Materials Declaration Package Body Size Ball Count Option CSP BGA 12 X 12 291 SnAgCu 0.30 mm Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Item BT Resin Glass fiber Copper Soldermask Nickel Gold Subtotal Molding Compound % of Compound 86.20 6.00 6.00 1.50 0.30 Weight (g) 1.36 E-01 9.47 E-03 9.47 E-03 2.37 E-03 4.74 E-04 1.58 E-01 PPM 441144 30707 30707 7675 1536 511771 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA 3051/3052. ICP-OES. Not Detected EPA 3051/3052. ICP-OES. Not Detected EPA 3051/3052. ICP-OES. Not Detected EPA 3060A & USEPA 7196A Not Detected EPA 3540C/3550C. GC/MS. Not Detected EPA 3540C/3550C. GC/MS. Weight (g) 2.22 E-02 2.22 E-02 1.68 E-02 1.08 E-02 9.75 E-03 6.91 E-03 8.86 E-02 PPM 71826 71826 54586 35051 31602 22410 287299 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Weight (g) 2.94 E-02 9.14 E-04 1.52 E-04 3.05 E-02 PPM 95256 2962 493 98712 Bond Wires % of Wire 99.99 Weight (g) 6.11 E-03 PPM 19817 % of Chip 100.0 Weight (g) 2.28 E-02 PPM 73913 Weight (g) 1.73 E-03 4.33 E-04 1.62 E-04 1.62 E-04 6.50 E-05 6.50 E-05 2.62 E-03 PPM Laminate % of Laminate 25.00 25.00 19.00 12.20 11.00 7.80 Solder Ball % of Solder Ball 96.50 3.00 0.50 Sn Ag Cu Subtotal Au Die Attach Paste Chip Si Item Silver Polymeric material Acrylate resin Diester resin Functionalized urethane resin Epoxy resin Subtotal Die Attach Material % of Die Attach 66.1 16.5 6.2 6.2 2.5 2.5 5614 1403 525 525 211 211 8489 Package Totals Weight (g) PPM 1000000 3.09 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method EPA 3051/3052. ICP-OES. EPA 3051/3052. ICP-OES. EPA 3051/3052. ICP-OES. EPA 3060A & USEPA 7196A EPA 3540C/3550C. GC/MS. EPA 3540C/3550C. GC/MS.