Materials Declaration Package Body Size LeadCount Option Item Silica Epoxy and Phenol resin Carbon black Subtotal Item Cu Ni Si Mg Subtotal LQFP_EP 28 X 28 X 1.4 208 Pb-free Molding Compound % of Compound 86.91 12.78 0.31 Leadframe % of Leadframe 96.20 3.00 0.65 0.15 Weight (g) 1.77 E+00 2.60 E-01 6.31 E-03 2.03 E+00 PPM 667577 98166 2381 768125 Weight (g) 4.81 E-01 1.50 E-02 3.23 E-03 7.58 E-04 5.00 E-01 PPM 181814 5669 1222 286 188990 Internal Leadframe Plating Weight (g) % of Plating 4.95 E-03 100 PPM Ag PPM Sn External Leadframe Plating % of Plating Weight (g) 2.43 E-02 100 Item Molding Compound Method EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3060A. Draft IEC62321. UV-VIS EPA Method 3540C. Draft IEC62321. GC/MS-D. EPA Method 3540C. Draft IEC62321. GC/MS-D. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3052. Draft IEC62321. ICP-OES. EPA Method 3060A. Draft IEC62321. UV-VIS EPA Method 3540C. Draft IEC62321. GC/MS-D. EPA Method 3540C. Draft IEC62321. GC/MS-D. 9191 Weight (g) 1.03 E-02 PPM Au Si Chip % of Chip 100 Weight (g) 6.59 E-02 PPM 24892 Weight (g) 5.84 E-03 1.46 E-03 5.47 E-04 2.19 E-04 8.06 E-03 PPM Die Attach % of Die Attach 72.4 18.1 6.8 2.7 PPM None Detected None Detected None Detected None Detected None Detected None Detected 1870 Bond Wires % of Wire 99.99 Item Ag Epoxy compound Anhydrides Polymeric material Subtotal Item Pb Cd Hg Cr+6 PBB PBDE 3886 2205 551 207 83 3045 Package Totals PPM Weight (g) 1000000 2.65 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary