pdf

Materials Declaration
Package
Body Size
LeadCount
Option
Ball Size
BGA
23 X 23 mm
316
SnAgCu
0.6 mm
Item
SiO2 Filler
Resin
Brominated compound
Antimony
Subtotal
Item
Laminate
Cu
Solder mask
Nickel
Brominated Compound
Gold
Subtotal
Molding Compound
% of Compound
87.6
11.0
0.9
0.5
Laminate
% of Laminate
46.1
40.9
7.7
1.8
3.2
0.4
Solder Ball
% of Plating
96.5
3.0
0.50
Sn
Ag
Cu
Subtotal
Bond Wires
% of Wire
99.00
1.00
Au
Pd
Subtotal
Chip
% of Chip
100.0
Si
Item
Filler
Resin
Subtotal
Die Attach
% of Die Attach
77.0
33.0
Weight (g)
6.59 E-01
8.28 E-02
6.80 E-03
3.80 E-03
7.52 E-01
PPM
343468
43155
3544
1981
392148
Weight (g)
3.81 E-01
3.38 E-01
6.37 E-02
1.50 E-02
2.61 E-02
3.00 E-03
8.27 E-01
PPM
198680
176321
33200
7818
13603
1564
431185
Weight (g)
2.71 E-01
8.40 E-03
1.40 E-03
2.81 E-01
PPM
141244
4378
730
146352
Weight (g)
1.43 E-02
1.44 E-04
1.44 E-02
PPM
7451
75
7526
Weight (g)
3.86 E-02
PPM
20131
Weight (g)
3.90 E-03
1.20 E-03
5.10 E-03
PPM
2033
625
2658
Weight (g)
1.92 E+00
PPM
1000000
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Mold Compound
Method
PPM
Not Detected
EPA 3051/3052. ICP-OES.
Not Detected
EPA 3051/3052. ICP-OES.
2.90
EPA 3051/3052. ICP-OES.
Not Detected
EPA 3060A/7196A. UV-VIS.
Not Detected
EPA 3540C/3550C. GC/MS.
Not Detected
EPA 3540C/3550C. GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Die Attach
Method
PPM
Not Detected
EPA 3051/3052. ICP-OES.
Not Detected
EPA 3051/3052. ICP-OES.
Not Detected
EPA 3051/3052. ICP-OES.
Not Detected
EPA 3060A/7196A. UV-VIS.
EPA 3540C/3550C. GC/MS.
Not Detected
EPA 3540C/3550C. GC/MS.
Not Detected
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary