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Materials Declaration
Package
Body Size
Ball Count
Option
Item
Molding Compound
% of Compound
88
12
Molding Compound
Weight (g)
8.94 E-02
1.22 E-02
PPM
464810
63431
Weight (g)
1.67 E-02
9.40 E-03
6.00 E-04
3.60 E-03
8.10 E-03
1.10 E-03
PPM
86827
48873
3120
18717
42114
5719
Solder Ball
% of Balls
96.5
3
0.5
Weight (g)
3.15 E-02
1.00 E-03
2.00 E-04
PPM
163775
5199
1040
Item
Bond Wires
% of Wire
99.99
Weight (g)
2.09 E-03
PPM
10844
Item
Chip 1- Bottom
% of Chip
100
Weight (g)
8.06 E-03
PPM
41898
Silica
Epoxy Resin
Item
BT-Epoxy
Copper
Gold
Nickel
Solder Mask
Brominated Compound
Item
Sn
Ag
Cu
Au
Si
Item
Si
Item
Ag Filler
Resin
Item
Si Filler
Epoxy/Acrylic
Item
Epoxy
Rubber
Silica
CSP-BGA - Stacked Die
9X9
124
Pb-Free
Laminate
% of Laminate
42.3
23.8
1.5
9.1
20.5
2.89
Chip 2 - Top
% of Chip
100
Weight (g)
6.17 E-03
PPM
32092
Die Attach 1 - Bottom Die
% of Die Attach
Weight (g)
1.00 E-03
78
3.00 E-04
22
PPM
5199
1560
Die Attach 2 - Top Die
% of Die Attach
Weight (g)
2.00 E-05
6
3.00 E-04
94
Film Spacer
% of Spacer
60
30
10
Item
Method
PPM
Pb
Cd
Hg
Cr+6
PBB
PBDE
Laminate
Item
Method
PPM
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach Paste 1
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Item
PPM
Method
Die Attach Paste 2
Method
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
104
1560
Weight (g)
3.00 E-04
2.00 E-04
1.00 E-04
PPM
1560
1040
520
Package Totals
Weight (g)
1.92 E-01
PPM
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
1/2/2006