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Materials Declaration
Package
Body Size
Ball Count
Option
Ball Size
Item
SiO2 Filler
Resin
Subtotal
Item
SiO2 Filler
Resin
Subtotal
Item
BT
Solder Mask
Copper
Nickel
Gold
Brominated compound
Subtotal
BGA_ED
40 X 40
432
Sn/Pb
0.76 mm
Molding Compound
% of Compound
73.2
26.8
Dam
% of Dam
73.0
27.0
Laminate
% of Laminate
61.10
22.08
15.51
0.95
0.24
0.12
Solder Ball
% of Solder Ball
63.0
37.0
Sn
Pb
Subtotal
Weight (g)
2.04 E-01
7.50 E-02
2.79 E-01
PPM
22074
8116
30190
Weight (g)
7.15 E-03
2.65 E-03
9.80 E-03
PPM
Weight (g)
5.12 E-01
1.85 E-01
1.30 E-01
8.00 E-03
2.00 E-03
1.00 E-03
8.38 E-01
PPM
55402
20018
14067
866
216
108
90678
Weight (g)
5.55 E-01
3.26 E-01
8.81 E-01
PPM
60055
35276
95331
774
286
1060
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.91 E-02
PPM
2067
Si
Chip
% of Chip
100.0
Weight (g)
8.34 E-02
PPM
9025
Weight (g)
7.00 E-03
2.00 E-03
9.00 E-03
PPM
Weight (g)
6.83 E+00
PPM
739079
Weight (g)
2.92 E-01
PPM
31597
Item
Ag Filler
Resin
Die Attach
% of Die Attach
75.0
25.0
Heat Sink
% of Heat Sink
Cu
Ni
Heat Sink Plating
% of Heat Sink Plating
100.0
Molding Compound
Method
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<5 PPM
<5 PPM
<5 PPM
< 0.5 PPM
None Detected
None Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Die Attach
Laminate
757
216
974
Package Totals
PPM
Weight (g)
1000000
9.24 E+00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
ICP-MS
ICP-MS
ICP-MS
Absorptiometer
Analysis was performed by GC/MS
Analysis was performed by GC/MS
Method