Materials Declaration Package Body Size LeadCount Option Ball Size BGA 23 X 23 mm 316 SnAgCu 0.6 mm Item SiO2 Filler Resin Brominated compound Antimony Subtotal Item Laminate Cu Solder mask Nickel Brominated Compound Gold Subtotal Molding Compound % of Compound 87.6 11.0 0.9 0.5 Laminate % of Laminate 46.1 40.9 7.7 1.8 3.2 0.4 Solder Ball % of Plating 96.5 3.0 0.50 Sn Ag Cu Subtotal Bond Wires % of Wire 99.00 1.00 Au Pd Subtotal Chip % of Chip 100.0 Si Item Filler Resin Subtotal Die Attach % of Die Attach 77.0 33.0 Weight (g) 6.59 E-01 8.28 E-02 6.80 E-03 3.80 E-03 7.52 E-01 PPM 343468 43155 3544 1981 392148 Weight (g) 3.81 E-01 3.38 E-01 6.37 E-02 1.50 E-02 2.61 E-02 3.00 E-03 8.27 E-01 PPM 198680 176321 33200 7818 13603 1564 431185 Weight (g) 2.71 E-01 8.40 E-03 1.40 E-03 2.81 E-01 PPM 141244 4378 730 146352 Weight (g) 1.43 E-02 1.44 E-04 1.44 E-02 PPM 7451 75 7526 Weight (g) 3.86 E-02 PPM 20131 Weight (g) 3.90 E-03 1.20 E-03 5.10 E-03 PPM 2033 625 2658 Weight (g) 1.92 E+00 PPM 1000000 Item Pb Cd Hg Cr+6 PBB PBDE Mold Compound Method PPM Not Detected EPA 3051/3052. ICP-OES. Not Detected EPA 3051/3052. ICP-OES. 2.90 EPA 3051/3052. ICP-OES. Not Detected EPA 3060A/7196A. UV-VIS. Not Detected EPA 3540C/3550C. GC/MS. Not Detected EPA 3540C/3550C. GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Method PPM Not Detected EPA 3051/3052. ICP-OES. Not Detected EPA 3051/3052. ICP-OES. Not Detected EPA 3051/3052. ICP-OES. Not Detected EPA 3060A/7196A. UV-VIS. EPA 3540C/3550C. GC/MS. Not Detected EPA 3540C/3550C. GC/MS. Not Detected Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary