TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1001 Series SP1001 Series - 8pF 15kV Unidirectional TVS Array Pb GREEN RoHS Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout Features SP1001-02 (SC70-3) SP1001-04 (SC70-5) SP1001-05 (SC70-6) 1 1 3 2 5 1 6 2 2 5 3 3 4 4 SP1001-02 (SOT 553) SP1001-04 (SOT 553) NC 5 SP1001-05 (SOT 563) 1 5 2 2 NC 4 3 4 1 6 2 5 3 4 SP1001-02 2 2 3 t -JHIUOJOH1SPUFDUJPO IEC61000-4-5, 2A (8/20μs) t $PNQVUFS1FSJQIFSBMT t -$%1%157T t .PCJMF1IPOFT t 4FU5PQ#PYFT t %JHJUBM$BNFSBT t %7%1MBZFST t %FTLUPQT/PUFCPPLT t .11.1 Application Example 6 1 5 2 LCD module Controller Input 4 Outside World 1 t 4NBMMQBDLBHFTBWFT board space SP1001-05 4 5 4 5 3 SP1001-04 t &4%QSPUFDUJPOPGL7 contact discharge, ±30kV air discharge, (Level 4, IEC61000-4-2) Applications SP1001-02 2 t -PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t &'5QSPUFDUJPO IEC61000-4-4, 40A (5/50ns) Functional Block Diagram 1 t -PXDBQBDJUBODFPGQ' (TYP) per I/O 3 D1 D2 D3 D4 SP 1001-04JTG (SC70-5) SP 1001-04XTG (SOT553) Shield Ground Signal Ground Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 21 Revision: April 14, 2011 SP1001 Series SP1001 Description TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1001 Series Absolute Maximum Ratings Symbol Thermal Information Parameter Value Units 2 A Storage Temperature Range Operating Temperature -40 to 85 °C Maximum Junction Temperature 150 °C Storage Temperature -60 to 150 °C Maximum Lead Temperature (Soldering 10s) 260 °C IPP Peak Current (tp=8/20μs) TOP TSTOR Parameter Rating Units -65 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min Typ Max Units VF IF=10mA 0.7 0.9 1.2 V 7.0 7.8 8.5 V 5.5 V Forward Voltage Drop VR IR=1mA Reverse Standoff Voltage VRWM IR≤1μA Reverse Leakage Current ILEAK Reverse Voltage Drop Clamp Voltage1 VR=5V VC Dynamic Resistance RDYN ESD Withstand Voltage1,2 VESD Diode Capacitance1 CD 0.5 μA IPP=1A, tp=8/20μs, Fwd 8.0 11.0 V IPP=2A, tp=8/20μs, Fwd 9.7 13.0 (VC2 - VC1) / (IPP2 - IPP1) 1.7 IEC61000-4-2 (Contact) ±15 IEC61000-4-2 (Air) ±30 V Ω kV kV Reverse Bias=0V 12 pF Reverse Bias=2.5V 8 pF Reverse Bias=5V 7 pF Notes: 1 Parameter is guaranteed by device characterization 2 A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode Capacitance vs. Reverse Bias Design Consideration Because of the fast rise-time of the ESD transient, placement of ESD devices is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install the ESD suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. 14 12 Capacitance (pF) 10 8 6 4 2 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 DC Bias (V) SP1001 Series 22 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1001 Series Soldering Parameters Pb – Free assembly tP Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Temperature TP Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 Peak Temperature (TP) 250+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes max. Do not exceed 260°C time to peak temperature Part Numbering System Time Product Characteristics SP1001-02 J T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays Series Number of Channels G= Green T= Tape & Reel Package J = SC70-3, -5 or -6, 3000 qty X = SOT553 or SOT563, 5000 qty 02 = 2 Channel 04 = 4 Channel 05 = 5 Channel Part Marking System Lead Plating Matte Tin (SC70-x) Pre-Plated Frame (SOT5x3) Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Notes : 1. All dimensions are in millimeters AXX 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. AXX Product Series Number of Channels A = SP1001 series (varies) 4. All specifications comply to JEDEC SPEC MO-203 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Assembly Site 6. Package surface matte finish VDI 11-13. (varies) Ordering Information Part Number Package Marking Min. Order Qty. SP1001-02JTG SC70-3 AX2 3000 SP1001-02XTG SOT553 AX2 5000 SP1001-04JTG SC70-5 AX4 3000 SP1001-04XTG SOT553 AX4 5000 SP1001-05JTG SC70-6 AX5 3000 SP1001-05XTG SOT563 AX5 5000 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 23 Revision: April 14, 2011 SP1001 Series SP1001 Reflow Condition TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1001 Series Package Dimensions — SC70 Package SC70-3 B Solder Pad Layout 3 SC70-3 Pins 3 JEDEC MO-203 Issue A Millimeters E HE 2 1 e e D A2 A A1 Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 e C L 6 SC70-5 e e 5 not used 4 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 SC70-5 Pins 5 JEDEC MO-203 Issue A Millimeters 3 2 1 B D A2 A A1 C L B 6 5 SC70-6 4 Min Max Min Max 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 E 1 2 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 SC70-6 Pins 6 JEDEC MO-203 Issue A HE Millimeters D A2 A A1 C Min Max Min Max 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 e L 24 Revision: April 14, 2011 Inches A 3 B SP1001 Series 0.65 BSC Package Solder Pad Layout Inches A e B 0.026 BSC HE HE E 0.66 BSC Package Solder Pad Layout Inches Min 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1001 Series Package Dimensions — SOT5 Package L SOT 553 6 5 (not used) 4 E HE Solder Pad Layout c B Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 e A D 6 5 L 4 E 2 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 SOT 563 Pins 6 Millimeters Solder Pad Layout Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 A c B Inches Min HE 3 e 0.50 BSC Package SOT 563 Inches Min A e 5 Millimeters 3 2 SOT 553 Pins e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Embossed Carrier Tape & Reel Specification — SC70-3 Dimensions Millimetres Min 1.65 1.85 0.065 0.073 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 40.0 +/- 0.20 1.574 +/- 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.30 2.50 0.090 0.098 B0 1.00 Ref 2.30 B1 K0 Revision: April 14, 2011 Max F A1 25 Min E 10P0 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. Inches Max 0.039 Ref 2.50 0.090 1.90 Ref 1.10 0.098 0.074 1.30 0.043 0.051 K1 0.60 Ref 0.023 Ref t 0.27 max 0.010 SP1001 Series SP1001 A D TVS Diode Arrays (SPA™ Family of Products) General Purpose ESD Protection - SP1001 Series Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6 Dimensions Millimetres Min Inches Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0 +/- 0.20 1.574 +/- 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1.12 1.32 0.044 0.052 t 0.27 max 0.010 max Embossed Carrier Tape & Reel Specification — SOT553 and SOT563 Dimensions Millimetres Min 26 Max 0.073 1.65 1.85 0.065 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.1 0.154 0.161 40.0 +/- 0.20 1.574 +/- 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 1.73 1.83 0.068 0.072 B0 1.73 1.83 0.068 0.072 K0 0.64 0.74 0.025 0.029 t Revision: April 14, 2011 Min E 10P0 SP1001 Series Inches Max 0.22 max .009 max ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.