Materials Declaration Package Body Size Ball Count Option Ball Size Item SiO2 Filler Resin Subtotal Item SiO2 Filler Resin Subtotal Item BT Solder Mask Copper Nickel Gold Brominated compound Subtotal BGA_ED 40 X 40 432 Sn/Pb 0.76 mm Molding Compound % of Compound 73.2 26.8 Dam % of Dam 73.0 27.0 Laminate % of Laminate 61.10 22.08 15.51 0.95 0.24 0.12 Solder Ball % of Solder Ball 63.0 37.0 Sn Pb Subtotal Weight (g) 2.04 E-01 7.50 E-02 2.79 E-01 PPM 22074 8116 30190 Weight (g) 7.15 E-03 2.65 E-03 9.80 E-03 PPM Weight (g) 5.12 E-01 1.85 E-01 1.30 E-01 8.00 E-03 2.00 E-03 1.00 E-03 8.38 E-01 PPM 55402 20018 14067 866 216 108 90678 Weight (g) 5.55 E-01 3.26 E-01 8.81 E-01 PPM 60055 35276 95331 774 286 1060 Au Bond Wires % of Wire 99.99 Weight (g) 1.91 E-02 PPM 2067 Si Chip % of Chip 100.0 Weight (g) 8.34 E-02 PPM 9025 Weight (g) 7.00 E-03 2.00 E-03 9.00 E-03 PPM Weight (g) 6.83 E+00 PPM 739079 Weight (g) 2.92 E-01 PPM 31597 Item Ag Filler Resin Die Attach % of Die Attach 75.0 25.0 Heat Sink % of Heat Sink Cu Ni Heat Sink Plating % of Heat Sink Plating 100.0 Molding Compound Method Item Pb Cd Hg Cr+6 PBB PBDE PPM Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 PPM <5 PPM <5 PPM < 0.5 PPM None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Die Attach Laminate 757 216 974 Package Totals PPM Weight (g) 1000000 9.24 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method ICP-MS ICP-MS ICP-MS Absorptiometer Analysis was performed by GC/MS Analysis was performed by GC/MS Method