SC284 Dual Channel 2.5MHz, 1.8A Synchronous Step-Down Regulator POWER MANAGEMENT Features Description VIN Range — 2.9 – 5.5V VOUT Selectable — 0.8 - 3.3V Up to 1.8A Output Current for Each Channel Ultra-Small Footprint, <1mm Height Solution Switching Frequency — 2.5MHz Efficiency Up to 94% Excellent Light Load Efficiency Low Output Noise Across Load Range Excellent Transient Response Start Up into Pre-Bias Output 100% Duty-Cycle Low Dropout Operation Shutdown Current — <1µA Internal Soft Start Input Under-Voltage Lockout Output Over-Voltage, Current Limit Protection Over-Temperature Protection Adjustable Output Voltage Package — 3 x 3 x 0.6(mm) UT20 Temperature Range — -40 to +85°C Lead-free, halogen-free, and RoHS/WEEE compliant Applications Desktop Computing Set-Top Box LCD TV Network Cards Printer The SC284 is a dual channel 1.8A synchronous stepdown regulator designed to operate with an input voltage range of 2.9 to 5.5 Volts. Each channel offers fifteen pre-determined output voltages via four control pins programmable from 0.8 to 3.3 Volts. The control pins allow for on-the-fly voltage changes, enabling system designers to implement dynamic power savings. The SC284 is also capable of adjusting the output voltage via an external resistor divider. The device operates with a fixed 2.5MHz oscillator frequency, allowing the use of small surface mount external components. Connecting CTL0 — CTL3 to logic low forces the device into shutdown mode reducing the supply current to less than 1µA. Connecting any of the control pins to logic high enables the converter and sets the output voltage according to Table 1. Other features include undervoltage lockout, soft-start to limit inrush current, and over-temperature protection. The SC284 is available in a 3 x 3 x 0.6 (mm) MLPQ-UT20 package and has a rated temperature range of -40 to +85°C. Typical Application Circuit VINA CINA 10µF RAVINA 1Ω CAVINA 10nF VINB CINB 10µF RAVINB 1Ω CAVINB 10nF LXA VOUTA AVINA LB 2.2µH LXB VOUTB AGNDA PVINB SC284 COUTA 22µF COUTB 22µF VOUTA VOUTB PGNDA AVINB AGNDB Revision 2.1 LA 2.2µH PVINA CTL0A CTL1A CTL2A CTL0A CTL3A CTL3A CTL1A CTL2A PGNDB CTL0B CTL1B CTL2B CTL3B CTL0B CTL1B CTL2B CTL3B SC284 20 P V IN A 19 18 17 16 1 TOP VIEW 15 CTL1B 14 CTL0B AGNDA 2 A V IN A 3 13 A V IN B CTL0A 4 12 AGNDB CTL1A 5 11 P V IN B T Package SC284ULTRT(1)(2) 3 x 3 x 0.6(mm) MLPQ-UT20 SC284EVB(3) Evaluation Board Notes: (1) Available in tape and reel only. A reel contains 3,000 devices. (2) Available in lead-free package only. Device is fully WEEE and RoHS compliant and halogen-free. (3) Please specify the default VOUTA & VOUTB when ordering. 10 LXB 9 PGNDB 8 VO UTB 7 C TL3A C TL2A 6 Device C TL2B CTL3B VOUTA Ordering Information PGNDA LXA Pin Configuration 3 x 3 x 0.6(mm) MLPQ-UT20 θJA 40°C/W Marking Information 284 yyw w xxxx yyww = Datecode xxxx = Semtech Lot number Table 1 – Output Voltage Settings CTL3_ CTL2_ CTL1_ CTL0_ Output Voltage 0 0 0 0 Shutdown 0 0 0 1 0.80 0 0 1 0 1.00 0 0 1 1 1.025 0 1 0 0 1.05 0 1 0 1 1.20 0 1 1 0 1.25 0 1 1 1 1.30 1 0 0 0 1.50 1 0 0 1 1.80 1 0 1 0 2.20 1 0 1 1 2.50 1 1 0 0 2.60 1 1 0 1 2.80 1 1 1 0 3.00 1 1 1 1 3.30 SC284 Absolute Maximum Ratings Recommended Operating Conditions VINA and VINB Supply (V) . . . . . . . . . . . . . . . . . . -0.3 to +6.0 VINA and VINB Supply (V) . . . . . . . . . . . . . . . . . . . . 2.9 to 5.5 LXA, LXB (V). . . . . . . . . . . . . -1 to VIN+1, -3 (20ns Max), 6 Max Maximum Output current each channel (A). . . . . . . . . . . 1.8 VOUTA, VOUTB (V). . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VIN+0.3) Temperature Range (°C). . . . . . . . . . . . . . . . . . . . . . . . . . -40 to +85 CTLxA/B pins (V). . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VIN + 0.3) Peak IR Reflow Temperature (°C). . . . . . . . . . . . . . . . . . . . . . . . 260 ESD Protection Level (kV) . . . . . . . . . . . . . . . . . . . . . . . . . 3KV (2) Thermal Information Thermal Resistance, Junction to Ambient (1) (°C/W) . . . . . . . . 40 Maximum Junction Temperature (°C) . . . . . . . . . . . . . . . . . . +150 Storage Temperature Range (°C). . . . . . . . . . . . . . . . . -65 to +150 Exceeding the absolute maximum ratings may result in permanent damage to the device and/or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not recommended. Notes: (1) Calculated from package in still air, mounted to 3 x 4.5 (in), 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards. (2) Tested according to JEDEC standard JESD22-A114-B. Electrical Characteristics Unless specified: VINA= VINB= 5.0V, VOUTA= VOUTB=1.50V, CINA=CINB=10µF, COA=COB= 22µF, L= 2.2µH, -40°C≤ TJ≤ +125 °C. Unless otherwise noted typical values are TA= +25 °C. Parameter Conditions Min Typ Max Units Rising VINA, VINB 2.65 2.75 2.85 V Hysteresis 240 300 ΔVOUT Channel A & B; VIN= 2.9 – 5.5V; IOUT=0A -2.0 ILIMIT Channel A & B; Peak LX current 2.25 IQ Channel A & B; No load, Per channel 10 ISHDN CTL0-3= GND, Per channel 1 High Side Switch Resistance(2) RDSON_P Channel A & B; ILX= 100mA, TJ= 25 °C 95 Low Side Switch Resistance(2) RDSON_N Channel A & B; ILX= -100mA, TJ= 25 °C 65 Channel A & B; VIN= 5.5V; LX= 0V; CTL0-3= GND 1 Under-Voltage Lockout Output Voltage Tolerance(1) Current Limit Supply Current Shutdown Current LX Leakage Current(2) Load Regulation Symbol UVLO ILK(LX) Channel A & B; VIN= 5.5V; LX= 5.0V; CTL0-3= GND ΔVLOAD-REG Channel A & B; VIN= 5.0V; IOUT=1mA – 1.8A Oscillator Frequency fOSC Channel A & B Soft-Start Time tSS Channel A & B; IOUT= 1.8A 3.0 mV +2.0 % 3.75 A mA 10 µA mΩ 10 µA -10 -1 ±0.5 2.0 2.5 850 % 3.0 MHz µs SC284 Electrical Characteristics (continued) Parameter Foldback Holding Current CTLx Input Current(2) Symbol ICL_HOLD Conditions Min Typ Max Units Average LX Current, VOUT=1.5V 240 mA Average LX Current, VOUT=3.3V 130 mA ICTL_ Channel A & B; CTL0-3=VIN or GND -2.0 CTLx Input High Threshold VCTLx_HI Channel A & B 1.2 CTLx Input Low Threshold VCTLx_LO Channel A & B VOUT Over Voltage Protection VOVP Channel A & B 115 % Thermal Shutdown Temperature TSD Channel A & B(3) 160 °C TSD_HYS Channel A & B(3) 10 °C Thermal Shutdown Hysteresis 2.0 µA V 0.4 V Notes: (1) The “Output Voltage Tolerance” includes output voltage accuracy, voltage drift over temperature and the line regulation. (2) The negative current means the current flows into the pin and the positive current means the current flows out from the pin. (3) The thermal shutdown for both Channel A and B is independent from each other. SC284 Typical Characteristics Circuit Conditions: CIN= 10uF/6.3V; COUT= 22uF/6.3V, Unless otherwise noted, L= 2.2uH (TOKO: 1127AS-2R2M). Efficiency vs. Load Current Efficiency Total Loss (Per Channel) vs. Load Current Total Loss 100% 1000 VIN=5.0V;VOUT=3.3V TA=25°C 95% 90% 85% Loss (mW) Efficiency (%) VIN=5.0V;VOUT=3.3V 800 80% VIN=3.3V;VOUT=1.5V 75% 600 VIN=3.3V;VOUT=1.5V 400 70% VIN=5.0V;VOUT=1.5V 65% 200 TA=25°C VIN=5.0V;VOUT=1.5V 60% 0 0.0 0.3 0.6 0.9 1.2 Output Current (A) 1.5 1.8 0.0 0.9 1.2 Output Current (A) 1.5 1.8 500 1.0% TA=25°C 0.8% TA= 25°C 450 0.6% 400 0.2% Dropout Voltage (mV) VIN=3.3V;VOUT=1.5V 0.4% VIN=5.0V;VOUT=1.5V 0.0% -0.2% -0.4% -0.6% L= 1071AS-2R2M (DCR= 60m_max) 350 300 250 200 150 100 VIN=5.0V;VOUT=3.3V -0.8% L= 1127AS-2R2M (DCR=48m_max) 50 -1.0% 0 0.0 0.3 0.6 0.9 1.2 1.5 1.8 0.0 0.3 Output Current (A) 0.9 1.2 1.5 1.8 HysteresisVariation Variation UVLOUVLO Hysteresis 5% 0.8% 4% 0.6% 3% 0.4% 2% 0.2% 1% Variation 1.0% 0.0% -0.2% 0% -1% -0.4% -2% -0.6% -3% -0.8% 0.6 Output Current (A) Rising Threshold Variation UVLOUVLO Rising Threshold Variation Variation 0.6 DropoutDropout Voltage in 100% Duty Cycle Operation Voltage of 100% Duty Cycle Operation LoadLoad Regulation Regulation Load Regulation 0.3 -4% IOUT= 0A IOUT= 0A -5% -1.0% -40 -15 10 35 Ambient Temperature (°C) 60 85 -40 -15 10 35 60 85 Ambient Temperature (°C) SC284 Typical Characteristics (continued) Circuit Conditions: CIN= 10uF/6.3V; COUT= 22uF/6.3V, Unless otherwise noted, L= 2.2uH (TOKO: 1127AS-2R2M). (P & N)vs. Variation Line RDS(ON)RDSON Variation Inputover Voltage RDSON (P & N) Variation Over Temperature RDS(ON) Variation vs. Temperature 30% 20% 25% 15% P-Channel 20% 10% 5% Variation 15% Variation VIN= 5.0V ILX= ±100mA 10% N-Channel 0% -5% 5% -10% 0% ILX= ±100mA TA= 25°C -5% N-Channel P-Channel -15% -20% -10% 2.5 3.0 3.5 4.0 4.5 5.0 -40 5.5 -15 5% 60 85 1.0% 4% 0.8% VOUT= 3.3V 3% 0.6% 2% 0.4% 1% 0.2% Variation Variation 35 Switching Frequency Variation vs. Temperature Switching Frequency Variation Switching Frequency Variation over Switching Frequency Variation vs. Line Input Voltage 0% -1% -2% -0.2% -0.6% IOUT= 0A TA= 25°C -4% 0.0% -0.4% VOUT= 1.5V -3% VIN= 5.0V IOUT= 0A -0.8% -5% -1.0% 2.5 3.0 3.5 4.0 4.5 5.0 5.5 -40 -15 Input Voltage (V) 35 60 85 Line Regulation Temperature Line Regulationvs. over Temperature 1.0% 1.0% 0.8% 0.8% 0.6% 0.6% 0.4% VOUT= 1.5V Regulation 0.4% 10 Ambient Temperature (°C) Line Regulation Line Regulation ove Line Regulation 10 Ambient Temperature (°C) Input Voltage (V) 0.2% 0.0% -0.2% 0.2% 0.0% -0.2% -0.4% -0.4% VOUT= 3.3V -0.6% -0.6% IOUT= 0A TA= 25°C -0.8% VOUT= 1.5V IOUT= 0A -0.8% -1.0% -1.0% 2.5 3.0 3.5 4.0 Input Voltage (V) 4.5 5.0 5.5 -40 -15 10 35 60 85 Ambient Temperature (°C) SC284 Typical Waveforms Circuit Conditions: CIN= 10uF/6.3V; COUT= 22uF/6.3V, L= 2.2uH (TOKO: 1127AS-2R2M). Output Voltage Ripple (VOUT=1.5V) Output Voltage Ripple (VOUT=1.5V) Output Voltage Ripple (VOUT=1.5V) Output Voltage Ripple (VOUT=1.5V) VOUT 1 0 m V /d iv VOUT 1 0 m V /d iv I LX 1 A /d iv I LX 1 A /d iv V LX 2 V /d iv V LX 2 V /d iv V IN = 3.3V I O U T = 1.8A V IN = 5.0V I O U T = 1.8A 5 0 0 n s/d iv Output Voltage Ripple (VOUT=3.3V) 5 0 0 n s/d iv Output Voltage Ripple (VOUT=3.3V) Output Voltage Ripple (VOUT=3.3V) Output Voltage Ripple (VOUT=3.3V) VOUT 1 0 m V /d iv VOUT 1 0 m V /d iv I LX 0 .5 A /d iv I LX 1 A /d iv V LX 2 V /d iv V LX 2 V /d iv V IN = 5.0V I O U T = 0A V IN = 5.0V I O U T = 1.8A 5 0 0 n s/d iv Transient Response (VOUT=1.5V) Transient Response (VOUT=1.5V; 0A to 1A to 0A) VOUT 5 0 0 n s/d iv Transient Response (VOUT=3.3V) Transient Response (VOUT=3.3V; 0A to 1A to 0A) VOUT 100m V /div 100m V /div IO U T IO U T 1A /div 500m A /div V IN = 5.0V I O U T = 0A to 1A 5 0 µs/d iv V IN = 5.0V I O U T = 0A to 1A 5 0 µs/d iv SC284 Typical Waveforms (continued) Circuit Conditions: CIN= 10uF/6.3V; COUT= 22uF/6.3V, L= 2.2uH (TOKO: 1127AS-2R2M). Start Up (VOUT=1.5V) Start Up (VOUT=1.5V) Start Up (Enable)(VOUT=1.5V) VIN Start Up (Enable)(VOUT=1.5V) VIN 2V/div 2V/div VCTLx VCTLx 2V/div 2V/div VOUT VOUT 0.5V/div 0.5V/div VIN=5.0V ROUT=1k VIN=5.0V ROUT=0.83 (1.8A) 50µs/div Start Up (VOUT=1.5V), EN=VIN Start Up (Power up VIN=VCTLx) (VOUT=1.5V) VIN 200µs/div Start Up (VOUT=1.5V), EN=VIN Start Up (Power up VIN=VCTLx) (VOUT=1.5V) VIN 2V/div 2V/div VOUT VOUT 0.5V/div 0.5V/div VIN=5.0V ROUT=1k VIN=5.0V ROUT=0.83 (1.8A) 200µs/div Start Up (VOUT=3.3V) Start Up (VOUT=3.3V) Start Up (Enable)(VOUT=3.3V) VIN 200µs/div Start Up (Enable)(VOUT=3.3V) VIN 2V/div 2V/div VCTLx VCTLx 2V/div 2V/div VOUT VOUT 1V/div 1V/div VIN=5.0V ROUT=1k 100µs/div VIN=5.0V ROUT=1.83 (1.8A) 200µs/div SC284 Typical Waveforms (continued) Circuit Conditions: CIN= 10uF/6.3V; COUT= 22uF/6.3V, L= 2.2uH (TOKO: 1127AS-2R2M). Start Up (VOUT=3.3V), EN=VIN Start Up (Power up VIN=VCTLx) (VOUT=3.3V) VIN Start Up (VOUT=3.3V), EN=VIN Start Up (Power up VIN=VCTLx) (VOUT=3.3V) VIN 2V/div 2V/div VOUT VOUT 1.5V/div 1.5V/div VIN=5.0V ROUT=1k VIN=5.0V ROUT=1.83 (1.8A) 200µs/div Shutdown-Disable (1.5V) Shutdown-Disable (3.3V) Shutdown (Disable)(VOUT=1.5V) VIN 200µs/div Shutdown (Disable)(VOUT=3.3V) VIN 2V/div 2V/div VCTLx VCTLx 2V/div 2V/div VOUT VOUT 1V/div 1.5V/div VIN=5.0V ROUT=1.5 200µs/div VIN=5.0V ROUT=3.3 200µs/div SC284 Pin Descriptions Pin # Pin Name Pin Function 1 PvinA Channel A — Input supply voltage for the converter power stage and internal circuitry. 2 AGNDA Ground connection for internal circuitry — connect directly to PGNDA. 3 AVINA Power supply for internal circuitry — Must be connected to PVINA using an R-C filter of 1Ω and 10nF. 4 CTL0A Channel A — Control bit 0, see Table 1 for decoding. This pin has a 1 MΩ internal pull-down resistor. This resistor is switched in circuit whenever the pin voltage is below the input high threshold, or when the part is in under-voltage lockout. 5 CTL1A Channel A — Control bit 1, see Table 1 for decoding. This pin has a 1 MΩ internal pull-down resistor. This resistor is switched in circuit whenever the pin voltage is below the input high threshold, or when the part is in under-voltage lockout. 6 CTL2A Channel A — Control bit 2, see Table 1 for decoding. This pin has a 1 MΩ internal pulldown resistor. This resistor is switched in circuit whenever the pin voltage is below the input high threshold, or when the part is in under-voltage lockout. 7 CTL3A Channel A — Control bit 3, see Table 1 for decoding. This pin has a 1 MΩ internal pull-down resistor. This resistor is switched in circuit whenever the pin voltage is below the input high threshold, or when the part is in under-voltage lockout. 8 VOUTB Output voltage sense pin of Channel B 9 PGNDB Channel B — Ground connection for converter power stage and internal circuitry. 10 LXB 11 PvinB Channel B — Input supply voltage for the converter power stage and internal circuitry. 12 AGNDB Ground connection for internal circuitry — connect directly to PGNDB. 13 AVINB Power supply for internal circuitry — Must be connected to PVINB using an R-C filter of 1Ω and 10nF. 14 CTL0B Channel B — Control bit 0, see Table 1 for decoding. This pin has a 1 MΩ internal pulld-own resistor. This resistor is switched in circuit whenever the pin voltage is below the input high threshold, or when the part is in under-voltage lockout. 15 CTL1B Channel B — Control bit 1 - see Table 1 for decoding. This pin has a 1 MΩ internal pull-down resistor. This resistor is switched in circuit whenever the pin voltage is below the input high threshold, or when the part is in under-voltage lockout. 16 CTL2B Channel B — Control bit 2, see Table 1 for decoding. This pin has a 1 MΩ internal pull-down resistor. This resistor is switched in circuit whenever the pin voltage is below the input high threshold, or when the part is in under-voltage lockout. 17 CTL3B Channel B — Control bit 3, see Table 1 for decoding. This pin has a 1 MΩ internal pull-down resistor. This resistor is switched in circuit whenever the pin voltage is below the input high threshold, or when the part is in under-voltage lockout. 18 VOUTA Output voltage sense pin of Channel A 19 PGNDA Channel A — Ground connection for converter power stage and internal circuitry. 20 LXA Switching node of Channel B — connect an inductor between this pin and the output capacitor. Switching node of Channel A — connect an inductor between this pin and the output capacitor. 10 SC284 Block Diagram C u rre n t A m p A V IN A 1 P V IN A 20 LXA 19 PGNDA 11 P V IN B 10 LXB 9 PGNDB 3 P lim it A m p O scilla to r a n d S lo p e G e n e ra to r VO UTA 18 CTL0A 4 CTL1A 5 CTL2A 6 CTL3A 7 AGNDA 2 C o n tro l L o g ic V o lta g e S e le ct E rro r A m p PW M C om p 500m V R ef C u rre n t A m p A V IN B 13 P lim it A m p O scilla to r a n d S lo p e G e n e ra to r VOUTB 8 CTL0B 14 CTL1B 15 CTL2B 16 CTL3B 17 AGNDB 12 C o n tro l L o g ic V o lta g e S e le ct E rro r A m p 500m V R ef PW M C om p 11 SC284 Applications Information Detailed Description The SC284 is a two channel synchronous step-down converter. Both channels on this device are designed to operate in fixed-frequency PWM mode at 2.5MHz and provide the same current capacity of up to 1.8A. The switching frequency is chosen to minimize the size of the external inductor and capacitors while maintaining high efficiency. Both channels of SC284 are independent. Operation During normal operation, the PMOS MOSFET is activated on each rising edge of the internal oscillator. The voltage feedback loop uses an internal feedback resistor divider. The period is set by the internal oscillator. The device has an internal synchronous NMOS rectifier and does not require a Schottky diode on the LX pin. The device operates as a buck converter in PWM mode with a fixed frequency of 2.5MHz. Programmable Output Voltage Both channels on SC284 have fifteen pre-determined output voltage values which can be individually selected by programming the CTL input pins (see Table 1 — Output Voltage Settings). Each CTL pin has an active 1 MΩ internal pull-down resistor. The 1MΩ resistor is switched in circuit whenever the CTL input voltage is below the input threshold, or when the part is in under-voltage lockout. It is recommended to tie all high CTL pins together and use an external pull-up resistor to VIN if there is no enable signal, or if the enable input is an open drain/collector signal. The CTL pins may be driven by a microprocessor to allow dynamic voltage adjustment for systems that reduce the supply voltage when entering sleep states. Avoid all zeros being present on the CTL pins when changing programmable output voltages as this would disable the device. SC284 is also capable of regulating a different (higher) output voltage, which is not shown in the Table 1, via an external resistor divider. There will be a typical 2µA current flowing into the VOUT pin. The typical schematic for an adjustable output voltage option from the standard 1.0V with CTLx=[0010], is shown in Figure 1. RFB1A/B and RFB2A/B are used to adjust the desired output voltage. If the RFB2A/B current is such that the 2µA VOUT pin current can be ignored, then RFB1A/B can be found by the next equation. RFB2A/B needs to be low enough in value for the current through the resistor chain to be at least 20µA in order to ignore the VOUT pin current. VOUT VOSTD u R FB2 VOSTD R FB1 where VOSTD is the pre-determined output voltage via the CTL pins. CFF is needed to maintain good transient response performance. The correct value of CFF can be found using the following Equation. CFF [nF] 2 .5 u VOUT 0.52 VOSTD u( ) R FB1 [k:] u VOUT VOSTD VOSTD 0.5 To simplify the design, it is recommended to program the desired output voltage from a standard 1.0V as shown in Figure 1 with the correct CFF calculated from Equation 2. For programming the output voltage from other standard voltages, RFB1, RFB2 and CFF need to be adjusted to meet Equations 1 and 2. V IN A R A V IN A 1Ω C IN A 10µF C A V IN A 0.1µF V IN B R A V IN B 1Ω C IN B 10µF C A V IN B 0.1µF Enable A PVIN A SC284 AVIN A AGN D A R FB 1 A VOU T A PVIN B C T L1A C OU TA R FB 1A = (V OU TA -1) x R FB 2 A for C T LAX = 0010 (1.0V) L R FB 1 B VOU T B C T L3A C T L0B C FFA V OU TB LXB C T L0A C T L2A Enable B R FB2 A 10kΩ AVIN B AGN D B V OU TA L LXA PGN D A R FB2 B 10kΩ C FFB C OU TB R FB1 B = (V OU TB -1) x R FB 2 B for C T LBX = 0010 (1.0V) C T L1B C T L2B C T L3B PGN D B Figure 1 — Output Voltage Programming 12 SC284 Applications Information (continued) Maximum Power Dissipation 2 T A = 68 °C 1 .8 Load Current Channel B (A) Each channel of SC284 has its own ΘJA of 40°C/W when only one channel is in operation. Since both channels are within same package, there is about 50% heat which will be transferred to the adjacent channel. The equivalent total thermal impedance will be higher when the neighboring channel is also in operation. To guarantee an operating junction temperature of less than 125°C, Figure 2 shows the maximum allowable power loss of each channel. The curve is based upon the junction temperature of either channel reaching a maximum of 125°C. Each channel of SC284 can support up to 1.8A load current. Figures 3a and 3b show the maximum allowable load current based upon the limit of maximum loss for VIN=3.3V and VIN=5.0V, respectively. The curves are drawn for high duty-cycle operation. If the operating duty-cycle is lower, the loss is lower allowing higher load current. 1 .6 T A = 75 °C 1 .4 T A = 85 °C 1 .2 1 0 .8 0 .6 0 .4 0 .2 0 0 0 .2 0.4 0 .6 0 .8 1 1 .2 1 .4 1 .6 2 T A < 7 6 °C Load Current B (A) Loss of Channel B (W) T A = 2 5 °C 1 .8 1 .6 1 .4 1 .2 1 0 .8 0 .6 T A = 8 5 °C 1 .4 1 .2 1 0 .8 0 .6 0 .4 T A = 5 5 °C 0 .2 0 .4 0 .2 0 0 0 0.2 0 .4 0 .6 0 .8 1 1 .2 1 .4 1 .6 1 .8 Loss of Channel A (W) 2 2 .2 2 .4 2 .6 2 .8 Figure 2 — Maximum allowable loss for each channel for a maximum junction temperature of 125°C Protection Features The SC284 provides the following protection features: Current Limit Over-Voltage Protection Soft-Start Operation Thermal Shutdown • • • • T A < 8 5 °C 1 .6 2 .2 2 2 (a) VIN= 3.3V, VOUT=2.5V 1 .8 2 .8 2 .6 2 .4 1 .8 Load Current Channel A (A) 0 0 .2 0 .4 0 .6 0 .8 1 1 .2 1 .4 1 .6 1 .8 2 Load Current A (A) (b) VIN= 5.0V, VOUT=3.3V Figure 3 — Maximum allowable Load Current for each channel for a maximum junction temperature of 125°C Current Limit and Protection The internal PMOS power device in the switching stage is protected by a current limit feature. If the inductor current is above the PMOS current limit for 16 consecutive cycles, the part enters foldback current limit mode and the output current is limited to the current limit holding current (ICL_HOLD) of a few hundred milliampere. Under this condition, the output voltage will be the product of ICL_HOLD and the load resistance. The current limit holding current will decrease when the output voltage