PLC Line Driver, 2 A

NCS5650
2 Amp PLC Line Driver
The NCS5650 is a high efficiency, Class A/B, low distortion power
line driver. Its design is optimized to accept a signal from a Power Line
Carrier modem. The output stage is designed to drive up to 2 A peak
into an isolation transformer or simple coil coupling to the mains. At
output current of 1.5 A, the output voltage is guaranteed to swing
within 1 V or less of either rail giving the user improved SNR. Power
supply options are single−sided 6 V to 12 V and dual balanced
$3.0 V to $6.0 V. The input stage contains an operational amplifier
which can be configured as a unity gain follower buffer or used to
provide the first stage of a 4−pole low pass filter. In addition the
NCS5650 offers a current limit programmable with a single resistor,
R−Limit, together with a current limit flag.
The device provides two independent thermal flags with hysteresis:
a thermal warning flag to let the user know the internal junction
temperature has reached a user programmable thermal warning
threshold and a thermal error flag that indicates the internal junction
temperature has exceeded 150°C. In shutdown mode the NCS5650
output goes into a high−impedance state. The NCS5650 comes in a 20
lead QFN package (4x4x1mm) with an exposed thermal pad for
enhanced thermal reliability.
Features
•
•
•
•
•
•
•
•
•
•
Rail−to−Rail Drop of Only $1 V with Iout = 1.5 A
VCC: Single−Sided (6 V to 12 V) or Dual−Balanced $6.0 V
Flexible 4th−Order Filtering
Current−Limit Set with One Resistor
Diagnostic Flags Level Shifted to V_c to Simplify Interface with
External MCU
♦ Thermal Warning Flag with Flexible Threshold Setting
♦ Thermal Error flag and Shutdown
♦ Overcurrent Flag
Enable/Shutdown Control
Extended Junction Temperature Range: −40°C to +125°C
Small Package: 20−pin 4x4x1mm QFN with Exposed Thermal Pad
Optimized for Operation in the Cenelec A to D Frequency Band
This is a Pb−Free Device
http://onsemi.com
MARKING
DIAGRAM
20
1
1
20
QFN20
CASE 485E
NCS
5650
ALYWG
G
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(*Note: Microdot may be in either location)
ORDERING INFORMATION
Device
NCS5650MNTXG
Package
Shipping
QFN20 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part or orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Typical Applications
• Power Line Communication Driver in AMM and AMR Metering
Systems
• Valve, Actuator, and Motor Driver
• Audio
© Semiconductor Components Industries, LLC, 2011
September, 2011 − Rev. 1
1
Publication Order Number:
NCS5650/D
NCS5650
Exposed
Pad
20 19 18 17 16
1
15
2
14
3
13
NCS5650
4
12
5
11
6
7 8
9 10
(Top View)
NOTE: The Exposed Pad (EP) on package bottom must be attached to a heat−sinking
conduit. The Exposed Pad must be electrically connected to VEE.
Figure 1. Pin Connections
AIN+
+
AOUT
AIN−
−
VC
EN
To Amplifiers
Status
Flags
Enable
Temp
Warn
TWARN
VWARN
Volt
Warn
Therm
SHDN
TSHDN
VCOM
Bias
ILIMIT
ILIM
EN
BIN−
GNDC
−
BOUT
BIN+
+
EN
+
−
RLIM
VCC
VEE
FLAG
Figure 2. NCS5650 Block Diagram
http://onsemi.com
2
NCS5650
PIN DESCRIPTION
Pin#
Symbol
1
Enable
Pin Function
2
Vcom
Virtual Common at (VCC − VEE)/2; not to be used as a reference. (See Note 1 Below)
3
AIN+
Positive (+) Input of Op Amp A
4
AIN−
Negative (−) Input of Op Amp A
5
Amp A Out
6
VCC
Positive supply for amplifiers
7
VCC
Positive supply for amplifiers
8
Amp B Out
Output of Op Amp B
9
Amp B Out
Output of Op Amp B
10
VEE
Negative supply for amplifiers
11
VEE
Negative supply for amplifiers
12
BIN−
Negative (−) Input of Op Amp B
13
BIN+
Positive (+) Input of Op Amp B
14
V−Warn
Thermal Warming Temp is set by a voltage determined by the ratio of two resistors (see Figure 8).
