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Materials Declaration
Package
Body Size
LeadCount
Option
Item
Silica
Epoxy and Phenol resin
Carbon black
Subtotal
Item
Cu
Ni
Si
Mg
Subtotal
LQFP_EP
28 X 28 X 1.4
208
Pb-free
Molding Compound
% of Compound
86.91
12.78
0.31
Leadframe
% of Leadframe
96.20
3.00
0.65
0.15
Weight (g)
1.77 E+00
2.60 E-01
6.31 E-03
2.03 E+00
PPM
667577
98166
2381
768125
Weight (g)
4.81 E-01
1.50 E-02
3.23 E-03
7.58 E-04
5.00 E-01
PPM
181814
5669
1222
286
188990
Internal Leadframe Plating
Weight (g)
% of Plating
4.95 E-03
100
PPM
Ag
PPM
Sn
External Leadframe Plating
% of Plating
Weight (g)
2.43 E-02
100
Item
Molding Compound
Method
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3060A. Draft IEC62321. UV-VIS
EPA Method 3540C. Draft IEC62321. GC/MS-D.
EPA Method 3540C. Draft IEC62321. GC/MS-D.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3052. Draft IEC62321. ICP-OES.
EPA Method 3060A. Draft IEC62321. UV-VIS
EPA Method 3540C. Draft IEC62321. GC/MS-D.
EPA Method 3540C. Draft IEC62321. GC/MS-D.
9191
Weight (g)
1.03 E-02
PPM
Au
Si
Chip
% of Chip
100
Weight (g)
6.59 E-02
PPM
24892
Weight (g)
5.84 E-03
1.46 E-03
5.47 E-04
2.19 E-04
8.06 E-03
PPM
Die Attach
% of Die Attach
72.4
18.1
6.8
2.7
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
1870
Bond Wires
% of Wire
99.99
Item
Ag
Epoxy compound
Anhydrides
Polymeric material
Subtotal
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
3886
2205
551
207
83
3045
Package Totals
PPM
Weight (g)
1000000
2.65 E+00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary