TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP03A-3.3 Series SP03A-3.3 Series 3.3V 150A Rail Clamp Array RoHS Pb GREEN Description This SP03A provides overvoltage protection for applications such as 10/100/1000 BaseT Ethernet, and T3/E3 interfaces. This new protector combines the TVS diode element with a diode rectifier bridge to provide both longitudinal and differential protection in one package. This design results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. This reduces intermodulation (IM) distortion caused by a typical solid-state protection solution. The application schematic provides the connection information and the SP03A is rated for GR-1089, intra-building transient immunity requirements for telecommunication installations. Pinout Features • Clamping speed of nanoseconds • RoHS compliant • MS-012 surface mount package (JEDEC SO-8) 1 8 2 7 3 6 4 5 • UL 94V-0 epoxy molding • Low clamping voltage • Low insertion loss, loglinear capacitance • Combined longitudinal and metallic protection • Lightning Protection, IEC61000-4-5, 150A (8/20µs) SO-8 (Top View) Functional Block Diagram Applications • T1/E1 Line cards • T3/E3 and DS3 Interfaces Line in Pin 1 and 8 • 10/100/1000 BaseT Ethernet • STS-1 Interfaces Line out Application Example TeleLink (0461 1.25) Pin 2, 3, 6, and 7 SP03A-3.3 1 8 2 7 3 6 4 5 Ground Line out Line in Pin 4 and 5 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. SP03A-3.3 Series 176 Revision: May 23, 2011 to chipset (Ethernet PHY, T3/E3 PHY, etc.) This schematic shows a high-speed data interface protection solution. The SP03A-3.3 is compatible with the intra-building surge requirements of Telcordia’s GR-1089CORE, and the Basic Level Recommendations of ITU K.20 and K.21. The TeleLink fuse provides overcurrent protection for the long term 50/60 Hz power fault events. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP03A-3.3 Series Absolute Maximum Ratings Thermal Information Rating Parameter Units Rating Units 170 °C/W Peak Pulse Current (8/20µs) 150 A SOIC Package Peak Pulse Power (8/20µs) 3300 W Operating Temperature Range -55 to 125 °C -65 to 150 °C IEC 61000-4-2, Direct Discharge, (Level 4) 30 kV Storage Temperature Range IEC 61000-4-2, Air Discharge, (Level 4) 30 kV Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) (SOIC - Lead Tips Only) 260 °C IEC 61000-4-5 (8/20µs) 150 A Telcordia GR 1089 (Intra-Building) (2/10µs) 100 A ITU K.20 (5/310µs) 40 A SP03A-3.3 Parameter CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min Typ Max Units VRWM IT≤1µA - - 3.3 V Reverse Breakdown Voltage VBR IT= 2µA 3.3 - - V Snap Back Voltage VSB IT= 50mA 3.3 - - V Reverse Leakage Current IR VRWM= 3.3V, T= 25°C - - 1 µA Clamping Voltage, Line-Ground VC IPP= 50A, tp=8/20 µs - - 13 V Clamping Voltage, Line-Ground VC IPP= 100A, tp=8/20 µs - - 17 V Clamping Voltage, Line-Line VC IPP= 50A, tp=8/20 µs - - 15 V Clamping Voltage, Line-Line VC IPP= 100A, tp=8/20 µs - - 20 V Between I/O Pins and Ground VR=0V, f= 1MHz - 9 12 pF Between I/O Pins VR=0V, f= 1MHz - 4.5 6 pF Reverse Stand-Off Voltage Junction Capacitance Cj Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time Figure 2: Current Derating Curve 120 Percentage of Rated Current (%IP) Peak Pulse Current (A) 1000 100 10 1 1 10 100 1000 100 80 60 40 20 0 0 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 20 40 60 80 100 120 140 160 Ambient Temperature (C) Pulse decay time (µs) 177 Revision: May 23, 2011 SP03A-3.3 Series TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP03A-3.3 Series Figure 3: Pulse Waveform Figure 4: Clamping Voltage vs. Peak Pulse Current 18 16 Clamp Voltage-VC(V) Percentage of IPP (%) 100 80 60 40 14 Line to Line 12 10 8 Line to Ground 6 4 2 20 0 0 0 0 5 10 15 20 25 30 35 40 10 20 30 Figure 5: Capacitance vs. Reverse Voltage 50 60 70 80 90 100 Figure 6: Forward Voltage vs. Forward Current 10 7 Line to Ground 9 6 Forward Voltage (V) 8 Capacitance (pF) 40 Peak Pulse Current-I PP (A) Time, µs 7 6 5 4 Line to Line 3 2 Ground-to-Line 5 4 3 2 1 1 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 10 20 30 Bias Voltage (V) 40 50 60 70 80 90 100 Forward Current (A) Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Time °C Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C SP03A-3.3 Series Critical Zone TL to TP Ramp-up TL TS(max) 25 +0/-5 tP TP Temperature Reflow Condition 178 Revision: May 23, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP03A-3.3 Series Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline MS-012 (SO-8) Pins 8 JEDEC MO-223 Issue A Millimetres LF o Recommended Soldering Pad Outline (Reference Only) Inches Min Max Min Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1.25 1.65 0.050 0.065 B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 1.27 BSC e 1.27 0.40 L 0.050 BSC 0.050 0.016 Embossed Carrier Tape & Reel Specification — SOIC Package Millimetres E G= Green 1.85 0.065 0.073 5.4 5.6 0.213 0.22 2.05 0.077 0.081 D 1.5 1.6 0.059 0.063 1.50 Min 3.9 4.1 40.0 +/- 0.20 0.059 Min 0.154 0.161 1.574 +/- 0.008 W 11.9 12.1 0.468 0.476 P 7.9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 t T= Tape & Reel Max 1.65 1.95 10P0 Silicon Protection Array (SPATM) Family of TVS Diode Arrays Min F P0 SP 03A– 3.3 B T G Max P2 D1 Part Numbering System Inches Min 0.30 +/- 0.05 0.012 +/- 0.002 Package B = SOIC Series Working Voltage Product Characteristics Part Marking System LF SP03A-3.3 XXXXXXXX First Line: Part number Second Line: Date code Ordering Information Part Number Package Marking Min. Order Qty. SP03A3.3BTG SOIC Tape & Reel SP03A-3.3 2500 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. 179 Revision: May 23, 2011 SP03A-3.3 Series SP03A-3.3 Package