increases. The load presented must fall below the current limit holding current for the part to exit foldback current 13 SC284 Applications Information (continued) limit mode. Figure 4 shows how the typical current limit holding current varies with output voltage. The SC284 is capable of sustaining an indefinite short circuit without damage and will resume normal operation when the fault is removed. The foldback current limit mode is disabled during soft-start. Current limit functionality is shown in Figure 5 at the end of this section. Current Limit Holding Current over Vout rail, the SC284 will not discharge the output during the soft start interval. Shut Down When all CTL pins of each channel are low, the channel will run in shutdown mode, drawing less than 1μA from the input power supply. The internal switches and bandgap voltage will be immediately turned off. 300 Current Limit Holding Current (mA) TA= 25°C 250 Thermal Shutdown VIN= 3.6V The device has a thermal shutdown feature to protect the SC284 if the junction temperature exceeds 160°C. During thermal shutdown, the on-chip power devices are disabled, tri-stating the LX output. When the temperature drops by 10°C, it will initiate a soft start cycle to resume normal operation. VIN= 5.0V 200 150 100 VIN= 3.3V 50 Inductor Selection 0 1.0 1.5 2.0 2.5 3.0 3.5 Output Voltage (V) Figure 4 — Typical Current Limit Holding Current vs. Output Voltage Over-Voltage Protection In the event of a 15% over-voltage on the output, the PWM drive is disabled leaving the LX pin floating. Soft-Start The soft-start mode is activated after VIN reaches its UVLO and one or more CTL pins are set high to enable the part. A thermal shutdown event will also activate the soft start sequence. Soft-start mode controls the maximum current during startup thus limiting inrush current. The PMOS current limit is stepped through four soft start levels of approximately 20%, 25%, 40%, & 100%. Each step is maintained for 200μs following an internal reference start up duration of 50μs giving a total nominal startup period of 850μs. During startup, the chip operates by controlling the inductor current swings between 0A and current limit. If at any time VOUT reaches 86% of the target or at the end of the soft-start period, the SC284 will switch to PWM mode operation. Figure 6 at the end of this section shows the typical diagram of soft start operation. The SC284 is capable of starting up into a pre-biased output. When the output is precharged by another supply The SC284 converter has internal loop compensation. The compensation is designed to work with an output filter corner frequency of less than 40kHz for a VIN of 5V and 50KHz for a VIN of 3.3V over any operating condition. The corner frequency of the output filter is shown in the following equation. 1 fC 2S L u C OUT Values outside this range may lead to instability, malfunction, or out-of-specification performance. In general, the inductance is chosen by making the inductor ripple current to be less than 30% of maximum load current. When choosing an inductor, it is important to consider the change in inductance with DC bias current. The inductor saturation current is specified as the current at which the inductance drops a specific percentage from the nominal value. This is approximately 30%. Except for short-circuit or other fault conditions, the peak current must always be less than the saturation current specified by the manufacturer. The peak current is the maximum load current plus one half of the inductor ripple current at the maximum input voltage. Load and/or line transients can cause the peak current to exceed this level for short durations. Maintaining the peak current 14 SC284 Applications Information (continued) below the inductor saturation specification keeps the inductor ripple current and the output voltage ripple at acceptable levels. Manufacturers often provide graphs of actual inductance and saturation characteristics versus applied inductor current. The saturation characteristics of the inductor can vary significantly with core temperature. Core and ambient temperatures should be considered when examining the core saturation characteristics. When the inductance has been determined, the DC resistance (DCR) must be examined. The efficiency that can be achieved is dependent on the DCR of the inductor. The lower values give higher efficiency. The RMS DC current rating of the inductor is associated with losses in the copper windings and the resulting temperature rise of the inductor. This is usually specified as the current which produces a 40˚C temperature rise. Most copper windings are rated to accommodate this temperature rise above maximum ambient. Magnetic fields associated with the output inductor can interfere with nearby circuitry. This can be minimized by the use of low noise shielded inductors which use the minimum gap possible to limit the distance that magnetic fields can radiate from the inductor. However shielded inductors typically have a higher DCR and are thus less efficient than a similarly sized non-shielded inductor. Final inductor selection depends on various design considerations such as efficiency, EMI, size, and cost. Table 2 lists the manufacturers of recommended inductor options. The saturation characteristics and DC current ratings are also shown. Manufacturer Part Number L (μH) DCR Max (Ω) Rated Current (A) L at Rated Current (μH) Dimensions LxWxH (mm) TOKO 1071AS-2R2M 2.20±20% 0.060 1.80 1.54 2.8x3.0x1.5 TOKO 1071AS-1R0N 1.00±30% 0.040 2.70 0.70 2.8x3.0x1.5 TOKO 1127AS-2R2M 2.20±20% 0.048 2.50 1.54 3.5x3.7x1.8 Panasonic ELLVGG1R0N 1.00±23% 0.062 2.20 0.70 3.2x3.2x1.5 COUT Selection The internal voltage loop compensation in the SC284 limits the minimum output capacitor value to 22µF if using a 2.2µH inductor or 44µF if using a 1µH inductor. This is due to its influence on the the loop crossover frequency, phase margin, and gain margin. Increasing the output capacitor above this minimum value will reduce the crossover frequency and provide greater phase margin. The total output capacitance should not exceed 50µF to avoid any start-up problems. For most typical applications it is recommended to use an output capacitance of 22µF to 44µF. When choosing the output capacitor’s capacitance, verify the voltage derating effect from the capacitor vendor’s data sheet. Capacitors with X7R or X5R ceramic dielectric are recommended for their low ESR and superior temperature and voltage characteristics. Y5V capacitors should not be used as their temperature coefficients make them unsuitable for this application. The output voltage droop due to a load transient is determined by the capacitance of the ceramic output capacitor. The ceramic capacitor supplies the load current initially until the loop responds. Within a few switching cycles the loop will respond and the inductor current will increase to match the required load. The output voltage droop during the period prior to the loop responding can be related to the choice of output capacitor by the relationship from the following equation. u ',/2$' &287 9'5223 u I26& The output capacitor RMS ripple current may be calculated from the following equation. ,&287506 § 9287 u 9,10$; 9287 · ¸¸ ¨ / u I26& u 9,1 ¨© ¹ Table 2 – Recommended Inductors 15 SC284 Applications Information (continued) Table 3 lists the manufacturers of recommended output capacitor options. Manufacturer Part Nunber Value (μF) Type Rated Voltage (VDC) Value at 3.3V (μF) Dimensions LxWxH (mm) Murata GRM21BR60J106K 10±10% X5R 6.3 4.74 2.0x1.25x1.25 (EIA:0805) Murata GRM219R60J106K 10±10% X5R 6.3 4.05 2.0x1.25x0.85 (EIA:0805) Murata GRM21BR60J226M 22±20% X5R 6.3 6.57 2.0x1.25x1.25 (EIA:0805) Murata GRM31CR60J476M 47±20% X5R 6.3 20.3 3.2x1.6x1.6 (EIA:1206) The input voltage ripple and RMS current ripple are at a maximum when the input voltage is twice the output voltage or 50% duty cycle. The input capacitor provides a low impedance loop for the edges of pulsed current drawn by the PMOS switch. Low ESR/ESL X5R ceramic capacitors are recommended for this function. To minimise stray inductance ,the capacitor should be placed as closely as possible to the VIN and GND pins of the SC284. Table 3 – Recommended Capacitors CIN Selection The SC284 source input current is a DC supply current with a triangular ripple imposed on it. To prevent large input voltage ripple, a low ESR ceramic capacitor is required. A minimum value of 10μF should be used. It is important to consider the DC voltage