasonic
ERJ3GEY0R00V
R-FB1
1
1.0 kΩ
Panasonic
ERJ3EKF1001V
R-FB2
1
1.5 kΩ
Panasonic
ERJ3EKF1501V
R-FB3
1
0
Panasonic
ERJ3GEY0R00V
R-FB6
1
0
Panasonic
ERJ3GEY0R00V
R-FB6
1
0
Panasonic
ERJ3GEY0R00V
R-PG
1
100 kΩ
Panasonic
ERJ3EKF1003V
Figure : Recommended component
22
Ver. CEB
NN30195A
PACKAGE INFORMATION ( Reference Data )
Outline Drawing
Unit : mm
23
Ver. CEB
NN30195A
PACKAGE INFORMATION ( Reference Data )
Power dissipation (Supplementary explanation)
24
Ver. CEB
NN30195A
IMPORTANT NOTICE
1.The products and product specifications described in this book are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore,
ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your
requirements.
2.When using the LSI for new models, verify the safety including the long-term reliability for each product.
3.When the application system is designed by using this LSI, be sure to confirm notes in this book.
Be sure to read the notes to descriptions and the usage notes in the book.
4.The technical information described in this book is intended only to show the main characteristics and application
circuit examples of the products. No license is granted in and to any intellectual property right or other right owned
by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to
the infringement upon any such right owned by any other company which may arise as a result of the use of
technical information de-scribed in this book.
5.This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of
our company.
6.This LSI is intended to be used for general electronic equipment.
Consult our sales staff in advance for information on the following applications: Special applications in which
exceptional quality and reliability are required, or if the failure or malfunction of this LSI may directly jeopardize
life or harm the human body.
Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in
connection with your using the LSI described in this book for any special application, unless our company agrees
to your using the LSI in this book for any special application.
7.This LSI is neither designed nor intended for use in automotive applications or environments unless the specific
product is designated by our company as compliant with the ISO/TS 16949 requirements.
Our company shall not be held responsible for any damage incurred by you or any third party as a result of or in
connection with your using the LSI in automotive application, unless our company agrees to your using the LSI in
this book for such application.
8.If any of the products or technical information described in this book is to be exported or provided to non-residents,
the laws and regulations of the exporting country, especially, those with regard to security export control, must be
observed.
9. Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of
controlled substances, including without limitation, the EU RoHS Directive.
Our company shall not be held responsible for any damage incurred as a result of your using the LSI not
complying with the applicable laws and regulations.
25
Ver. CEB
NN30195A
USAGE NOTES
1. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed
operating conditions (operating power supply voltage and operating environment etc.). Especially, please be
careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off
and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as
redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical
injury, fire, social damages, for example, by using the products.
2. Comply with the instructions for use in order to prevent breakdown and characteristics change due to external
factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's
process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf
life and the elapsed time since first opening the packages.
3. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board),
it might smoke or ignite.
4. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit
between pins. In addition, refer to the Pin Description for the pin configuration.
5. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to
problems such as a solder-bridge between the pins of the semiconductor device. Also, perform a full technical
verification on the assembly quality, because the same damage possibly can happen due to conductive
substances, such as solder ball, that adhere to the LSI during transportation.
6. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs
such as output pin-VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin
short (load short) .
And, safety measures such as an installation of fuses are recommended because the extent of the abovementioned damage and smoke emission will depend on the current capability of the power supply.
7. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit
should not work during normal operation.
Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is
momentarily exceeded due to output pin to VCC short (Power supply fault), or output pin to GND short (Ground
fault), the LSI might be damaged before the thermal protection circuit could operate.
8. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not
applied to the pins because the device might be damaged, which could happen due to negative voltage or
excessive voltage generated during the ON and OFF timing when the inductive load of a motor coil or actuator
coils of optical pick-up is being driven.
9. The product which has specified ASO (Area of Safe Operation) should be operated in ASO
10. Verify the risks which might be caused by the malfunctions of external components.
11. Connect the metallic plates on the back side of the LSI with their respective potentials (AGND, PVIN, LX). The
thermal resistance and the electrical characteristics are guaranteed only when the metallic plates are connected
with their respective potentials.
26
Ver. CEB
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202