Materials Declaration Package Body Size Ball Count CSP BGA 12 X 12 121 0.6 Pb Free Ball Size Option Item Epoxy resin SiO2 Filler Phenol Resin Carbon Black Metal Hydroxide Item BT-Epoxy Glass Fiber Copper Gold Nickel Solder Mask Brominated Compound Molding Compound % of Compound 7 85 6.5 0.5 1 Weight (g) 1.08 E-02 1.31 E-01 1.00 E-02 7.71 E-04 1.54 E-03 PPM 22887 277913 21252 1635 3270 Weight (g) 28 4.78 E-02 25 4.27 E-02 19 3.24 E-02 11 1.88 E-02 7.8 1.33 E-02 9.35 1.60 E-02 Confidential Not Determined PPM 101322 90466 68754 39805 28225 33834 Laminate % of Laminate Solder Ball % of Solder Ball 96.5 3 0.5 Weight (g) 1.11 E-01 3.45 E-03 5.75 E-04 PPM 235130 7310 1218 Bond Wires % of Wire 99.99 Weight (g) 1.88 E-03 PPM Au 100 Weight (g) 2.59 E-02 PPM 54903 Weight (g) 9.16 E-04 2.90 E-03 PPM 24 76 Si Item Resin Ag Filler Die Attach % of Die Attach PPM <2.0 <2.0 <2.0 <2.0 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 <5.0 Item Pb Cd Hg Cr+6 PBB PBDE PPM <14 <2.0 <2.0 <19 Not Detected Not Detected Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICPaes) Mercury Analyser EPA method #3060A(UV) Die Attach Paste Method ICP-AES ICP-AES ICP-AES ICP-AES Laminate Sn Ag Cu Chip % of Chip Item Pb Cd Hg Cr+6 Method 3988 1941 6147 Package Totals Weight (g) PPM 1000000 4.72 E-01 STS-BC-E Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 10/29/04 Materials Declaration Package Body Size Ball Count CSP BGA 12 X 12 121 0.6 SnPbAg Ball Size Option Item Silica Epoxy Resin Phenol resin Antimony Trioxide Bromine Item BT-Epoxy Glass Fiber Copper Gold Nickel Solder Mask Brominated Compound Molding Compound % of Compound 90 4.8 3.91 0.69 0.6 Weight (g) 1.36 E-01 7.24 E-03 5.90 E-03 1.04 E-03 9.05 E-04 PPM 289866 15460 12593 2222 1932 Weight (g) 28 4.78 E-02 25 4.27 E-02 19 3.24 E-02 11 1.88 E-02 7.8 1.33 E-02 9.35 1.60 E-02 Confidential Not Determined PPM 102057 91122 69253 40094 28430 34080 Laminate % of Laminate Solder Ball % of Solder Ball 62 36 2 Weight (g) 7.13 E-02 4.14 E-02 2.30 E-03 PPM 152164 88353 4909 Bond Wires % of Wire 99.99 Weight (g) 1.88 E-03 PPM Au 100 Weight (g) 2.59 E-02 PPM 55302 Weight (g) 8.78 E-04 2.94 E-03 PPM 23 77 Chip % of Chip Item Resin Ag Filler PPM <5 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 <5.0 Item Pb Cd Hg Cr+6 PBB PBDE PPM <14 <2.0 <2.0 <19 Not Detected Not Detected Molding Compound Method BS EN 1122:2001B (ICPaes) Die Attach Paste Method ICP-AES ICP-AES ICP-AES ICP-AES Laminate Sn Pb Ag Si Item Cd Die Attach % of Die Attach Method 4017 1874 6273 Package Totals Weight (g) PPM 1000000 4.68 E-01 STS-BC-A Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 10/29/04