LITTELFUSE SP1001

TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP1001 Series
SP1001 Series - 8pF 15kV Unidirectional TVS Array
Pb GREEN
RoHS
Zener diodes fabricated in a proprietary silicon avalanche
technology protect each I/O pin to provide a high level of
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes above
the maximum level specified in the IEC 61000-4-2
international standard (Level 4, ±8kV contact discharge)
without performance degradation. Their very low loading
capacitance also makes them ideal for protecting highspeed signal pins.
Pinout
Features
SP1001-02
(SC70-3)
SP1001-04
(SC70-5)
SP1001-05
(SC70-6)
1
1
3
2
5
1
6
2
2
5
3
3
4
4
SP1001-02
(SOT 553)
SP1001-04
(SOT 553)
NC
5
SP1001-05
(SOT 563)
1
5
2
2
NC
4
3
4
1
6
2
5
3
4
SP1001-02
2
2
3
t -JHIUOJOH1SPUFDUJPO
IEC61000-4-5, 2A (8/20μs)
t $PNQVUFS1FSJQIFSBMT
t -$%1%157T
t .PCJMF1IPOFT
t 4FU5PQ#PYFT
t %JHJUBM$BNFSBT
t %7%1MBZFST
t %FTLUPQT/PUFCPPLT
t .11.1
Application Example
6
1
5
2
LCD module
Controller
Input
4
Outside World
1
t 4NBMMQBDLBHFTBWFT
board space
SP1001-05
4
5
4
5
3
SP1001-04
t &4%QSPUFDUJPOPGœL7
contact discharge, ±30kV
air discharge, (Level 4,
IEC61000-4-2)
Applications
SP1001-02
2
t -PXMFBLBHFDVSSFOUPG
0.5μA (MAX) at 5V
t &'5QSPUFDUJPO
IEC61000-4-4, 40A
(5/50ns)
Functional Block Diagram
1
t -PXDBQBDJUBODFPGQ'
(TYP) per I/O
3
D1
D2
D3
D4
SP 1001-04JTG (SC70-5)
SP 1001-04XTG (SOT553)
Shield
Ground
Signal
Ground
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
21
Revision: April 14, 2011
SP1001 Series
SP1001
Description
TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP1001 Series
Absolute Maximum Ratings
Symbol
Thermal Information
Parameter
Value
Units
2
A
Storage Temperature Range
Operating Temperature
-40 to 85
°C
Maximum Junction Temperature
150
°C
Storage Temperature
-60 to 150
°C
Maximum Lead Temperature (Soldering 10s)
260
°C
IPP
Peak Current (tp=8/20μs)
TOP
TSTOR
Parameter
Rating
Units
-65 to 150
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (TOP = 25°C)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
VF
IF=10mA
0.7
0.9
1.2
V
7.0
7.8
8.5
V
5.5
V
Forward Voltage Drop
VR
IR=1mA
Reverse Standoff Voltage
VRWM
IR≤1μA
Reverse Leakage Current
ILEAK
Reverse Voltage Drop
Clamp Voltage1
VR=5V
VC
Dynamic Resistance
RDYN
ESD Withstand Voltage1,2
VESD
Diode Capacitance1
CD
0.5
μA
IPP=1A, tp=8/20μs, Fwd
8.0
11.0
V
IPP=2A, tp=8/20μs, Fwd
9.7
13.0
(VC2 - VC1) / (IPP2 - IPP1)
1.7
IEC61000-4-2 (Contact)
±15
IEC61000-4-2 (Air)
±30
V
Ω
kV
kV
Reverse Bias=0V
12
pF
Reverse Bias=2.5V
8
pF
Reverse Bias=5V
7
pF
Notes:
1
Parameter is guaranteed by device characterization
2
A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode
Capacitance vs. Reverse Bias
Design Consideration
Because of the fast rise-time of the ESD transient,
placement of ESD devices is a key design consideration.
To achieve optimal ESD suppression, the devices should be
placed on the circuit board as close to the source of the ESD
transient as possible. Install the ESD suppressors directly
behind the connector so that they are the first board-level
circuit component encountered by the ESD transient. They
are connected from signal/data line to ground.
14
12
Capacitance (pF)
10
8
6
4
2
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
DC Bias (V)
SP1001 Series
22
Revision: April 14, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP1001 Series
Soldering Parameters
Pb – Free assembly
tP
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Temperature
TP
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
tS
25
Peak Temperature (TP)
250+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes max.
Do not exceed
260°C
time to peak temperature
Part Numbering System
Time
Product Characteristics
SP1001-02 J T G
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
Series
Number of Channels
G= Green
T= Tape & Reel
Package
J = SC70-3, -5 or -6, 3000 qty
X = SOT553 or SOT563, 5000 qty
02 = 2 Channel
04 = 4 Channel
05 = 5 Channel
Part Marking System
Lead Plating
Matte Tin (SC70-x) Pre-Plated Frame
(SOT5x3)
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
Notes :
1. All dimensions are in millimeters
AXX
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
AXX
Product Series
Number of Channels
A = SP1001 series
(varies)
4. All specifications comply to JEDEC SPEC MO-203 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
Assembly Site
6. Package surface matte finish VDI 11-13.
(varies)
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP1001-02JTG
SC70-3
AX2
3000
SP1001-02XTG
SOT553
AX2
5000
SP1001-04JTG
SC70-5
AX4
3000
SP1001-04XTG
SOT553
AX4
5000
SP1001-05JTG
SC70-6
AX5
3000
SP1001-05XTG
SOT563
AX5
5000
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
23
Revision: April 14, 2011
SP1001 Series
SP1001
Reflow Condition
TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP1001 Series
Package Dimensions — SC70
Package
SC70-3
B
Solder Pad Layout
3
SC70-3
Pins
3
JEDEC
MO-203 Issue A
Millimeters
E HE
2
1
e
e
D
A2 A
A1
Max
Min
Max
A
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
e
C
L
6
SC70-5
e
e
5
not used
4
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
SC70-5
Pins
5
JEDEC
MO-203 Issue A
Millimeters
3
2
1
B
D
A2 A
A1
C
L
B
6
5
SC70-6
4
Min
Max
Min
Max
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
E
1
2
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
SC70-6
Pins
6
JEDEC
MO-203 Issue A
HE
Millimeters
D
A2 A
A1
C
Min
Max
Min
Max
0.80
1.10
0.031
0.043
A1
0.00
0.10
0.000
0.004
A2
0.70
1.00
0.028
0.039
B
0.15
0.30
0.006
0.012
c
0.08
0.25
0.003
0.010
D
1.85
2.25
0.073
0.089
E
1.15
1.35
0.045
0.053
e
L
24
Revision: April 14, 2011
Inches
A
3
B
SP1001 Series
0.65 BSC
Package
Solder Pad Layout
Inches
A
e
B
0.026 BSC
HE
HE
E
0.66 BSC
Package
Solder Pad Layout
Inches
Min
0.65 BSC
0.026 BSC
HE
2.00
2.40
0.079
0.094
L
0.26
0.46
0.010
0.018
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP1001 Series
Package Dimensions — SOT5
Package
L
SOT 553
6
5
(not used)
4
E
HE
Solder Pad Layout
c
B
Max
Min
Max
0.50
0.60
0.020
0.024
B
0.17
0.27
0.007
0.011
c
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
e
A
D
6
5
L
4
E
2
0.020 BSC
L
0.10
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
SOT 563
Pins
6
Millimeters
Solder Pad Layout
Max
Min
Max
0.50
0.60
0.020
0.024
B
0.17
0.27
0.007
0.011
c
0.08
0.18
0.003
0.007
D
1.50
1.70
0.059
0.067
E
1.10
1.30
0.043
0.051
A
c
B
Inches
Min
HE
3
e
0.50 BSC
Package
SOT 563
Inches
Min
A
e
5
Millimeters
3
2
SOT 553
Pins
e
0.50 BSC
0.020 BSC
L
0.10
0.30
0.004
0.012
HE
1.50
1.70
0.059
0.067
Embossed Carrier Tape & Reel Specification — SC70-3
Dimensions
Millimetres
Min
1.65
1.85
0.065
0.073
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
1.00
1.25
0.039
0.049
P0
3.90
4.10
0.154
0.161
40.0 +/- 0.20
1.574 +/- 0.008
W
7.70
8.10
0.303
0.318
P
3.90
4.10
0.153
0.161
A0
2.30
2.50
0.090
0.098
B0
1.00 Ref
2.30
B1
K0
Revision: April 14, 2011
Max
F
A1
25
Min
E
10P0
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
Inches
Max
0.039 Ref
2.50
0.090
1.90 Ref
1.10
0.098
0.074
1.30
0.043
0.051
K1
0.60 Ref
0.023 Ref
t
0.27 max
0.010
SP1001 Series
SP1001
A
D
TVS Diode Arrays (SPA™ Family of Products)
General Purpose ESD Protection - SP1001 Series
Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6
Dimensions
Millimetres
Min
Inches
Max
Min
Max
E
1.65
1.85
0.065
0.073
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
1.00
1.25
0.039
0.049
P0
3.90
4.10
0.154
0.161
10P0
40.0 +/- 0.20
1.574 +/- 0.008
W
7.70
8.10
0.303
0.318
P
3.90
4.10
0.153
0.161
A0
2.14
2.34
0.084
0.092
B0
2.24
2.44
0.088
0.096
K0
1.12
1.32
0.044
0.052
t
0.27 max
0.010 max
Embossed Carrier Tape & Reel Specification — SOT553 and SOT563
Dimensions
Millimetres
Min
26
Max
0.073
1.65
1.85
0.065
F
3.45
3.55
0.135
0.139
P2
1.95
2.05
0.077
0.081
D
1.40
1.60
0.055
0.063
D1
0.45
0.55
0.017
0.021
P0
3.90
4.1
0.154
0.161
40.0 +/- 0.20
1.574 +/- 0.008
W
7.70
8.10
0.303
0.318
P
3.90
4.10
0.153
0.161
A0
1.73
1.83
0.068
0.072
B0
1.73
1.83
0.068
0.072
K0
0.64
0.74
0.025
0.029
t
Revision: April 14, 2011
Min
E
10P0
SP1001 Series
Inches
Max
0.22 max
.009 max
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.