15
R−Limit
Output B Current Limit Set Resistor (R−Limit) to Pin 10, VEE + 1.92 V
16
ILIM flag
Current Limit Flag (High indicates Output Current w limit set by R−Limit)
17
TSD flag
Thermal Shutdown Flag (High indicates Junction Temperature w 150°C)
18
TW flag
Thermal Warning Flag (High indicates Junction Temperature w threshold set by V−Warn)
19
Vc
Digital supply for logic flag thresholds
20
GNDc
Digital ground for logic flag thresholds
21
Exposed Pad
Enable/ Shutdown Input (Low = Enable)
Output of Op Amp A
The exposed pad should be connected to the lowest voltage potential in the circuit.
1. The principal purpose of pin 2 is to facilitate the implementation of the 4th−order lowpass filter when operating on single−sided supply
by providing a virtual common at mid−supply. When operating on dual balanced supplies, Pin 2 must be left floating and the external
common of the dual supplies should be used for the filter implementation.
MAXIMUM RATINGS
Symbol
VS
VICR
Rating
Supply Voltage (VCC to VEE)
Input Common Mode Voltage Range
TJ
Maximum Junction Temperature (Operating Range −40°C to 125°C)
Tstg
Storage Temperature
Mounting Temperature (Infrared or Convection − 30 sec)
Value
Unit
13.2
V
(VEE − 0.3 V, VCC + 0.3 V)
< Vs
V
160
°C
−65 to 165
°C
260
MSL
Moisture Sensitivity Level
JA
Thermal Resistance
20−Pin QFN with Exposed Thermal Pad
(With exposed thermal pad soldered to 9 in2 of 2 oz Cu PCB area (62 mil thick
board) using 14 vias each with an 18 mil diameter and 1.5 mils Cu walls. See
Application Information.)
Level 1
33
°C/W
Logic control pins
5.5
V
Enable, RLIMIT, ILIM, TSD, TW, Vc
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
http://onsemi.com
3
NCS5650
ELECTRICAL CHARACTERISTICS VS = 12 V All limits apply over the temperature range, TJ = –40°C to +125°C, unless
otherwise noted. Total supply VS = VCC − VEE.
NCS5650
Parameter
Symbol
Condition
Min
Typ
Max
Units
INPUT OPERATIONAL AMPLIFIER (Op Amp A)
Offset Voltage
Input Offset Voltage
Offset vs Power Supply
VOS
VCC = +12 V, VEE = 0 V
±3
±10
mV
PSRR
VCC = +6 V, VEE = −6 V
25
150
uV/V
f = 1 kHz, VIN = GND,
BW = 131 kHz
250
Input Bias Current (Note 2)
IB
Input Voltage Noise Density
en
nA
nV/√Hz
Input Voltage Range
Common−Mode Voltage Range
VCM
Common−Mode Rejection Ratio
CMRR
VEE
− 0.1
VEE − 0.1 v VCM v VCC − 3
70
VCC −
3
V
85
dB
0.2 | 1.5
G | pF
0.2 | 3
G | pF
100
dB
80
MHz
1.5
MHz
60
V/s
G = +1, RL = 500 , VO = 8 VPP, f =
1 kHz, Cin = 220 F, Cout = 330 F
0.015
%
G = +1, RL = 50 , VO = 8 VPP, f =
100 kHz, Cin = 220 F, Cout = 330 F
0.023
Input Impedance
Differential
Common−Mode
Open−Loop Gain (Note 2)
RL = 500 80
Frequency Response
Gain Bandwidth Product
GBW
Full Power Bandwidth (Note 2)
Slew Rate
G = +5, Vout = 11 VPP
200
SR
Total Harmonic Distortion + Noise
THD+N
Output
Voltage Output Swing from Rail
VCC = +12 V, VEE = 0 V
From Positive Rail
VOH
RL = 500 VCC
From Negative Rail
VOL
RL = 500 VCC
Short−Circuit Current
ISC
Output Impedance
Z0
Capacitive Load Drive
Closed Loop G = +4, f = 100 kHz
CLOAD
0.3
1
0.3
1
V
V
280
mA
0.25
100
pF
OUTPUT OPERATIONAL AMPLIFIER (Op Amp B)
Offset Voltage
Input Offset Voltage
Offset vs Power Supply
VOS
VCC = +12 V, VEE = 0 V
±3
± 10
mV
PSRR
VCC = +12 V, VEE = 0 V
25
150
V/V
1
nA
Input Bias Current (Note 2)