coefficient characteristics when determining the actual required value. It should be noted a 10µF, 6.3V, X5R ceramic capacitor with 5V DC applied may exhibit a capacitance as low as 4.5µF. To estimate the required input capacitor, determine the acceptable input ripple voltage and calculate the minimum value required for CIN as shown by the following equation. &,1 § 9 · ¨¨ 287 ¸¸ 9,1 ¹ © § '9 · ¨¨ (65 ¸¸ u I26& © ,287 ¹ 9287 9,1 The input capacitor RMS ripple current varies with the input and output voltage. The maximum input capacitor RMS current is found from the next equation . ,&,1506 9287 9,1 § 9287 · ¨¨ ¸ 9,1 ¸¹ © 16 SC284 Applications Information (continued) J 6WDJH 6WDJH 6WDJHV K 6WDJH M &RQGLWLRQV . / 0 L 2SHUDWLRQGHVFULSWLRQ 6RIWVWDUWHQGV 1RUPDO3:0RSHUDWLRQ 2YHUORDGSURWHFWLRQLVHQDEOHGDQGSHDNFXUUHQWOLPLWDWOHYHO &\FOHE\F\FOHSHDNFXUUHQWOLPLW 2&3SURWHFWLRQLVDFWLYDWHG IROGEDFNSHDNFXUUHQWOLPLW 3:021ZKHQLQGXFWRUFXUUHQWRI$ 3:02))ZKHQLQGXFWRUFXUUHQWKLWVSHDNFXUUHQWOLPLWRIIROGEDFNPRGH 2SHUDWLRQGHVFULSWLRQ ,QGXFWRUFXUUHQWKLWVSHDNFXUUHQWOLPLW 3HDNFXUUHQWOLPLWIRUFRQVHFXWLYHF\FOHV 9RXW WDUJHW ,QGXFWRUFXUUHQWGRHVQ WKLWSHDNFXUUHQWOLPLW Figure 5 — Current Limit Protection 6WDJHV % 6WDJH $ 6WDJH 6WDJH & * ) + ' 6WDJH , 6WDJH 6WDJH ( 6WDJH &RQGLWLRQV $ % & ' ( ) * + , 2SHUDWLRQGHVFULSWLRQ &KLSLV2)) 3HDNFXUUHQWOLPLWDWOHYHO 3:021ZKHQLQGXFWRUFXUUHQWRI$ 3:02))ZKHQLQGXFWRUFXUUHQWKLWVSHDNFXUUHQWOLPLW 6WDJHGXUDWLRQRIV 3HDNFXUUHQWOLPLWDWOHYHO 3:021ZKHQLQGXFWRUFXUUHQWRI$ 3:02))ZKHQLQGXFWRUFXUUHQWKLWVSHDNFXUUHQWOLPLW 6WDJHGXUDWLRQRIV 3HDNFXUUHQWOLPLWDWOHYHO 3:021ZKHQLQGXFWRUFXUUHQWRIP$ 3:02))ZKHQLQGXFWRUFXUUHQWKLWVSHDNFXUUHQWOLPLW 6WDJHGXUDWLRQRIV 3HDNFXUUHQWOLPLWDWOHYHO 3:021ZKHQLQGXFWRUFXUUHQWRIP$ 3:02))ZKHQLQGXFWRUFXUUHQWKLWVSHDNFXUUHQWOLPLW 6WDJHGXUDWLRQRIV 3HDNFXUUHQWOLPLWDWOHYHO 6ZLWFKWRFORVHGORRS3:0RSHUDWLRQ 6RIW6WDUWHQGV 1RUPDO3:0RSHUDWLRQ 2YHUORDGSURWHFWLRQLVHQDEOHG 2SHUDWLRQGHVFULSWLRQ 9,1!89/27KUHVKROG $1' 2QHRUPRUH&7/SLQLVKLJK $1' ,QWHUQDOUHIHUHQFHLVUHDG\ (QGRIVWDJH$1'9RXWRIWDUJHW (QGRIVWDJH$1'9RXWRIWDUJHW (QGRIVWDJH$1'9RXWRIWDUJHW (QGRIVWDJH$1'9RXWRIWDUJHW 9RXW!RIWDUJHW 9RXW!RIWDUJHW 9RXW!RIWDUJHW (QGRIVRIWVWDUWWLPHRIV Figure 6 — Soft Start Operation 17 SC284 Applications Information (continued) PCB Layout Considerations The layout diagram in Figure 7 shows a recommended top-layer PCB for the SC284 and supporting components. Figure 8 shows the bottom layer for this PCB. Fundamental layout rules must be followed since the layout is critical for achieving the performance specified in the Electrical Characteristics table. Poor layout can degrade the performance of the DC-DC converter and can contribute to EMI problems, ground bounce, and resistive voltage losses. Poor regulation and instability can result. The following guidelines are recommended when developing a PCB layout: . The input capacitor, CIN, should be placed as close to the VIN and GND pins as possible. This capacitor provides a low impedance loop for the pulsed currents present at the buck converter’s input. Use short wide traces to connect as closely to the IC as possible. This will minimize EMI and input voltage ripple by localizing the high frequency current pulses. 2. Keep the LX pin traces as short as possible to minimize pickup of high frequency switching edges to other parts of the circuit. COUT and L should be connected as close as possible between the LX and GND pins, with a direct return to the GND pin from COUT. 3. Route the output voltage feedback/sense path away from the inductor and LX node to minimize noise and magnetic interference. 4. Use a ground plane referenced to the SC284 GND pin. Use several vias to connect to the component side ground to further reduce noise and interference on sensitive circuit nodes. 5. If possible, minimize the resistance from the output and GND pin to the load. This will reduce the voltage drop on the ground plane and improve the load regulation. It will also improve the overall efficiency by reducing the copper losses on the output and ground planes. Figure 7 — Recommended PCB Layout (Top Layer) Figure 8 — Bottom Layer Detail 18 SC284 Outline Drawing – 3x3 MLPQ-UT20 Land Pattern – 3x3 MLPQ-UT20 19 SC284 © Semtech 2015 All rights reserved. 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