Si4364DY Datasheet

Si4364DY
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
30
RDS(on) (Ω)
ID (A)
0.0045 at VGS = 10 V
20
0.0055 at VGS = 4.5 V
19
• Halogen-free According to IEC 61249-2-21
Available
• TrenchFET® Power MOSFET
• Optimized for “Low Side” Synchronous
Rectifier Operation
• 100 % Rg Tested
APPLICATIONS
• DC/DC Converters
• Synchronous Rectifiers
SO-8
S
1
8
D
S
2
7
D
S
3
6
D
G
4
5
D
D
G
Top View
S
Ordering Information: Si4364DY-T1-E3 (Lead (Pb)-free)
Si4364DY-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Symbol
VDS
Gate-Source Voltage
VGS
TA = 25 °C
Continuous Drain Current (TJ = 150 °C)a
TA = 70 °C
ID
10 s
Steady State
30
a
IS
Continuous Source Current (Diode Conduction)
Maximum Power Dissipationa
TA = 25 °C
TA = 70 °C
PD
20
13
15
10
60
2.9
1.3
3.5
1.6
2.2
1
TJ, Tstg
Operating Junction and Storage Temperature Range
V
± 16
IDM
Pulsed Drain Current (10 µs Pulse Width)
Unit
- 55 to 150
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Symbol
t ≤ 10 s
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
29
35
67
80
13
16
Unit
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
Document Number: 70680
S09-0221-Rev. E, 09-Feb-09
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Si4364DY
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
0.8
Typ.
Max.
Unit
Static
VGS(th)
VDS = VGS, ID = 250 µA
1.8
V
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = ± 16 V
± 100
nA
Zero Gate Voltage Drain Current
IDSS
VDS = 30 V, VGS = 0 V
1
VDS = 30 V, VGS = 0 V, TJ = 55 °C
5
On-State Drain Currenta
ID(on)
Gate Threshold Voltage
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltage
a
VDS ≥ 5 V, VGS = 10 V
RDS(on)
µA
30
A
VGS = 10 V, ID = 20 A
0.0035
0.0045
VGS = 4.5 V, ID = 19 A
0.0043
0.0055
gfs
VDS = 15 V, ID = 20 A
90
VSD
IS = 2.9 A, VGS = 0 V
0.70
1.1
48
75
Ω
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
VDS = 15 V, VGS = 4.5 V, ID = 20 A
11
0.5
td(on)
Turn-On Delay Time
VDD = 15 V, RL = 15 Ω
ID ≅ 1 A, VGEN = 4.5 V, Rg = 6 Ω
tr
Rise Time
td(off)
Turn-Off Delay Time
Fall Time
tf
Source-Drain Reverse Recovery
Time
trr
nC
16
IF = 2.9 A, dI/dt = 100 A/µs
1.1
1.9
17
30
16
30
165
250
55
90
40
80
Ω
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
60
60
VGS = 10 V thru 3 V
50
I D - Drain Current (A)
I D - Drain Current (A)
50
40
30
20
10
40
30
20
TC = 125 °C
10
25 °C
2V
- 55 °C
0
0
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2
1
2
3
4
5
0
0.0
0.5
1.0
1.5
2.0
2.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
3.0
Document Number: 70680
S09-0221-Rev. E, 09-Feb-09
Si4364DY
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
0.010
9000
0.008
7200
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
Ciss
0.006
VGS = 4.5 V
0.004
5400
3600
VGS = 10 V
1800
0.002
Coss
Crss
0
0.000
0
10
20
30
40
0
50
6
12
30
Capacitance
6
1.6
VDS = 15 V
ID = 20 A
VGS = 10 V
ID = 20 A
1.4
4
3
2
(Normalized)
5
R DS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
24
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
On-Resistance vs. Drain Current
1.2
1.0
0.8
1
0
0
14
28
42
56
0.6
- 50
70
- 25
0
Qg - Total Gate Charge (nC)
25
50
75
100
125
150
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
0.025
R DS(on) - On-Resistance ( Ω)
50
I S - Source Current (A)
18
TJ = 150 °C
10
TJ = 25 °C
1
0.020
0.015
0.010
ID = 20 A
0.005
0.000
0
0.2
0.4
0.6
0.8
1.0
1.2
0
2
4
6
8
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
Document Number: 70680
S09-0221-Rev. E, 09-Feb-09
10
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Si4364DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.4
60
ID = 250 µA
50
0.0
40
Power (W)
VGS(th) Variance (V)
0.2
- 0.2
30
- 0.4
20
- 0.6
10
- 0.8
- 50
- 25
0
25
50
75
100
TJ - Temperature (°C)
125
150
0
10 - 2
10 - 1
1
10
100
600
Time (s)
Single Pulse Power
Threshold Voltage
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
2. Per Unit Base = R thJA = 67 °C/W
3. T JM - TA = PDMZthJA(t)
Single Pulse
0.01
10 - 4
t1
t2
10 - 3
10 - 2
4. Surface Mounted
10 - 1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 - 4
10 - 3
10 - 2
10 - 1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?70680.
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Document Number: 70680
S09-0221-Rev. E, 09-Feb-09
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Revision: 02-Oct-12
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Document Number: 91000