IB
Input Voltage Noise Density
en
f = 1 kHz, VIN = GND,
BW = 131 kHz
125
nV/√Hz
Input Voltage Range
Common−Mode Voltage Range
VCM
Common−Mode Rejection Ratio
CMRR
VEE
− 0.1
VEE − 0.1 v VCM v VCC − 3
2. Guaranteed by characterization or design.
3. Formula accuracy requires a resistor with $1% tolerance.
http://onsemi.com
4
70
VCC −
3
85
V
dB
NCS5650
ELECTRICAL CHARACTERISTICS VS = 12 V All limits apply over the temperature range, TJ = –40°C to +125°C, unless
otherwise noted. Total supply VS = VCC − VEE.
NCS5650
Parameter
Symbol
Condition
Min
Typ
Max
Units
OUTPUT OPERATIONAL AMPLIFIER (Op Amp B)
Input Impedance
Differential
0.2 | 11
G | pF
Common−Mode
0.2 | 22
G | pF
100
dB
60
MHz
Open−Loop Gain (Note 2)
RL = 5 80
Frequency Response
Gain Bandwidth Product
GBW
Full Power Bandwidth (Note 2)
Slew Rate
G = +2, Vout = 11 VPP
200
400
kHz
70
V/s
G = +1, RL = 50 ,
VO = 8 VPP, f = 1 kHz
0.015
%
G = +1, RL = 50 ,
VO = 8 VPP, f = 100 kHz
0.067
SR
Total Harmonic Distortion + Noise
THD+N
Output
Voltage Output Swing from Rail
VCC = +12 V, VEE = 0 V
From Positive Rail
VOH
Iout = 1.5 A to Mid−Supply
0.7
1
V
From Negative Rail
VOL
Iout = 1.5 A to Mid−Supply
0.4
1
V
Voltage Output Swing from Rail
VCC = +6 V, VEE = −6 V
From Positive Rail
VOH
Iout = 1.5 A to GND
0.7
1
V
Negative Rail
VOL
Iout = 1.5 A to GND
0.4
1
V
Z0
Closed Loop G = +1,
f = 100 kHz
Output Impedance
Enabled Mode
Shutdown Mode
Capacitive Load Drive
CLOAD
0.065
12
M
500
nF
+160
°C
BOTH AMPLIFIERS COMBINED
Junction Temperature
TJ
At Shutdown (Note 2)
+150
+135
°C
Thermal Warning Tolerance
Twarning is determined by the ratio of
two resistors (see Figure 8) (Note 3)
±10
°C
Current Limit Tolerance
I−Limit is determined by a single
resistor (see Figure 5 text) (Note 3)
±50
mA
Single−Supply Operation (VEE Tied
to System Common)
6 to 12
Dual Balanced−Supply operation
±3.0 to ±6.0
At Recovery from Shutdown
Power Supply
Operating Voltage Range
Quiescent Current
Enabled Mode
Shutdown Mode
VCOM
VS
IQ
VCC = +6 V, VEE = −6 V
VCC = 12 V, VEE = 0 V
Internal resistor divider.
Bypass purposes only.
2. Guaranteed by characterization or design.
3. Formula accuracy requires a resistor with $1% tolerance.
http://onsemi.com
5
5.8
13.2
V
20
120
40
150
mA
A
6.0
6.2
V
NCS5650
ELECTRICAL CHARACTERISTICS VS = 12 V All limits apply over the temperature range, TJ = –40°C to +125°C, unless
otherwise noted. Total supply VS = VCC − VEE.
