Materials Declaration Package Body Size Ball Count Option Ball Size Item Silica Phenol Resin Epoxy Resin Carbon Black Metal Hydroxide Item BT-Epoxy Glass Fiber Copper Gold Nickel Solder Mask CSP BGA 9X9 100 Pb-Free 0.45 Molding Compound % of Compound 85 6.5 6.5 0.5 1 Sub-Total Laminate % of Laminate 28 25 19 11 7.8 9.35 Sub-Total Molding Compound Weight (g) 6.09 E-02 4.65 E-03 4.65 E-03 3.58 E-04 7.16 E-04 7.12 E-02 PPM 25182 1926 1926 148 296 29477 Item Pb Cd Hg Cr+6 PBB PBDE PPM <2.0 <2.0 <2.0 <2.0 <5.0 <5.0 Weight (g) 1.64 E-02 1.47 E-02 1.11 E-02 6.45 E-03 4.58 E-03 5.49 E-03 PPM 6797 6069 4612 2670 1893 2270 Item PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 5.88 E-02 24311 Die Attach Paste Pb Cd Hg Cr+6 PBB PBDE Solder Ball % of Solder Balls 96.5 3 0.5 Sub-Total Weight (g) 2.10 E+00 6.52 E-02 1.09 E-02 2.17 E+00 PPM 867611 26972 4495 899079 Item Bond Wires % of Wire 99.99 Weight (g) 6.01 E-02 PPM 24868 Item Chip % of Chip 100 Weight (g) 1.11 E-04 PPM Weight (g) 4.19 E-02 1.18 E-02 5.37 E-02 PPM 17331 4888 22220 Sn Ag Cu Au Si Item Ag Filler Resin Die Attach % of Die Attach 78 22 Sub-Total Method ICP-AES ICP-AES ICP-AES ICP-AES USEPA3540 or 3550 (GC/MS) USEPA3540 or 3550 (GC/MS) Substrate Item Item Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICPAES) Mercury Analyser EPA method #3060A(UV) B3/264/EEC (GC/ECDMS) B3/264/EEC (GC/ECDMS) Pb Cd Hg Cr+6 PBB PBDE PPM <2 <2 <2 6.0 NA NA Method SGS Test Report SGS Test Report SGS Test Report SGS Test Report NA NA 46 Package Totals Weight (g) PPM 2.42 E+00 1000000 STS-BC-G Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 11/27/2005