Data Sheet

TEA1623P; TEA1623PH
STARplug switched mode power supply controller IC
Rev. 3 — 30 August 2010
Product data sheet
1. General description
The TEA1623 is a Switched Mode Power Supply (SMPS) controller IC that operates
directly from rectified universal mains. It is implemented in the high voltage EZ-HV SOI
process, combined with a low voltage BiCMOS process.
The device includes a high voltage power switch and a circuit for start-up directly from the
rectified mains voltage. A dedicated circuit for valley switching is built in, which makes a
very efficient slim-line electronic power-plug concept possible.
In its most basic version of application, the TEA1623 acts as a voltage source. Here, no
additional secondary electronics are required. A combined voltage and current source can
be realized with minimum costs for external components. Implementation of the TEA1623
renders an efficient and low cost power supply system.
2. Features and benefits
„
„
„
„
„
„
„
„
„
„
„
„
„
„
Designed for general purpose power supplies
Integrated power switch: 6.5 Ω and 650 V
Operates from universal AC mains supplies: 80 V to 276 V
Adjustable frequency for flexible design
RC oscillator for stable output regulation
Valley switching for minimum switch-on loss
Frequency reduction at low power output for low standby power: < 100 mW
Adjustable OverCurrent Protection (OCP)
UnderVoltage Protection (UVP)
Temperature protection
Short-winding protection
Safe restart mode for system fault conditions
Simple application with both primary and secondary (opto) feedback
Available in 8-pin and 16-pin DIP packages.
3. Applications
„
„
„
„
„
„
Adapters
Set-Top Box (STB)
DVD
VCD
CD(R)
PC Silverbox standby SMPS
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
VCC(max)
maximum supply voltage
VDRAIN(max)
maximum DMOS power
transistor drain voltage
IDRAIN
supply current drawn from no auxiliary supply
pin DRAIN
RDSon
drain-source on-state
resistance
fosc
Conditions
Min
Typ
Max
Unit
-
-
40
V
-
-
650
V
-
0.5
-
mA
Tj = 25 °C
-
6.5
7.5
Ω
Tj = 100 °C
-
9.0
10.0
Ω
10
-
200
kHz
Tj > 0 °C
ISOURCE = −0.5 A
oscillator frequency range
5. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
TEA1623P
DIP8
plastic dual in-line package; 8 leads (300 mil)
SOT97-1
TEA1623PH
DIP16
plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
TEA1623P_TEA1623PH
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
2 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
6. Block diagram
VCC
1
8
SUPPLY
DRAIN
VALLEY
TEA1623P
GND
LOGIC
2
7
n.c.
100 mV
PWM
stop
RC
3
OSCILLATOR
6
THERMAL
SHUTDOWN
low frequency
SOURCE
PROTECTION
LOGIC
POWER-UP
RESET
f
1.8
blank
U
overcurrent
REG
4
2.5 V
0.5 V
10x
5
AUX
short winding
0.75 V
col011
Fig 1.
Block diagram of TEA1623P
TEA1623P_TEA1623PH
Product data sheet
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Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
3 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
VCC
3
14
SUPPLY
1, 2, 7, 9,
10, 13,
15, 16
VALLEY
TEA1623PH
GND
DRAIN
n.c.
LOGIC
4
100 mV
PWM
stop
RC
5
OSCILLATOR
12
THERMAL
SHUTDOWN
low frequency
SOURCE
PROTECTION
LOGIC
POWER-UP
RESET
f
1.8
blank
U
overcurrent
REG
2.5 V
6
0.5 V
11
10x
AUX
short winding
SGND
8
0.75 V
col013
Fig 2.
Block diagram of TEA1623PH
7. Pinning information
7.1 Pinning
VCC
1
8
DRAIN
GND
2
7
n.c.
RC
3
6
SOURCE
REG
4
5
AUX
TEA1623P
n.c.
1
16 n.c.
n.c.
2
15 n.c.
VCC
3
14 DRAIN
GND
4
RC
5
REG
6
11 AUX
n.c.
7
10 n.c.
SGND
8
9
001aaa310
Fig 3.
Product data sheet
13 n.c.
12 SOURCE
n.c.
001aaa312
Pin configuration for SOT97-1 (DIP8)
TEA1623P_TEA1623PH
TEA1623PH
Fig 4.
Pin configuration for SOT38-1 (DIP16)
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
4 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
TEA1623P
TEA1623PH
VCC
1
3
supply voltage
GND
2
4
ground
RC
3
5
frequency setting
REG
4
6
regulation point
SGND
-
8
signal ground; preferably connected
to pin GND
AUX
5
11
input for voltage from auxiliary
winding for timing (demagnetization)
SOURCE
6
12
source of internal MOS switch
n.c.
7
1, 2, 7, 9, 10, 13,
15, 16
not connected
DRAIN
8
14
drain of internal MOS switch; input for
start-up current and valley sensing
8. Functional description
The TEA1623 is the heart of a compact flyback converter, with the IC placed at the
primary side. The auxiliary winding of the transformer can be used for indirect feedback to
control the isolated output. This additional winding also powers the IC. A more accurate
control of the output voltage and/or current can be implemented with an additional
secondary sensing circuit and optocoupler feedback.
The TEA1623 uses voltage mode control. The frequency is determined by the maximum
transformer demagnetizing time or the frequency of the oscillator. In the first case, the
converter operates in the Self Oscillating Power Supply (SOPS) mode. In the latter case, it
operates at a constant frequency, which can be adjusted with external components RRC
and CRC. This mode is called Pulse Width Modulation (PWM). Furthermore, a primary
stroke is started only in a valley of the secondary ringing. This valley switching principle
minimizes capacitive switch-on losses.
8.1 Start-up and UnderVoltage LockOut (UVLO)
Initially, the IC is self supplying from the rectified mains voltage. The IC starts switching as
soon as the voltage on pin VCC passes the VCC(start) level. The supply is taken over by the
auxiliary winding of the transformer as soon as VCC is high enough and the supply from
the line is stopped for high efficiency operation.
As soon as the voltage on pin VCC drops below the VCC(stop) level, the IC stops switching
and restarts from the rectified mains voltage.
8.2 Oscillator
The frequency of the oscillator is set by the external resistor and capacitor on pin RC. The
external capacitor is charged rapidly to the VRC(max) level and, starting from a new primary
stroke, it discharges to the VRC(min) level. Because the discharge is exponential, the
TEA1623P_TEA1623PH
Product data sheet
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Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
5 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
relative sensitivity of the duty factor to the regulation voltage at low duty factor is almost
equal to the sensitivity at high duty factors. This results in a more constant gain over the
duty factor range compared to PWM systems with a linear sawtooth oscillator. Stable
operation at low duty factors is easily realized. For high efficiency, the frequency is
reduced as soon as the duty factor drops below a certain value. This is accomplished by
increasing the oscillator charge time.
To ensure that the capacitor can be charged within the charge time, the value of the
oscillator capacitor should be limited to approximately 1 nF.
8.3 Duty factor control
The duty factor is controlled by the internal regulation voltage and the oscillator signal on
pin RC. The internal regulation voltage is equal to the external regulation voltage (−2.5 V)
multiplied by the gain of the error amplifier (typical 20 dB or 10×).
The minimum duty factor of the switched mode power supply is 0 %. The maximum duty
factor is set to 75 % (typical value at 100 kHz oscillation frequency).
8.4 Valley switching
A new cycle is started at the primary stroke when the switch is switched on (see Figure 5).
After a certain time (determined by the RC oscillator voltage and the internal regulation
level), the switch is turned off and the secondary stroke starts. The internal regulation
level is determined by the voltage on pin REG. After the secondary stroke, the drain
1
voltage shows an oscillation with a frequency of approximately ----------------------------- , where:
2π × L p C p
Lp is the primary self inductance on the drain node.
Cp is the parasitic capacitance on the drain node.
As soon as the oscillator voltage is high again and the secondary stroke has ended, the
circuit waits for a low drain voltage before starting a new primary stroke.
The primary stroke starts some time before the actual valley at low ringing frequencies,
and some time after the actual valley at high ringing frequencies. Figure 6 shows a typical
curve for a reflected voltage N × Vo of 80 V. This voltage is the output voltage Vo
(see Figure 7) transferred to the primary side of the transformer with the factor N
(determined by the turns ratio of the transformer). Figure 6 shows that the system
switches exactly at minimum drain voltage for ringing frequencies of 480 kHz, thus
reducing the switch-on losses to a minimum. At 200 kHz, the next primary stroke is started
at 33 ° before the valley. The switch-on losses are still reduced significantly.
TEA1623P_TEA1623PH
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
6 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
primary
stroke
secondary
stroke
secondary
ringing
drain
valley
secondary
stroke
A
B
regulation level
RC
oscillator
col007
A: Start of new cycle with valley switching.
B: Start of new cycle in a classical PWM system.
Fig 5.
Signals for valley switching
001aaa311
40
phase
(°)
20
0
−20
−40
0
200
400
600
800
f (kHz)
Reflected voltage at N × Vo = 80 V.
Fig 6.
Typical phase of drain ringing at switch-on
8.5 Demagnetization
The system operates in discontinuous conduction mode all the time. As long as the
secondary stroke has not ended, the oscillator will not start a new primary stroke. During
the suppression time tsuppr, demagnetization recognition is suppressed. This suppression
may be necessary in applications where the transformer has a large leakage inductance
and at low output voltages.
TEA1623P_TEA1623PH
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
7 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
8.6 Protection
8.6.1 Overcurrent protection
The cycle-by-cycle peak drain current limit circuit uses the external source resistor RI (see
Figure 7) to measure the current. The circuit is activated after the leading edge blanking
time tleb. The protection circuit limits the source voltage to Vsource(max), and thus limits the
primary peak current.
8.6.2 Short-winding protection
The short-winding protection circuit is also activated after the leading edge blanking time.
If the source voltage exceeds the short-winding protection voltage Vswp, the TEA1623
stops switching. Only a power-on reset will restart normal operation. The short-winding
protection also protects in case of a secondary diode short circuit.
8.6.3 OverTemperature Protection (OTP)
An accurate temperature protection is provided in the TEA1623. When the junction
temperature exceeds the thermal shut-down temperature, the IC stops switching. During
thermal protection, the IC current is lowered to the start-up current. The IC continues
normal operation as soon as the overtemperature situation has disappeared.
8.6.4 OverVoltage Protection (OVP)
Overvoltage protection can be achieved in the application by pulling pin REG above its
normal operation level, or by keeping the level of pin AUX above Vdemag. The current
primary stroke is terminated immediately and no new primary stroke is started until the
voltage on pin REG drops to its normal operation level. Pin REG has an internal clamp.
The current feed into pin REG must be limited.
8.7 Characteristics of the complete power-plug
8.7.1 Input
The input voltage range comprises the universal AC mains from 80 V to 276 V.
8.7.2 Accuracy
The accuracy of the complete converter, functioning as a voltage source with primary
sensing, is approximately 8 % (mainly dependent on the transformer coupling). The
accuracy with secondary sensing is defined by the accuracy of the external components.
For safety requirements in case of optocoupler feedback loss, the primary sensing
remains active when an overvoltage circuit is connected.
8.7.3 Efficiency
An efficiency of 75 % at maximum output power can be achieved for a complete converter
designed for universal mains.
8.7.4 Ripple
A minimum ripple is obtained in a system designed for a maximum duty factor of 50 %
under normal operating conditions and a minimized dead time. The magnitude of the
ripple in the output voltage is determined by the frequency and duty factor of the
converter, the output current level, and the value and ESR of the output capacitor.
TEA1623P_TEA1623PH
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
8 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VCC
supply voltage
continuous
VRC
oscillator input voltage
VSOURCE
DMOS power transistor source
voltage
VDRAIN
DMOS power transistor drain
voltage
Min
Max
Unit
[1]
−0.4
+40
V
[1]
−0.4
+3
V
−0.4
+5
V
−0.4
+650
V
-
6
mA
Voltage
Tj > 0 °C
Current
regulation input current
[2]
IAUX
auxiliary winding input current
[2]
−10
+5
mA
IRC
oscillator capacitor charge current
−3
-
mA
ISOURCE
source current
−2
+2
A
IDRAIN
drain current
−2
+2
A
TEA1623P; Tamb < 45 °C
-
1.0
W
TEA1623PH; Tamb < 50 °C
-
1.7
W
IREG
General
total power dissipation
Ptot
Tstg
storage temperature
−55
+150
°C
Tj
junction temperature
−20
+145
°C
pin DRAIN
−1500
+1500
V
all other pins
−2000
+2000
V
−200
+200
V
electrostatic discharge voltage
VESD
model[3]
human body
machine model[4]
all pins
[1]
Pins VCC and RC are not allowed to be current driven.
[2]
Pins REG and AUX are not allowed to be voltage driven.
[3]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
[4]
Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 μH coil and a 10 Ω series resistor.
10. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance from junction to ambient
in free air
[1]
Typ
[1]
Unit
-
TEA1623P
100
K/W
TEA1623PH
55
K/W
Thermal resistance Rth(j-a) can be lower when pin GND is connected to sufficient copper area on the printed-circuit board. See the
TEA152x application note for details.
TEA1623P_TEA1623PH
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
9 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
11. Characteristics
Table 6.
Characteristics
Tamb = 25 °C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into
the IC, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
9
9.5
10
V
undervoltage lockout
7.0
7.5
8.0
V
Supplies
Supply on pin VCC
VCC(start)
start voltage
VCC(stop)
stop voltage
ICC(operate)
operating supply current
normal operation
-
1.3
1.9
mA
ICC(startup)
start-up supply current
start-up
-
180
400
μA
ICC(ch)
charging current
VDRAIN > 60 V
VCC = 0 V
−650
−520
−390
μA
VCC = 8.5 V
−375
−275
−175
μA
no auxiliary supply
-
0.5
-
mA
with auxiliary supply; VDRAIN > 60 V
-
30
125
μA
-
0
-
%
-
75
-
%
Supply on pin DRAIN
IDRAIN
supply current drawn from pin
DRAIN
PWM mode
δmin
minimum duty factor
δmax
maximum duty factor
fosc = 100 kHz
Self-oscillating power supply mode
Vdemag
demagnetization recognition
voltage level
50
100
150
mV
tsuppr
time of suppression of transformer
ringing at start of secondary stroke
1.0
1.5
2.0
μs
Oscillator: pin RC
VRC(min)
minimum voltage of RC oscillator
setting
60
75
90
mV
VRC(max)
maximum voltage of RC oscillator
setting
2.4
2.5
2.6
V
tRC(ch)
RC charging time
-
1
-
μs
fosc
oscillator frequency range
10
-
200
kHz
Duty factor regulator: pin REG
VREG
input voltage on pin REG
2.4
2.5
2.6
V
GV(erroramp)
voltage gain of error amplifier
-
20
-
dB
VREG(clamp)
clamping voltage on pin REG
IREG = 6 mA
-
-
7.5
V
−102
-
+102
V/μs
N × Vo = 100 V
200
550
800
kHz
-
150
-
ns
-
-
125
μA
Valley switching recognition
dV/dtvalley
valley recognition
fvalley
ringing frequency for valley
switching
td(valley-on)
delay from valley recognition to
switch-on
Output stage (FET)
IL(drain)
drain leakage current
TEA1623P_TEA1623PH
Product data sheet
VDRAIN = 650 V
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Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
10 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
Table 6.
Characteristics …continued
Tamb = 25 °C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into
the IC, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBR(drain)
drain breakdown voltage
Tj > 0 °C
650
-
-
V
RDSon
drain-source on-state resistance
ISOURCE = −0.5 A
Tj = 25 °C
-
6.5
7.5
Ω
Tj = 100 °C
-
9.0
10.0
Ω
-
75
-
ns
drain fall time
tdrain(f)
VDRAIN(switch_on) = 300 V; no
external capacitor at pin DRAIN
Temperature protection
Tprot(max)
maximum threshold temperature
150
160
170
°C
Tprot(hys)
threshold temperature hysteresis
-
2
-
°C
Overcurrent and short winding protection: pin SOURCE
Vsource(max)
overcurrent protection voltage
dV/dt = 0.1 V/μs
0.47
0.50
0.53
V
Vswp
short-winding protection voltage
dV/dt = 0.5 V/μs
0.7
0.75
0.8
V
td(propagation)
delay from detecting Vsource(max) to dV/dt = 0.5 V/μs
switch-off
-
160
185
ns
tleb
leading edge blanking time
250
350
450
ns
overcurrent and short-winding
protection
12. Application information
LF
D5
Z1
CF1
Vo
C5
D1
CF2
mains
R1
D2
R2
CVCC
VCC
GND
RRC
RC
R4
CRC
REG
1
8
2
7
TEA1623P
3
6
4
5
DRAIN
C6 - Ycap
n.c.
SOURCE
AUX
RI
RAUX
R3
col012
Further application information can be found in the TEA152x application note.
Fig 7.
Application with primary sensing for TEA1623P
TEA1623P_TEA1623PH
Product data sheet
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Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
11 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
13. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
D
A2
A
A1
L
c
Z
w M
b1
e
(e 1)
b
MH
b2
5
8
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.02
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Fig 8.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT97-1
050G01
MO-001
SC-504-8
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Package outline SOT97-1 (DIP8)
TEA1623P_TEA1623PH
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
12 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
b1
w M
(e 1)
b
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
2.2
inches
0.19
0.02
0.15
0.055
0.045
0.021
0.015
0.013
0.009
0.86
0.84
0.26
0.24
0.1
0.3
0.15
0.13
0.32
0.31
0.37
0.33
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Fig 9.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT38-1
050G09
MO-001
SC-503-16
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Package outline SOT38-1 (DIP16)
TEA1623P_TEA1623PH
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
13 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
14. Soldering of through-hole mount packages
14.1 Introduction to soldering through-hole mount packages
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
14.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
14.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 °C and 400 °C, contact may be up to 5 seconds.
