LITTELFUSE SP720ABG

TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP720 Series
SP720 Series 3pF 4kV Rail Clamp Array
RoHS
Pb GREEN
The SP720 is an array of SCR/Diode bipolar structures for
ESD and over-voltage protection to sensitive input circuits.
The SP720 has 2 protection SCR/Diode device structures
per input. A total of 14 available inputs can be used to
protect up to 14 external signal or bus lines. Over-voltage
protection is from the IN (pins 1-7 and 9-15) to V+ or V-.
The SCR structures are designed for fast triggering at a
threshold of one +VBE diode threshold above V+ (Pin 16) or
a -VBE diode threshold below V- (Pin 8). From an IN input,
a clamp to V+ is activated if a transient pulse causes the
input to be increased to a voltage level greater than one
VBE above V+. A similar clamp to V- is activated if a negative
pulse, one VBE less than V-, is applied to an IN input.
Standard ESD Human Body Model (HBM) Capability is:
Pinout
SP720 (PDIP, SOIC)
TOP VIEW
IN 1
16 V+
IN 2
15 IN
IN 3
14 IN
IN 4
13 IN
IN 5
12 IN
- MIL STD 3015.7 ................................................. 15kV
IN 6
11 IN
- IEC 61000-4-2, Direct Discharge,
IN 7
10 IN
- Single Input .......................................... 4kV (Level 2)
9 IN
- Two Inputs in Parallel ............................ 8kV (Level 4)
V-
8
Features
t &4%*OUFSGBDF$BQBCJMJUZGPS)#.4UBOEBSET
- IEC 61000-4-2, Air Discharge ...............15kV (Level 4)
t )JHI1FBL$VSSFOU$BQBCJMJUZ
Functional Block Diagram
- IEC 61000-4-5 (8/20μs) ....................................... ±3A
- Single Pulse, 100μs Pulse Width ........................ ±2A
V+ 16
- Single Pulse, 4μs Pulse Width ............................ ±5A
t %FTJHOFEUP1SPWJEF0WFS7PMUBHF1SPUFDUJPO
- Single-Ended Voltage Range to ........................ +30V
IN
IN 1
2
3-7
9 - 15
- Differential Voltage Range to ............................ ±15V
t 'BTU4XJUDIJOH ..............................................2ns Risetime
IN
t -PX*OQVU-FBLBHFT .................................1nA at 25º (Typ)
t -PX*OQVU$BQBDJUBODF....................................... 3pF (Typ)
t "O"SSBZPG4$3%JPEF1BJST
t 0QFSBUJOH5FNQFSBUVSF3BOHF....................-40ºC to 105ºC
V-
8
Applications
t .JDSPQSPDFTTPS-PHJD
Input Protection
t "OBMPH%FWJDF*OQVU
Protection
t %BUB#VT1SPUFDUJPO
t 7PMUBHF$MBNQ
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
55
Revision: April 14, 2011
SP720 Lead-Free/Green Series
Lead-Free/Green SP720
Description
TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP720 Series
Thermal Information
Absolute Maximum Ratings
Parameter
Rating
Units
+35
V
±2A, 100μs
V
Continuous Supply Voltage, (V+) - (V-)
Forward Peak Current, IIN to VCC, IIN to GND
(Refer to Figure 5)
Parameter
Thermal Resistance (Typical, Note 1)
Rating
TJA
PDIP Package
90
o
SOIC Package
130
o
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Maximum Storage Temperature Range
Maximum Junction Temperature (Plastic
Package)
Note:
Maximum Lead Temperature (Soldering 10s)
(SOIC Lead Tips Only)
ESD Ratings and Capability - See Figure 1, Table 1
Load Dump and Reverse Battery (Note 2)
Units
o
C/W
C/W
C/W
-65 to 150
o
150
o
260
o
C
C
C
1. TJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Characteristics
TA = -40oC to 105oC, VIN = 0.5VCC , Unless Otherwise Specified
Parameter
Symbol
Operating Voltage Range,
VSUPPLY = [(V+) - (V-)]
Test Conditions
VSUPPLY
Forward Voltage Drop:
Min
Typ
Max
Units
-
2 to 30
-
V
IIN = 1A (Peak Pulse)
IN to V-
VFWDL
-
2
-
V
IN to V+
VFWDH
-
2
-
V
IIN
-20
5
20
nA
IQUIESCENT
-
50
200
nA
Note 3
-
1.1
-
V
VFWD/IFWD; Note 3
-
1
-
Ω
Input Leakage Current
Quiescent Supply Current
Equivalent SCR ON Threshold
Equivalent SCR ON Resistance
Input Capacitance
CIN
-
3
-
pF
Input Switching Speed
tON
-
2
-
ns
Notes:
2. In automotive and battery operated systems, the power supply lines should be externally protected for load dump and everse battery V+ and V- pins are connected to the same supply
voltage source as the device or control line under protection, a current limiting resistor should be connected in series between the external supply and the SP720 supply pins to limit
reverse battery current to within the rated maximum limits. Bypass capacitors of typically 0.01μF or larger from the V+ and V- pins to ground are recommended.
3. Refer to the Figure 3 graph for definitions of equivalent “SCR ON Threshold” and “SCR ON Resistance.” These characteristics are given here for thumb-rule nformation to determine peak
current and dissipation under EOS conditions.
Typical Application of the SP720
(Application as an Input Clamp for Over-voltage, greater than 1VBE
Above V+ or less than -1VBE below V-)
+VCC
+VCC
INPUT
DRIVERS
OR
SIGNAL
SOURCES
LINEAR OR
DIGITAL IC
INTERFACE
IN 1-7
IN 9-15
TO +VCC
V+
SP720
V-
SP720 INPUT
PROTECTION CIRCUIT
(1 OF 14 ON CHIP)
SP720 Lead-Free/Green Series
56
Revision: April 14, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP720 Series
ESD Capability
ESD capability is dependent on the application and defined
test standard. The evaluation results for various test
standards and methods based on Figure 1 are shown in
Table 1.
Figure 1: Electrostatic Discharge Test
CHARGE
SWITCH
DISCHARGE
SWITCH
CD
IN
H.V.
SUPPLY
VD
DUT
IEC 1000-4-2: R 1 50 to 100M
MIL STD 3015.7: R 1 1 to 10M
The HBM capability to the IEC 61000-4-2 standard is
greater than 15kV for air discharge (Level 4) and greater
than 4kV for direct discharge (Level 2). Dual pin capability (2
adjacent pins in parallel) is well in excess of 8kV (Level 4).
Table 1: ESD Test Conditions
Standard
Type/Mode
MIL STD 3015.7
For ESD testing of the SP720 to EIAJ IC121 Machine
Model (MM) standard, the results are typically better than
1kV from 200pF with no series resistance.
IEC 61000-4-2
EIAJ IC121
RD
CD
±VD
Modified HBM
1.5kΩ
100pF
15kV
Standard HBM
1.5kΩ
100pF
6kV
HBM, Air Discharge
330Ω
150pF
15kV
HBM, Direct Discharge
330Ω
150pF
4kV
HBM, Direct Discharge,
Two Parallel Input Pins
330Ω
150pF
8kV
0kΩ
200pF
1kV
Machine Model
Figure 3: High Current SCR Forward Voltage Drop Curve
Figure 2: Low Current SCR Forward Voltage Drop Curve
100
2.5
TA = 25°C
SINGLE PULSE
FORWARD SCR CURRENT (A)
80
60
40
20
0
TA = 25°C
SINGLE PULSE
2
1.5
1
I FWD
EQUIV. SAT. ON
THRESHOLD ~ 1.1V
V FWD
0.5
0
600
800
1000
1200
0
FORWARD SCR VOLTAGE DROP (mV)
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
1
2
3
FORWARD SCR VOLTAGE DROP (V)
57
Revision: April 14, 2011
SP720 Lead-Free/Green Series
Lead-Free/Green SP720
For the “Modified” MIL-STD-3015.7 condition that is
defined as an “in-circuit” method of ESD testing, the V+
and V- pins have a return path to ground and the SP720
ESD capability is typically greater than 15kV from 100pF
through 1.5kΩ. By strict definition of MIL-STD-3015.7 using
“pin-to-pin” device testing, the ESD voltage capability
is greater than 6kV. The MIL-STD-3015.7 results were
determined from AT&T ESD Test Lab measurements.
FORWARD SCR CURRENT (mA)
RD
R1
TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP720 Series
Peak Transient Current Capability for Long Duration Surges
The peak transient current capability rises sharply as the
width of the current pulse narrows. Destructive testing
was done to fully evaluate the SP720’s ability to withstand
a wide range of transient current pulses. The circuit used to
generate current pulses is shown in Figure 4.
Figure 4: Typical SP720 Peak Current Test Circuit
with a Variable Pulse Width Input
+
VG
-
The test circuit of Figure 4 is shown with a positive pulse
input. For a negative pulse input, the (-) current pulse input
goes to an SP720 ‘IN’ input pin and the (+) current pulse
input goes to the SP720 V- pin. The V+ to V- supply of the
SP720 must be allowed to float. (i.e., It is not tied to the
ground reference of the current pulse generator.) Figure
5 shows the point of overstress as defined by increased
leakage in excess of the data sheet published limits.
VARIABLE TIME DURATION
CURRENT PULSE GENERA TOR
R1
CURRENT
SENSE
(-)
(+)
VOLTAGE
PROBE
The maximum peak input current capability is dependent
on the V+ to V- voltage supply level, improving as the
supply voltage is reduced. Values of 0, 5, 15 and 30
voltages are shown. The safe operating range of the
transient peak current should be limited to no more than
75% of the measured overstress level for any given pulse
width as shown in Figure 5.
R 1 ~ 10 TYPICAL
VG ADJ. 10V/ATYPICAL
C1 ~ 100 μF
1 IN
V+ 16
2 IN
IN 15
3 IN
IN 14
4 IN
IN 13
+
C1
SP720
5 IN
IN 12
6 IN
IN 11
7 IN
IN 10
8 V-
IN 9
-
Figure 5: SP720 Typical Nonrepetitive Peak Current
Pulse Capability
Showing the Measured Point of Overstress in Amperes vs
pulse width time in milliseconds (TA = 25oC)
When adjacent input pins are paralleled, the sustained
peak current capability is increased to nearly twice that
of a single pin. For comparison, tests were run using dual
pin combinations 1+2, 3+4, 5+6, 7+9, 10+11, 12+13 and
14+15.
10
CAUTION: SAFE OPERATING CONDITIONS LIMIT
THE MAXIMUM PEAK CURRENT FOR A GIVEN
PULSE WIDTH TO BE NO GREATER THAN 75%
OF THE VALUES SHOWN ON EACH CURVE.
SINGLE PIN STRESS CURVES
DUAL PIN STRESS CURVE
9
8
PEAK CURRENT (A)
The overstress curve is shown in Figure 5 for a 15V supply
condition. The dual pins are capable of 10A peak current
for a 10μs pulse and 4A peak current for a 1ms pulse. The
complete for single pulse peak current vs. pulse width time
ranging up to 1 second are shown in Figure 5.
7
6
5
4
3
15V
0V
5V
30V
2
1
15V
V+ TOV-SUPPLY
0
0.001
0.01
0.1
1
10
100
1000
PULSE WIDTH TIME (ms)
SP720 Lead-Free/Green Series
58
Revision: April 14, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP720 Series
Soldering Parameters
Pb – Free assembly
tP
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
5°C/second max
TS(max) to TL - Ramp-up Rate
5°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Temperature
TP
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Lead-Free/Green SP720
Reflow Condition
Ramp-do
Ramp-down
Preheat
TS(min)
tS
25
Peak Temperature (TP)
250+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
5°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
time to peak temperature
Time
Package Dimensions Dual-In-Line Plastic Packages (PDIP)
N
E1
INDEX
AREA
1 2 3
N/2
Package
PDIP
Pins
16 Lead Dual-in-Line
JEDEC
E16.3 MS-001-BB Issue D
-B-
Millimeters
-AD
A2
-C-
SEATING
PLANE
A
-
A1
0.39
A
L
D1
e
B1
Max
E
BASE
PLANE
D1
eA
A1
B
CL
eC
0.010 (0.25) M C A B S
Max
5.33
-
0.210
4
-
0.015
-
4
2.93
4.95
0.115
0.195
-
B
0.356
0.558
0.014
0.022
-
B1
1.15
1.77
0.045
0.070
8, 10
C
0.204
0.355
0.008
0.014
-
Notes:
1. Controlling Dimensions: INCH. in case of conflict between English and Metric
dimensions, the inch dimensions control.
Notes
Min
A2
C
eB
Inches
Min
D
18.66
19.68
0.735
0.775
5
D1
0.13
-
0.005
-
5
E
7.62
8.25
0.300
0.325
6
E1
6.10
7.11
0.240
0.280
5
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No.
95.
4. Dimensions A, A1 and L are measured with the package seated in JE-DEC seating
plane gauge GS-3.
e
2.54 BSC
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.010 inch (0.25mm).
eA
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
eB
-
L
2.93
7.
eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero
or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall
not exceed 0.010 inch (0.25mm).
N
7.62 BSC
16
0.100 BSC
-
0.300 BSC
6
10.92
-
0.430
7
3.81
0.115
0.150
4
16
9
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1
dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
59
Revision: April 14, 2011
SP720 Lead-Free/Green Series
TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP720 Series
Package Dimensions — Small Outline Plastic Packages (SOIC)
N
Package
INDEX
AREA
H
0.25(0.010) M
B M
Pins
16
JEDEC
M16.15 (JEDEC MS-012-AC Issue C)
E
-B-
SOIC
Millimeters
1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
μ
e
A1
B
C
Inches
Notes
Min
Max
Min
Max
A
A1
B
C
D
E
1.35
0.10
0.33
0.19
9.80
3.80
1.75
0.25
0.51
0.25
10.00
4.00
0.0532
0.0040
0.013
0.0075
0.3859
0.1497
0.0688
0.0098
0.020
0.0098
0.3937
0.1574
9
3
4
e
H
h
L
N
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.27
16
0.050 BSC
0.2284
0.2440
0.0099
0.0196
0.016
0.050
16
5
6
7
0.10(0.004)
0.25(0.010) M C A M B S
Notes:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication
Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash,
protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
μ
0º
8º
0º
8º
-
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and
protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be
located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7.
“N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating
plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
10. Controlling dimension:MILLIMETER. Converted inch dimensions are not necessarily
exact.
Part Numbering System
Product Characteristics
SP720ABTG
P=Lead Free
G = Green
TG= Tape and Reel / Green
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
Package
Series
AB = 16 Ld SOIC
AP = 16 Ld PDIP
See Ordering Information section for specific options available
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
Ordering Information
Part Number
Temp. Range (ºC)
Package
Environmental
Informaton
Marking
Min. Order
SP720APP
-40 to 105
16 Ld PDIP
Lead-free
720APP
1500
SP720ABG
-40 to 105
16 Ld SOIC
Green
720ABG
1920
SP720ABTG
-40 to 105
16 Ld SOIC
Tape and Reel
Green
720ABG
2500
SP720 Lead-Free/Green Series
60
Revision: April 14, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.