NCS5650
Symbol
Condition
Min
Logic/flag Supply Range
V_c
Logic/flag supply for operation with
external MCU
3.0
Reference Point for GND_c
Vgc
With Single−Sided Power Supply
VEE (Pins 10 and 11) Connected to System
Common
With Dual−Balanced Power Supply
Common of Dual Supply Connected to
System Common
Parameter
Typ
Max
Units
5.5
V
LOGIC INPUT/OUTPUT
Shutdown Input Mode
Output Enabled
Ve/s LOW
E/S Pin Open or Forced LOW
Vgc
− 0.4
Vgc +
0.8
V
Output Shutdown
Ve/s HIGH
E/S Pin Forced HIGH
Vgc
+2
V_c
V
Output Enabled
Ie/s LOW
E/S Pin LOW
0.1
A
Output Shutdown
Ie/s HIGH
E/S Pin HIGH
10
A
Output Shutdown Time
60
ns
Output Enable Time (Note 2)
5
10
s
All Flag Outputs
HIGH State
V
Vgc
+2
LOW State
Vgc +
0.8
2. Guaranteed by characterization or design.
3. Formula accuracy requires a resistor with $1% tolerance.
http://onsemi.com
6
V
NCS5650
APPLICATIONS INFORMATION
Exposed Thermal Pad
Bypassing
The NCS5650 is capable of delivering 1.5 A, into a
reactive load. Output signal swing should be kept as high as
possible to minimize internal heat generation to keep the
internal junction temperature as low as possible. The
NCS5650 can swing to within 1 V of either rail without
adding distortion. An exposed thermal pad is provided on
the bottom of the device to facilitate heat dissipation.
Application Note AND8402/D provides considerable
details for optimizing the soldering down of the exposed
pad. A very good example of the exposed pad
implementation is provided in the layout information
included with the NCS5650 Demo Board. The demo board
implements 14 vias, each with an 18 mil diameter and
1.5 mils Copper walls.
Optimal stability and noise rejection will be implemented
with power−supply bypassing placed as physically close to
the device as possible. A parallel combination of 10 F and
0.01 F is recommended (ceramic and tantalum,
respectively) for each sensitive point. For either
single−supply operation or split supply operation, bypass
should be placed directly across VCC to VEE. In addition add
bypass from VC to GNDc. Reference Figure 4.
VCOM
VCC
2
6
−
7
Multi−Feedback Filter (MFB)
VO
CENELEC EN 50065−1 is a European standard for
signaling on low−voltage electrical installations in the
frequency range 3 kHz to 148. 5 kHz. More specifically Part
1 of that specification deals with frequency bands and
electromagnetic disturbances introduced into the electrical
mains. A practical solution to meet this requirement is to
place a 4th−order filter between the output of the modem and
the isolation transformer connected to the mains. In this
datasheet a MFB filter topology is proposed to help meet the
requirements of the CENELEC standard. Four (4) pole
filters require two op amps for implementation. The
NCS5650 has an input pre−amplifier and an output power
amplifier. Therefore only passive components (R’s and C’s)
need to be added. In addition the NCS5650 has a mid−supply
virtual common at pin 2 (Vcom) to facilitate implementation
of the filter topology when powered from a single−sided
power supply.
Figure 3 below shows the frequency response for each
stage and the overall filter.
+
10
VC
VEE
Figure 4.
Current Limit (R−Limit)
The 2 A output current of the NCS5650 can be
programmed by the simple addition of a resistor (RLimit)
from pin 15 to the lowest potential in the circuit: VEE for
balanced supplies, and GND for single supplies (see
Figure 5). If the load current tries to exceed the set current
limit, the ILIM flag will go logic High signaling the user to
take any necessary action. When the current output recovers,
the ILIM flag will return to logic Low. The curve in Figure 5
is tolerance typically to ±50 mA. Unlike traditional power
amplifiers the NCS5650 current limits functions both when
sourcing and sinking current. To calculate the resistance
required to program a desired current limit the following
equation can be used:
16
14
AMP OUT (dbV)
12
10
Total Gain
AmpA Gain
I LIM + 1.215
R CL
8
6
4
19
11
AmpB Gain
−
2
VO
0
−2
0.1
8197
+
1
10
FREQUENCY (kHz)
100
15
11
1000
Figure 3. Amplifier Voltage vs. Frequency
VEE
Figure 5.
http://onsemi.com
7
NCS5650
Figure 6 graphically illustrates the required resistance in
ohms to program the current limit.
