Materials Declaration Package Body Size Ball Count Option CSP BGA 15 X 15 X 1.85 (4 layers) 196 SnPb Molding Compound % of Compound 86.5 12.7 0.5 0.3 Weight (g) 2.57 E-01 3.84 E-02 1.48 E-03 8.85 E-04 PPM 277711 41497 1596 958 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM 8.2 US EPA #3052 Not Detected US EPA #3052 Not Detected US EPA #3052 Not Detected US EPA #3060A Not Detected Analysis performed by GC/MS Not Detected Analysis performed by GC/MS Laminate % of Laminate 46.6 41.3 6.2 3.2 2.2 0.4 Weight (g) 1.62 E-01 1.44 E-01 2.17 E-02 1.11 E-02 7.79 E-03 1.41 E-03 PPM 175463 155684 23446 11997 8434 1522 Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM 3.1 US EPA #3052 Not Detected US EPA #3052 Not Detected US EPA #3052 Not Detected US EPA #7196A and #3060A Not Detected Analysis performed by GC/MS Not Detected Analysis performed by GC/MS Sn Pb Solder Ball % of Plating 63.0 37.0 Weight (g) 1.55 E-01 9.08 E-02 PPM 167200 98197 Au Bond Wires % of Wire 99.9 Weight (g) 4.64 E-03 PPM 5021 Si Chip % of Chip 100.0 Weight (g) 2.57 E-02 PPM 27862 Die Attach % of Die Attach 78.0 22.0 Weight (g) 2.46 E-03 6.94 E-04 PPM 2662 751 Item SiO2 Filler Epoxy resin Antimony Trioxide Brominated Epoxy Resin Item BT-Epoxy Copper Solder Mask Brominated Compound Nickel Gold Item Ag Filler Resin Package Totals Weight (g) PPM 1000000 9.24 E-01 AMK-BC-I Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 03/08/06