14.4 Package related soldering information
Table 7.
Suitability of through-hole mount IC packages for dipping and wave soldering
Package
TEA1623P_TEA1623PH
Product data sheet
Soldering method
Dipping
Wave
CPGA, HCPGA
-
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable
suitable[1]
PMFP[2]
-
not suitable
[1]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2]
For PMFP packages hot bar soldering or manual soldering is suitable.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
14 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
15. Abbreviations
Table 8.
Abbreviations
Acronym
Description
BiCMOS
Bipolar CMOS
CMOS
Complementary Metal-Oxide Semiconductor
DMOS
Diffusion Metal-Oxide Semiconductor
ESR
Equivalent Series Resistance
OCP
OverCurrent Protection
OTP
OverTemperature Protection
OVP
OverVoltage Protection
PWM
Pulse Width Modulation
SMPS
Switched Mode Power Supply
SOI
Silicon On Insulator
SOPS
Self Oscillating Power Supply
STB
Set-Top Box
UVLO
UnderVoltage LockOut
UVP
UnderVoltage Protection
VCD
Video Compact Disc
16. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice Supersedes
TEA1623P_TEA1623PH v.3
20100830
Product data sheet
-
TEA1623P_TEA1623PH_2
-
TEA1623P_TEA1623PH_1
Modifications:
TEA1623P_TEA1623PH_2
Modifications:
TEA1623P_TEA1623PH_1
TEA1623P_TEA1623PH
Product data sheet
•
•
Table 1 “Quick reference data” updated.
Table 4 “Limiting values” updated.
20091104
Product data sheet
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
•
Section 15 “Abbreviations” added.
Pin configuration drawing A and B split into Figure 3 “Pin configuration for SOT97-1
(DIP8)” and Figure 4 “Pin configuration for SOT38-1 (DIP16)”.
20040317
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2010
-
© NXP B.V. 2010. All rights reserved.
15 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
TEA1623P_TEA1623PH
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
16 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TEA1623P_TEA1623PH
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
17 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
19. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Quick reference data . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . .2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .5
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .9
Thermal characteristics . . . . . . . . . . . . . . . . . . .9
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .10
Suitability of through-hole mount IC
packages for dipping and wave soldering . . . .14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .15
Revision history . . . . . . . . . . . . . . . . . . . . . . . .15
continued >>
TEA1623P_TEA1623PH
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
18 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
20. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Block diagram of TEA1623P . . . . . . . . . . . . . . . . .3
Block diagram of TEA1623PH . . . . . . . . . . . . . . . .4
Pin configuration for SOT97-1 (DIP8) . . . . . . . . . .4
Pin configuration for SOT38-1 (DIP16) . . . . . . . . .4
Signals for valley switching . . . . . . . . . . . . . . . . . .7
Typical phase of drain ringing at switch-on . . . . . .7
Application with primary sensing for TEA1623P . 11
Package outline SOT97-1 (DIP8) . . . . . . . . . . . .12
Package outline SOT38-1 (DIP16) . . . . . . . . . . .13
continued >>
TEA1623P_TEA1623PH
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
19 of 20
TEA1623P; TEA1623PH
NXP Semiconductors
STARplug switched mode power supply controller IC
21. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.6.1
8.6.2
8.6.3
8.6.4
8.7
8.7.1
8.7.2
8.7.3
8.7.4
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
17
17.1
17.2
17.3
17.4
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 5
Start-up and UnderVoltage LockOut (UVLO) . . 5
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Duty factor control . . . . . . . . . . . . . . . . . . . . . . 6
Valley switching . . . . . . . . . . . . . . . . . . . . . . . . 6
Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 7
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Overcurrent protection . . . . . . . . . . . . . . . . . . . 8
Short-winding protection . . . . . . . . . . . . . . . . . . 8
OverTemperature Protection (OTP) . . . . . . . . . 8
OverVoltage Protection (OVP) . . . . . . . . . . . . . 8
Characteristics of the complete power-plug . . . 8
Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ripple . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal characteristics . . . . . . . . . . . . . . . . . . 9
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10
Application information. . . . . . . . . . . . . . . . . . 11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Soldering of through-hole mount packages . 14
Introduction to soldering through-hole
mount packages . . . . . . . . . . . . . . . . . . . . . . . 14
Soldering by dipping or by solder wave . . . . . 14
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14
Package related soldering information . . . . . . 14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Contact information. . . . . . . . . . . . . . . . . . . . . 17
19
20
21
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 30 August 2010
Document identifier: TEA1623P_TEA1623PH