VCC
R9
20
−
14
RLimit (k)
15
VO
+
R10
10
VEE
Figure 7.
5
3
0
0
0.25
0.5
0.75
1
1.25
1.5
1.75
2.75
2
2.5
CURRENT LIMITS (A)
Figure 6.
VTW
2.25
Thermal Shutdown and Thermal Warning Flag
2
1.75
In the event load conditions cause internal over−heating
the amplifier will go into shutdown to prevent damage.
Under these conditions pin 17 the TSD flag (Thermal Shut
Down) will go logic High. Thermal shutdown takes place at
an internal junction temperature of approximately 160°C;
the amplifier will recover to the Enabled mode when the
junction temperature cools back down to approximately
135°C.
The user has the option to avoid entering into the TSD
mode by monitoring the junction temperature via the
Thermal Warning feature. Figure 8 shows how the user can
select any junction temperature (Twarn) in the range 105°C
to 145°C by applying the appropriate voltage to pin 14. A
simple way to implement this feature is by setting the ratio
of a voltage divider between VCC (pins 6,7) and VEE (the
negative supply, pin 10 or 11). The voltage ratio required to
program the thermal warning of the NCS5650 can be
calculated using the following equation:
VTW = 6.665 x 10−3 (TJ) + 1.72
Figure 8 illustrates the linearity of the internal junction
temperature to the required voltage on pin 14 (Twarn).
1.5
1.25
1
−40
−20
0
20
40
60
TJ (°C)
80
100 120
140
Figure 8.
Virtual Common (Vcom)
The principal purpose of Vcom is to provide a convenient
virtual common for implementing the 4th−order CENELEC
filter when operating on single−sided power supply. When
operating on balanced split supplies it is recommended to
use the power supply common for the filter implementation
and to leave Vcom floating.
Digital Power Supply GND−Reference and Translators
In many mixed signal applications analog GND and
digital GND are not always at the same potential. To
minimize GND loop issues, the NCS5650 has a separate
GND pin (pin 20) which should be used to reference the
digital supply and the warning flags (pins 16, 17, and 18). In
most applications this would be the same GND reference
used for the PLC modem. Please note that at some point in
the application digital GND and analog GND must be tied
together.
http://onsemi.com
8
NCS5650
PACKAGE DIMENSIONS
QFN20, 4x4, 0.5P
CASE 485E−01
ISSUE B
A
B
D
PIN ONE
REFERENCE
2X
0.15 C
ÉÉÉ
ÉÉÉ
ÉÉÉ
A3
ÇÇ
ÉÉ
EXPOSED Cu
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
MOLD CMPD
A1
DETAIL B
ÉÉ
ÇÇ
ÇÇ
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
OPTIONAL CONSTRUCTIONS
2X
0.15 C
L
L
TOP VIEW
(A3)
DETAIL B
L1
A
0.10 C
DETAIL A
OPTIONAL CONSTRUCTIONS
0.08 C
A1
SIDE VIEW
C
SEATING
PLANE
SOLDERING FOOTPRINT*
4.30
0.10 C A B
D2
DETAIL A
20X
20X
0.58
L
6
MILLIMETERS
MIN
MAX
0.80
1.00
--0.05
0.20 REF
0.20
0.30
4.00 BSC
2.60
2.90
4.00 BSC
2.60
2.90
0.50 BSC
0.20 REF
0.35
0.45
0.00
0.15
2.88
0.10 C A B
11
1
E2
1
K
2.88 4.30
20
e
20X
b
0.10 C A B
0.05 C
PKG
OUTLINE
NOTE 3
BOTTOM VIEW
20X
0.35
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
9
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCS5650/D